Panasonic PalmTheater DVD-LV60 User manual

ORDERNO.ODSD010847C3
PortableDVDAUDIO/VIDEO PLAYER
DVD-LV60
Colour
(S).................Silver Type
Areas
GK..................China.
SPECIFICATIONS
Specifications
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Power supply: DC 9V (DC IN terminal) /
DC 7.2V (Exclusivebattery
terminal)
Power consumption: 14W(8W: Unit only)
AC adaptor
Power source: AC 100-240V, 50/60Hz
Power consumption: 30W
DC output: 9V, 2A
Dimensions: 159(W) x140(D) x27(H) mm
(whentheLCD screenisclosed,
excluding protrusions)
Mass: 510g
Operating temperature
range: 5-35°C
Operating humidityrange: 5-90%RH (no condensation)
Region number: Region No.6
Signal system: PAL625/50,PAL525/60,
NTSC (Selectable)
Discs played:
(1)DVD disc
(2)Compact disc (CD-DA, VideoCD)
(3) CD-R/CD-RW(CD-DA, VideoCD formatteddiscs)
LCD screen: 5.8” -Si, TFT wide-screenLCD
S videooutput:
Y output level: 1Vp-p(75 )
C output level: 0.286Vp-p(75 ) (NTSC)
0.3Vp-p(75 ) (PAL)
Output terminal: Alsousedforvideooutput/input
Videooutput/input:
Output/input level: 1Vp-p(75 )
Output/input terminal: Mini-jack
(1system, Output/input selectable)
Audiooutput/input:
Output/input level: 1.5Vrms (1kHz, 0dB)
Output/input terminal:
2ch(MIX) Output (L/R):Stereomini-jack / (1system, Output
/input selectable)
Audiosignal output characteristics:
(1)Frequencyresponse:
DVD (linear audio): 4Hz-22kHz (48kHz sampling)
4Hz-44kHz (96kHz sampling)
CD audio: 4Hz-20kHz
(2)S/N ratio:
CD audio: 115dB
(3)Dynamicrange:
CD audio: 97dB
Digital audiooutput:
Optical digital output: Mini optical terminal
(Alsousedforaudiooutput/input)
Pickup:
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Wavelength: 660nm/ 780nm
Laser power: CLASS 2/ CLASS 1
Note
Specificationsare subject tochangewithout notice.
Mass and dimensionsare approximate.
Power consumption instandbymode:1.5W(whenusing the
includedAC adaptor)
2001 Matsushita ElectricIndustrial Co., Ltd. All rights reserved.
Unauthorized copying and distribution isaviolation of law.
1. SAFETY PRECAUTIONS
1.1. GENERALGUIDELINES
1. When servicing, observe the original lead dress. Ifashort circuit
isfound, replace all parts which have been overheated or
damaged bythe short circuit.
2. After servicing, see to itthat all the protective devices such as
insulation barriers, insulation papers shields are properly
installed.
3. After servicing, make the following leakage current checks to
prevent the customer from being exposed to shock hazards.
1.1.1. LEAKAGE CURRENTCOLD CHECK
1. Unplug the AC cord and connect ajumper between the two
prongs on the plug.
2. Measure the resistance value, with an ohmmeter, between the
jumpered AC plug and each exposed metalliccabinet part on the
equipment such as screwheads, connectors, control shafts, etc.
When the exposed metallicpart has areturn path to thechassis,
the reading shouldbe between 1M and 5.2M . / When the
exposed metal does not have areturn path to the chassis, the
reading must be .
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Figure 1
1.1.2. LEAKAGE CURRENTHOTCHECK (See Figure 1 .)
1. Plug the AC cord directlyinto the AC outlet. Donot use an
isolation transformer for thischeck.
2. Connect a1.5k , 10 watts resistor, inparallel with a0.15 F
capacitors, between each exposed metallicpart on the set and a
good earth ground such as awater pipe, as shownin Figure 1 .
3. Use an AC voltmeter, with 1000 ohms/voltor more sensitivity, to
measure the potential across the resistor.
4. Check each exposed metallicpart, and measure the voltage at
each point.
5. Reverse the AC plug inthe AC outlet and repeat each of the above
measurements.
6. The potential at anypoint shouldnot exceed 0.75 volts RMS. A
leakage current tester (Simpson Model 229 or equivalent) maybe
used to make the hot checks, leakage current must not exceed 1/2
milliamp. Incase ameasurement isoutsideof the limits specified,
there isapossibilityof ashock hazard, and the equipment should
be repaired and rechecked before itisreturned to the customer.
2. PREVENTION OF ELECTRO STATIC DISCHARGE
(ESD) TO ELECTROSTATICALLY SENSITIVE (ES)
DEVICES
Some semiconductor(solidstate) devices canbe damagedeasilybystatic electricity. Such
components commonlyare calledElectrostaticallySensitive (ES) Devices. Examples of typical
ES devices are integratedcircuits and some field-effect transistorsand semiconductor"chip"
components. The following techniques shouldbe usedtohelpreduce the incidence of
component damage causedbyelectrostatic discharge (ESD).
1. Immediatelybefore handling anysemiconductor component or
semiconductor-equipped assembly, drainoff anyESDon your
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bodybytouching aknownearth ground. Alternatively, obtainand
wear acommerciallyavailabledischargingESDwrist strap, which
shouldbe removed for potential shock reasons prior to applying
power to the unitunder test.
2. After removing an electrical assemblyequipped with ES devices,
place the assemblyon aconductive surface such as alminum foil,
to prevent electrostaticcharge buildup or exposure of the
assembly.
3. Use onlyagrounded-tipsoldering iron to solder or unsolder ES
devices.
4. Use onlyan anti-staticsolder removal device. Some solder
removal devices not classified as "anti-static(ESDprotected)"
can generate electrical charge sufficient to damage ES devices.
5. Donot use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Donot remove areplacement ES device from its protective
package until immediatelybefore you are readyto install it. (Most
replacement ES devices are packaged with leads electrically
shorted together byconductive foam, alminum foil or comparable
conductivematerial).
7. Immediatelybefore removing the protective material from the
leads of areplacement ES device, touch the protective material to
the chassisor circuitassemblyinto which the device will be
installed.
Caution
Besure no power isapplied to the chassisor circuit, and observe
all other safetyprecautions.
8. Minimize bodilymotions when handling unpackaged replacement
ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabricor the lifting of your foot from a
carpeted floor can generate staticelectricity(ESD)sufficient
todamage an ES device).
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