Panasonic KX-TG2260BXS User manual

© 2003 Panasonic Communications Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
KX-TG2260BXS
KX-TGA228BXS
Digital Cordless Answering System
Silver Version
(for Asia, Middle Near East and Other areas)
Telephone Equipment
ORDER NO. KM40308187C3

1 ABOUT LEAD FREE SOLDER (PbF: Pb free) 4
1.1. Suggested PbF Solder 4
1.2. How to recognize that Pb Free solder is used 5
2 FOR SERVICE TECHNICIANS 6
3 CAUTION 6
4 BATTERY 7
4.1. Installing the Battery in the Handset 7
4.2. Battery Charge 7
4.3. Battery Recharge 7
4.4. Battery Strength 7
4.5. Battery Replacement 8
4.6. Battery information 8
5 LOCATION OF CONTROLS 9
5.1. Base Unit 9
5.2. Handset 10
6 DISPLAY 11
6.1. Troubleshooting 11
7 SETTINGS 15
7.1. Connections 15
7.2. Dialing Mode (Handset) 15
7.3. Line Mode (Handset) 16
7.4. Direct Commands 17
8 OPERATIONS 18
8.1. Making Calls 18
8.2. Answering Calls 21
8.3. FLASH Button 22
8.4. Dial Lock (Handset) 23
8.5. Erasing Messages 24
8.6. Phone Book (Handset) 25
9 DISASSEMBLY INSTRUCTIONS 29
10 ASSEMBLY INSTRUCTIONS 31
10.1. Fix the LCD to P.C. Board (Handset) 31
11 TROUBLESHOOTING GUIDE 32
11.1. Check Power 33
11.2. Error Message Table (Base Unit) 33
11.3. Check Record 34
11.4. Check Playback 35
11.5. Check Sp-phone Transmission 35
11.6. Check Sp-phone Reception 36
11.7. Check Battery Charge 37
11.8. Check Link 37
11.9. Check the RF Unit 38
11.10. Check Handset Transmission 43
11.11. Check Handset Reception 43
11.12. Check Caller ID 43
12 TEST MODE 44
12.1. Test mode flow chart for Base Unit 44
12.2. TAM Test mode flow chart 45
12.3. Test mode flow chart for Handset 46
12.4. X201 Check 47
12.5. Adjustment Battery Low Detector Voltage 47
12.6. Base Unit Reference Drawing 48
12.7. Handset Reference Drawing 49
12.8. Frequency Table 50
13 DESCRIPTION 51
13.1. Frequency 51
13.2. Time Division Duplex (TDD) operation 51
13.3. Signal Flowchart in the Whole System 52
14 EXPLANATION OF BBIC (Base Band IC) DATA
COMMUNICATION 53
14.1. Calling 53
14.2. To Terminate Communication 53
14.3. Ringing 53
14.4. Ports for Transmitting and Receiving of Data 53
15 BLOCK DIAGRAM (BASE UNIT) 54
16 CIRCUIT OPERATION (BASE UNIT) 55
16.1. DSP (Digital Speech/Signal Processing: IC201) 55
16.2. Flash Memory (IC300) 55
16.3. Power Supply Circuit 56
16.4. Reset Circuit 57
16.5. Locator/Intercom Mode 58
16.6. Telephone Line Interface 58
16.7. Auto Disconnect Circuit 59
16.8. Parallel Connection Detect Circuit 59
16.9. Calling Line Identification (Caller ID) 60
17 BLOCK DIAGRAM (HANDSET) 61
18 CIRCUIT OPERATION (HANDSET) 62
18.1. Construction 62
18.2. Power Supply Circuit 62
18.3. Reset Circuit 63
18.4. Charge Circuit 64
18.5. Ringer and Handset SP-Phone 64
18.6. Sending Signal 64
18.7. Reception Signal 65
CONTENTS
Page Page
2
KX-TG2260BXS / KX-TGA228BXS

19 SIGNAL ROUTE 66
20 CPU DATA (BASE UNIT) 67
20.1. IC201 67
21 CPU DATA (HANDSET) 68
21.1. IC201 68
22 EXPLANATION OF RF UNIT TERMINALS 69
22.1. IC801 69
23 HOW TO REPLACE A FLAT PACKAGE IC 70
23.1. Preparation 70
23.2. Procedure 70
23.3. Removing Solder from Between Pins 70
24 CABINET AND ELECTRICAL PARTS (BASE UNIT) 71
25 CABINET AND ELECTRICAL PARTS (HANDSET) 72
26 ACCESSORIES AND PACKING MATERIALS 73
27 TERMINAL GUIDE OF THE ICs, TRANSISTORS AND DIODES
74
27.1. Base Unit 74
27.2. Handset 74
28 REPLACEMENT PARTS LIST 75
28.1. Base Unit 75
28.2. Handset 77
28.3. Accessories and Packing Materials 79
29 FOR SCHEMATIC DIAGRAM 80
29.1. Base Unit (SCHEMATIC DIAGRAM (BASE UNIT)) 80
29.2. Handset (SCHEMATIC DIAGRAM (HANDSET)) 80
29.3. Memo 81
30 SCHEMATIC DIAGRAM (BASE UNIT) 82
30.1. Main 82
30.2. Memo 84
30.3. Operation 85
31 SCHEMATIC DIAGRAM (HANDSET) 86
31.1. Memo 88
32 CIRCUIT BOARD (BASE UNIT) 89
32.1. Main 89
32.2. Operation 91
33 CIRCUIT BOARD (HANDSET) 93
33.1. Main 93
3
KX-TG2260BXS / KX-TGA228BXS

