Panasonic KX-TG2216LAS User manual

ORDERNO. KM40309204C3
TelephoneEquipment
KX-TG2216LAS/ KX-TGA226LAS
2.4GHzDigital Cordless Phone
SilverVersion
(for LatinAmerica)
SPECIFICATIONS
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1. ABOUTLEADFREE SOLDER(PbF:Pbfree)
Note:
Inthe information below, Pb, the symbol forleadinthe periodic table of elements, will referto
standardsolderorsolderthatcontains lead.
We will use PbF solderwhendiscussing the leadfree solderusedinourmanufacturing process
whichis made from Tin(Sn), Silver(Ag), and Copper(Cu).
This model, and others like it, manufacturedusing leadfree solderwill have PbF stampedon
the PCB. Forservice and repairwork we suggestusing the same type of solderalthough, with
some precautions, standardPbsoldercanalsobe used.
Caution
-PbF solderhas amelting pointthat is50°F~70°F(30°C~40°C)
higherthanPbsolder. Please use asoldering iron with
temperaturecontrol and adjust itto700°F±20°F(370°C±10°C). In
case ofusing high temperaturesoldering iron, please becareful
nottoheat too long.
-PbF solderwill tend tosplashifitisheatedmuchhigherthanits
melting point, approximately1100°F, (600°C).
-Ifyou must use Pbsolderon aPCB manufacturedusing PbF
solder, removeas muchoftheoriginal PbF solderas possibleand
besurethat anyremaining ismeltedprior toapplying thePb
solder.
-Whenapplying PbF soldertodoublelayeredboards, please check
thecomponentsidefor excess whichmayflowontotheopposite
side(See figure, below).
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1.1. SuggestedPbF Solder
There are several types of PbF solderavailable commercially. While this productis
manufacturedusing Tin, Silver, and Copper,
(Sn+Ag+Cu), you canalsouse Tinand Copper, (Sn+Cu), orTin, Zinc, and Bismuth, (Sn+Zn+Bi).
Please check the manufac
turer’s specific instructions forthe melting points of theirproducts and anyprecautions for
using theirproductwith other
materials.
The following leadfree (PbF) solderwire sizes are recommendedforservice of this product:
0.3mm, 0.6mm and 1.0mm.
1.2. Howtorecognizethat PbFree solderisused
1.2.1. Base Unit
1.2.1.1. Main
(Component View)
Note:
The location of the “PbF“mark is subjectto change without notice.
1.2.1.2. Operation
(Component View)
Note:
The location of the “PbF“mark is subjectto change without notice.
(FlowSolderSide View)
Note:
The location of the “PbF“mark is subjectto change without notice.
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1.2.2. Handset
(Component View)
Note:
The location of the “PbF“mark is subjectto change without notice.
2. FORSERVICE TECHNICIANS
ICs and LSIs are vulnerable to static electricity.
Whenrepairing, the following precautions will helpprevent recurring malfunctions.
1. Covertheplasticparts boxes withaluminum foil.
2. Ground thesoldering irons.
3. Use aconductivemat on theworktable.
4. DonottouchICor LSI pinswithbarefingers.
3. CAUTION
Dangerof explosion ifbatteryis incorrectlyreplaced. Replace onlywith the same orequivalent
type recommendencedbythe manufacturer.
Dispose of usedbatteries according to the manufacture’s Instructions.
4. BATTERY
4.1. Installing theBatteryintheHandset
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4.2. BatteryCharge
4.3. BatteryRecharge
Note forService:
The batterystrength maynot be indicatedcorrectlyifthe batteryis disconnectedand
connectedagain, evenafteritis fullycharged.
Inthatcase, byrecharging the batteryas mentionedabove, you will geta correctindication of
the batterystrength.
4.4. BatteryStrength
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