LG OLED48C1PT Series User manual

P/NO : MFL71796402 (2102-REV01)
CHASSIS : EB11C / ED11C
MODEL : OLED48C1*L*
OLED48C1PVB / PT*
CAUTION
BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
OLED TV
SERVICE MANUAL
Copyright © 2021 LG Electronics Inc. All rights reserved. Only training and service purposes.
Any reproduction, duplication, distribution (including by way of email, facsimile or other electronic means),
publication, modification, copying or transmission of this Service Manual is STRICTLY PROHIBITED unless you
have obtained the prior written consent of the LG Electronics entity from which you received this Service Manual.
The material covered by this prohibition includes, without limitation, any text, graphics or logos in this Service
Manual.

- 2 - Copyright © LG Electronics Inc. All rights reserved.
Only training and service purposes.
CONTENTS
CONTENTS .............................................................................................. 2
SAFETY PRECAUTIONS ........................................................................ 3
SERVICING PRECAUTIONS ................................................................... 4
SPECIFICATION ...................................................................................... 6
SOFTWARE UPDATE ............................................................................ 10
BLOCK DIAGRAM ................................................................................. 12
EXPLODED VIEW .................................................................................. 13
ASSEMBLY / DISASSEMBLY GUIDE .................................................... 14
TROUBLE SHOOTING GUIDE ................................................ APPENDIX

- 3 - Copyright © LG Electronics Inc. All rights reserved.
Only training and service purposes.
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩand 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
IMPORTANT SAFETY NOTICE
SAFETY PRECAUTIONS

- 4 - Copyright © LG Electronics Inc. All rights reserved.
Only training and service purposes.
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precau-
tions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug
or other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explo-
sion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication
of contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks
are correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged eas-
ily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-e󰀨ect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component dam-
age caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain o󰀨 any electrostatic
charge on your body by touching a known earth ground. Alter-
natively, obtain and wear a commercially available discharg-
ing wrist strap device, which should be removed to prevent
potential shock reasons prior to applying power to the unit
under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or expo-
sure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder
ES devices.
4. Use only an anti-static type solder removal device. Some sol-
der removal devices not classied as “anti-static” can generate
electrical charges su󰀩cient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges su󰀩cient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads elec-
trically shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective mate-
rial to the chassis or circuit assembly into which the device will
be installed.
CAUTION: Be sure no power is applied to the chassis or cir-
cuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replace-
ment ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity suf-
cient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropri-
ate tip size and shape that will maintain tip temperature within
the range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand
against the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the compo-
nent lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.

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Only training and service purposes.
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the cir-
cuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remain-
ing on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the h t sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip o󰀨 excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as pos-
sible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and
if necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-o󰀨" the board. The
following guidelines and procedures should be followed when-
ever this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connec-
tions).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip o󰀨
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly con-
nected to the a󰀨ected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the
lead of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

