LG OLED55B8STB User manual

P/NO : MFL70425427 (1807-REV00)
CHASSIS : EB82B
MODEL : OLED55B8STB
OLED65B8STB
CAUTION
BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
OLED TV
SERVICE MANUAL
CONFIDENTIAL
Copyright © 2018 LG Electronics Inc. All rights reserved. Only training and service purposes.

- 2 - Copyright © LG Electronics Inc. All rights reserved.
Only training and service purposes.
CONTENTS
CONTENTS .............................................................................................. 2
SAFETY PRECAUTIONS ........................................................................ 3
SERVICING PRECAUTIONS ................................................................... 4
SPECIFICATION ...................................................................................... 6
SOFTWARE UPDATE ............................................................................ 10
BLOCK DIAGRAM ................................................................................. 11
EXPLODED VIEW .................................................................................. 18
DISASSEMBLY GUIDE........................................................................... 19
TROUBLE SHOOTING GUIDE ................................................ APPENDIX

- 3 - Copyright © LG Electronics Inc. All rights reserved.
Only training and service purposes.
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩ and 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
IMPORTANT SAFETY NOTICE
SAFETY PRECAUTIONS

- 4 - Copyright © LG Electronics Inc. All rights reserved.
Only training and service purposes.
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precau-
tions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug
or other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explo-
sion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication
of contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks
are correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged eas-
ily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component dam-
age caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alter-
natively, obtain and wear a commercially available discharg-
ing wrist strap device, which should be removed to prevent
potential shock reasons prior to applying power to the unit
under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or expo-
sure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder
ES devices.
4. Use only an anti-static type solder removal device. Some sol-
der removal devices not classied as “anti-static” can generate
electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads elec-
trically shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective mate-
rial to the chassis or circuit assembly into which the device will
be installed.
CAUTION: Be sure no power is applied to the chassis or cir-
cuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replace-
ment ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity suf-
cient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropri-
ate tip size and shape that will maintain tip temperature within
the range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand
against the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the compo-
nent lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.

- 5 - Copyright © LG Electronics Inc. All rights reserved.
Only training and service purposes.
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the cir-
cuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remain-
ing on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as pos-
sible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and
if necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed when-
ever this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connec-
tions).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly con-
nected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the
lead of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

- 6 - Copyright © LG Electronics Inc. All rights reserved.
Only training and service purposes.
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement .
1. Application range
This specification is applied to the LED TV used EB82B
chassis.
2. Requirement for Test
Each part is tested as below without special notice
(1) Temperature: 25 °C ± 5 °C(77 °F ± 9 °F), CST: 40 °C ± 5 °C
(2) Relative Humidity: 65 % ± 10 %
(3) Power Voltage
: Standard input voltage (AC 100-240 V~, 50/60 Hz)
* Standard Voltage of each products is marked by models.
(4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
(5) The receiver must be operated for about 20 minutes prior
to the adjustment.
3. Test method
(1) Performance: LGE TV test method followed
(2) Demanded other specification
- Safety : CE, IEC specification
- EMC : CE, IEC specification
- Wireless : Wireless HD Specification (Option)
4. Model General Specification
No. Item Specication Remarks
1 Market Asia, Oceania, Africa, Middle East
2 Television system
(1) Digital TV : DVB-T/T2, DVB-C, DVB-S/S2
(2) Analogue TV
PAL B/B, PAL B/G, PAL D/K, PAL-I,
SECAM B/G, SECAM D/K, NTSC-M
DVB-S/S2 : *VA
3 Channel Storage ATV & DVB-T/T2 : 3,000EA,
DVB-S/S2 : 6,000EA
4 Receiving system Analog : Upper Heterodyne
Digital : COFDM, QAM
► DVB-T
- Guard Interval(Bitrate_Mbit/s): 1/4, 1/8, 1/16, 1/32
- Modulation : Code Rate
QPSK : 1/2, 2/3, 3/4, 5/6, 7/8
16-QAM : 1/2, 2/3, 3/4, 5/6, 7/8
64-QAM : 1/2, 2/3, 3/4, 5/6, 7/8
► DVB-T2
- Guard Interval(Bitrate_Mbit/s)
1/4, 1/8, 1/16, 1/32, 1/128, 19/128, 19/256,
- Modulation : Code Rate
QPSK : 1/2, 2/5, 2/3, 3/4, 5/6
16-QAM : 1/2, 2/5, 2/3, 3/4, 5/6
64-QAM : 1/2, 2/5, 2/3, 3/4, 5/6
256-QAM : 1/2, 2/5, 2/3, 3/4, 5/6
► DVB-C
- Symbolrate : 4.0Msymbols/s to 7.2Msymbols/s
- Modulation : 16QAM, 64-QAM, 128-QAM and 256-QAM
► DVB-S/S2 (Model : *VA)
- Symbolrate
DVB-S2 (8PSK / QPSK) : 2 ~ 45Msymbol/s
DVB-S (QPSK) : 2 ~ 45Msymbol/s
- Viterbi
DVB-S mode : 1/2, 2/3, 3/4, 5/6, 7/8
DVB-S2 mode: 1/2, 2/3, 3/4, 3/5, 4/5, 5/6, 8/9, 9/10
5 Video Input RCA PAL, SECAM, NTSC 4 System : PAL, SECAM, NTSC, PAL60
6 Component Input Y/Pb/Pr
7 Head phone out Antenna, AV, Component, HDMI1/2/3/4, USB1/2/3
8 HDMI Input HDMI1, HDMI2(ARC), HDMI3, HDMI4 PC(HDMI Ver. 1.4), Support HDCP
9 Audio Input DVI Audio, Component, AV
10 SPDIF out SPDIF out
11 USB Input For My Media(Movie/Photo/Music List) or For SVC
12 LAN Ethernet Connect

