Panasonic TX-32LED7F User manual

Service Manual
Colour LCD Television
TX-32LXD7
TX-32LED7F
TX-26LXD7
TX-26LED7F
GLP22 Chassis
Specifications
(Informations in brackets [ ] refers to model 26”)
Power Source: 220-240V AC, 50Hz
Power Consumption 115W [100W]
Stand-by Power Consumption: 1.0W (TV ONLY)
13W (TV+DVB set to record)
Aerial Impedance: 75Ωunbalanced, Coaxial Type
Receiving System: LXD7 LED7F
PAL-I, PAL-I/H, B/G, D/K
PAL-525/60 (AV only) SECAM B/G, D/K, L/L’
DVB (via UHF aerial input) PAL-525/60 (AV only)
M.NTSC (AV only) DVB (via VHF/UHF aerial input)
NTSC (AV only) M.NTSC (AV only)
NTSC (AV only)
Receiving Channels: LXD7 LED7F
UHF E21-E68 VHF E2-E12 VHF H1-H2 (ITALY)
VHF A-H (ITALY) VHF R1-R2
VHF R3-R5 VHF R6-R12
UHF E21-E69 CATV (S01-S05)
CATV S1-S10 (M1-M10) CATV S11-S20 (U1-U10)
CATV S21-S41 (Hyperband)
Operating Conditions: Temperature: 0°C ÷35°C
Humidity: 20% ÷ 80% RH (non condensing)
Scanning format: 480i(60Hz), 480p(60Hz), 576i(50Hz), 576p(50Hz), 720p(60Hz), 720p(50Hz), 1.080i(60Hz),
1.080i(50Hz), 1.080p(60Hz), 1.080p(50Hz)
Intermediate Frequency:
Video/Audio LXD7 LED7F
Video 38,9MHz 38,9MHz, 33,9MHz
Audio 32.90MHz 33,4MHz (B/G), 33,16MHz (A2)
32.35MHz(NICAM) 33,05MHz (NICAM B/G, D/K, L’)
32,4MHz (D/K), 32,66MHz (CZ STEREO)
40,4MHz (L’), 39,75MHz (L’ NICAM)
Colour 34,47MHz 34,47MHz (PAL)
34,5MHz, 34,65MHz (SECAM)
38,3MHz, 38,15MHz (SECAM L’)
ORDER No. PCZ0704032CE
Panasonic CS ( U.K. ) Ltd.
WILLOUGHBY ROAD,
BRACKNELL,
BERKS.,
RG12 8FT.

Terminals:
AV1 IN Video (21 pin) 1V p-p 75Ω
Audio (21 pin) 500mV rms 10kΩ
RGB (21 pin) 0,7V p-p 75Ω
AV1 OUT Video (21 pin) 1V p-p 75Ω
Audio (21 pin) 500mV rms 1kΩ
AV2 IN Video (21 pin) 1V p-p 75Ω
Audio (21 pin) 500mV rms 10kΩ
RGB (21 pin) 0,7V p-p 75Ω
S-video IN (21-pin)Y: 1V p-p 75Ω
C:0,3V p-p 75Ω
AV2 OUT Video (21 pin) 1V p-p 75Ω
Audio (21 pin) 500mV rms 1kΩ
AV3 IN S-Video IN (4-pin)Y: 1V p-p 75Ω
C:0,286V p-p 75Ω
Audio (RCAx2) 500mV rms 10kΩ
Video (RCAx1) 1V p-p 75Ω
HDMI Type A Connector
COMPONENT Video (RCAx3) Y:1V p-p 75Ω(including synchronization)
Pb, Pr: ±0,35V p-p 75Ω
AUDIO IN Audio (RCAx2) 500mV rms 10kΩ(for YUV; HDMI1)
AUDIO OUT Audio (RCAx2) 500mV rms 1kΩ(high Impedance)
LCD screen: L5EDD8Q00029 [L5EDD6Q00023]
1366 x 768 XGA, 16:9
Visible Diagonal 800mm [660mm]
Audio Output: 20W (2x10W)
Headphones: 3,5mm (M3), 8ΩImpedance
Accessories supplied : Remote Control 2 x R6 (UM3) Batteries
Dimensions: LXD7
Height: Width: Depth:
Including TV stand 615mm 791mm 239mm
[525mm] [657mm] [239mm]
TV set only 563mm 791mm 117mm
[473mm] [657mm] [117mm]]
Net weight: 17,5kg [15kg]
Specifications are subject to change without notice.
Weights and dimensions shown are approximate.
This service information is designed for experienced repair technicians only and is not designed for use by the general public. It does not
contain warnings or cautions to advise non-technical individuals of potencial dangers in attempting to service a product. Products
powered by electricity should be serviced or repaired only by experienced professional technicians. Any attempt to service or repair the
product or products deal within this service information by anyone else could result in serious injury or death.
Warning
2