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Only training and service purposes.
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement .
1. Application range
This specification is applied to the LED TV used EB11C /
ED11C chassis.
2. Requirement for Test
Each part is tested as below without special notice.
(1) Temperature: 25 °C ± 5 °C(77 °F ± 9 °F), CST: 40 °C ± 2 °C
(2) Relative Humidity: 60 % ± 10 %
(3) Power Voltage
: Standard input voltage (AC 100-240 V~, 50/60 Hz)
* Standard Voltage of each products is marked by models.
(4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
(5) The receiver must be operated for about 20 minutes prior
to the adjustment.
3. Test method
(1) Performance: LGE TV test method followed
(2) Demanded other specification
- Safety : CE, IEC specification
- EMC : CE, IEC specification
4. Model General Specification
No. Item Specication Remarks
1 Market EU/CIS/OCEANIA/ASIA/AFRICA
2Broadcasting
system
(1) Digital TV : DVB-T/T2, DVB-C, DVB-S/S2
(2) Analogue TV
PAL B/B, PAL B/G, PAL D/K, PAL-I,
SECAM B/G, SECAM D/K, NTSC-M
Depending on country
3 Program coverage
(1) Digital TV
- DVB-T / DVB-T2*
-VHF III : 174 ~ 230 MHz
-UHF IV : 470 ~ 606 MHz
-UHF V : 606 ~ 862 MHz
-S Band II : 230 ~ 300 MHz
-S Band III : 300 ~ 470 MHz
-DVB-S/S2* (950 ~ 2150 MHz)
-DVB-C* (46 ~ 890 MHz)
(2) Analogue TV (46 ~ 862 MHz)
Only DVB-T2/C/S2 support model only.
4 Receiving system
Analog : Upper Heterodyne
Digital : COFDM(DVB-T) Only DVB-T Model
Digital : COFDM(DVB-T/T2) Only DVB-T2 Model
Digital : QAM
► DVB-T
- Guard Interval(Bitrate_Mbit/s): 1/4, 1/8, 1/16, 1/32
- Modulation: Code Rate
QPSK : 1/2, 2/3, 3/4, 5/6, 7/8
16-QAM : 1/2, 2/3, 3/4, 5/6, 7/8
64-QAM : 1/2, 2/3, 3/4, 5/6, 7/8
► DVB-T2
- Guard Interval(Bitrate_Mbit/s)
1/4, 1/8, 1/16, 1/32, 1/128, 19/128, 19/256,
- Modulation : Code Rate
QPSK : 1/2, 2/5, 2/3, 3/4, 5/6
16-QAM : 1/2, 2/5, 2/3, 3/4, 5/6
64-QAM : 1/2, 2/5, 2/3, 3/4, 5/6
256-QAM : 1/2, 2/5, 2/3, 3/4, 5/6
► DVB-C
- Symbolrate: 4.0Msymbols/s to 7.2Msymbols/s
- Modulation: 16QAM, 64-QAM, 128-QAM and 256-QAM
► DVB-S/S2
- Symbolrate
DVB-S2 (8PSK / QPSK) : 2 ~ 45Msymbol/s
DVB-S (QPSK) : 2 ~ 45Msymbol/s
- Viterbi
DVB-S mode : 1/2, 2/3, 3/4, 5/6, 7/8
DVB-S2 mode: 1/2, 2/3, 3/4, 3/5, 4/5, 5/6, 8/9, 9/10

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Only training and service purposes.
5. External Input Support Format
5.1. CVBS input
5.2. Component input(Y, CB/PB, CR/PR)
No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Proposed
1 720*480i 15.73 59.94 13.50 SDTV, DVD 480I(525I)
2 720*480i 15.75 60.00 13.51 SDTV, DVD 480I(525I)
3 720*576i 15.62 50.00 13.50 SDTV, DVD 576I(625I) 50Hz
4 720*480p 31.47 59.94 27.00 SDTV 480P
5 720*480p 31.50 60.00 27.03 SDTV 480P
6 720*576p 31.25 50.00 27.00 SDTV 576P 50Hz
7 1280*720 44.96 59.94 74.18 HDTV 720P
8 1280*720 45.00 60.00 74.25 HDTV 720P
9 1280*720 37.50 50.00 74.25 HDTV 720P 50Hz
10 1920*1080 28.12 50.00 74.25 HDTV 1080I 50Hz,
11 1920*1080 33.72 59.94 74.18 HDTV 1080I
12 1920*1080 33.75 60.00 74.25 HDTV 1080I
13 1920*1080 56.25 50.00 148.50 HDTV 1080P
14 1920*1080 67.43 59.94 148.50 HDTV 1080P
15 1920*1080 67.50 60.00 148.50 HDTV 1080P
No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Proposed Remarks
1 720*480i 15.73 59.94 13.50 SDTV, DVD 480I(525I) NTSC-M
2 720*480i 15.73 60.00 13.51 SDTV, DVD 480I(525I) NTSC-M
3 720*576i 15.63 50.00 13.50 SDTV, DVD 576I(625I) 50Hz PAL-BDGHI
No. Item Specication Remarks
5 Head Phone out Antenna, HDMI1, HDMI2, HDMI3, HDMI4, USB1,
USB2, USB3, AV, Comp Depending on country
6 Component Input Y/Pb/Pr Depending on country
7HDMI
Input
HDMI1
PC / DTV Format Support HDMI2.1
HDMI2
HDMI3
HDMI4
8 Video Input RCA PAL, SECAM, NTSC 4 System : PAL, SECAM, NTSC, PAL60
9 Audio Input DVI Audio, Component, AV
10 SPDIF out (1 EA) Optical Audio out
11 USB Input (3 EA) EMF, For SVC (download)
12 Ethernet Connect
(1EA) STP cable
13 PCMCIA Card slot
(1EA) PCMCIA Slot only EU/CIS

