Intel D810E2CA3 User manual

Intel®Desktop Board
D810E2CA3
Technical Product Specification
February 2001
Order Number A43979-001
The Intel®Desktop Board D810E2CA3 may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current
characterized errata are documented in the Intel Desktop Board D810E2CB Specification Update.

Revision History
Revision Revision History Date
-001 First release of the Intel®Desktop Board D810E2CA3 Technical Product
Specification February 2001
This product specification applies only to the standard D810E2CA3 board with BIOS identifier
CA81030A.86A.
Changes to this specification will be published in the D810E2CA3 Monthly Specification Update
before being incorporated into a revision of this document.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL®PRODUCTS. EXCEPT AS
PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY
WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE
OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR
PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL
PROPERTY RIGHT.
Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property
rights that relate to the presented subject matter. The furnishing of documents and other materials and information does
not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other
intellectual property rights.
Intel products are not intended for use in medical, life saving, or life sustaining applications or for any other application in
which the failure of the Intel product could create a situation where personal injury or death may occur.
Intel may make changes to specifications and product descriptions at any time, without notice.
The Intel®Desktop Board D810E2CA3 may contain design defects or errors known as errata that may cause the product to
deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be
obtained from:
Intel Corporation
P.O. Box 5937
Denver, CO 80217-9808
or call in North America 1-800-548-4725, Europe 44-0-1793-431-155, France 44-0-1793-421-777,
Germany 44-0-1793-421-333, other Countries 708-296-9333.
†Third-party brands and names are the property of their respective owners.
Copyright 2001 Intel Corporation. All rights reserved.

iii
Preface
This Technical Product Specification (TPS) specifies the board layout, components, connectors,
power and environmental requirements, and BIOS for the Intel®D810E2CA3 desktop board. It
describes the standard board product and available manufacturing options.
Intended Audience
The TPS is intended to provide detailed, technical information about the board and its components
to the vendors, system integrators, and other engineers and technicians who need this level of
information. It is specifically not intended for general audiences.
What This Document Contains
Chapter Description
1 A description of the hardware used on this board
2 A map of the resources of the board
3 The features supported by the BIOS Setup program
4 The contents of the BIOS Setup program’s menus and submenus
5 A description of the BIOS error messages, beep codes, and Power-On Self-Test
(POST) codes
Typographical Conventions
This section contains information about the conventions used in this specification. Not all of these
symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
✏NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
WARNING
Warnings indicate conditions that, if not observed, can cause personal injury.

Intel Desktop Board D810E2CA3 Technical Product Specification
iv
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#).
(NxnX) When used in the description of a component, N indicates component type, xn are the
relative coordinates of its location on the board, and X is the instance of the particular part at
that general location. For example, J5J1 is a connector, located at 5J. It is the first
connector in the 5J area.
GB Gigabyte (1,073,741,824 bytes)
KB Kilobyte (1024 bytes)
Kbit Kilobit (1024 bits)
kbits/sec 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/sec Megabytes per second
Mbit Megabit (1,048,576 bits)
Mbit/sec Megabits per second
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
†This symbol is used to indicate third-party brands and names that are the property of their
respective owners.

v
Contents
1Desktop Board Description
1.1 Overview ....................................................................................................................12
1.1.1 Feature Summary ........................................................................................12
1.1.2 Manufacturing Options.................................................................................13
1.1.3 Board Layout................................................................................................14
1.1.4 Block Diagram..............................................................................................15
1.2 Online Support ...........................................................................................................16
1.3 Design Specifications .................................................................................................16
1.4 Processor...................................................................................................................19
1.5 System Memory .........................................................................................................20
1.6 Intel®810E2 Chipset ..................................................................................................21
1.6.1 USB..............................................................................................................22
1.6.2 IDE Interfaces ..............................................................................................22
1.6.3 Real-Time Clock, CMOS SRAM, and Battery...............................................23
1.6.4 SST 49LF004A 4 Mbit Firmware Hub (FWH) ...............................................23
1.7 I/O Controller..............................................................................................................24
1.7.1 Serial Ports ..................................................................................................24
1.7.2 Parallel Port..................................................................................................24
1.7.3 Diskette Drive Controller ..............................................................................25
1.7.4 Keyboard and Mouse Interface ....................................................................25
1.8 Graphics Subsystem ..................................................................................................26
1.8.1 Integrated Graphics Controller .....................................................................26
1.8.2 Digital Video Output (DVO) Connector (Optional) ........................................28
1.9 Audio Subsystem........................................................................................................29
1.9.1 AD1885 Analog Codec.................................................................................29
1.9.2 Audio Connectors.........................................................................................30
1.10 LAN Subsystem (Optional).........................................................................................31
1.10.1 Intel®82562ET Platform LAN Connect Device.............................................31
1.10.2 RJ-45 LAN Connector LEDs.........................................................................31
1.11 CNR (Optional)...........................................................................................................32
1.12 Hardware Management Subsystem (Optional)...........................................................33
1.12.1 Hardware Monitor Component .....................................................................33
1.12.2 Fan Control and Monitoring..........................................................................33
1.13 Power Management Features ....................................................................................34
1.13.1 Software Support .........................................................................................34
1.13.2 Hardware Support........................................................................................38
2Technical Reference
2.1 Introduction.................................................................................................................43
2.2 Memory Map ..............................................................................................................43
2.3 I/O Map .....................................................................................................................44
2.4 DMA Channels ...........................................................................................................45
2.5 PCI Configuration Space Map....................................................................................46