CONTENTS
SAFETY PRECAUTIONS.......................................................................... 4
GENERAL GUIDE LINES..................................................................... 4
TOUCH – CURRENT CHECK.............................................................. 4
PREVENTION OF ELECTROSTATIC DISCHARGE (ESD)
TO ELECTROSTATICALLY SENSITIVE (ES) DEVICES.......................... 5
ABOUT LEAD FREE SOLDER (PBF)........................................................ 6
SUGGESTED PB FREE SOLDER....................................................... 6
APPLICABLE SIGNALS............................................................................. 7
SERVICE HINTS ....................................................................................... 8
CHASSIS BOARD LAYOUT...................................................................... 9
SETTING INSPECTION............................................................................. 9
SELF-CHECK .......................................................................................... 10
POWER LED BLINKING TIMING CHART............................................... 11
SERVICE MODE FUNCTION.................................................................. 12
SERVICE ................................................................................................ 13
OPTION BYTES DESCRIPTION............................................................. 14
ADJUSTMENT METHOD ........................................................................ 15
WIRING DIAGRAM.................................................................................. 16
BLOCK DIAGRAMS................................................................................. 17
PARTS LOCATION.................................................................................. 20
REPLACEMENT PARTS LIST................................................................. 22
SCHEMATIC DIAGRAMS........................................................................ 41
AP-BOARD SCHEMATIC DIAGRAM................................................ 42
G-BOARD SCHEMATIC DIAGRAM................................................... 43
H-BOARD (1 OF 4) SCHEMATIC DIAGRAM..................................... 44
P-BOARD SCHEMATIC DIAGRAM................................................... 48
V-BOARD SCHEMATIC DIAGRAM ................................................... 49
DG-BOARD (1 OF 13) SCHEMATIC DIAGRAM................................ 50
CONDUCTOR VIEWS............................................................................. 63
3

Safety Precautions
General Guide Lines
1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated
or damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3. After servicing, make the following touch current checks to prevent the customer from being exposed to shock hazards.
4. Always ensure panel TKP0E16001 is correctly replaced before returning to customer (see Fig.1).
Touch-Current Check
1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.
2. Connect a measuring network for touch currents between each exposed metallic part on the set and a good earth
ground such as a water pipe, as shown in Fig. 2.
3. Use Leakage Current Tester (Simpson 228 or equivalent) to measure the potential across the measuring network.
4. Check each exposed metallic part, and measure the voltage at each point.
5. Reserve the AC plug in the AC outlet and repeat each of the above measure.
6. The potential at any point (TOUCH CURRENT) expressed as voltage U1 and U2, does not exceed the following values:
For a. c.: U1 = 35 V (peak) and U2 = 0.35 V (peak);
For d. c.: U1 = 1.0 V,
Note:
The limit value of U2 = 0.35 V (peak) for a. c. and U1 = 1.0 V for d. c. correspond to the values 0.7 mA (peak) a. c. and
2.0 mA d. c.
The limit value U1 = 35 V (peak) for a. c. correspond to the value 70 mA (peak) a. c. for frequencies greater than 100
kHz.
7. In case a measurement is out of the limits specified, there is a possibility of a shock hazard, and the equipment should
be repaired and rechecked before it is returned to the customer.
Fig. 2
4
TO
A
PPLIANCES
EXPOSED
METAL PARTS
Resistance values in ohms (Ω)
V
R0=500
Ω
RS=1500
Ω
CS=0.22
µ
F
10k
Ω
0.022
µ
F
U1
COLD
WATER PIPE
(EARTH GROUND)
V: Voltmetr or oscilloscope
(r.m.s. or peak reading)
Measuring network for TOUCH CURRENTS
Input resistance: ≥ 1M
Ω
Input capacitance: ≤ 200pF
Frequency range: 15Hz to 1MHz and d.c.respectively
NOTE – Appropriate measures should be taken to obtain the correct value in case of non-sinusoidal waveforms
U2(V)
Fig. 1

