Panasonic KX-TS620BXB User manual

© 2006 Panasonic Communications Co., Ltd. All
rights reserved. Unauthorized copying and distribu-
tion is a violation of law.
ORDER NO. KM40605055CE
Telephone Equipment
KX-TS620BXB
KX-TS620BXW
Telephone Answering System
Black Version
White Version
(for Asia, Middle Near East and Other areas)

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KX-TS620BXB/KX-TS620BXW

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KX-TS620BXB/KX-TS620BXW
TABLE OF CONTENTS
PAGE PAGE
1 Safety Precaution ------------------------------------------------ 4
1.1. For Service Technicians --------------------------------- 4
2 Warning -------------------------------------------------------------- 4
2.1. Battery Caution--------------------------------------------- 4
2.2. About Lead Free Solder (Pbf: Pb free)--------------- 4
3 Specifications ----------------------------------------------------- 6
4 Technical Descriptions ----------------------------------------- 7
4.1. Block Diagram (Base Unit) ------------------------------ 7
4.2. Circuit Operation (Base Unit)--------------------------- 8
4.3. Ringer IC----------------------------------------------------10
4.4. Module Block Diagram ---------------------------------- 11
4.5. Signal Route -----------------------------------------------12
5 Location of Controls and Components ------------------13
5.1. Controls -----------------------------------------------------13
6 Installation Instructions ---------------------------------------15
6.1. Connections------------------------------------------------15
7 Operation Instructions-----------------------------------------17
7.1. Dial Lock ----------------------------------------------------17
7.2. Troubleshooting-------------------------------------------18
8 Troubleshooting Guide ----------------------------------------20
8.1. Troubleshooting Guide ----------------------------------20
8.2. How to Replace the Flat Package IC----------------27
9 Disassembly and Assembly Instructions ---------------29
10 Schematic Diagram ---------------------------------------------30
10.1. For Schematic Diagram---------------------------------30
10.2. Schematic Diagram (Main)-----------------------------32
10.3. Schematic Diagram (Operation) ----------------------34
11 Printed Circuit Board-------------------------------------------35
11.1. Circuit Board (Main)--------------------------------------35
11.2. Circuit Board (Operation) -------------------------------37
12 Appendix Information of Schematic Diagram ---------39
12.1. CPU Data --------------------------------------------------39
12.2. Terminal Guide of the Ics, Transistor and
Diodes -------------------------------------------------------41
13 Exploded View and Replacement Parts List -----------42
13.1. Cabinet and Electric Parts -----------------------------42
13.2. Accessories and Packing Materials------------------43
13.3. Replacement Part List-----------------------------------44

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1 Safety Precaution
1.1. For Service Technicians
ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover the plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on the worktable.
4. Do not touch IC or LSI pins with bare fingers.
2Warning
2.1. Battery Caution
1. Danger of explosion if battery is incorrectly replaced.
2. Replace only with the same or equivalent type recommended by the manufacturer.
3. Dispose of used batteries according to the manufacture’s Instructions.
2.2. About Lead Free Solder (Pbf: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that con-
tains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
Caution
• PbF solder has a melting point that is 50 °F ~ 70 °F (30 °C ~ 40 °C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700 °F ± 20 °F (370 °C ± 10 °C).
• Exercise care while using higher temperature soldering irons.:
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100 °F (600 °C).
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).

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2.2.1. Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the manufac
turer’s specific instructions for the melting points of their products and any precautions for using their product with other materi-
als. The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.
2.2.2. How to recognize that Pb Free solder is used
(Example: Operation P.C.B.)
(Component View)
Note:
The location of the “PbF” mark is subject to change without notice.
CN801
MIC
17
18
1
2
PQUP11371Z
A
PbF
Marked

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3 Specifications

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4 Technical Descriptions
4.1. Block Diagram (Base Unit)
T1 D3, D5 C1
PC1 R1
IC1 D4, D6
Speaker
Q103, Q104 D7, D9
T
R
Q401 D8, D10
MIC
D306
D304
IC304
Q701 Q702
6.5V DC Power
IC903
IC902
IC303, Q301
LCD
IC305
Handset / Headset
MIC
SP
IC904
Q402
Q108
Ringer indication LED
LED 804 (1AP - SUB)
IC901
DSP MICON
NS BBIC
JOHN SMITH 1234567890
Keyboard
Switch
RINGER
IC
BELL
Line
ON/OFF
Handset
Sending
Amp
Headset
Detection
FLASH
MEMORY
CIDIN+
CIDIN -
V
SP-Phone
Amp
MIC -
LSR +
HeadsetDET
MIC +
LSR -
LINE IN -
LINE OUT
Sidetone
Bridge
Reg.
1.8V
Reg.
3.2V
RSTn
VDD, AVD
VDDIO
VBAT2
Reset IC
Regulator
4.0V
Regulator
4.0V
ACFL
Power Down
Detection
KX-TS620 BLOCK DIAGRAM

