HOLOPLOT X1 User manual

HOLOPLOT X1
Modul 80-S
User Manual / Version 1.0 en

2X1 MD80-S Manual 1.0 en
HOLOPLOT X1 Modul 80-S
User Manual — Version: 1.0 en
05/2021
Copyright © 2021 by Holoplot GmbH.
All rights reserved.
The contents of this manual are furnished for
informational purposes only and should not be
construed as a legal commitment.
HOLOPLOT reserves the right to change the content of
this manual without prior notice.
We recommend that you regularly check the
HOLOPLOT website for the latest version.
All third-party trademarks mentioned herein are the
property of their respective trademark holders.
Holoplot GmbH
Ringbahnstr. 12 (10-14) / A2
12099 Berlin, Germany
[phone]
[email protected]
holoplot.com

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How to use this Manual
Important Safety Instructions
The HOLOPLOT Audio System
Audio Modules
Controller
Software Suite
Connected Services
HOLOPLOT Sound Field Control
3D Audio-Beamforming - Optimized Sound for Audience Areas
Wave Field Synthesis - Accurate Localization for Listeners
Panning Object-Based Audio
Matrix Array Size
X1 Modul 80-S
Audio Module Overview
The Loudspeaker Cabinet
The Electronics Package
The Display Panel
The Connector Panels
Connectors on the Electronics Package
Connectors on the Loudspeaker Cabinet
Installation Requirements and Recommendations
Handling the Audio Module
Storing
Installation
Rigging the Audio Module
Rigging Points
Areas not to be Covered
Distances between Audio Modules
Ground Stacking
Heat Generation and Dissipation
Cooling and Air Flow Requirements
Clearance Required at the Back
Power Setup and Requirements
AC Power Distribution Requirements
AC Power Connectors
AC Power IN (blue)
AC Power OUT (gray)
AC Power Cable Requirements
Voltage Requirements
Power States and Current/Power Draw
Protection Circuitry
Intelligent AC Power Supply
Network Setup and Requirements
Providing Network Signal to the Audio Module
Network Design
Networking Requirements
Network Cable Connections
Providing Signal to the Subwoofer via Sublink
Operating the X1 Modul 80-S
Minimum System Setup Required
Quick-Start Guide: Connecting the MD80-S to Power and Network
Playing back Audio on the MD80-S
Monitoring and Controlling the MD80-S during Operation
Accessing HOLOPLOT Control
Updating
Blinking
Turning off the Audio Module
Service
Maintenance and Care
HOLOPLOT Connected Services
X1 Modul 80-S Data Sheet
Manufacturer’s Declarations
WEEE Declaration (Disposal)
EU Declaration of Conformity (CE Symbol)
FCC Statement of Conformity
Industry Canada (IC) Statement of Conformity
Table of Contents

4X1 MD80-S Manual 1.0 en
We recommend that you regularly check our website
at holoplot.com for updates and supplementary
information.
In case of any questions, HOLOPLOT Customer Support
is available at:
Tel. (DE): [phone]
Tel. (USA): [phone]
Email: [email protected]
How to use this Manual
NOTE:
Important knowledge for the topic under
discussion as well as references to
supplementary information
TIP:
Additional practical advice and helpful
explanations
i
Read these instructions in their entirety before handling
or using a HOLOPLOT Audio System. In particular, pay
close attention to material related to safety issues. The
rst section of this document provides a summary of all
important safety instructions in two languages, English
and French.
The following symbols indicate important safety-related
instructions or warnings provided in this manual or on
the product itself:
As you read these instructions, you will also encounter
the following icons indicating complementary
information or helpful guidance:
Important operating instructions
Instructions d’utilisation importantes
Dangerous voltage: Risk of electric shock
Risque de choc électrique
Protective earth ground
Terre de protection
Multiple power plugs
Fiches d’alimentation multiples
!
How to use this Manual