Intel Desktop Board D810E2CA3 Technical Product Specification
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2.6 Interrupts....................................................................................................................46
2.7 PCI Interrupt Routing Map..........................................................................................47
2.8 Connectors.................................................................................................................48
2.8.1 Back Panel Connectors................................................................................49
2.8.2 Internal I/O Connectors................................................................................53
2.8.3 External I/O Connectors...............................................................................63
2.9 Jumper Blocks............................................................................................................66
2.9.1 BIOS Setup Configuration Jumper Block......................................................67
2.9.2 USB Port 0 Configuration Jumper Block.......................................................67
2.10 Mechanical Considerations.........................................................................................68
2.10.1 Form Factor .................................................................................................68
2.10.2 I/O Shield.....................................................................................................69
2.11 Electrical Considerations............................................................................................70
2.11.1 Power Consumption.....................................................................................70
2.11.2 Add-in Board Considerations........................................................................70
2.11.3 Standby Current Requirements....................................................................71
2.11.4 Fan Power Requirements.............................................................................72
2.11.5 Power Supply Considerations ......................................................................72
2.12 Thermal Considerations..............................................................................................73
2.13 Reliability....................................................................................................................74
2.14 Environmental Specifications......................................................................................75
2.15 Regulatory Compliance ..............................................................................................75
2.15.1 Safety Regulations.......................................................................................75
2.15.2 EMC Regulations .........................................................................................76
2.15.3 Product Certification Markings (Board Level) ...............................................76
3Overview of BIOS Features
3.1 Introduction.................................................................................................................77
3.2 BIOS Flash Memory Organization..............................................................................77
3.3 Resource Configuration..............................................................................................78
3.3.1 PCI Autoconfiguration ..................................................................................78
3.3.2 IDE Support .................................................................................................78
3.4 System Management BIOS (SMBIOS).......................................................................78
3.5 Legacy USB Support..................................................................................................79
3.6 BIOS Updates ............................................................................................................80
3.6.1 Language Support........................................................................................80
3.6.2 Custom Splash Screen.................................................................................80
3.7 Recovering BIOS Data ...............................................................................................81
3.8 Boot Options...............................................................................................................82
3.8.1 CD-ROM and Network Boot.........................................................................82
3.8.2 Booting Without Attached Devices...............................................................82
3.9 Fast Booting Systems with Intel®Rapid BIOS Boot....................................................82
3.9.1 Peripheral Selection and Configuration ........................................................82
3.9.2 Intel Rapid BIOS Boot..................................................................................83
3.9.3 Operating System ........................................................................................83
3.10 BIOS Security Features..............................................................................................84