- 7 - Copyright © LG Electronics Inc. All rights reserved.
Only training and service purposes.
5. External Input Support Format
5.1. CVBS input
5.2. Component input(Y, CB/PB, CR/PR)
No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Proposed
1 720*480i 15.73 59.94 13.50 SDTV, DVD 480I(525I)
2 720*480i 15.75 60.00 13.51 SDTV, DVD 480I(525I)
3 720*576i 15.62 50.00 13.50 SDTV, DVD 576I(625I) 50Hz
4 720*480p 31.47 59.94 27.00 SDTV 480P
5 720*480p 31.50 60.00 27.03 SDTV 480P
6 720*576p 31.25 50.00 27.00 SDTV 576P 50Hz
7 1280*720 44.96 59.94 74.18 HDTV 720P
8 1280*720 45.00 60.00 74.25 HDTV 720P
9 1280*720 37.50 50.00 74.25 HDTV 720P 50Hz
10 1920*1080 28.12 50.00 74.25 HDTV 1080I 50Hz,
11 1920*1080 33.72 59.94 74.18 HDTV 1080I
12 1920*1080 33.75 60.00 74.25 HDTV 1080I
13 1920*1080 56.25 50.00 148.50 HDTV 1080P
14 1920*1080 67.43 59.94 148.50 HDTV 1080P
15 1920*1080 67.50 60.00 148.50 HDTV 1080P
No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Proposed Remarks
1 720*480i 15.73 59.94 13.50 SDTV, DVD 480I(525I) NTSC-M
2 720*480i 15.73 60.00 13.51 SDTV, DVD 480I(525I) NTSC-M
3 720*576i 15.63 50.00 13.50 SDTV, DVD 576I(625I) 50Hz PAL-BDGHI