5X1 MD80-S Manual 1.0 en
ENGLISH
1. Read and follow these instructions.
2. Heed all warnings.
3. Do not use this device near water. Do not install the
device in wet or humid locations. Do not expose this
device to rain or moisture. Do not allow water to
get inside the device. Do not put objects containing
liquid on or near the device.
4. Clean this device only with dry cloth.
5. Do not block any ventilation openings. Do not dress
cables in front of intake fans or exhaust cooling vents.
Install in accordance with the installation instructions
provided in this manual.
6. Do not install near any heat sources such as radiators
or heat registers.
7. Avoid direct sunlight to reduce the risk of
overheating the device.
8. The Amphenol HP Series 25 connector must not
be engaged or disengaged when under load. Either
de-energize before disconnecting, or disconnect the
other end of the cable.
9. Make sure the voltage received by the Audio Module
remains within its 115 - 240 V AC operating range.
Mains voltages exceeding the specied nominal
range can cause damage to the Audio Module.
Important Safety Instructions
FRANCAIS
1. Lisez et suivez toutes ces instructions.
2. Tenez compte de tous les avertissements.
3. N’utilisez pas cet appareil à proximité de l’eau.
N’installez pas l’appareil dans des endroits humides
ou mouillés. N’exposez pas cet appareil à la pluie
ou à l’humidité. Ne laissez pas l’eau ou tout autre
objet étranger pénétrer dans l’appareil. Ne mettez
pas d’objets contenant du liquide sur l’appareil ou à
proximité de celui-ci.
4. Nettoyez l’appareil uniquement avec un chiffon sec.
5. N’obstruez pas les ouvertures de ventilation.
N’habillez pas les câbles devant les orices
d’admission ou d’évacuation des ventilateurs.
Installez l’appareil conformément aux instructions
d’installation fournies dans ce manuel.
6. Ne l’installez pas à proximité de sources de chaleur
telles que radiateurs ou bouches de chaleur.
7. Pour réduire le risque de surchauffe de l’appareil,
évitez de l’exposer à la lumière directe du soleil.
8. Le connecteur Amphenol HP série 25 ne doit pas
être engagé ou désengagé lorsqu’il est sous charge
ou sous tension. Il faut soit le mettre hors tension
avant de le débrancher, soit débrancher l’autre
extrémité du câble.
9. Assurez-vous que la tension reçue par le Module Audio
reste dans sa plage de fonctionnement de 115 - 240 V.
Les tensions du secteur dépassant la plage nominale
spéciéepeuvent endommager le Module Audio.
Important Safety Instructions

6X1 MD80-S Manual 1.0 en Important Safety Instructions
10. Only use the AC Power OUT at input voltages equal to
or higher than 208 V AC to prevent electrical hazards.
11. If the “POWER” LED does not turn green, switch off
the AC power source immediately and verify that the
voltage is within the required range. If the problem
persists, contact HOLOPLOT Customer Support.
12. Before applying AC power to any Audio Module, make
sure that the voltage potential difference between
neutral and earth ground is less than 5 V. When
powering the Electronics Package and the subwoofer
amplier module from two different power sources
/ wall sockets, make sure that both power sources
provide the same ground potential.
13. The Audio Module requires a grounded outlet. Always
use a grounded outlet and plug. Improper grounding
of connections between Audio Modules and other
equipment may produce noise, hum, or cause serious
damage to the devices’ electronic components.
14. Connect the device to a two-pole, three-wire
grounding mains receptacle. The receptacle must be
connected to a fuse or circuit breaker. Connection to
any other type of receptacle poses a shock hazard
and may violate local electrical codes.
15. When wiring AC power cables and distribution
systems, preserve AC line polarity and connect the
protective earth at both ends of the cable.
16. Protect the power cord from being walked on or
pinched, particularly at plugs and convenience
receptacles. The AC mains plug or appliance coupler
must remain readily accessible for operation.
17. Do not apply power to the device if any power cable is
damaged or frayed.
18. Do not exceed the current rating of any branch circuit
breaker. Include a 25 % safety buffer.
10. N’utilisez la sortie AC Power OUT qu’à des tensions
d’entrée AC égales ou supérieures à 208 V an
d’éviter tout risque électrique.
11. Si le voyant “POWER” ne devient pas vert, coupez
immédiatement l’alimentation en courant alternatif
et vériez que la tension est dans la plage requise. Si
le problème persiste, contactez le support technique
de HOLOPLOT.
12. Avant d’appliquer le courant alternatif à un Module
Audio, assurez-vous que la différence de potentiel
entre le neutre et la terre est inférieure à 5 V.
Lorsque vous alimentez le Electronics Package et le
module d’amplication du subwoofer à partir de deux
sources d’alimentation / prises murales différentes,
assurez-vous que les deux sources d’alimentation
fournissent le même potentiel de terre.
13. Le Module Audio nécessite une prise de courant avec
mise à la terre. Utilisez toujours une prise de courant
et une che avec mise à la terre. Une mauvaise mise
à la terre des connexions entre les Modules Audio
et d’autres équipements peut produire du bruit, un
bourdonnement ou causer de sérieux dommages aux
composants électroniques des appareils.
14. Branchez l’appareil à une prise de courant bipolaire,
à trois ls avec mise à la terre. La prise doit être
reliée à un fusible ou à un disjoncteur. La connexion
à tout autre type de prise de courant présente un
risque de choc électrique et peut enfreindre les
codes électriques locaux.
15. Lors du câblage des câbles d’alimentation en courant
alternatif et des systèmes de distribution, préservez
la polarité des lignes de courant alternatif et reliez la
terre aux deux extrémités du câble.
16. Protégez le cordon d’alimentation pour éviter qu’on
marche dessus ou qu’il soit pincé, en particulier
au niveau des ches et des prises de courant. La
che secteur ou le coupleur de l’appareil doit rester
facilement accessible pour le fonctionnement.
17. Ne faites pas fonctionner l’appareil si le câble
d’alimentation est efloché ou cassé.
18. Ne dépassez pas le courant nominal de tout
disjoncteur de dérivation. Incluez un tampon de
sécurité de 25 %.