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Only training and service purposes.
5.3. HDMI input(DTV)
No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed Remarks
1 640*480 31.46 59.94 25.125 SDTV 480P
2 640*480 31.50 60.00 25.125 SDTV 480P
3 720*480 15.73 59.94 13.500 SDTV, DVD 480I(525I)
Spec. out but display4 720*480 15.75 60.00 13.514 SDTV, DVD 480I(525I)
5 720*576 15.62 50.00 13.500 SDTV, DVD 576I(625I) 50Hz
6 720*480 31.47 59.94 27 SDTV 480P
7 720*480 31.50 60.00 27.027 SDTV 480P
8 720*576 31.25 50.00 27 SDTV 576P
9 1280*720 37.5 50.00 74.25 HDTV 720P
10 1280*720 44.96 59.94 74.176 HDTV 720P
11 1280*720 45.00 60.00 74.25 HDTV 720P
12 1920*1080 33.72 59.94 74.176 HDTV 1080I
13 1920*1080 33.75 60.00 74.25 HDTV 1080I
14 1920*1080 28.12 50.00 74.25 HDTV 1080I
15 1920*1080 26.97 23.97 63.296 HDTV 1080P
16 1920*1080 27.00 24.00 63.36 HDTV 1080P
17 1920*1080 33.71 29.97 79.120 HDTV 1080P
18 1920*1080 33.75 30.00 79.20 HDTV 1080P
19 1920*1080 56.25 50.00 148.5 HDTV 1080P
20 1920*1080 67.43 59.94 148.350 HDTV 1080P
21 1920*1080 67.50 60.00 148.50 HDTV 1080P
22 1920*1080 135.00 120.00 HDTV 1080P
23 1920*1080 134.86 119.88 HDTV 1080P
24 1920*1080 112.50 100.00 HDTV 1080P
25 3840*2160 53.95 23.98 296.703 UDTV 2160P
26 3840*2160 54.00 24.00 297.00 UDTV 2160P
27 3840*2160 56.25 25.00 297.00 UDTV 2160P
28 3840*2160 61.43 29.97 296.703 UDTV 2160P
29 3840*2160 67.50 30.00 297.00 UDTV 2160P
30 3840*2160 112.5 50.00 594 UDTV 2160P When HDMI1,2,3
UHD DEEP COLOUR ON
31 3840*2160 134.86 59.94 593.407 UDTV 2160P When HDMI1,2,3
UHD DEEP COLOUR ON
32 3840*2160 135.00 60.00 594 UDTV 2160P When HDMI1,2,3
UHD DEEP COLOUR ON
33 4096*2160 53.95 23.98 296.703 UDTV 2160P
34 4096*2160 54.00 24.00 297 UDTV 2160P
35 4096*2160 56.25 25.00 297 UDTV 2160P
36 4096*2160 61.43 29.97 296.703 UDTV 2160P
37 4096*2160 67.50 30.00 297 UDTV 2160P
38 4096*2160 112.50 50.00 594 UDTV 2160P When HDMI1,2,3
UHD DEEP COLOUR ON
39 4096*2160 134.86 59.94 593.407 UDTV 2160P When HDMI1,2,3
UHD DEEP COLOUR ON
40 4096*2160 135.00 60.00 594 UDTV 2160P When HDMI1,2,3
UHD DEEP COLOUR ON

- 9 - Copyright © LG Electronics Inc. All rights reserved.
Only training and service purposes.
5.4. HDMI Input (PC)
No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed Remarks
1 640*350 31.46 70.09 25.17 EGA
2 720*400 31.46 70.08 28.32 DOS
3 640*480 31.46 59.94 25.17 VESA(VGA)
4 800*600 37.87 60.31 40 VESA(SVGA)
5 1024*768 48.36 60.00 65 VESA(XGA)
6 1152*864 54.34 60.05 80 VESA
7 1360*768 47.71 60.01 84.75 VESA(WXGA)
8 1280*1024 63.98 60.02 109.00 SXGA Support to HDMI-PC
9 1920*1080 67.50 60.00 158.40 WUXGA(Reduced Blanking)
10 1920*1080 135 120
11 3840*2160 54 24.00 297.00 UDTV 2160P
12 3840*2160 56.25 25.00 297.00 UDTV 2160P
13 3840*2160 67.5 30.00 297.00 UDTV 2160P
14 4096*2160 53.95 23.97 296.703 UDTV 2160P
15 4096*2160 54 24 297 UDTV 2160P