- 8 - Copyright © LG Electronics Inc. All rights reserved.
Only training and service purposes.
5.3. HDMI input(DTV)
No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed Remarks
1 640*480 31.46 59.94 25.125 SDTV 480P
2 640*480 31.50 60.00 25.125 SDTV 480P
3 720*480 15.73 59.94 13.500 SDTV, DVD 480I(525I)
Spec. out but display4 720*480 15.75 60.00 13.514 SDTV, DVD 480I(525I)
5 720*576 15.62 50.00 13.500 SDTV, DVD 576I(625I) 50Hz
6 720*480 31.47 59.94 27 SDTV 480P
7 720*480 31.50 60.00 27.027 SDTV 480P
8 720*576 31.25 50.00 27 SDTV 576P
9 1280*720 37.5 50.00 74.25 HDTV 720P
10 1280*720 44.96 59.94 74.176 HDTV 720P
11 1280*720 45.00 60.00 74.25 HDTV 720P
12 1920*1080 33.72 59.94 74.176 HDTV 1080I
13 1920*1080 33.75 60.00 74.25 HDTV 1080I
14 1920*1080 28.12 50.00 74.25 HDTV 1080I
15 1920*1080 26.97 23.97 63.296 HDTV 1080P
16 1920*1080 27.00 24.00 63.36 HDTV 1080P
17 1920*1080 33.71 29.97 79.120 HDTV 1080P
18 1920*1080 33.75 30.00 79.20 HDTV 1080P
19 1920*1080 56.25 50.00 148.5 HDTV 1080P
20 1920*1080 67.43 59.94 148.350 HDTV 1080P
21 1920*1080 67.50 60.00 148.50 HDTV 1080P
22 1920*1080 135.00 120.00 297 HDTV 1080P
23 1920*1080 134.86 119.88 296.70 HDTV 1080P
24 1920*1080 112.50 100.00 297 HDTV 1080P
25 3840*2160 53.95 23.98 296.703 UDTV 2160P
26 3840*2160 54.00 24.00 297.00 UDTV 2160P
27 3840*2160 56.25 25.00 297.00 UDTV 2160P
28 3840*2160 61.43 29.97 296.703 UDTV 2160P
29 3840*2160 67.50 30.00 297.00 UDTV 2160P
30 3840*2160 112.5 50.00 594 UDTV 2160P When HDMI1,2,3
UHD DEEP COLOUR ON
31 3840*2160 134.86 59.94 593.407 UDTV 2160P When HDMI1,2,3
UHD DEEP COLOUR ON
32 3840*2160 135.00 60.00 594 UDTV 2160P When HDMI1,2,3
UHD DEEP COLOUR ON
33 4096*2160 53.95 23.98 296.703 UDTV 2160P
34 4096*2160 54.00 24.00 297 UDTV 2160P
35 4096*2160 56.25 25.00 297 UDTV 2160P
36 4096*2160 61.43 29.97 296.703 UDTV 2160P
37 4096*2160 67.50 30.00 297 UDTV 2160P
38 4096*2160 112.50 50.00 594 UDTV 2160P When HDMI1,2,3
UHD DEEP COLOUR ON
39 4096*2160 134.86 59.94 593.407 UDTV 2160P When HDMI1,2,3
UHD DEEP COLOUR ON
40 4096*2160 135.00 60.00 594 UDTV 2160P When HDMI1,2,3
UHD DEEP COLOUR ON

- 9 - Copyright © LG Electronics Inc. All rights reserved.
Only training and service purposes.
5.4. HDMI Input (PC)
No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed Remarks
1 640*350 31.46 70.09 25.17 EGA
2 720*400 31.46 70.08 28.32 DOS
3 640*480 31.46 59.94 25.17 VESA(VGA)
4 800*600 37.87 60.31 40 VESA(SVGA)
5 1024*768 48.36 60.00 65 VESA(XGA)
6 1152*864 54.34 60.05 80 VESA
7 1360*768 47.71 60.01 84.75 VESA(WXGA)
8 1280*1024 63.98 60.02 109.00 SXGA Support to HDMI-PC
9 1920*1080 67.50 60.00 158.40 WUXGA(Reduced Blanking)
10 1920*1080 135 120
11 3840*2160 54 24.00 297.00 UDTV 2160P
12 3840*2160 56.25 25.00 297.00 UDTV 2160P
13 3840*2160 67.5 30.00 297.00 UDTV 2160P
14 4096*2160 53.95 23.97 296.703 UDTV 2160P
15 4096*2160 54 24 297 UDTV 2160P

- 10 - Copyright © LG Electronics Inc. All rights reserved.
Only training and service purposes.
SOFTWARE UPDATE
1. USB DOWNLOAD
(1) Insert the USB memory Stick to the USB port.
(2) Automatically detect the SW Version and show the below
message.
(3) Click [YES]: initiate the download and install of the update.
(4) Click [Check Now]: move to “About This TV” page for update.
(5) TV is updating.
(6) After finished the update, below Pop-up appear.
(7) Click [Yes] : TV will be DC OFF -> ON
(8) After TV turned on, Check the updated SW Version and
Tool Option
2. NSU DOWNLOAD
* This Function is needed to connect to the internet.
(1) Menu → All Settings → General → About This TV
(2) Click [CHEK FOR UPDATES]: system check newest version.
(3) Click [DOWNLOAD AND INSTALL].
(4) TV is updating.
(5) After finished the update, below Pop-up appear.
(6) Turn OFF the TV and On. Check the updated SW Version
and Tool Option.