Prevention of Electrostatic Discharge (ESD) to Electrostatically
Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are
called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect
transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of
component damage caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on
your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD
wrist strap, which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge build up or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD
protected)" can generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective
material to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity
(ESD) sufficient to damage an ES device).
There are special components used in this equipment which are important for safety.
These parts are marked by in schematic diagrams, exploded views and replacement parts list. It is essential that
these critical parts should be replaced with manufacturer’s specified parts to prevent shock, fire, or other hazards. Do
not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE
5

About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work,
we’d suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol
stamped on the back of PCB.
Caution
•Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40°C)
higher. Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
•Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before
applying Pb solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
•After applying PbF solder to double layered boards, please check the component side for excess solder which may
flow onto the opposite side. (see Fig.3)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.
However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used. (see Fig.4)
Fig.3
Fig.4
6

Applicable signals
Note:
•Signals other than above may not be displayed properly.
•The above signals are reformatted for optimal viewing on your display.
7
Signal name COMPONENT HDMI
525 (480) / 60i * *
525 (480) / 60p * *
625 (576) / 50i * *
625 (576) / 50p * *
750 (720) / 60p * *
750 (720) / 50p * *
1,125 (1,080) / 60i * *
1,125 (1,080) / 50i * *
1,125 (1,080) / 60p *
1,125 (1,080) / 50p *
Component (Y, Pb, Pr), HDMI

Service Hints
How to remove the backcover
Remove the 18[16] fixing screws. (see Fig.5)
How to remove the Pedestal assembly
Lay the main unit face down. (see Fig.6)
Remove the 4 fixing screws and the pedestal assembly. (see Fig.7)
Fig.6
8
Fig.7
SCREWS
SCREWS SCREWS
Fig.5

Chassis Board Layout
Setting Inspection
Voltage Confirmation
Confirm the following voltages:
AP board
Description Test point Position Normal mode Stand by mode Active stand by mode
Sub_5V TP3805 AP3, pin 2,3 5,04V +/- 0,25V Max 2V 5,04V +/- 0,25V
Panel 5/12V TP3802 AP4, pin 12,13 12,13V +/- 0,45V Max 2V Max 2V
Sound_Vcc TP3804 AP3, pin 21,22 15,10V +/- 0,45V Max 2V Max 2V
9V TP3808 Q3814, pin 5,6,7,8 8,93V +/- 0,25V 8,93V +/- 0,25V 8,93V +/- 0,25V
STBY_5V TP3810 AP4, pin 21 5,0V +/- 0,25V 5,0 +/- 0,25V 5,0V +/- 0,25V
P board
24V TP852 P4, pin 5,6,7,8 24,5V +/- 1V 24,5V +/- 1V
DG board
Sub1,2V TP5601 1,17V - 1,32V
Sub1,8V TP5602 1,7V - 1,9V
Sub3,3V TP5600 3,14V - 3,46V
MHQ1,2V TP4209 1,1V - 1,3V
Board Name Function
AP-Board Power Supply Regulator
DG-Board Global Core, HDMI, IDTV Processor, D/A Converter
G-Board Side AV Connector
H-Board AV Connector, TV tuner, AV Switch
P-Board Main Input, Power Supply, Main Switch
V-Board Remote Receiver, LED IR, Cats
9
V-BOARD
AP-BOARD
DG-BOARD
H-BOARD
P-BOARD
G-BOARD