Contents
vii
4BIOS Setup Program
4.1 Introduction.................................................................................................................85
4.2 Maintenance Menu.....................................................................................................86
4.2.1 Extended Configuration Submenu................................................................87
4.3 Main Menu..................................................................................................................88
4.4 Advanced Menu..........................................................................................................89
4.4.1 PCI Configuration Submenu.........................................................................90
4.4.2 Boot Configuration Submenu .......................................................................91
4.4.3 Peripheral Configuration Submenu...............................................................92
4.4.4 IDE Configuration Submenu.........................................................................94
4.4.5 Diskette Configuration Submenu..................................................................96
4.4.6 Event Log Configuration...............................................................................97
4.4.7 Video Configuration Submenu......................................................................98
4.5 Security Menu ............................................................................................................99
4.6 Power Menu.............................................................................................................100
4.7 Boot Menu................................................................................................................101
4.8 Exit Menu .................................................................................................................102
5Error Messages and Beep Codes
5.1 BIOS Error Messages...............................................................................................103
5.2 Port 80h POST Codes..............................................................................................105
5.3 Bus Initialization Checkpoints...................................................................................109
5.4 Speaker ...................................................................................................................110
5.5 BIOS Beep Codes....................................................................................................111
Figures
1. D810E2CA3 Board Components................................................................................14
2. Board Block Diagram..................................................................................................15
3. Intel 810E2 Chipset Block Diagram............................................................................21
4. Block Diagram of Audio Subsystem............................................................................29
5. ICH2 and CNR Signal Interface..................................................................................32
6. Using the Wake on LAN Technology Connector.........................................................39
7. Location of Standby Power Indicator LED ..................................................................41
8. Back Panel Connectors..............................................................................................49
9. Audio, Video, Power, and Hardware Control Connectors ...........................................54
10. Add-in Board and Peripheral Interface Connectors.....................................................58
11. External I/O Connectors.............................................................................................63
12. Location of the Jumper Blocks....................................................................................66
13. Board Dimensions......................................................................................................68
14. Back Panel I/O Shield Dimensions.............................................................................69
15. High-Temperature Zones............................................................................................73

Intel Desktop Board D810E2CA3 Technical Product Specification
viii
Tables
1. Feature Summary.......................................................................................................12
2. Manufacturing Options ...............................................................................................13
3. Specifications .............................................................................................................16
4. Supported Processors................................................................................................19
5. System Memory Configurations..................................................................................20
6. Supported Graphics Refresh Frequencies..................................................................27
7. LAN Connector LED States........................................................................................31
8. APM Wake Up Devices and Events............................................................................35
9. Effects of Pressing the Power Switch.........................................................................36
10. Power States and Targeted System Power................................................................37
11. Wake Up Devices and Events ....................................................................................37
12. Fan Connector Descriptions.......................................................................................39
13. System Memory Map..................................................................................................43
14. I/O Map ......................................................................................................................44
15. DMA Channels ...........................................................................................................45
16. PCI Configuration Space Map....................................................................................46
17. Interrupts....................................................................................................................46
18. PCI Interrupt Routing Map..........................................................................................47
19. PS/2 Keyboard/Mouse Connectors.............................................................................50
20. RJ-45 LAN Connector (Optional)................................................................................50
21. USB Connectors.........................................................................................................50
22. VGA Connector ..........................................................................................................51
23. Parallel Port Connector...............................................................................................51
24. Serial Port A Connector..............................................................................................52
25. Audio Line Out Connector ..........................................................................................52
26. Audio Line In Connector.............................................................................................52
27. Audio Mic In Connector..............................................................................................52
28. ATAPI CD-ROM Connector (J2D1) ............................................................................55
29. Front Panel Audio Connector (J2E1)..........................................................................55
30. Auxiliary Line In Connector (J2E2) .............................................................................55
31. Optional Digital Video Out Connector (J2G2).............................................................56
32. Processor Fan Connector (J2K1) ..............................................................................56
33. Chassis Fan Connector (J2G1) ..................................................................................56
34. Power Connector (J8G1)............................................................................................57
35. Optional Wake on LAN Technology Connector (J7A1)..............................................57
36. CNR Connector (J3A1)...............................................................................................59
37. PCI Bus Connectors (J3A2, J3B1, J3C1, J3D1).........................................................60
38. Diskette Drive Connector (J7E1) ................................................................................61
39. IDE Connectors (J8D1, J8D2)....................................................................................62
40. Serial Port B Connector (J1E2) ..................................................................................64
41. Front Panel USB Connector (J8B1)............................................................................64
42. Auxiliary Front Panel Power LED Connector (J8A3)...................................................64
43. Front Panel Connector (J8B2)....................................................................................64
44. States for a Single-colored Power LED.......................................................................65
45. States for a Dual-colored Power LED.........................................................................65
46. BIOS Setup Configuration Jumper Settings................................................................67

