Panasonic SC-HTR310P User manual

I
Amplifier Section
RMS
output power of each channel driven
10%
total harmonic distortion
1
kHz Front CH 70 W per channel (4 Ω)
1
kHz Center CH 70 W per channel (4 Ω)
100
Hz Subwoofer CH 90 W per channel (3 Ω)
Total
RMS output power 300 W
Total
harmonic distortion
half
power at 1kHz (Front CH) 0.5 % (4 Ω)
Input
sensitivity
TV,
AUX 3 450 mV, IHF’66
S/N
at rated power (4 Ω)
BD/DVD,
TV, AUX 1, AUX 2 80 dB
Input
impedance
TV,
AUX 3 47 kΩ
Tone
controls
BASS
50Hz,+6dBto-6dB
TREBLE
20 kHz, +6 dB to -6 dB
Digital
input
Optical
2
Coaxial
1
HDMI
Input 1
HDMI
Output 1
This
system supports “HDAVI Control 1” function.
I
General
© 2008 Matsushita Electric Industrial Co. Ltd.. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
SC-HTR310P
Colour
(K)... Black Type
Power supply AC 120V, 60 Hz
Power consumption
Main set 68 W
Standby (HDMI ON) 0.7 W
Standby (HDMI OFF) 0.3 W
IRack System
INCLUDING SPEAKER
Dimensions (W x H x D) 1300 mm x 444 mm x 458 mm
Mass approx. 50 kg
* Mass is a Completed (AMP, Speaker Unit inc)
Maximum Loading Weight 80 kg
ISpeaker System
FRONT (L/R) 1-Way 1 Speaker System
(Bass Reflect)
6.5 cm Cone Type Full Range x1
CENTER 1-Way 1 Speaker System
(Bass Reflect)
6.5 cm Cone Type Full Range x1
SUBWOOFER 1-Way 2 Speaker System
(Bass Reflect)
13 cm Cone Type Woofer x2
Notes :
1. Specifications are subject to change without notice.
2. Total harmonic distortion is measured by the digital spectrum
analyser.
Home Theater Audio System
Specification
ORDER NO. MD0808009CE
A6

1 Safety Precautions 3
2 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices 6
3 Handling the Lead free Solder 7
4 Operating Procedures 8
5 Self Diagnosis Display Function 25
6 HDMI Checking Method 29
7 Assembling and Disassembling 31
8 Service Position 84
9 Voltage Measurement & Waveform Chart 92
10 Wiring Connection Diagram 103
11 Block Diagram 105
12 Notes Of Schematic Diagram 109
13 Schematic Diagram 111
14 Printed Circuit Board Diagrams 127
15 Illustration of IC’s, Transistors and Diodes 135
16 Terminal Function of IC’s 136
17 Exploded Views 137
18 Replacement Parts List 141
CONTENTS
Page Page
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(This “Safety Precaution” is applied only in U.S.A.)
1.1.2. Leakage Current Hot Check
1 Safety Precautions
1.1. General Guidelines
1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2. After servicing, ensure that all the protective devices such as insulation barriers, insulation papers shields are properly installed.
3. After servicing, check for leakage current checks to prevent from being exposed to shock hazards.
1. Before servicing, unplug the power cord to prevent an electric shock.
2. When replacing parts, use only manufacturer’s recommended components for safety.
3. Check the condition of the power cord. Replace if wear or damage is evident.
4. After servicing, be sure to restore the lead dress, insulation barriers, insulation papers, shields, etc.
5. Before returning the serviced equipment to the customer, be sure to make the following insulation resistance test to prevent the
customer from being exposed to a shock hazard.
1.1.1. Leakage Current Cold Check
1. Unplug the AC cord and connect a jumper between the two prongs on the plug.
2. Using an ohmmeter measure the resistance value, between the jumpered AC plug and each exposed metallic cabinet part on
the equipment such as screwheads, connectors, control shafts, etc. When the exposed metallic part has a return path to the
chassis, the reading should be between 1MΩand 5.2Ω.
When the exposed metal does not have a return path to the chassis, the reading must be .
1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.
2. Connect a 1.5kΩ, 10 watts resistor, in parallel with a 0.15µF capacitors, between each exposed metallic part on the set and a
good earth ground such as a water pipe, as shown in Figure 1.
3. Use an AC voltmeter, with 1000 ohms/volt or more sensitivity, to measure the potential across the resistor.
4. Check each exposed metallic part, and measure the voltage at each point.
5. Reverse the AC plug in the AC outlet and repeat each of the above measurements.
6. The potential at any point should not exceed 0.75 volts RMS. A leakage current tester (Simpson Model 229 or equivalent) may
be used to make the hot checks, leakage current must not exceed 1/2 milliamp. should the measurement is outside of the limits
specified, there is a possibility of a shock hazard, and the equipment should be repaired and re-checked before it is returned
to the customer.
Fig. 1
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1.2. Before Repair and Adjustment
Disconnect AC power, discharge ac capacitors C5712, C5808, C5805, C5813, C5816, C5824, C5517, C5516, C5508, C5509,
C5510, C5511, C5512 and C5513 through a 10Ω, 1W resistor to ground.
DO NOT SHORT-CIRCUIT DIRECTLY (with a screwdriver blade, for instance), as this may destroy solid state devices.
After repairs are completed, restore power gradually using a variac, to avoid overcurrent.
• Current consumption at AC 120 V, 60 Hz in NO SIGNAL mode (at volume minimum) should be 200 ~ 800 mA.
1.3. Protection Circuitry
The protection circuitry may have operated if either of the following conditions are noticed:
• No sound is heard when the power is turned on.
• Sound stops during a performance.
The function of this circuitry is to prevent circuitry damage if, for example, the positive and negative speaker connection wires are
"shorted", or if speaker systems with an impedance less than the indicated rated impedance of the amplifier are used.
If this occurs, follow the procedure outlines below:
1. Turn off the power.
2. Determine the cause of the problem and correct it.
3. Turn on the power once again after one minute.
Note:
When the protection circuitry functions, the unit will not operate unless the power is first turned off and then on again.
1.4. Safety Part Information
Safety Parts List:
There are special components used in this equipment which are important for safety.These parts are marked by in the
Schematic Diagrams & Replacement Parts List. It is essential that these critical parts should be replaced with manufacturer’s
specified parts to prevent shock, fire or other hazards. Do not modify the original design without permission of manufacturer.
Table 1
Reference No. Part No. Part Name & Description Remarks
8 REXX0640-J BLACK WIRE [M]
9 REXX0641-J RED WIRE [M]
14 RKMX0141B-S1 TOP CABINET [M]
15 RGR0383D-C REAR PANEL [M]
A2 K2CB2CB00021 AC CORD [M]
A6 RFA2903 TOP GLASS ACCESSORY [M]
A8 RXQ1607 PREPARED GLASS DOOR ASSY L [M]
A9 RXQ1608 PREPARED GLASS DOOR ASSY R [M]
DZ5701 ERZV10V511CS ZENER [M]
L5701 ELF15N035AN LINE FILTER [M]
L5702 ELF22V020A LINE FILTER [M]
T701 G4D1A0000117 SW TRANSFORMER [M]
T5701 ETS42BM1A1AC TRANSFORMER [M]
T5751 ETS19AB281AG BACKUP TRANSFORMER [M]
PC5701 B3PBA0000402 PHOTO COUPLER [M]
PC5720 B3PBA0000402 PHOTO COUPLER [M]
PC5799 B3PBA0000402 PHOTO COUPLER [M]
F1 K5D802APA008 FUSE [M]
IP701 K5H5012A0010 IC PROTECTOR [M]
IP702 K5H302100004 IC PROTECTOR [M]
TH5701 D4CAA2R20001 THERMISTOR [M]
TH5860 D4CC11040013 THERMISTOR [M]
P5701 K2AB2B000011 AC INLET [M]
PCB5 REPX0676N SMPS P.C.B. / AC INLET P.C.B. [M] (RTL)
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1.5. Caution for fuse replacement
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2 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equiped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equiped with ES devices, place the assembly on a conductive surface such as aluminium
foil, to prevent electrostatic charge build up or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder remover device. Some solder removal devices not classified as “anti-static (ESD protected)” can
generate electrical charge to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminium foil or
comparable conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize body motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to
damage an ES device).
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SC-HTR3 10P

