MatchX LPWAN User manual

MatchX Dev Kit
LoRa Development Board with Grove Sensors
User Guide
Rev 1.0

Copyright c 2017 MatchX GmbH
WWW.MATCHX.IO
No part of the specifications may be reproduced in any form or by any means or used to make any
derivative such as translation, transformation, or adaptation without permission from MatchX GmbH
All rights reserved.
First release, Nov 2017

Contents
1Introduction .................................................... 5
1.1 Productoverview ................................................ 5
1.1.1 Lora ............................................................ 5
1.1.2 BLE ............................................................. 6
1.2 MainFeatures ................................................... 6
1.2.1 Hardware........................................................ 6
1.2.2 Software......................................................... 6
2Hardware Architecture - SoM module ............................ 7
2.1 Pin-out and pin description of the SoM module . . . . . . . . . . . . . . . . . . . . . . . 7
2.1.1 Dimensions....................................................... 9
2.2 Operatingfrequencybands ...................................... 10
2.2.1 EU863-870MHzISMBand ........................................... 10
2.2.2 US902-928MHzISMBand ........................................... 10
2.2.3 Australia915-928MHzISMBand ...................................... 10
3Hardware Architecture - Evaluation Board ...................... 13
3.1 BlockDiagram.................................................. 13
3.2 Hardwarefeatures .............................................. 15
3.3 Connectors .................................................... 16
3.3.1 Connectorspin-out ............................................... 17
3.4 Jumpersandtestconnectors ..................................... 20

4
3.5 Hardwareselectableoptions ..................................... 21
4Sensor connection ............................................. 23
4.1 GroveDigital ................................................... 23
4.2 GroveAnalog .................................................. 23
4.3 GroveUART .................................................... 24
4.4 GroveI2C ...................................................... 24
5Quick Installation Guide ....................................... 25
5.1 Software and Hardware requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
5.2 Connections ................................................... 25
5.2.1 Power.......................................................... 25
5.2.2 Bluetoothconnection ............................................. 26
5.3 Setup.......................................................... 26
5.4 Registering a node on MarchX server . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
5.5 Setting DevEUI, AppEUI and DevKey . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
5.6 RegionSelection ................................................ 28
6Software Development Guide .................................. 30
6.1 References..................................................... 30
6.2 Prerequisites.................................................... 30
6.3 Software development under Windows OS . . . . . . . . . . . . . . . . . . . . . . . . . . 31
6.3.1 UsingSmartSnippetStudio .......................................... 33
6.4 Software development under Linux . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
7Product specification .......................................... 37
7.1 Softwareenvironment ........................................... 37
7.2 Hardwareenvironment .......................................... 37
7.2.1 RFperformance.................................................. 38
7.2.2 Electricalcharacteristics ........................................... 38
7.2.3 Antennacharacteristics ........................................... 39
7.3 Dimensions..................................................... 40
7.4 Certification .................................................... 41

1. Introduction
1.1 Product overview
The LPWAN Dev Kit by MatchX is a high performance, ready to use development platform allowing
you to kick-start your IoT project. Together with a MatchX Core module the Dev Kit is an incredibly
flexible solution that can be deployed in a various number of applications which require long distance
communication and long battery life. The unique combination of both LoRa and Bluetooth Low
Energy makes non-contact firmware updates easy, especially when the device is mounted in a
unaccessible place.
This guide covers both the US and EU version of the Dev Kit. The main differences between
these two versions are listed in Table 1.1.number
Parameter US EU
Operating Frequency Band 902-928MHz 863-870MHz
Maximum Output Power +17dBm +14dBm
Lora BW 500k/125kHz 125kHz
SF 7-10 7-12
Certification IEC 60950-1 EN 300200
FCC PART 15.247 EN 301489
Table 1.1: Comparison of different regions
1.1.1 Lora
The MatchX Module uses LoRa communication to send messages over long distances (up to 20km
in open spaces). This unique modulation scheme guarantees robust wireless communication even in
difficult from RF point of view environments such as high-rise city landscapes or within the inside
of buildings. The module can output up to 17dBm of power and is fully LoraWAN compatible. It’s
uniquely designed to work with the MatchX Box gateway and can also be used with a LoraWAN