7X1 MD80-S Manual 1.0 en
19. For all AC power cables, use the correct cable mount
connectors from Amphenol. All connectors must be at
least 25 A rated. Use at least AWG-12 wires.
20. The plug on the other end of the AC power cable
must be selected in accordance with the relevant
requirements of the region in which you will
operate the device.
21. To reduce the risk of electric shock, disconnect
the device from the AC mains before installing or
connecting other cables. Reconnect the power cord
only after making all connections.
22. Unplug this device during lightning storms or when
unused for long periods of time.
23. Rigging used with this device must comply with the
safety instructions in this manual.
24. Disconnect the Modul 80-S from both power
connections and all other connections before
handling/moving/rigging the device.
25. To safely rig a Modul 80-S, all eight M10 points must
be used together. Each rigging screw shall be xed
with an appropriate torque not exceeding 65 Nm.
26. If Audio Modules lack appropriate xation to the oor
or to a secure structure, they might fall or tip. Without
xation, Audio Modules might move due to vibrations
caused by the loudspeaker drivers.
27. To prevent electrical or mechanical safety hazards,
the device must only be handled, installed, and
maintained by suitably trained personnel.
28. Refer all other servicing to HOLOPLOT authorized
service personnel. Servicing is required when the
device has been damaged in any way, such as when
the power supply cord or plug has been damaged;
liquid has been spilled or objects have fallen into the
device; rain or moisture has entered the device; the
device has been dropped; or when for undetermined
reasons the device does not operate normally.
19. Pour tous les câbles d’alimentation en courant
alternatif, utilisez les connecteurs de montage de
câble appropriés d’Amphenol. Tous les connecteurs
doivent être au moins de 25 A. Utilisez au moins des
ls AWG-12.
20. La che d’alimentation située à l’autre extrémité du
câble d’alimentation CA doit être choisie en fonction
des exigences de la région dans laquelle vous
utiliserez l’appareil.
21. Pour réduire le risque de choc électrique,
débranchez l’appareil du secteur avant d’installer
ou de brancher d’autres câbles. Ne rebranchez le
cordon d’alimentation qu’après avoir effectué tous
les branchements.
22. Débranchez cet appareil pendant les orages ou
lorsqu’il n’est pas utilisé pendant de longues
périodes.
23. Les systèmes de xation utilisés avec cet appareil
doivent être conformes aux instructions de sécurité
de ce manuel.
24. Débranchez le Modul 80-S de l’alimentation et de
toutes les autres connexions avant de manipuler/
déplacer/xer l’appareil.
25. Lorsque vous utilisez les points de xation M10 pour
xer le Module Audio, les huit points M10 doivent
être utilisés ensemble. Chaque ridoir doit être serré
avec un couple adéquat ne dépassant pas 65 Nm.
26. Si les Module Audio ne sont pas correctement xés
au sol ou à une structure solide, ils peuvent tomber
ou basculer. Sans xation, les Module Audio peuvent
se déplacer en raison des vibrations provoquées par
les haut-parleurs.
27. Pour éviter tout risque de sécurité électrique ou
mécanique, l’appareil ne doit être manipulé, installé
et entretenu que par un personnel qualié et formé.
28. Conez toutes les autres opérations d’entretien
au personnel de service agréé par HOLOPLOT.
L’entretien est nécessaire lorsque le dispositif a été
endommagé de quelque manière que ce soit, par
exemple lorsque le cordon d’alimentation ou la prise
ont été endommagés, qu’un liquide a été renversé
ou que des objets sont tombés dans le dispositif, que
la pluie ou l’humidité a pénétré dans le dispositif,
que le dispositif est tombé ou que, pour des raisons
indéterminées, le dispositif ne fonctionne pas
normalement.
Important Safety Instructions

