Panasonic DVD-S32EB User manual

ORDER NO.CHM0602004CE
DVD Player
DVD-S32EB / DVD-S32GN / DVD-S32PX
DL4.5 Mechanism Series
Color
(S).......................Silver Type
SPECIFICATIONS
Specifications
Power supply: AC230-240 V, 50 Hz
(DVD-S32EB/GN)
AC110-240 V, 50/60 Hz
(DVD-S32PX)
Power consumption: 10 W
Power consumption in standby mode:
approx. 1 W
Dimensions: 430 (W) × 251 (D) × 43 (H) mm
Mass: 2.2 kg (approx.)
Signal system: PAL 625/50, PAL 525/60, NTSC
(DVD-S32EB/GN)
NTSC
(DVD-S32PX)
Operating temperature range: + 5 to + 35 °C
Operating humidity range: 5 to 90 % RH (no
condensation)
Discs played [8 cm (3 ” ) or 12 cm (5 ” )]:
(1) DVD (DVD-Video)
(2) DVD-R (DVD-Video, MP3*2,4, JPEG*3,4)
(3) DVD-RW (DVD-Video, MP3*2,4, JPEG*3,4)
(4) +R/+RW (Video)
(5) CD, CD-R / CD-RW (CD-DA, Video CD, SVCD*1, MP3*2,4,
JPEG*3,4)
(6) DVD-R DL (DVD-Video)
(7) +R DL (Video)
*1 Conforming to IEC62107
*2 MPEG-1 Layer 3, MPEG-2 Layer 3
*3 Exif Ver2.1 JPEG Baseline files
Picture resolution: between 320 × 240 and 6144 × 4096
pixels (Sub sampling is 4:2:2 or 4:2:0)
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*4 The total combined maximum number of recognizable
audio and picture contents and groups: 1000 audio and
picture contents and 256 groups.
Video output:
Output level: 1 Vp-p (75 )
Output terminal: Pin jack (1 system)
(DVD-S32GN/PX)
Pin jack (1 system)/AV
(DVD-S32EB)
S video output:
Y output level: 1 Vp-p (75 )
C output level: 0.286 Vp-p (75 )
(DVD-S32PX)
NTSC: 0.286 Vp-p (75 )
PAL: 0.300 Vp-p (75 )
(DVD-S32EB/GN)
Output terminal: S terminal (1 system)
(DVD-S32GN/PX)
AV
(DVD-S32EB)
Component video output: [NTSC: 525(480)p/525(480)i,
PAL: 625(576)p/625(576)i]
(DVD-S32EB/GN)
[NTSC: 525(480)p/525(480)i]
(DVD-S32PX)
Y output level: 1 Vp-p (75 )
P B output level: 0.7 Vp-p (75 )
P R output level: 0.7 Vp-p (75 )
Output terminal: Pin jack (Y: green, P B : blue,
P R : red)
Number of terminals: 1 system
RGB video output: (DVD-S32EB)
R output level: 0.7 Vp-p (75 )
G output level: 0.7 Vp-p (75 )
B output level: 0.7 Vp-p (75 )
Output terminal: AV
Video performance:
Horizontal resolution: More than 500 lines
Video S/N ratio: More than 65dB
Audio output:
Output level: 2 Vrms (1 kHz, 0 dB)
Output terminal: Pin jack
(DVD-S32GN/PX)
Pin jack/AV
(DVD-S32EB)
Number of terminals:
2 channel: 1 system
Audio performance:
(1) Frequency response:
DVD (linear audio): 4 Hz-22 kHz (48 kHz sampling)
4 Hz-44 kHz (96 kHz sampling)
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CD audio: 4 Hz-20 kHz
(2) S / N ratio:
CD audio: 115 dB
(3) Dynamic range:
DVD (linear audio): 92 dB
CD audio: 90 dB
(4) Total harmonic
distortion:
CD audio: 0.003 %
Digital audio output:
Coaxial digital output: Pin jack
Pickup
Wave length: 653 nm / 790 nm
Laser power: CLASS 1 / CLASS 3A
Note:
Specifications are subject to change without notice.
Mass and dimensions are approximate.
Solder:
This model uses lead free solder (PbF).
2006 Matsushita Electric Industrial CO., Ltd. All rights reserved.
Unauthorized copying and distribution is a violation of law.
1. SAFETY PRECAUTIONS
1.1. GENERAL GUIDELINES
1. When servicing, observe the original lead dress. If a short circuit is
found, replace all parts which have been overheated or damaged by the
short circuit.