6Chapter 1. Introduction
compatible Gateway of your choice.
1.1.2 BLE
The module offers a novel firmware solution upgrade by augmenting LoRa, together with Bluetooth
Low Energy (BLE). As LoRa protocol is not suitable for transmitting large amounts of data, MatchX
has combated this with BLE, offering a quick, robust and remote way of updating your software.
It is a perfect method in cases where a sensor may be mounted in an unaccessible place like in a
basement, sealed container box or behind a wall. Moreover BLE together with provided mobile app
enables you to configure your module and read its status and additional data.
1.2 Main Features
LPWAN Dev Kits long range, long battery life, flexible sensor configuration and wireless firmware
update are the key features that are offered by the Core module.
1.2.1 Hardware
•integrated MatchX Core System on Module
•+18.5dBm output power in 868MHz/915MHz
•-146dBm sensitivity of LoraWAN packets
•integrated Semtech SX1276 LoRa and Bluetooth Low Energy
•0 Hz up to 96 MHz 32-bit ARM Cortex-M0 Dialog DA14680 microcontroller
•GPS receiver with 22 tracking / 66 acquisition- channels
•optional NB-IOT, Tri-Band LTE-FDD and Dual-Band GPRS/EDGE module
•integrated Li-ION battery charger
•16 bit I/O expander
•GROVE sensor connector
•RGB indicator LED and User Button
•temperature sensor with 0.125◦C resolution and 1◦C accuracy
•unique ID EEPROM memory
•ultra low power design
1.2.2 Software
•Runs LoRa and Bluetooth stack simultaneously
•Low power consumption modes
•Easy to use software package
•Eclipse-based IDE
•Firmware upgrade over the air
•Mobile application
R
Currently there is no Class B support in server yet, but the hardware and firmware are fully
prepared for Class B specification, it is expected to support Class B in future firmware upgrade.

2. Hardware Architecture - SoM module
2.1 Pin-out and pin description of the SoM module
The pin-out of the MatchX Core SoM module can be seen on Figure 2.1 and the description of the
pins in Table 2.1. On top of the module there are two UF.L RF connectors, the one on the left is the
LoRa antenna connector, a suitable 868MHz in EU and 915MHz in US, 50 Ohm antenna is expected
to be connected on these port. The other connector is for connecting the 2.4GHz, 50 Ohm BLE
antenna. Both antennas come together with the evaluation board.
Figure 2.1: Pin-out of the SoM module.

8Chapter 2. Hardware Architecture - SoM module
Pin
num-
ber
Name Description
1V3P3_LDO 3.3V output of the internal LDO
2GND Ground
3VDD_RFS Supply voltage of the radio front-end
4LED1 Open drain output type, LED driver
5LED2 Open drain output type, LED driver
6LED3 Open drain output type, LED driver
7RESET Reset signal, active high
8P1_6 General Purpose I/O P1_6 / NTC resistor for battery temperature sensing
9P1_4 General Purpose I/O P1_4 / ADC1 / battery temperature sensing
10 P4_2 General Purpose I/O P4_2
11 P4_3 General Purpose I/O P4_3
12 P2_3 General Purpose I/O P2_3
13 P1_3 General Purpose I/O P1_3 / ADC2
14 P0_7 General Purpose I/O P0_7 / ADC3
15 SWD_DIO Serial Wire Debug interface I/O signal / GPIO P0_6 / ADC4
16 SWD_CLK Serial Wire Debug interface clock signal / GPIO P2_4 / ADC7
17 P3_3 General Purpose I/O P3_3
18 P3_4 General Purpose I/O P3_4
19 P3_2 General Purpose I/O P3_2
20 VBATT Battery voltage input
21 GND Ground
22 VBUS 5V supply, charging voltage
Table 2.1: USB-C connector pins description.
The module can be powered in two ways:
1. By connecting the VBATT to a battery voltage (2.7V to 4.2V).
2. By supplying +5V on the VBUS pin.
If both power sources are present, the battery will be charged form +5V power supply. The charging
current and charging characteristics for different battery types is software configurable. The module
provides V3P3_LDO voltage, it is a output of internal LDO of the DA14680 MCU, and it can be
used to supply external devices, but the maximum current drawn can’t be grater than 100mA. By
default VDD_RFS is connected to V3P3_LDO with an external 0R resistor. The current draw of
VDD_RFS is around 35mA during transmission with +14dBm power output and around 90mA
with +17dBm power. This has to be taken in consideration when planning the power budget of
V3P3_LDO . When even higher RF transmission power is required it is advisable to use different
power source for VDD_RFS . On the Evaluation Board it can be done by using 3.3V output of the
low power converter.
The source of V3P3_LDO is VBUS when present or VBATT otherwise. As it is a output of a
LDO, when VBUS is not present, and VBATT drops below 3.3V the V3P3_LDO will follow the
battery voltage. By default all GPIO are referenced to V3P3_LDO (it is also possible to configure
1.8V as the GPIO level, each GPIO can be configured individually) so care must be taken to ensure