Contents
ix
47. USB Port 0 Configuration Jumper Settings.................................................................67
48. Power Usage..............................................................................................................70
49. Standby Current Requirements..................................................................................71
50. Fan DC Power Requirements.....................................................................................72
51. Thermal Considerations for Components ...................................................................74
52. Environmental Specifications......................................................................................75
53. Safety Regulations .....................................................................................................75
54. EMC Regulations........................................................................................................76
55. Supervisor and User Password Functions..................................................................84
56. BIOS Setup Program Menu Bar .................................................................................85
57. Setup Function Keys ..................................................................................................86
58. Maintenance Menu.....................................................................................................86
59. Extended Configuration Menu....................................................................................87
60. Main Menu..................................................................................................................88
61. Advanced Menu..........................................................................................................89
62. PCI Configuration Submenu.......................................................................................90
63. Boot Setting Configuration Submenu..........................................................................91
64. Peripheral Configuration Submenu.............................................................................92
65. IDE Device Configuration ...........................................................................................94
66. IDE Configuration Submenus .....................................................................................95
67. Diskette Configuration Submenu................................................................................96
68. Event Log Configuration Submenu.............................................................................97
69. Video Configuration Submenu....................................................................................98
70. Security Menu ............................................................................................................99
71. Power Menu.............................................................................................................100
72. Boot Menu................................................................................................................101
73. Exit Menu .................................................................................................................102
74. BIOS Error Messages...............................................................................................103
75. Uncompressed INIT Code Checkpoints....................................................................105
76. Boot Block Recovery Code Checkpoints ..................................................................105
77. Runtime Code Uncompressed in F000 Shadow RAM ..............................................106
78. Bus Initialization Checkpoints...................................................................................109
79. Upper Nibble High Byte Functions............................................................................109
80. Lower Nibble High Byte Functions............................................................................110
81. Beep Codes..............................................................................................................111

Intel Desktop Board D810E2CA3 Technical Product Specification
x

11
1 Desktop Board Description
What This Chapter Contains
1.1 Overview ....................................................................................................................12
1.2 Online Support ...........................................................................................................16
1.3 Design Specifications .................................................................................................16
1.4 Processor...................................................................................................................19
1.5 System Memory .........................................................................................................20
1.6 Intel®810E2 Chipset ..................................................................................................21
1.7 I/O Controller..............................................................................................................24
1.8 Graphics Subsystem ..................................................................................................26
1.9 Audio Subsystem........................................................................................................29
1.10 LAN Subsystem (Optional).........................................................................................31
1.11 CNR (Optional)...........................................................................................................32
1.12 Hardware Management Subsystem (Optional)...........................................................33
1.13 Power Management Features ....................................................................................34

Intel Desktop Board D810E2CA3 Technical Product Specification
12
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the D810E2CA3 board’s major features.
Table 1. Feature Summary
Form Factor microATX (9.6 inches by 8.0 inches)
Processor Support for either an Intel®Pentium®III processor in a Flip Chip Pin Grid Array
(FC-PGA) package or an Intel®Celeron™processor in an FC-PGA package or
a PPGA package
Memory • Two 168-pin Dual Inline Memory Module (DIMM) sockets
• Support for up to 512 MB of 100 MHz non-ECC, unbuffered synchronous
DRAM (SDRAM)
• Support for serial presence detect (SPD) and non-SPD DIMMs
Chipset The Intel®810E2 chipset, consisting of:
• Intel®82810E DC-133 Graphics and Memory Controller Hub (GMCH)
• Intel®82801BA I/O Controller Hub (ICH2)
• SST 49LF004A 4 Mbit firmware hub (FWH)
I/O Control SMSC LPC47M102 low pin count (LPC) interface I/O controller
Video Intel 82810E DC-133 Graphics and Memory Controller Hub (integrated in the
chipset) with an optional 4 MB of 133 MHz display cache
Audio • Intel 82801BA ICH2 digital controller (AC link output)
• Analog Devices AD1885 Audio Codec
Peripheral Interfaces • Four Universal Serial Bus (USB) ports
• Two IDE interfaces with Ultra DMA, ATA-66/100 support
• One diskette drive interface
• Two serial ports
• One parallel port
• PS/2 keyboard and mouse ports
Expansion
Capabilities Four PCI-bus add-in card connectors
BIOS • Intel/AMI BIOS stored in an SST 49LF004A 4 Mbit firmware hub (FWH)
• Support for SMBIOS, Advanced Configuration and Power Management
Interface (ACPI), Advanced Power Management (APM), and Plug and Play
Instantly Available PC • Support for
PCI Local Bus Specification Revision 2.2
• Suspend to RAM support
• Wake on PS/2†keyboard and USB ports
For information about Refer to
The board’s compliance level with ACPI, APM, Plug and Play, and SMBIOS Table 3, page 16