8X1 MD80-S Manual 1.0 en
29. N’essayez pas de démonter l’appareil. Ne retirez pas
la grille du haut-parleur. L’ouverture de l’appareil
annulera la garantie.
30. L’exposition à des niveaux de pression sonore élevés
peut entraîner une perte auditive permanente.
Utilisez une protection adéquate, telle que des
bouchons d’oreille ou des écouteurs de protection,
lorsque vous êtes exposé à des niveaux élevés de
pression acoustique (voir la che technique à la n
de ce manuel pour connaître le niveau de pression
acoustique maximal que cet appareil peut produire).
29. Do not attempt to disassemble the device. Do not
remove the loudspeaker grille. Opening the device
will void the warranty.
30. Exposure to high sound pressure levels can cause
permanent hearing loss. Use adequate protection
such as ear plugs or protective earphones, when
exposed to high levels of acoustic pressure (see data
sheet at the end of this manual for the maximum
sound pressure level this device can produce).
Important Safety Instructions

9X1 MD80-S Manual 1.0 en
AUDIO MODULES
HOLOPLOT Audio Modules are 3D Audio-Beamforming
and Wave Field Synthesis loudspeakers with integrated
signal processing and amplication that can be arrayed
horizontally and vertically to create differently sized
HOLOPLOT Matrix Arrays.
The two HOLOPLOT X1 Audio Modules, “Modul 96”
(MD96) and “Modul 80-S” (MD80-S), are targeted at
high-performance audio applications. All HOLOPLOT X1
Audio Modules are identical in width, height, and rigging
system, but differ in depth, weight, and frequency
range. The MD96 is a two-way Audio Module with 96
loudspeaker drivers; the MD80-S is a three-way Audio
Module with 80 loudspeaker drivers and a single sensor-
controlled subwoofer driver.
HOLOPLOT Audio System
In HOLOPLOT Audio Modules, each loudspeaker driver
is individually amplied and controlled by its own Digital
Signal Processor (DSP), enabling ultimate control
over sound. HOLOPLOT Audio Modules are capable of
generating multiple sound elds simultaneously — each
with its own content, equalization, level, shape, and
position — either in a single Audio Module deployment or
as part of a larger HOLOPLOT Matrix Array system.
Each Audio Module provides digital audio connectivity
through Audinate Dante — up to 200 channel-based or
object-based audio content streams can be received by
one Audio Module, processed in parallel, and mapped to,
or panned between multiple sound elds.
HOLOPLOT Audio System
A HOLOPLOT Audio System consists of:
• AUDIO MODULES — 3D Audio-Beamforming and Wave Field Synthesis loudspeakers
• CONTROLLER — a rack-mountable device to manage HOLOPLOT Audio Modules
• SOFTWARE SUITE — for design and simulation, control and monitoring, as well as
authoring of object-based audio content and playback for HOLOPLOT Audio Systems
HOLOPLOT X1
Modul 96
HOLOPLOT X1
Modul 80-S