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4.2. Circuit Operation (Base Unit)
4.2.1. Outline
The unit consists of the following ICs as shown in the Block Diagram (Base Unit) (P.7).
•BBIC (Base Band IC): IC901
- Handling all the audio, signal and data processing needed
- ADPCM codec filter for speech encoding and speech decoding (DSP section)
- Echo-cancellation and Echo-suppression (DSP section)
- Any tones (tone, sidetone, ringing tone, etc.) generation (DSP section)
- DTMF receiver (DSP section)
- ADC, DAC, timer and power control circuitry
- All interfaces (eg: LCD, LED, Analog Front End, etc.)
•FLASH MEMORY: IC902
- Voice Prompt (TAM) Download Area
- Program D/L Area
•RINGER IC: IC1
- Bell signal generator (for bell detection purpose)
-RefertoRinger IC (P.10)
•SP AMP: IC904
- Low voltage audio power amplifier
•Additionally,
- Power Supply Circuit (+4.0V, +4.0V, +3.2V, +1.8V output)
- Telephone Line Interface Circuit
- Bell Detection Circuit
- SP-Phone Circuit
- Handset Circuit
-TAMCircuit
4.2.2. Power Supply Circuit
The power is supplied to the BBIC, Flash ROM, SP AMP, Logic IC, LCD, LED from AC adaptor (6.5V) as below:
• BBIC (IC901): CN301 -> D304 -> IC304 -> Q702 -> IC901
• Flash Memory (IC902): CN301 -> D304 -> IC304 -> Q702 -> IC902
• Logic IC (IC905): CN301 -> D304 -> IC304 -> Q702 -> IC905
• SP AMP (IC904): CN301 -> IC305 -> IC904
• LCD (LCD): CN301 -> D304 -> IC304 -> Q702 -> L302 -> LCD
• LED (LED801, LED802): CN301 -> IC305 -> L301 -> CN403 -> CN801 -> LED

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4.2.3. Telephone Line Interface
Function:
• Bell Signal Detection
• Caller ID Detection
• ON/OFF hook Circuit
•AudioCircuit
4.2.3.1. Bell Detection Circuit
When the bell signal is input from LINE to T/R (when the telephone rings), BBIC detects bell signal via following path:
T -> D3 -> IC1(1) -> IC1(8) -> C4 -> R6 -> PC1(1) -> PC1(4) -> IC901(63)
R -> R1 -> LED804 -> D4 -> IC1(1) -> IC1(8) -> C4 -> R6 -> PC1(1) -> PC1(4) -> IC901(63)
After bell signal detected at IC901(63), the bell ringing signal is output at the speaker via the following path:
4.2.3.2. Caller ID Detection Circuit
Normally, FSK caller ID data is followed after the 1st bell signal.
When the bell signal is detected by BBIC, Caller ID signal is sent through the circuit via
following path:
T -> C501 -> R503 -> R905 -> IC901(107)
R -> C502 -> R504 -> R908 -> IC901(112)
4.2.3.3. On/Off Hook Circuit
In standby mode, SW101 is open and Q104 is OFF. Consequently Q103 is open and cut the DC loop current and voice signal.
This is an on-hook condition.
When handset is picked up or SP-Phone key is pressed, Q104 turns on and then Q103 turns on, thus providing an off-hook
condition. A DC loop is made and current flows through the circuit via following path:
T -> D7 -> Q103 -> Q108 -> R124 -> D106 -> D10 -> R
Pulse signal is generated by repeated switches between high (3.2V) and low (0V) logic output from IC901(79), switching the line
loop on and off.
4.2.3.4. Handset Circuit
* Refer to Signal Route (P.12).
4.2.3.5. Speakerphone Circuit
* Refer to Signal Route (P.12).

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4.3. Ringer IC

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4.4. Module Block Diagram
4.4.1. LCD Module Block
4.4.2. Connector Pin Assignment
Pin no. Signal Function Enable
1 VDD +3V Power Supply —
2 VSS 0V Power Supply —
3 DB4 Data Bus Line H/L
4 DB5 Data Bus Line H/L
5 DB6 Data Bus Line H/L
6 DB7 Data Bus Line H/L
7 R/W Read / Write H/L
8 E Enable Signal H
9 D/C Data / Command Control H/L
10 CS Chip Signal L
11 RES Reset Signal Input L

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4.5. Signal Route

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5 Location of Controls and Components
5.1. Controls

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6 Installation Instructions
6.1. Connections
6.1.1. Connecting the Handset/AC Adaptor/Telephone Line Cord

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6.1.2. Connecting a Communication Device

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7 Operation Instructions
7.1. Dial Lock
7.1.1. To Set the Dial Lock
7.1.2. To Cancel the Dial Lock
Follow above steps 1 through 3. In step 3, “ “ will disappear.
For Service Hint:
(*1): If the current password is forgotten, enter “726276642” at the change password menu and you will be able to change the
password. After you enter a new password, you will be able to cancel the dial lock.

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7.2. Troubleshooting

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8 Troubleshooting Guide
8.1. Troubleshooting Guide
Cross Reference:
Check Power (P.21)
Check Bell Detection (P.21)
Check Playback (P.22)
Check Record OGM/IGM (P.22)
Check SP-phone Voice Transmission (P.23)
Check SP-phone Voice Reception (P.23)
Check Handset Voice Transmission (P.24)
Check Handset Voice Reception (P.24)
Check Pulse Dial (P.25)
Check DTMF Dial (P.25)
Check Caller ID Detection (P.26)