Desktop Board Description
13
1.1.2 Manufacturing Options
Table 2 describes the board’s manufacturing options. Not all of the following manufacturing
options are available in all marketing channels. Please contact your Intel representative to
determine what manufacturing options are available to you.
Table 2. Manufacturing Options
Video Digital video output (DVO) connector
Hardware Monitor
Subsystem • Wired for Management (WfM) compliant
• Voltage sensor to detect out of range values
Communication and
Networking Riser (CNR)
Connector
One CNR connector (shared with slot 4)
LAN Subsystem Intel®82562ET 10/100 Mbit/sec Platform LAN Connect (PLC) device
Wake on LAN†
Technology Connector Support for system wake up using an add-in network interface card with
remote wake up capability

Intel Desktop Board D810E2CA3 Technical Product Specification
14
1.1.3 Board Layout
Figure 1 shows the major components of the D810E2CA3 desktop board.
OM11030
D
CB
F
E
G
L KN M IJ H
O
A
S
U
R
P
T
Q
A AD1885 audio codec M Front panel USB
B Serial port B connector N Front panel connector
C SMSC LPC47M102 I/O controller O Intel 82801BA I/O Controller Hub (ICH2)
D Back panel connectors P Intel®82802AB Firmware Hub (FWH)
E DVO connector (optional) Q Battery
F Processor socket
G DIMM sockets R Intel 82810E DC-133 Graphics and Memory
Controller Hub (GMCH)
H Power connector S PCI bus add-in card connectors
I Diskette drive connector T 4 MB display cache (optional)
J Speaker
K Secondary IDE connector U Communications and Networking Riser (CNR)
connector (optional)
L Primary IDE connector
Figure 1. D810E2CA3 Board Components

Desktop Board Description
15
1.1.4 Block Diagram
Figure 2 is a block diagram of the major functional areas of the D810E2CA3 board.
810E2 Chipset
Processor
Connector
DIMM
Banks
(2)
Primary/
Secondary IDE
Interface ATA-66/100
USB
66/100/133 MHz
System Bus
Hardware
Monitor
(Optional)
82801BA I/O Controller
Hub (ICH2)
82810E
Graphics Memory
Controller Hub
(GMCH)
SST 49LF004A
Firmware Hub
(FWH)
100 MHz
SDRAM
Bus AHA
Bus
4 MB
Display
Cache
(Optional)
OM11131
Diskette Drive
Connector
LPC I/O
Controller
PS/2 Keyboard
PS/2 Mouse
Parallel Port
Serial Port A
Serial Port B
LPC
Bus
SMBus
PCI Bus PCI Slot 1
PCI Slot 2
PCI Slot 3
PCI Slot 4
DVO
Connector
(Optional)
Digital Video
Output
USB Ports 0 and 1
USB Ports 2 and 3
VGA Port
Audio
Codec
Line Out
Line In
Mic In
CD-ROM
Auxiliary Line In
AC Link
Optional
AC Link
CNR
Connector
LAN
Connector
Physical
Layer
Interface
CSMA/CD
Unit
Interface
Display
Interface
Figure 2. Board Block Diagram