10X1 MD80-S Manual 1.0 en HOLOPLOT Audio System
SOFTWARE SUITE
HOLOPLOT Plan makes the design, simulation, and set-
up of a HOLOPLOT Audio System simple and intuitive.
The 3D graphic interface allows users to design Matrix
Arrays of different congurations and create sound
elds based on 3D Audio-Beamforming and Wave Field
Synthesis technology. Venue models are easily imported
from standard 3D modeling software such as SketchUp.
HOLOPLOT Plan also simulates and visualizes direct
sound pressure levels, giving a realistic prediction of
the audio quality in the venue. For further analysis and
advanced simulations, projects can be exported to EASE.
HOLOPLOT Control makes managing and operating a
HOLOPLOT Audio System efcient and hassle-free. As
a rst-level gateway to the system, it provides critical
diagnostic information and allows users to easily locate
Matrix Arrays within the venue, control volume and
equalization, and monitor performance. By displaying
essential system data (such as component health or
network status), HOLOPLOT Control aids technical staff in
operating and maintaining the entire system.
CONTROLLER
The HOLOPLOT Controller manages a HOLOPLOT
Audio System through a standard IP network, providing
different functionalities: general system control,
collection of system health and performance data, as
well as sound eld control.
The HOLOPLOT Controller is based on a Dell PowerEdge
XR2 Industrial Rack Server and is a 19-inch 1U standard
rack-mountable device.
HOLOPLOT Create is a complete solution for production
of object-based audio content. It enables creators
to produce transformational audio experiences with
immersive sound objects integrated and designed for
HOLOPLOT Matrix Arrays. Audio object properties can
be controlled via standard DAW automation (plug-in in
AU and VST3 format), and by third-party devices via the
OSC (Open Sound Control) protocol.

11X1 MD80-S Manual 1.0 en
CONNECTED SERVICES
Given an active internet connection, a HOLOPLOT Audio
System will have access to the HOLOPLOT Cloud and
IoT-enabled HOLOPLOT services.
The optional Connected Services allow the HOLOPLOT
service team or HOLOPLOT afliated service teams to
access a HOLOPLOT installation for remote monitoring
and remote failure analysis, enabling efcient and
targeted technical support as well as prediction of
maintenance service intervals.
Furthermore, Connected Services provide HOLOPLOT
Audio Systems with software updates and upgrades
for improved performance and security as well as new
features — making the system better over time.
HOLOPLOT Audio System

12X1 MD80-S Manual 1.0 en
When generating a sound eld based on 3D Audio-
Beamforming technology, signal processing coefcients
for each loudspeaker driver are algorithmically optimized
depending on the target audience area, the Audio
Modules’ locations, as well as areas in the respective
architectural surrounding of the array that shall be
actively avoided by the sound eld.
A single HOLOPLOT Matrix Array can simultaneously
create multiple optimized 3D Audio-Beamforming
sound elds, targeting different areas and reproducing
different content for each of these areas. The 3D Audio-
Beamforming capabilities of a HOLOPLOT Matrix Array
are dependent on the size of the array.
HOLOPLOT Sound Field Control
HOLOPLOT Sound Field Control
3D AUDIO-BEAMFORMING
OPTIMIZED SOUND FOR
AUDIENCE AREAS
HOLOPLOT 3D Audio-Beamforming enables the control
of sound wave propagation by adjusting the vertical and
horizontal steering angle and the vertical and horizontal
opening angles. The sound eld of a HOLOPLOT Matrix
Array can be congured individually to adapt to an
installation’s requirements, even when facing complex-
shaped environments or challenging room acoustics.
A sound eld based on HOLOPLOT 3D Audio-Beamforming
technology is usually deployed to provide the following:
• uniformity of coverage (spectral consistency over a
predened audience area)
• improved speech intelligibility
• reduced unwanted sound spill onto stages and into
neighboring residential areas
• eliminated sound from reective surfaces, reducing
the creation of acoustic echo and minimizing room
reverberation artifacts
A HOLOPLOT Audio System can be deployed as single, or multiple arrays of HOLOPLOT
Audio Modules. Each array of Audio Modules can simultaneously generate multiple
sound elds based on two HOLOPLOT core technologies: 3D Audio-Beamforming and
Wave Field Synthesis — each with its own characteristics and advantages.