- 11 - Copyright © LG Electronics Inc. All rights reserved.
Only training and service purposes.
DDR4 2640
512MB
DDR4 2640
512MB
DDR4 / 2640
512MB
DDR4 2640
512MB
Audio Amp
Main
Soc
IF(+/-)
Optic LAN
EEPROM(NVRAM)
(256Kb)
PHY3_RX0N
eMMC
(8GB)
Micom
X_TAL
24MHz
X_TAL
32.768KHz
I2S Out
I2C 0
I2C 4
SOY1/Y1/PB1/PR1_IN
SPDIF_OUT
Ethernet PHY I2C 1
SUB
ASSY
IR / KEY / Eye
Wi-Fi/BT Combo
USB_WIFI
CVBS
HP
CVBS_IN2 AUAD_L/R_IN
OCP OCP
USB2.0_1_DM/P0
USB2.0_2_DM/P1
PHY2_RX0N
PHY1_RX0N
Vx1 Output
SIF
HDMI4 (2.0) PHY0_RX0N
M1
M2
DDR4 / 2640
512MB
DDR4 / 2640
512MB
I2C 5 AUDA_OUTL/R
HP Amp
AV
Comp
M0
I2C
TS
IF_P/N
I_P/N, Q_P/N
AAD_ADC_SIF CVBS_IN1
Tuner
TS
HDMI3 (2.0) HDMI1 (2.0) HDMI2 (2.0) (ARC)
USB1 (2.0) USB2 (2.0) USB3 (2.0) OCP
Side
Rear
IR/KEY
BLOCK DIAGRAM
1. Summary

- 12 - Copyright © LG Electronics Inc. All rights reserved.
Only training and service purposes.
+3.3V_NORMAL
SCL0 SDA0
2.4KΩ
IC101
Main SoC
+3.3V_NORMAL
3.3KΩ
33Ω NVRAM
+3.3V_NORMAL
Audio Amp
Front
SCL2 SDA2
SCL4
SDA4
SCL5
SDA5
SCL1 SDA1
Micom 33Ω
3.3KΩ
+3.3V_NORMAL
100Ω
33pF
DC-DC
0.9V CORE 33Ω
100KΩ
Vx1 51p Wafer 33Ω
3.3KΩ
2.7KΩ
+3.3V_TU
LNB
33Ω
1.8KΩ
33Ω Tuner
+3.3V_TU
SCL3
SDA3
47pF
2. I2C Map

- 13 - Copyright © LG Electronics Inc. All rights reserved.
Only training and service purposes.
12V
3.3V Normal
4A
0.9V_CPU
3A
1.8V IO
3A
1.2V DDR
3.5A
0.9V_CORE
15A
ETH
3.5V ST-BY
4A
5V Normal
6A
WIFI
LNB
MICOM/IR/ETC
SOC- O18
0.9V DDR
3A
20V AUDIO AMP. IC
FRONT
2.5V DDR4 VPP
LDO 1A
Sequence 3.3V / 1.8V →1.2V → 0.9V
3. POWER

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Only training and service purposes.
Tuner
SCL_RF SDA_RF
+3.3V_RF
CVBS
SIF
IF_N
IF_P
1.8KΩ
+3.3V_TU
I2C_SDA/SCL_5_TU
AN22[SCL5/GPIO73]
AM22[SDA5/GPIO72]
+3.3V_TU
IF_AGC
TU_CVBS_SOC
AR16[DVBS_IN1]
IF_AGC
AT25[IFAGC]
TU_SIF_TU
AU24[AAD_ADC_SIF]
IF Filter
TADC_INN/P
AU23[DMD_TADC_INN]
AT23[DMD_TADC_INP]
Main SoC
33Ω
47pF
LNB
I_P
I_N
LNB_OUT
AT26[IFAGCS]
Filter
AR22[DMD_SADC_INP_I]
AT22[DMD_SADC_INN_I]
SADC_I_INN/P
Q_N
Q_P
Filter
AT21[DMD_SADC_INN_Q]
AU21[DMD_SADC_INP_Q]
SADC_Q_INN/P
4. TUNER

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Only training and service purposes.
Main SoC
AR15 [CVBS_IN2]
AV_CVBS_IN
AV Jack
Component Jack
AV1_CVBS_IN_SOC
AR13 [PB1_IN] AU14 [PR1_IN] AR12 [SOY1_IN] AT12 [Y1_IN]
COMP2_Pb COMP2_Pr
COMP2_Pb_IN_SOC
COMP2_Pr_IN_SOC
Jack Side SoC Side
SPDIF_OUT
SPDIF OUT
H/P JACK
HP_L/ROUT_JACK
AL34[PHY0_ARC_OUT]
SPDIF_OUT_ARC
COMP2/AV_L_IN COMP2/AV_R_IN
AR10 [AUAD_L_IN AT10 [AUAD_R_IN]
AUAD_L_CH2_IN
AUAD_R_CH2_IN
HP AMP
ARC OUT
(HDMI2)
Front Speaker
Micom AMP_RESET
AJ5[DACLRCH] AK5[DACSCK/GPIO81] AJ6[DACLRCK]
AU9[IEC958OUT]
Audio Amp
For front
AMP_MUTE
COMP2_Y COMP2_SOG2_IN_SOC
COMP2_Y_IN_SOC
I2S I/F
AL7[GPIO23 ]
AR10[AUDA_L_IN] AT10[AUDA_R_IN]
5. VIDEO & AUDIO IN/OUT