1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
We will use PbF when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn), Silver
(Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
Caution
• ••
• PbF solder has a melting point that is 50°F ~ 70°F (30°C ~ 40°C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700°F ± 20°F (370°C ± 10°C). In case of using high temperature soldering iron, please
be careful not to heat too long.
• ••
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F, (600°C).
• ••
• If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible
and be sure that any remaining is melted prior to applying the Pb solder.
• ••
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See figure, below).
1.1. Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper,
(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the manufac
turer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
4
KX-TG2260BXS / KX-TGA228BXS

1.2.1. Base Unit
1.2.1.2. Operation
PbF
MIC
Marked
(Component View)
PbF
3112 45
ANS
LED903 ANS
LED903
VM
LED900
INUSE
R905
C902 LED901
SP
R904 R900
C901 R902 R903 C900 R901
REP
LCD900
REC CHK MSG1 MSG2
ERS MEMO
RDL
FLS
MUTE
SP
HLD
2
1
5
6
87
GND
29
VCC
18
15 16 17 21 23 26
25
28
30
27 19
202224
4
0
130
118
ICOM
CN900 CN901
6791113
1210814
#
9
MIC
UPDOWN
MICP
MICM
3
SKIP
STOP
LED904 CIQ
Marked
(Flow Solder Side View)
1.2. How to recognize that Pb Free solder is used
1.2.1.1. Main
18
1
1
30
PbF
IC201
CN101 CN100
30 51
50
1
Marked
(Component View)
Note:
The location of the “PbF” mark is subject to change without notice.
Note:
The location of the “PbF” mark is subject to change without notice.
5
KX-TG2260BXS / KX-TGA228BXS

1.2.2. Handset
IC801
IC201
PbF
ANTANTG
Marked
(Component View)
Note:
The location of the “PbF” mark is subject to change without notice.
2 FOR SERVICE TECHNICIANS
ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1.Cover the plastic parts boxes with aluminum foil.
2.Ground the soldering irons.
3.Use a conductive mat on the worktable.
4.Do not touch IC or LSI pins with bare fingers.
3 CAUTION
Danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent type recommendenced by the
manufacturer.
Dispose of used batteries according to the manufacture’s Instructions.
6
KX-TG2260BXS / KX-TGA228BXS

4 BATTERY
4.1. Installing the Battery in the Handset
4.2. Battery Charge
4.3. Battery Recharge
Note for Service:
The battery strength may not be indicated correctly if the battery is disconnected and connected again, even after it is fully
charged.
In that case, by recharging the battery as mentioned above, you will get a correct indication of the battery strength.
4.4. Battery Strength
7
KX-TG2260BXS / KX-TGA228BXS

4.5. Battery Replacement
4.6. Battery information
8
KX-TG2260BXS / KX-TGA228BXS

5 LOCATION OF CONTROLS
5.1. Base Unit
9
KX-TG2260BXS / KX-TGA228BXS

5.2. Handset
10
KX-TG2260BXS / KX-TGA228BXS

6 DISPLAY
6.1. Troubleshooting
11
KX-TG2260BXS / KX-TGA228BXS

12
KX-TG2260BXS / KX-TGA228BXS

13
KX-TG2260BXS / KX-TGA228BXS

14
KX-TG2260BXS / KX-TGA228BXS

7 SETTINGS
7.1. Connections
7.2. Dialing Mode (Handset)
15
KX-TG2260BXS / KX-TGA228BXS

7.3. Line Mode (Handset)
16
KX-TG2260BXS / KX-TGA228BXS

7.4. Direct Commands
17
KX-TG2260BXS / KX-TGA228BXS

8 OPERATIONS
8.1. Making Calls
8.1.1. Using the Handset
18
KX-TG2260BXS / KX-TGA228BXS

19
KX-TG2260BXS / KX-TGA228BXS

8.1.2. Using the Base Unit
20
KX-TG2260BXS / KX-TGA228BXS