13X1 MD80-S Manual 1.0 en HOLOPLOT Sound Field Control
PANNING OBJECT-BASED AUDIO
Similar to panning content between traditional
loudspeakers, which creates phantom sources that
can be localized between loudspeaker locations,
content can also be panned between sound elds
generated by a HOLOPLOT Audio System, no matter
if those are based on 3D Audio-Beamforming or Wave
Field Synthesis. The content can be panned between
individual sound elds created from a single HOLOPLOT
Matrix Array, and also between sound elds created
from multiple, distributed arrays.
HOLOPLOT Audio Systems simultaneously support both
traditional channel-based and object-based content.
Object-based content can be authored, played back,
and spatialized either with HOLOPLOT Create or by
employing a third-party spatializer where compatible.
Virtual Source Area
Listener Area
HOLOPLOT Array
3
Virtual Source Area
Array
Listener
Area
1
2
Audio
Object
Array
Virtual Source Area
WAVE FIELD SYNTHESIS
ACCURATE LOCALIZATION
FOR LISTENERS
In creative applications, a Wave Field Synthesis sound
eld is usually deployed to create a distinctly localized
sound source. Such a virtual sound source usually has a
point-shaped origin behind or in front of a HOLOPLOT
Matrix Array, which in this case creates a spherically
propagating sound eld.
A single HOLOPLOT Matrix Array can create multiple
sound elds simultaneously, each producing different
content, enabling the creation of auditory scenes with
multiple localized sound sources.
Because sound elds created by Wave Field Synthesis
are based on parametric coefcients which can
be dynamically adjusted, the sound source origin
location of a sound eld can be changed, resulting in a
corresponding perceived change of the localization of
the sound source for listeners.
HOLOPLOT Wave Field Synthesis can be deployed in
conjunction with HOLOPLOT 3D Audio-Beamforming
capabilities. These technologies provide users with
a vastly augmented creative palette compared to
traditional loudspeaker systems.

14X1 MD80-S Manual 1.0 en
MATRIX ARRAY SIZE
A single HOLOPLOT Audio Module is capable of creating
multiple optimized 3D Audio-Beamforming as well as
Wave Field Synthesis sound elds. The larger an array
of Audio Modules, the greater the control over its sound
eld in low frequencies. Furthermore, an increased array
size allows for higher SPL broadband values, improves
coverage homogeneity in high frequencies, and reduces
sound spill outside the targeted area.
HOLOPLOT Sound Field Control
Sound elds created with HOLOPLOT Matrix Arrays are
controllable independently horizontally and vertically.
The upper control frequency is dependent on the beam
conguration. The respective amount of control in
low frequencies is dependent on the array size in the
corresponding axis.

15X1 MD80-S Manual 1.0 en
X1 Modul 80-S
The Modul 80-S (MD80-S) is the larger of the two HOLOPLOT X1 Audio Modules.
The three-way Audio Module integrates 80 loudspeaker drivers in its rst two matrix
layers, and an additional sensor-controlled subwoofer driver in its third layer - making
the MD80-S an even more versatile product to be used whenever there is a need for
extra punch in the lowest frequencies.
Like the MD96, the MD80-S combines the latest technological advancements in audio
and high-performance sound reproduction capabilities, enabling the use of 3D Audio-
Beamforming and Waveeld Synthesis in a variety of ambitious applications.
AUDIO MODULE OVERVIEW
The front-facing part of the MD80-S, the “Loudspeaker
Cabinet” integrates loudspeaker drivers, sensors,
and rigging-points, as well as the power supply and
amplication for the subwoofer driver. The rear-
facing part, the “Electronics Package” integrates
power supplies, amplication, signal processing, and
networking electronics.
X1 Modul 80-S
Loudspeaker
Cabinet
Electronics
Package