2. After servicing, see to it that all the protective devices such as
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insulation barriers, insulation papers shields are properly installed.
3. After servicing, make the following leakage current checks to prevent
the customer from being exposed to shock hazards.
1.1.1. LEAKAGE CURRENT COLD CHECK
1. Unplug the AC cord and connect a jumper between the two prongs on
the plug.
2. Measure the resistance value, with an ohmmeter, between the
jumpered AC plug and each exposed metallic cabinet part on the
equipment such as screwheads, connectors, control shafts, etc. When
the exposed metallic part has a return path to thechassis, the reading
should be between 1M and 5.2M . / When the exposed metal does
not have a return path to the chassis, the reading must be .
Figure 1
1.1.2. LEAKAGE CURRENT HOT CHECK (See Figure 1 .)
1. Plug the AC cord directly into the AC outlet. Do not use an isolation
transformer for this check.
2. Connect a 1.5k , 10 watts resistor, in parallel with a 0.15 F
capacitors, between each exposed metallic part on the set and a good
earth ground such as a water pipe, as shown in Figure 1.
3. Use an AC voltmeter, with 1000 ohms/volt or more sensitivity, to
measure the potential across the resistor.
4. Check each exposed metallic part, and measure the voltage at each
point.
5. Reverse the AC plug in the AC outlet and repeat each of the above
measurements.
6. The potential at any point should not exceed 0.75 volts RMS. A leakage
current tester (Simpson Model 229 or equivalent) may be used to make
the hot checks, leakage current mu3st not exceed 1/2 milliamp. In case
a measurement is outsideof the limits specified, there is a possibility of
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a shock hazard, and the equipment should be repaired and rechecked
before it is returned to the customer.
2. PREVENTION OF ELECTRO STATIC DISCHARGE
(ESD) TO ELECTROSTATICALLY SENSITIVE (ES)
DEVICES
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such
components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistorsand semiconductor "chip" components.
The following techniques should be used to help reduce the incidence of component damage caused
by electro static discharge (ESD).
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any ESD on your body by
touching a known earth ground. Alternatively, obtain and wear a
commercially available dischargingESD wrist strap, which should be
removed for potential shock reasons prior to applying power to the unit
under test.
2. After removing an electrical assembly equipped with ES devices, place
the assembly on a conductive surface such as alminum foil, to prevent
electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static solder removal device. Some solder removal
devices not classified as "anti-static (ESD protected)" can generate
electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical
charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package
until immediately before you are ready to install it. (Most replacement
ES devices are packaged with leads electrically shorted together by
conductive foam, alminum foil or comparableconductive material).
7. Immediately before removing the protective material from the leads of a
replacement ES device, touch the protective material to the chassis or
circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all
other safety precautions.
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8. Minimize bodily motions when handling unpackaged replacement ES
devices. (Otherwise hamless motion such as the brushing together of
your clothes fabric or the lifting of your foot from a carpeted floor can
generate static electricity (ESD) sufficient todamage an ES device).
3. PRECAUTION OF LASER DIODE
4. SERVICE CAUTION BASED ON LEGAL RESTRICTIONS
4.1. General description about Lead Free Solder (PbF)
The lead free solder has been used in the mounting process of all electrical components on the printed
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circuit boards used for this equipment in considering the globally environmental conservation.
The normal solder is the alloy of tin (Sn) and lead (Pb). On the other hand, the lead free solder is the
alloy mainly consists of tin (Sn), silver (Ag) and Copper (Cu), and the melting point of the lead free
solder is higher approx.30°C (86°F) more than that of the normal solder.
Definition of PCB Lead Free Solder being used
Service caution for repair work using Lead Free Solder (PbF)
- The lead free solder has to be used when repairing the equipment for
which the lead free solder is used. (Definition: The letter of “PbF” is
printed on the PCB using the lead free solder.)
- To put lead free solder, it should be well molten and mixed with the
original lead free solder.
- Remove the remaining lead free solder on the PCB cleanly for soldering
of the new IC.
- Since the melting point of the lead free solder is higher than that of the
normal lead solder, it takes the longer time to melt the lead free solder.
- Use the soldering iron (more than 70W) equipped with the temperature
control after setting the temperature at 350±30°C (662±86°F).
Recommended Lead Free Solder (Service Parts Route.)
The following 3 types of lead free solder are available through the service parts route.