2.1 Pin-out and pin description of the SoM module 9
that no voltage higher than V3P3_LDO is presented to any GPIO. This may happen when powering
external devices, that connect to SoM module, from a boost converter.
Figure 2.2: Block diagram of the Core module.
2.1.1 Dimensions
Figure 2.3: Dimension of the SoM module.

10 Chapter 2. Hardware Architecture - SoM module
2.2 Operating frequency bands
2.2.1 EU 863-870MHz ISM Band
In the European region the EN300220-2 V3.1.1 (2017-02) regulation defines the allowed frequency
allocation and spectrum access. Every device working in this band must comply with these rules
as shown in the Table 2.3. EU regulations restrict the maximum radiated power as well as the duty
cycle of the transmission in different frequency bands.To comply with the duty cycle requirement the
transmitting device must wait after every transmitted packet. The time device has to wait depends
on the time on air of transmitted packet and this in turn depends on the length of the packet and
spreading factor SF. This relation and required wait time can be seed in Table 2.2 According to
LoRaWAN specification every device has to implement at least 3 channels as follows:
•868.10 MHz
•868.30 MHz
•868.50 MHz
The SoM is preconfigured to work with the MatchX Box gateway and additionally to the 3 mandatory
channels 5 additional channels are defined. The list of all preconfigured channels can be found in
Table 2.4.
Spreading Factor Bit rate Range (depends Time on air (ms) 0.1% duty cycle 1% duty cycle
(125kHz Lora) (bps) on conditions) (10 bytes payload) waiting time waiting time
SF7 5470 2 km 56 ms 1 min 6s
SF8 3125 4 km 100 ms 1 min 40s 10s
SF9 1760 6 km 200 ms 3 min 20s 20s
SF10 980 8 km 370 ms 6 min 10s 37s
SF11 440 14 km 740 ms 12 min 20s 1 min 14s
SF12 290 20 km 1400 ms 23 min 20s 2min 20s
Table 2.2: Modules operating frequencies.
2.2.2 US 902-928MHz ISM Band
These frequencies band can be used in USA, Canada and all other countries that adopt the entire
FCC-Part15 regulations in 902-928 ISM band. For these region MatchX uses predefined frequencies
listed in Table 2.5. The FCC regulation puts restriction on the maximum dwell time of 400ms in
uplink, thats why the maximum allowed spreading factor is SF10.
2.2.3 Australia 915-928MHz ISM Band
These frequencies band can be used in Australia region. For these region MatchX uses predefined
frequencies listed in Table 2.6. All channels use 125kHz bandwidth and maximum of +20dBm
output power can be reached.