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Only training and service purposes.
HDMI4(2.0)_H
CEC_REMOTE
HDMI1(2.0)_V
HDMI3(2.0)_V
AE33[HDMI2_0_SCL]
AD33[HDMI2_0_SDA]
AD32[HDMI_2_0_HPD]
Micom
CEC_REMOTE
CEC_REMOTE CEC_REMOTE
+5V_HDMI_4
+5V_HDMI_3 +5V_HDMI_2
+5V_HDMI_1
Main SoC
HDMI_HPD_4
HDMI_HPD_3
HDMI_HPD_2
HDMI_HPD_1
DDC_SCL/SDA_4 DDC_SCL/SDA_3 DDC_SCL/SDA_2
DDC_SCL/SDA_1
AF33[HDMI2_1_SCL]
AF34[HDMI2_1_SDA]
AF32[HDMI_2_1_HPD]
AJ33[HDMI2_2_SCL]
AJ34[HDMI2_2_SDA]
AJ32[HDMI2_2_HPD]
AK33[HDMI2_3_SCL]
AK32[HDMI2_3_SDA] AL33[HDMI2_3_HPD]
AL34[PHY0_ARC_OUT] SPDIF_OUT_ARC
HDMI2(2.0)_V
6. HDMI

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Only training and service purposes.
Main SoC
OCP
USB1(2.0)_V
+5V_USB_1
USB2.0_1_DM/DP0_JACK
USB2.0_1_DM/DP0
AA37[USB3_0_DP0]
AA36[USB3_0_DM0]
W37[GPIO91/EB_CS1] W36[GPIO90/EB_CS0]
/USB_OCD1
USB_CTL1
+5V_NORMAL
OCP +5V_USB_2
USB2.0_2_DM/DP0_JACK
USB2.0_2_DM/DP1
AU31[USB2_1_DP0]
AT31[USB2_1_DM0] /USB_OCD2
USB_CTL2
OCP +5V_USB_3
USB2.0_3_DM/DP0_JACK
USB2.0_3_DM/DP0
AU30[UB2_0_DP0]
AT30[USB2_0_DM0]
AL24[JTMS1/SPI_CS1/GPIO33]
AL25[JTDO1/SPI_DO1/GPIO34]
/USB_OCD3
USB_CTL3
USB2(2.0)_H
USB3(2.0)_H
AM33[GPIO94] AM34[GPIO95]
+3.5V_WIFI
WIFI_DP/DM_JACK
WIFI_DP/DM
MICOM
BT_WAKEUP_HOST
BT_WAKEUP_DEVICE
COMBO_RESET
WOL/WIFI_POWER_ON
AT8[USB2_2_DP0]
AU8[USB2_2_DM0]
UART
SOC_RX/TX
AM12[UART0_RXD/GPIO106]
AL12[UART0_TXD/GPIO105]
SOC_TX/RX
7. USB / Wi-Fi / BT / UART

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Only training and service purposes.
700
A10
AR2
200
540
811
530 810
510
570
812 120
121
HS1
HR1
HP1
HW1
571
400
920
710
500
LV1LV2
900
Stand Screw
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE

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Only training and service purposes.
DISASSEMBLY GUIDE / ASSEMBLY GUIDE
Total Screw No. : 27 EA
1. Remove screw 1 EA, disassemble power cord from back cover.
2. Remove screw 4 EA, disassemble back cover from module.
* Put hand on the marked area(O), separate the back cover to the top.
11
1 1
2
2 2 2 2 2 2 2 2
2
2
Screw : 4 EA, Latch : 11 EA
1 2
1
Screw : 1 EA
1

- 20 - Copyright © LG Electronics Inc. All rights reserved.
Only training and service purposes.
3. Remove screw 1 EA, disassemble Wifi/Jog assy.
4. Remove the latch 2 EA, disassemble IR assy.
1
Screw : 1 EA
1
2
Latch : 2 EA
2
2
Slide