16X1 MD80-S Manual 1.0 en
THE LOUDSPEAKER CABINET
The Loudspeaker Cabinet of the MD80-S is constructed
of an enclosure made of glass ber-reinforced
polycarbonate and a wooden extension housing.
The wooden extension housing integrates the subwoofer
driver as well as a dedicated digital subwoofer amplier
module with independent AC to DC power supply
unit, a differential pressure sensor and a zero-latency
DSP - enabling adaptive closed-loop processing of the
subwoofer driver signal.
1. 4x infrared transceivers —
enabling an Audio Module to
identify its location within an array
3. 4x digital microphones —
for quality control of the
loudspeaker drivers
2. 4x front-facing RGB LEDs —
for easily locating the Audio
Module in the venue
Further features:
• 2x temperature sensors —
each monitoring a low-
frequency loudspeaker
drivers’ magnet assembly
• 2x temperature sensors —
each monitoring a high-
frequency loudspeaker
drivers’ magnet assembly
• 2x orientation sensors —
detecting Audio Module’s
orientation
11
1
1
2
2
2
23
3
3
3
The MD80-S integrates the following active electronic
components in its glass ber polycarbonate enclosure:
X1 Modul 80-S
An 18-inch sensor-controlled
subwoofer driver with two
high energy, high-density
neodymium-iron-boron magnets
in a bandpass enclosure
Glass ber-reinforced
polycarbonate enclosure
Air-ow optimized
subwoofer ports
16x 5-inch low-frequency cone
loudspeaker drivers in individual
dual-ported chambers
64x 1.3-inch high-frequency
soft-dome loudspeaker
drivers coupled with individual
wave guides — delivering
powerful sound with a studio-
grade brilliance
Metal grille and hydrophobic,
damp, and dust repellent
acoustic cloth - protecting the
HF and LF drivers
Wooden extension housing

17X1 MD80-S Manual 1.0 en X1 Modul 80-S
THE ELECTRONICS PACKAGE
The Electronics Package is fabricated of aluminum
alloy and houses the main electronic components. It is
both the brain and powerhouse of the Audio Module,
integrating processor and amplication.
The Electronics Package connects to the Loudspeaker
Cabinet through two 108-pin connectors, which carry the
amplied loudspeaker signals, a digital bus, and power
for the active electronic components in the front of the
Audio Module.
The Electronics Package integrates:
• 5x 16-channel digital amplier modules — providing
individual amplication and DSP control to each of
the 80 drivers in the rst two matrix layers
• 2x AC to DC amplier “Smart Rail” power supply
modules
• 2x DC amplier energy storage modules
• the “Core” — integrating a processing module
combining a high-performance Field Programmable
Gate Array (FPGA) and a dual-core ARM®
Cortex™-A9, with an independent AC to DC ancillary
power supply
• an optional “Dante Module” — providing Dante audio
networking connectivity
• 8x temperature-controlled fans — actively cooling
the Electronics Package
• the “Display Panel” — providing information on the
Audio Module’s ID and status
THE DISPLAY PANEL
The backside of the Electronics Package integrates
the Display Panel, which displays Audio Module status
and error messages, and provides basic information
like IP addresses and rmware version. The resistive
touch screen responds to pressure and therefore can be
operated by a ngertip, even when wearing gloves, or by
an appropriate stylus tip (pen).
“Reset”
pin-hole switch
“Test”
pin-hole switch
2x LEDs for contextual Audio
Module status display
• the upper LED lights up
blue when Audio Module
is in factory mode
• the lower LED mirrors
the behavior of the four
RGB LEDs on the front of
the Loudspeaker Cabinet
3.5” TFT color touch screen
with a resolution of 320 x 240
pixels screen: displays the serial
number, rmware version,
IP addresses, Audio Module
state, and error messages in
case a fault was detected
LED labeled “STATUS” for
general Audio Module status
indication, which lights up
red if an error is detected
and is off otherwise
LED labeled “POWER” for
Audio Module power status
indication, which lights up
green as soon as the Audio
Module is powered on
i
The touch screen utilizes a thin
exible sheet that may be damaged
by sharp objects or heavy treatment.