- RFKZ03D01K-----------(0.3mm 100g Reel)
- RFKZ06D01K-----------(0.6mm 100g Reel)
- RFKZ10D01K-----------(1.0mm 100g Reel)
Note
* Ingredient: tin (Sn) 96.5%, silver (Ag) 3.0%, Copper (Cu) 0.5%, Cobalt
(Co) / Germanium (Ge) 0.1 to 0.3%
5. PREVENTION OF STATIC ELECTRICITY DISCHARGE
The laser diode in the traverse unit (optical pickup) may brake down due to static electricity of clothes
or human body. Use due caution to electrostatic breakdown when servicing and handling the laser
diode.
5.1. Grounding for electrostatic breakdown prevention
Some devices such as the DVD player use the optical pickup (laser diode) and the optical pickup will be
damaged by static electricity in the working environment. Proceed servicing works under the working
environment where grounding works is completed.
5.1.1. Worktable grounding
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1. Put a conductive material (sheet) or iron sheet on the area where the
optical pickup is placed, and ground the sheet.
5.1.2. Human body grounding
1. Use the anti-static wrist strap to discharge the static electricity form
your body.
5.1.3. Handling of optical pickup
1. To keep the good quality of the optical pickup maintenance parts
during transportation and before installation, the both ends of the laser
diode are short-circuited. After replacing the parts with new ones,
remove the short circuit accordingto the correct procedure. (See this
Technical Guide.)
2. Do not use a tester to check the laser diode for the optical pickup.
Failure to do so will damage the laser diode due to the power supply in
the tester.
5.2. Handling Precautions for Traverse Unit (Optical Pickup)
1. Do not give a considerable shock to the traverse unit (optical pickup)
as it has an extremely high-precise structure.
2. When replacing the optical pickup, install the flexible cable and cut its
short land with a nipper. See the optical pickup replacement procedure
in this Technical Guide. Before replacing the traverse unit, remove the
short pin for preventingstatic electricity and install a new unit. Connect
the connector as short times as possible.
3. The flexible cable may be cut off if an excessive force is applied to it.
Use caution when handling the cable.
4. The half-fixed resistor for laser power adjustment cannot be adjusted.
Do not turn the resistor.
6. DISASSEMBLING THE CASING AND CHECKING
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P.C.B.S
6.1. Disassembly Procedure
6.2. Casing Parts and P.C.B. Positions
6.3. Top Panel
1. Unscrew the screws.
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6.4. Front Panel
1. Release the tabs and connector.
2. Release the tabs.
6.5. Operation P.C.B. and Power SW P.C.B.
1. Unscrew the screws.
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6.6. Module P.C.B.
1. Remove the connectors.
2. Unscrew the screws.
3. Press each tab with the nipper to module PCB vertically.
6.7. Mechanism Unit
1. Unscrew the screws.
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2. Release the tabs.
6.8. Rear panel
1. Unscrew the screws
2. Release the tabs.
6.9. Mother P.C.B.
1. Unscrew the screws.
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6.10. Service Position
6.10.1. Servicing position of the Module P.C.B.
6.10.2. Servicing position of the Mother P.C.B.
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6.10.3. List of the Extension Cables
7. ASSEMBLING AND DISASSEMBLING THE
MECHANISM UNIT
7.1. Disassembly Procedure
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7.2. Traverse Unit
1. Slide the lever (A) in the arrow direction (to the opposite side) till it
stops.
2. Slide the lever (A) further by bending the tab at the right side of the
lever A in the right direction. (The right groove opens and the boss
becomes seen.)
3. Open the lever (B) to left. (The 2 grooves at the left side open.)
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4. Remove the traverse unit
7.3. Tray
1. Slide the guide tray unit while pressing the stopper in the arrow
direction, and remove the guide tray unit.
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2. Raise the loading unit.
3. Slide the lever in the arrow direction till it stops and pull the tray out.
4. Spread the tabs at the both sides and pull the tray out. (The tray slides
a little forward and stops.)
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5. Remove the drive arm concave phase from the tray slider and tray.
<Assembling the tray unit>
1. Insert a part of the tray into the unit sliding over the groove on the
mechanical chassis unit.
2. Insert the tray to the point before the tab of the mechanical chassis unit.
3. Hook the drive arm concave phase over the tray and the tray slider.
4. Press in the tray.
5. Make sure that the tray and the drive arm move smoothly.
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7.4. Loading section
1. Spread the tabs at the both sides and push out the drive arm shaft.
2. Hook the lock lever spring on the lock lever projection part temporarily.
3. Unlock the tab and remove the lock lever.
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4. Remove the belt.
5. Unlock the tab and remove the pulley.
6. Remove the relay gear.
7. Turn the change lever in the arrow direction till it stops.
8. Hook the change lever spring on the change lever project part
temporarily.
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