Intel Desktop Board D810E2CA3 Technical Product Specification
16
1.2 Online Support
To find information about… Visit this World Wide Web site:
Intel’s D810E2CA3 board under “Product Info” or
“Customer Support” http://www.intel.com/design/motherbd/ http://support.intel.com/support/motherboards/desktop
Processor data sheets http://www.intel.com/design/litcentr
Proper date access in systems with
Intel®motherboards http://support.intel.com/support/year2000
ICH2 addressing http://developer.intel.com/design/chipsets/datashts
Custom splash screens http://intel.com/design/motherbd/gen_indx.htm
Audio software and utilities http://www.intel.com/design/motherbd
LAN software and drivers http://www.intel.com/design/motherbd
Graphics software and utilities http://www.intel.com/design/motherbd
1.3 Design Specifications
Table 3 lists the specifications applicable to the D810E2CA3 board.
Table 3. Specifications
Reference
Name Specification Title Version, Revision Date, and Ownership The information is available from…
AC ‘97 Audio Codec ‘97 Version 2.1,
May 1998,
Intel Corporation.
ftp://download.intel.com/ial/
scalableplatforms/ac97r22.pdf
ACPI Advanced Configuration
and Power Interface
Specification
Version 2.0,
July 27, 2000,
Compaq Computer Corp.,
Intel Corporation,
Microsoft Corporation,
and Toshiba Corporation.
http://www.teleport.com/~acpi/
AGP Accelerated Graphics Port
Interface Specification
Version 2.0,
May 4, 1998,
Intel Corporation.
http://www.agpforum.org/
AMI BIOS American Megatrends
BIOS Specification
AMIBIOS 99,
1999,
American Megatrends, Inc.
http://www.amij.com/amibios/
bios.platforms.desktop.html
APM Advanced Power
Management BIOS
Interface Specification
Version 1.2,
February 1996,
Intel Corporation,
Microsoft Corporation.
http://www.microsoft.com/
hwdev/busbios/amp_12.htm
ATA/
ATAPI-5
Information Technology -
AT Attachment with Packet
Interface -5,
(ATA/ATAPI-5)
Revision 3
February 29, 2000,
Contact: T13 Chair,
Seagate Technology
http://www.t13.org
continued

Desktop Board Description
17
Table 3. Specifications (continued)
Reference
Name Specification Title Version, Revision Date and Ownership The information is available from…
ATX ATX Specification Version 2.03,
December 1998,
Intel Corporation.
http://www.teleport.com/
~ffsupprt/
BIS Boot Integrity Services Version 1.0 for WfM 2.0,
August 1999,
Intel Corporation.
http://developer.intel.com/
design/security/bis/
bisfaq.htm
CNR
Communication and
Network Riser (CNR)
Specification
Version 1.1,
October 18, 2000,
Intel Corporation.
http://developer.intel.com/
technology/cnr/index.htm
DVI
Digital Visual Interface
DVI
Revision 1.0,
April 2, 1999,
Intel Corporation,
Silicon Image Incorporated,
Compaq Computer Corporation,
Fujitsu Limited,
Hewlett-Packard, and
NEC Corporation.
http://www.ddwg.org/
downloads.html
EPP IEEE std 1284.1-1997
Enhanced Parallel Port
Version 1.7,
1997,
Institute of Electrical and
Electronic Engineers.
http://standards.ieee.org/
reading/ieee/std_public/
description/busarch/
1284.1-1997_desc.html
El Torito Bootable CD-ROM
Format Specification
Version 1.0,
January 25, 1995,
Phoenix Technologies Ltd., and
IBM Corporation.
http://www.ptltd.com/
techs//specs.html
LPC Low Pin Count Interface
Specification
Version 1.0,
September 29, 1997,
Intel Corporation.
http://www.intel.com/
design/chipsets/industry/
lpc.htm
PCI PCI Local Bus
Specification
Version 2.2,
December 18, 1998,
PCI Special Interest Group.
http://www.pcisig.com/
PCI Bus Power
Management Interface
Specification
Version 1.1,
December 18, 1998,
PCI Special Interest Group.
http://www.pcisig.com/
Plug and Play Plug and Play BIOS
Specification
Version 1.0a,
May 5, 1994,
Compaq Computer Corp.,
Phoenix Technologies Ltd.,
and Intel Corporation.
http://www.microsoft.com/
hwdev/respec/
pnpspecs.htm
PXE Preboot Execution
Environment
Version 2.1,
September 1999,
Intel Corporation.
http://developer.intel.com/
ial/WfM/wfm20/design/
mapxe/index.htm
continued