18X1 MD80-S Manual 1.0 en
K
R
O
W
T
E
N
Secondary
Uplink
Secondary
Downlink
Primary
Downlink
Primary
Uplink
K
N
I
L
O
L
O
H
A
B
1
2
K
N
I
L
B
U
S
N
I
Do not connect
under load
T
U
O
AC Output:
240V~9.5A
208V~9A
AC Input Range:
115-240V
50-60Hz
AC Input:
115V~6.5A
240V~12.8A
AC Input Range:
115–240 V
50–60 Hz
AC Input:
115 V~1.1 A
240 V~0.9 A
Do not connect
under load
Only power from
Electronics Package
at Power IN ≥ 208 V
SUBLINK
IN
X1 Modul 80-S
THE CONNECTOR PANELS
CONNECTORS ON THE ELECTRONICS PACKAGE
Control Network & Dante Audio Network
Four etherCON standard RJ45 networking connections
for redundant control and Dante audio networking
connectivity: two for primary up- and downlink, and two
for secondary up- and downlink.
Hololink
HoloLink connectors carry HOLOPLOT proprietary audio
networking protocols, used for special purposes.
SubLink
Two SubLink etherCON RJ45 networking connections
which can be utilized to provide audio signal to the
subwoofer amplier module integrated into the
Loudspeaker Cabinet of the MD80-S, and to standalone
Subwoofer Modules offered by HOLOPLOT in the future.
SubLink connectors carry HOLOPLOT proprietary audio
networking protocols.
Power connections
An Amphenol HP-3-MDQ AC Power IN connector
providing AC power to the Audio Module and an
Amphenol HP-3-MDGQ connector for AC Power OUT
providing power to the subwoofer integrated into the
Loudspeaker Cabinet.
CONNECTORS ON THE LOUDSPEAKER CABINET
SubLink for the integrated subwoofer
A SubLink RJ45 network port for receiving audio signal
from the Electronics Package.
Power IN for the subwoofer electronics
An Amphenol HP-3-MDQ AC Power IN connector to
provide AC power for the subwoofer amplier module.

19X1 MD80-S Manual 1.0 en
Installation Requirements and Recommendations
Installation and Cooling Requirements
HANDLING THE AUDIO MODULE
STORING
Audio Modules shall be contained in their packaging or
travel cases to protect from damage, until installation.
INSTALLATION
• Audio Modules shall be kept on a at, even, and
stable surface with sufcient load-carrying capacity,
to prevent them falling or tipping.
• Audio Modules shall not be lifted by any other means
than the rigging points identied.
• Audio Modules shall only be ‘stood’ on the bottom,
top, or sides. They shall not be stood on the
Electronics Package (rear of Audio Module) or front
grille. Standing in any other way can damage the
Audio Module.
The Modul 80-S is a heavy device
and should not be carried by
operators, or handled without
suitable equipment.
!
Disconnect the Modul 80-S from
both power connections before
handling/moving/rigging the device
to avoid shock hazard.

20X1 MD80-S Manual 1.0 en
RIGGING POINTS
The Modul 80-S provides eight M10x1.5 threaded rigging
attachment points made of stainless steel (EN 1.4305 /
AISI 303), four front-facing and four rear-facing. The
M10x1.5 threads are integrated on both ends of four
so-called “Suspension Bolts” that are integrated into the
Loudspeaker Cabinet. These rigging points are intended
for direct attachment to a rigid rigging system, and for
supporting the Audio Module.
There are two additional M10x1.5 threaded safety points
(EN 1.4305 / AISI 303) integrated on the back of the Audio
Module for secondary safety cable attachment (optional).
To safely rig the MD80-S, all eight
M10 points must be used together.
Each rigging screw shall be xed
with an appropriate torque not
exceeding 65 Nm.
!
IMPORTANT SAFETY AND LEGAL NOTE:
A rigging system must be designed and used in
accordance with local, state, federal, and industry
regulations. It is the user’s responsibility to
evaluate the reliability of any rigging method
for their application. Rigging should only be
designed and carried out by experienced
professionals. Any rigging design must be veried
and approved by a qualied structural engineer.
HOLOPLOT cannot take any liability and
responsibility for any custom rigging system.
RIGGING THE AUDIO MODULE
HOLOPLOT currently does not offer any general rigging
options for X1 Audio Modules. The following information
is intended to enable a third party to design a custom
rigging system.
3D CAD les of the Audio Modules are
available from HOLOPLOT on request.
FRONT
800
600
30 30
225225
Installation and Cooling Requirements
All measurements given in mm
BACK
30
165
30
165
BACK
30 30
225225
600