3 Handling the Lead free Solder
3.1. General description about Lead Free Solder (PbF)
The lead free solder has been used in the mounting process of all electrical components on the printed circuit boards used for this
equipment in considering the globally environmental conservation.
The normal solder is the alloy of tin (Sn) and lead (Pb). On the other hand, the lead free solder is the alloy mainly consists of tin
(Sn), silver (Ag) and Copper (Cu), and the melting point of the lead free solder is higher approx.30 degrees C (86°F) more than that
of the normal solder.
Definition of PCB Lead Free Solder being used
The letter of “PbF” is printed either foil side or components side on the PCB using the lead free solder.
(See right figure)
Service caution for repair work using Lead Free Solder (PbF)
• The lead free solder has to be used when repairing the equipment for which the lead free solder is used.
(Definition: The letter of “PbF” is printed on the PCB using the lead free solder.)
• To put lead free solder, it should be well molten and mixed with the original lead free solder.
• Remove the remaining lead free solder on the PCB cleanly for soldering of the new IC.
• Since the melting point of the lead free solder is higher than that of the normal lead solder, it takes the longer time to melt
the lead free solder.
• Use the soldering iron (more than 70W) equipped with the temperature control after setting the temperature at 350±30
degrees C (662±86°F).
Recommended Lead Free Solder (Service Parts Route.)
• The following 3 types of lead free solder are available through the service parts route.
RFKZ03D01K-----------(0.3mm 100g Reel)
RFKZ06D01K-----------(0.6mm 100g Reel)
RFKZ10D01K-----------(1.0mm 100g Reel)
Note
* Ingredient: Tin (Sn), 96.5%, Silver (Ag) 3.0%, Copper (Cu) 0.5%, Cobalt (Co) / Germanium (Ge) 0.1 to 0.3%
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4 Operating Procedures
4.1. Control guide
4.1.1. This system
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4.1.2. Control panel
4.1.3. Amplifier
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4.1.4. Remote control
4.2. Remote control preparation
4.2.1. Inserting the batteries
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4.2.2. Using the remote control
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4.3. Installing and assembling the rack
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4.4. Home Theater connections
4.4.1. Basic connections
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4.4.2. Connecting equipment with HDMI terminal (TV, DVD recorder, etc.)
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4.4.3. Connecting with digital terminal-mouted equipment
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