HP Pavilion Notebook PC 17 Installation instructions

EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Notebooks and Tablet PCs
Marketing Name / Model
[List multiple models if applicable.]
HP Pavilion Notebook PC 17
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
1
Batteries
All types including standard alkaline and lithium coin
or button style batteries battery cell , RTC battery
2
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
1
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
0
External electrical cables and cords
power cord
1
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
0

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Template Revision B
PSG instructions for this template are available at EL-MF877-01
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1
#1
Description #2
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove battery
2. Remove BASE screw*14
3. Disassemble Base
4. Pull out antenna, LCD cable, speaker-R, and FFC*5 (HDD, Touchpad, Keyboard Membrane, Keyboard BLK, DB board
5. Dis-fasten CPU, GPU, Fan screw*9 and remove fan, thermal module
6. Pull out DC-in cable and speaker -L cable
7. Dis-fasten MB screw*1, speaker screw*4, DB board screw*2, and remove HDD, speaker L&R
8. Remove MB and DB board
9. Dis-fasten midle cap screw*2 and hinge screw*3
10. Disassemble Top assy and LCD assy
11. Dis assemble LCD bezel
12. Dis-fasten panel screw*4, hinge screw*6
13. Remove panel, hinge
14. Dis-fasten inner cap screw*4
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
1. Remove battery

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Template Revision B
PSG instructions for this template are available at EL-MF877-01
2. Disassemble Base case
3. Dis-fasten CPU, GPU, Fan screw*9 and remove fan, thermal module
4. Dis-fasten middle cap screw*2 and hinge screw*3,

EL-MF877-00 Page 4
Template Revision B
PSG instructions for this template are available at EL-MF877-01
5. Dis-assemble LCD ASSY
6. Total part disassembly

EL-MF877-00 Page 5
Template Revision B
PSG instructions for this template are available at EL-MF877-01