2.2 Operating frequency bands 11
Operational Fre-
quency band
Maximum e.r.p
Channel access and
occupation rules
(e.g. Duty cycle or
LBT + AFA)
Band num-
ber from
EC Decision
2013/752/EU
[i.3]
Class 1 sub-
class number
according
Commission
Decision
2000/299/EU
[i.7]
K
863,000 MHz to
865,000 MHz 25 mW e.r.p.
≤ 0,1% duty cycle
or polite spectrum
access
46a 66
L
865,000 MHz to
868,000 MHz
25 mW e.r.p.
Power density:
-4,5 dBm/100
kHz
≤ 1 % duty cycle or
polite spectrum ac-
cess
47 67
M
868,000 MHz to
868,600 MHz 25 mW e.r.p.
≤ 1% duty cycle or
polite spectrum ac-
cess
48 28
N
868,700 MHz to
869,200 MHz 25 mW e.r.p.
≤ 0,1% duty cycle
or polite spectrum
access
50 29
O
869,400 MHz to
869,650 MHz 25 mW e.r.p.
≤ 0,1% duty cycle
or polite spectrum
access
54a 130
P
869,400 MHz to
869,650 MHz 500 mW e.r.p.
≤ 10 % duty cycle
or polite spectrum
access
54b 30
Q
869,700 MHz to
870,000 MHz 5 mW e.r.p. No requirement 56a 31
R
869,700 MHz to
870,000 MHz 25 mW e.r.p.
≤ 1% duty cycle or
polite spectrum ac-
cess
56c 69
Table 2.3: EU wide harmonized national radio interfaces.
Frequency Bandwidth Maximum e.r.p Channel access
864.7 MHz 125 kHz 14 dBm ≤0,1% duty cycle
864.9 MHz 125 kHz 14 dBm ≤0,1% duty cycle
865.1 MHz 125 kHz -4.5 dBm ≤1% duty cycle
865.3 MHz 125 kHz -4.5 dBm ≤1% duty cycle
868.1 MHz 125 kHz 14 dBm ≤1% duty cycle
868.3 MHz 125 kHz 14 dBm ≤1% duty cycle
868.5 MHz 125 kHz 14 dBm ≤1% duty cycle
868.8 MHz 125 kHz 14 dBm ≤0,1% duty cycle
Table 2.4: Core Module operating frequencies in EU 863-870MHz ISM Band.

12 Chapter 2. Hardware Architecture - SoM module
Channel number Frequency Channel number Frequency
1 903.90 MHz 5 904.70 MHz
2 904.10 MHz 6 904.90 MHz
3 904.30 MHz 7 905.10 MHz
4 904.50 MHz 8 905.30 MHz
Table 2.5: Modules operating frequencies (uplink) in US 902-928MHz ISM Band.
Channel number Frequency Channel number Frequency
1 915.20 MHz 5 916.00 MHz
2 915.40 MHz 6 916.20 MHz
3 915.60 MHz 7 916.40 MHz
4 915.80 MHz 8 916.60 MHz
Table 2.6: Modules operating frequencies (uplink) in Australia 915-928MHz ISM Band.

3. Hardware Architecture - Evaluation Board
3.1 Block Diagram
The development board comprises of two main subsystems:
1. MatchX SoM with LoRa and Bluetooth radios
2. SIMCom SIM7000E NB-IOT module with 3G/4G and GPS
Figure 3.1: Block diagram of the Dev Kit.

14 Chapter 3. Hardware Architecture - Evaluation Board
MatchX SoM is the core of the Dev Kit. It is responsible for controlling the SIMCom module,
accessing the sensors, I/O expender, RGB LED etc. It also controls different power rails enabling
low power modes.
The Dev Kit can be powered by USB-C +5V and/or Lithium-ion battery connected to X401
connector.The presence of +5V is signaled by a red LED next to USB-C. When both +5V and battery
are present the MatchX SoM will start to charge the battery. The battery type, charging current, and
charging curve are software configurable.
MatchX SoM provides V3P3_LDO output, which is a low current output of internal LDO
capable to deliver up to 100mA of current. As it is used to power the LoRa RF front-ent by default,
it can be used to power just very low power peripherals. If more current is needed, a onboard SMPS
TPS62740 should be used. It outputs a 3.3V up to 300mA current. Its output should be connected to
the V3P3 power rail with the J402 jumper in position 1-2.
The SIMCom module is optional and is not included in a standard package but all peripheral
components are already soldered. The main communication interface between MatchX SoM and
SIMCom module is UART together with two control lines (SIM_NRST and SIM_PWR_KEY).
Please refer to SIMCom SIM7000E datasheet to find more information about the modules operation.
The SIM7000E is powered from +5V provided by USB-C connector which is converted to 3.3V by a
LDO. Its enable pin can be controlled by a SoM or can be always set high by a jumper.
The Dev Kit offers two ways to receive GPS signal. One is by using aforementioned SIM7000E
module. A cheaper and less power demanding alternative is using SIM28ML.