Intel Desktop Board D810E2CA3 Technical Product Specification
18
Table 3. Specifications (continued)
Reference
Name Specification Title Version, Revision Date and Ownership The information is available from…
SDRAM PC SDRAM Unbuffered
DIMM Specification
Revision 1.0,
February 1998,
Intel Corporation.
http://www.intel.com/
design/chipsets/memory
PC SDRAM DIMM
Specification Revision 1.7, November 1999,
Intel Corporation.
http://www.intel.com/
technology/memory
PC Serial Presence
Detect (SPD)
Specification
Revision 1.2B,
November 1999,
Intel Corporation.
http://www.intel.com/
technology/memory
SMBIOS System Management
BIOS
Version 2.3.1,
March 16, 1999,
American Megatrends Inc.,
Award Software International Inc.,
Compaq Computer Corporation
Dell Computer Corporation,
Hewlett-Packard Company,
Intel Corporation,
International Business Machines
Corporation,
Phoenix Technologies Limited,
and SystemSoft Corporation.
http://developer.intel.com/
ial/wfm/design/smbios
UHCI Universal Host Controller
Interface Design Guide
Version 1.1,
March 1996,
Intel Corporation.
http://www.usb.org/
developers
USB Universal Serial Bus
Specification
Version 1.1,
September 23, 1998,
Compaq Computer Corporation,
Intel Corporation,
Microsoft Corporation, and
NEC Corporation.
http://www.usb.org/
developers
WfM Wired for Management
Baseline
Version 2.0,
December 18, 1998,
Intel Corporation.
http://developer.intel.com/
ial/WfM/wfmspecs.htm

Desktop Board Description
19
1.4 Processor
CAUTION
Use only the processors listed below. Use of unsupported processors can damage the D810E2CA3
board, the processor, and the power supply. See the Intel Desktop Board D810E2CA3
Specification Update for the most up-to-date list of supported processors for the D810E2CA3
board.
The D810E2CA3 board supports either an Intel Pentium III processor (FC-PGA package), or an
Intel Celeron processor (PGA package). The system bus speed is automatically selected. The
board supports the processors listed in Table 4.
Table 4. Supported Processors
Processor Speed Processor Speed System Bus Frequency L2 Cache Size
500E, 550E, 600, 650, 700,
750, 800, and 850 MHz 100 MHz 256 KB
533EB, 600EB, 667, 733,
800EB, 866, and 933 MHz 133 MHz 256 KB
Pentium III processor
1.0B GHz 133 MHz 256 KB
400, 433, 466, 500, 533A,
566A, 600, 633, 667, 700, 733,
and 766 MHz
66 MHz 128 KBCeleron processor in an
FC-PGA package
800 MHz 100 MHz 128 KB
All supported onboard memory can be cached, up to the cachability limit of the processor. See the
processor’s data sheet for cachability limits.
For information about Refer to
Processor support Section 1.2, page 16
Processor data sheets Section 1.2, page 16

Intel Desktop Board D810E2CA3 Technical Product Specification
20
1.5 System Memory
CAUTION
Before installing or removing memory, disconnect AC power by unplugging the power cord from
the computer. Failure to do so could damage the memory and the board.
✏NOTE
To be fully compliant with all applicable Intel
®
SDRAM memory specifications, the board should
be populated with DIMMs that support the Serial Presence Detect (SPD) data structure. If your
memory module does not support SPD, you will see a notification to this effect on the screen at
power-up. The BIOS will attempt to configure the memory controller for normal operation;
however, DIMMs may not function at the determined frequency.
✏NOTE
Because the main system memory is also used as video memory, the board requires 66 MHz or
100 MHz SDRAM DIMMs. It is highly recommended that SPD DIMMs be used, since this allows
the BIOS to read the SPD data and program the chipset to accurately configure memory settings
for optimum performance. If non-SPD memory is installed, the BIOS will attempt to correctly
configure the memory settings, but performance and reliability may be impacted.
The board has two DIMM sockets. SDRAM can be installed in one or both sockets. Minimum
memory size is 64 MB; maximum memory size is 512 MB. The BIOS automatically detects
memory type, size, and speed. Due to the video requirements of the D810E2CA3 board, most
configurations require at least 64 MB of memory.
The board supports memory with the following features:
• 3.3V, 168-pin DIMMs with gold-plated contacts
• 100 MHz unbuffered SDRAM
• Non-ECC (64-bit) memory
• Serial Presence Detect (SPD) or non-SPD memory (BIOS recovery requires SPD DIMMs)
• Unbuffered single- or double-sided DIMMs
This board is designed to support DIMM configurations listed in Table 4 below.
Table 5. System Memory Configurations
DIMM Size Non-ECC Configuration
16 MB 2 Mbit x 64
32 MB 4 Mbit x 64
64 MB 8 Mbit x 64
128 MB 16 Mbit x 64
256 MB (Note) 32 Mbit x 64
Note: A 256 MB DIMM used with this board must be built with 128 Mbit device technology.