- 10 - Copyright © LG Electronics Inc. All rights reserved.
Only training and service purposes.
SOFTWARE UPDATE
1. USB DOWNLOAD
(1) Plug in the USB to the TV
(2) If there are update-able files in the USB, the TV would ask
that the user want to process the SW upper version update.
(3) Click “Yes” button : Start Update
(4) Click “Check Now” : Go to SW Update menu for monitoring
(5) TV has been starting SW update
(6) After finishing the update, it will show a pop-up below the
picture.
(7) Click “Yes” : Tv will be turn off and on itself
2. NSU DOWNLOAD
(This Function is needed to connect to the internet.)
Case 1) Auto Update On
(1) Go to Menu → All Settings → Support → Software
Update, then check Auto update is turned on.
(2) After the update complete, the user can check a pop-up
below the picture, which indicated update is complete and
the new version will be applied after the TV turn off and on.
(3) If the user want to check the process of updating
[Menu → All Settings → Support → Software Update]
.

- 11 - Copyright © LG Electronics Inc. All rights reserved.
Only training and service purposes.
(4) If it needs to cancel the update, click “cancel update” button
(5) [“No”] : update continue
[“Yes”] : update cancel
Case 2) NOT Allow Automatic Updates
Toggle Item
(1) Go to Menu → All Settings → Support → Software Update
(2) If it found upper version SW than the TV SW version, TV
would show a pop-up like below the picture.
“The latest version of the SW is available for your TV. Do
you want to update now”
(3) [Yes] : update starts.
[No] : Close the pop-up, check out later
(4) If the user started the update, the TV shows a pop-up
below the picture.
(5) [CHECK NOW] : Just start the update
[Close] : Close the pop-up

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Only training and service purposes.
Main SoC
eMMC (8GB)
CI Slot
USB1 (2.0)
OCP USB2 (2.0)
HDMI3 HDMI2(ARC) HDMI1
Air/ Cable
TUNER
(T2/C/A)
TUNER
(S,S2)
DVB-S
LNB
T2/C/S/S2 H
H
-
H
-
NIM tuner
IF (+/-)
P_TS_OUT
P_TS_IN
MICOM
IR / KEY
USB_WIFI
X_TAL
50MHz
Sub Assy
LAN
ETHERNET
SPDIF
AV/COMP CVBS/YPbPr
SPDIF OUT
H/PAMP
RS-232 MAX323
MAIN Audio AMP
I2S Out
I2C 0
Vx1 51P (8 lane)
Vx1
Vx1
IF_S
IF
NVRAM (256Kb)
I2C_4
I2C3
IQ (+/-), IP(+/-)
HDMI4
TS
Area OPT
USB_WIFI
0.8V
Core
3.3V
Normal
3.5V
ST_BY
5V
Normal
9
9 9
9B67 9 9
9
9
9
9
9
9
9
9B67
9B67
9
9B67
9B67
9
9 9
9
9
9
7R
3DQHO
From
Power
B/D
9
7R:,),%7
&RPER
eMMC
CLK/DATA/STRB
USB3 (2.0)
UEI MICOM
IR Blaster
Vx1 41P (8 lane)
LPDDR4
16Gb
1.1V
DDR
9
9 9 1.8V
DDR
9
0.8V
CPU
9
0.8V
DDR/C4TX
9
9
9
1.8V
9
9 0.8V
9
9
MAIN Audio AMP
9
9
9 9
LPDDR4
8Gb
6LJQDO)ORZ
6XSSO\3RZHU
,QRXW3RZHU
BLOCK DIAGRAM

- 13 - Copyright © LG Electronics Inc. All rights reserved.
Only training and service purposes.
200
400
540
800
200T
810
530
HR1
HR2 HP1
HW1
121
HS1
AR2 A10
700
910
900
920
120
500
501
570
LV1LV2
Stand Screw
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE

- 14 - Copyright © LG Electronics Inc. All rights reserved.
Only training and service purposes.
ASSEMBLY / DISASSEMBLY GUIDE
1. DISASSEMBLY
(1) Dis-Assemble STAND COVER.
(2) Unfix SCREW and DisAssemble the STAND.
1
1 1
1
Latch : 2 EA
1
1 1
Check the LATCH Position.