3.2 Hardware features 15
3.2 Hardware features
Figure 3.2: Hardware features of the Dev Kit.
Components marked on the Figure 3.2 are:
Optional SIMCOM SIM7000E NB-IOT module with 3G/4G and GPS
MatchX SoM module with LoRa and Bluetooth
SIM28ML GPS receiver
3.3V low power converter for sensors supply
PCA6416A I2C I/O expander
3.3V LDO for powering the optional SIM7000E module
RGB LED controlled by the MatchX SoM
User button, connected to P3_2 of the SoM module
Reset button for MatchX SoM
PCT2075GV I2C temperature sensor

16 Chapter 3. Hardware Architecture - Evaluation Board
I2C Serial EEPROM 24AA025UIDT-I/OT
LED indicating presence of USB +5V
NET indication LED of the SIM7000E
LED indicating presence of SIM card
3.3 Connectors
Figure 3.3: Connectors on the Dev Kit.
Connectors marked on the Figure 3.3 are:
J102 MatchX SoM modules I/Os
J201 SIM7000E I/Os and signals
J103 PCA6416A I/Os

3.3 Connectors 17
J100 RGB LED control signals
J301 Grove sensors I2C connector
J101 MatchX SoM SWD programming and debugging connector
J300 I2C connector
X401 S2B-PH-SM4-TB Lithium battery connector
USB-C connector, +5V supply and programming
SIM card socket for SIM7000E
3.3.1 Connectors pin-out
Figure 3.4: Pin-out of the Dev Kit.
The J102 connector, shown on Figure 3.5 routs out all GPIOs available on the MatchX SoM
module. Some of these GPIOs are used by default to control functions of the Dev Kit.

18 Chapter 3. Hardware Architecture - Evaluation Board
Pin Name Function Description
1 P2_3 UART_SIM_RX UART interface to SIMCom module, connected with J109 jumper
2 P1_3 UART_SIM_TX UART interface to SIMCom module, connected with J105 jumper
3 P4_3 I2C_SCL Main I2C bus, connected with J104 jumper
4 P4_2 I2C_SDA Main I2C bus, connected with J108 jumper
5 P1_4 - Not used
6 P1_6 - Not used
7 P0_7 - Not used
8 P3_3 - Not used
9 P3_4 PS_EN controls enable pin of TPS62740
10 P3_2 USR_BUTTON User button connection
11 V3P3 3.3V 3.3V power, the source selectable by J402 jumper
12 GND GND Ground
Table 3.1: Functions assignment of the MatchX SoM GPIOs
Figure 3.5: Pin-out of J102 connector.
Figure 3.6: Pin-out of J301 connector.

3.3 Connectors 19
The J103 connector, shown on Figure 3.7, exposes all pins available on the PCA6416A I2C I/O
expander. It offers 16 I/Os organized in two ports P0 and P1. Each pin can be configured individually
as a input or output, and its state can be read and set by the I2C commands. Additionally there is a
interrupt line EXP_INT that is being driven by the PCA6416A when input IO changes it state.
Figure 3.7: Pin-out of J103 connector.
The J201 connector, depicted on Figure 3.8, exposes all unused pins of the SIMCom SIM7000E
module. For more information about the signals functions please refer to the modules datasheet.
Figure 3.8: Pin-out of J201 connector.

20 Chapter 3. Hardware Architecture - Evaluation Board
3.4 Jumpers and test connectors
Figure 3.9: Jumpers and test connectors on the Dev Kit.
Components marked on the Figure 3.9 are:
J402 - selection of the source of V3P3 used to power RGB LED and sensors. A jumper
in position 1-2 selects the 3V3 from low power converter (located left), jumper in position 2-3
selects the V3P3_LDO output from integrated LDO of the SoM module
J111, J112 - connect the P1_3 and P0_7 to Grove D1 and D2 lines
J104, J108 - connect the P4_2 and P4_3 to I2C_SDA and I2C_SCL
J105, J109 - connect P1_2 and P2_3 of MatchX SoM to UART_SIM_TX and UART_SIM_RX
of the SIM7000E module
J107 - connects the enable line of the 3.3V LDO that powers SIM7000E ether to EXT_P0_2
(I/O expander) in position 1-2 or to 5V (always on) in position 2-3.
J110 - connects SIM_NRST of the SIM7000E to EXT_P0_1 of the I/O expander