Self Check
Self-check is used to automatically check the bus lines and hexadecimal code of the TV set. To enter Self-Check mode, keep
pressing the down (-/v) button on the TV set and press the STATUS button on the remote control. To exit Self Check,
switch off the TV set at the power button.
Display Ref. No. Description P.C.B.
ADV IC4510 A/D CONVERTER DG-Board
VSW IC3001 AV SWITCH H-Board
ADAV IC2106 AUDIO PROCESSOR H-Board
ASW IC3101 AV SWITCH H-Board
TUN1 TU3200 ANALOG TUNER H-Board
GENX IC1100 MICROPROCESSOR DG-Board
MEM1 IC1101 EEPROM DG-Board
MEM2 IC8601 EEPROM DG-Board
D-TUN TU8301 DIGITAL TUNER DG-Board
OFDM IC8301 COFDM DEMODULATOR DG-Board
If the CCU
p
orts have been checked and found to be incorrect or not located then " - - " will a
pp
ear in
p
lace of "O.K.".
10
SUM
OPTION 1
OPTION 2
OPTION 3
CHECK
MODEL ID
189e
2c
ea
7f
95
04
03040000
00000002
1863
0c
ea
7f
75
04
030a0000
00000002
A
DV O.K.
VSW O.K.
A
DAV O.K.
A
SW O.K.
GENX O.K.
MEM1 O.K.
MEM2 O.K.
TUN1 O.K.
D-TUN O.K.
OFDM O.K.
PEAKS-SOFT 1.050
PEAKS-EEP 01.05.0024
GenX-SOFT 1.00.00
GenX-EEP 1.02.00
GenX-ROMCORR 1.01.00
Self Check Com
p
lete
26 Panasonic 2007LCD 26led70.dat:000009
189d
2c
ea
7
f
95
04
03040000
00000004
A
DV O.K.
VSW O.K.
A
DAV O.K.
A
SW O.K.
GENX O.K.
MEM1 O.K.
MEM2 O.K.
TUN1 O.K.
D-TUN O.K.
OFDM O.K.
PEAKS-SOFT 1.050
PEAKS-EEP 01.05.0023
GenX-SOFT 1.00.00
GenX-EEP 1.02.00
GenX-ROMCORR 1.01.00
SUM
OPTION 1
OPTION 2
OPTION 3
CHECK
MODEL ID
32 Self Check Complete
Panasonic 2007LCD 32led70.dat:00000b
A
DV O.K.
VSW O.K.
A
DAV O.K.
A
SW O.K.
GENX O.K.
MEM1 O.K.
MEM2 O.K.
TUN1 O.K.
D-TUN O.K.
OFDM O.K.
2.050
02.05.0015
1.00.00
1.02.00
1.01.00
PEAKS-SOFT
PEAKS-EEP
GenX-SOFT
GenX-EEP
GenX-ROMCORR
SUM
OPTION 1
OPTION 2
OPTION 3
CHECK
MODEL ID
Self Check Complete
26 Panasonic 2007LCD 26led70f.dat:000056
2.050
02.05.0014
1.00.00
1.02.00
1.01.00
1872
0c
ea
7
f
75
04
030a000
0000004
A
DV O.K.
VSW O.K.
A
DAV O.K.
A
SW O.K.
GENX O.K.
MEM1 O.K.
MEM2 O.K.
TUN1 O.K.
D-TUN O.K.
OFDM O.K.
PEAKS-SOFT
PEAKS-EEP
GenX-SOFT
GenX-EEP
GenX-ROMCORR
SUM
OPTION 1
OPTION 2
OPTION 3
CHECK
MODEL ID
32 Self Check Complete
Panasonic 2007LCD 32led70f.dat:000067
TX-26LXD7
TX-32LXD7
TX-26LED7F
TX-32LED7F