- 15 - Copyright © LG Electronics Inc. All rights reserved.
Only training and service purposes.
(3) DisAssemble the SCREW and BRACKET from the BRACKET.
(4) Unfasten the HARNESS from POWER PCB WAFER.
(5) Unfix SCREW and DisAssemble the REAR COVER from the MODULE.
* Put hand on the marked area( O), Separate the back cover to the top.
DisAssemble the WAFER.
2
CHASSIS ASSEMBLY,SUB
SCREW,MACHINE BRH + 3M 5.5M SWCH10A FZB N -
SUB EDX1C 48/55/65CX, 55/65BX
No Description Qty
①
②
1
1
Specification
DisAssemble the SCRW and BRACKET.
22
2 2
Check the LATCH Position.
1
COVER ASSEMBLY,REAR
SCREW,MACHINE BRH + 3M 5.5M SWCH10A FZB N -
OLED48CX . 48\” CX COVER ASSEM
No Description Qty
①
②
1
4
Specification

- 16 - Copyright © LG Electronics Inc. All rights reserved.
Only training and service purposes.
(6) Unfix the TAPE from the harness.
(7) Unfasten the HARNESS.
1
1
TAPE,POLYESTER POLYESTER 100% FR(FIRE RESISTA
No Description Qty
①4
Specification
11

- 17 - Copyright © LG Electronics Inc. All rights reserved.
Only training and service purposes.
(8) DisAssemble and UnFix the SUB PCB ASSY from the MODULE.
(9) Disassemble SPEAKER L/R.
Release
1
2
Release
BRACKET ASSEMBLY,SUB
SCREW,MACHINE BRH + 3MM 5.5MM SWCH18A FZMW N
BRACKET OLED48CX -IR ASSY(IR
No Description Qty
①
②
1
1
Specification
IR ASSY
WIFI ASSY
RH LH
12
SPEAKER ASSEMBLY
SPEAKER ASSEMBLY K0600711 65 55 CX BX LEFT 20W
K0600712 65 55 CX BX RIGHT 20W
No Description Qty
①
②
1
1
Specification

- 18 - Copyright © LG Electronics Inc. All rights reserved.
Only training and service purposes.
(10) Disassemble/Unfix the MAIN PCB.
(11) Disassemble/Unfix the POWER.
(12) Unfasten the HARNESS.
(13) Unfix and Disassemble the SCREW and the SUPPORTER,VESA.
2
2
22
11
1
1
Unfasten ⓑ→ⓐ
After DisAssemble
the screw
ⓐ
ⓑ
SUPPORTER,VESA
SCREW,MACHINE BRH + 3MM 5.5MM SWCH18A FZMW N
PRESS EGI 1.6 SUPPORTER EGI 32
No Description Qty
①
②
4
4
Specification
3
3
1
33
3
3
3
3
3
3
A
B
3
5
2
3
ⓑ
ⓐ
4
CHASSIS ASSEMBLY
POWER SUPPLY ASSEMBLY
SCREW,MACHINE
HARNESS,SINGLE
HARNESS,SINGLE
FREE LGP48CX-20OP LCD YY -
BRH + 3MM 5.5MM SWCH18A FZMW N
20022HS-14B2 TO 20022HS-14B2_1
20022HS 15B2 TO 20022HS 15B2 L
MAIN EDX1C OLED48CX6LA MAIN EB
No Description Qty
①
②
③
④
⑤
1
1
12
1
1
Specification

- 19 - Copyright © LG Electronics Inc. All rights reserved.
Only training and service purposes.
(14) Unfix and Disassemble the SUPPORTER, STAND.
1
33
33
PLATE
SCREW,MACHINE BRH + 3MM 5.5MM SWCH18A FZMW N
PRESS HGI 1.6T SUPPORTER HGI E
No Description Qty
①
②
1
4
Specification

- 20 - Copyright © LG Electronics Inc. All rights reserved.
Only training and service purposes.
2. ASSEMBLY
* This work should be worked by 2 persons.
(1) Input the Module.
(2) Remove the MODULE protective film.
[Self/Successive Check]
1. [Visual Check] Check the damage and dirt on the MODULE
[Key Control Point]
* Taking the outside when handling the LCD module
* Caution while handling the LCD module. (damage, removing the harness, hands print, dirt)
Do not remove module front protection film
1
2
GUIDE Line
OLED,MODULE-AM
GASKET CUTTING POLYESTER SPONGE 35*15
LE480AQD-ENA2 47INCH 3840X2160
No Description Qty
①
②
1
1
Specification