Panasonic VIERA TC-P50GT30 User manual

© Panasonic Corporation 2011.
Unauthorized copying and distribution is a violation
of law.
ORDER NO.MTNC110217CE
B34 Canada: B62
50 inch Class 1080p Plasma HDTV
Model No. TC-P50GT30
GPF14DU Chassis

2
TABLE OF CONTENTS PAGE PAGE
1 Safety Precautions -----------------------------------------------3
1.1. General Guidelines ----------------------------------------3
2 Warning --------------------------------------------------------------4
2.1. Prevention of Electrostatic Discharge (ESD)
to Electrostatically Sensitive (ES) Devices ----------4
2.2. About lead free solder (PbF) ----------------------------5
3 Service Navigation------------------------------------------------6
3.1. PCB Layout--------------------------------------------------6
3.2. Applicable signals------------------------------------------7
4 Specifications ------------------------------------------------------8
5 Technical Descriptions----------------------------------------10
5.1. Specification of KEY for DTCP-IP, WMDRM
and Widevine----------------------------------------------10
6 Service Mode----------------------------------------------------- 11
6.1. How to enter into Service Mode---------------------- 11
6.2. Option - Mirror---------------------------------------------13
6.3. Service tool mode----------------------------------------13
6.4. Hotel mode-------------------------------------------------14
6.5. Data Copy by SD Card ---------------------------------15
7 Troubleshooting Guide----------------------------------------18
7.1. Check of the IIC bus lines------------------------------18
7.2. Power LED Blinking timing chart---------------------19
7.3. No Power---------------------------------------------------19
7.4. No Picture--------------------------------------------------20
7.5. Local screen failure--------------------------------------21
8 Service Fixture & Tools ---------------------------------------22
8.1. SC jig--------------------------------------------------------22
9 Disassembly and Assembly Instructions---------------23
9.1. Remove the Rear cover --------------------------------23
9.2. Remove the AC inlet ------------------------------------23
9.3. Remove the P-Board------------------------------------23
9.4. Remove the P2-Board ----------------------------------23
9.5. Remove the Terminal covers and the shield
metals-------------------------------------------------------24
9.6. Remove the A-Board------------------------------------24
9.7. Remove the Side unit assy ----------------------------24
9.8. Remove the SU-Board----------------------------------25
9.9. Remove the SD-Board----------------------------------25
9.10. Remove the SC-Board----------------------------------25
9.11. Remove the SS-Board----------------------------------26
9.12. Remove the SS2-Board --------------------------------26
9.13. Remove the Fan------------------------------------------26
9.14. Remove the Speakers ----------------------------------26
9.15. Remove the Stand bracket-----------------------------27
9.16. Remove the K-Board------------------------------------27
9.17. Remove the S-Board------------------------------------27
9.18. Remove the V-Board------------------------------------27
9.19. Remove the Bottom cabinet assy--------------------27
9.20. Remove the Plasma panel section from the
Cabinet assy.----------------------------------------------28
9.21. Remove the Contact metals---------------------------28
9.22. Remove the C1-Board----------------------------------28
9.23. Remove the C2-Board----------------------------------29
9.24. Remove the C3-Board----------------------------------29
9.25. Replace the Plasma panel-----------------------------29
10 Measurements and Adjustments --------------------------30
10.1. Adjustment-------------------------------------------------30
11 Block Diagram ---------------------------------------------------35
11.1. Main Block Diagram------------------------------------- 35
11.2. Block (1/4) Diagram ------------------------------------ 36
11.3. Block (2/4) Diagram------------------------------------- 37
11.4. Block (3/4) Diagram------------------------------------- 38
11.5. Block (4/4) Diagram------------------------------------- 39
12 Wiring Connection Diagram -------------------------------- 41
12.1. Caution statement. -------------------------------------- 41
12.2. Wiring (1) -------------------------------------------------- 41
12.3. Wiring (2) -------------------------------------------------- 41
12.4. Wiring (3) -------------------------------------------------- 42
12.5. Wiring (4) -------------------------------------------------- 43
12.6. Wiring (5) -------------------------------------------------- 44
12.7. Wiring (6) -------------------------------------------------- 45
12.8. Wiring (7) -------------------------------------------------- 46
13 Schematic Diagram
14 Printed Circuit Board
15 Exploded View

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1 Safety Precautions
1.1. General Guidelines
1. When conducting repairs and servicing, do not attempt to modify the equipment, its parts or its materials.
2. When wiring units (with cables, flexible cables or lead wires) are supplied as repair parts and only one wire or some of the
wires have been broken or disconnected, do not attempt to repair or re-wire the units. Replace the entire wiring unit instead.
3. When conducting repairs and servicing, do not twist the Fasten connectors but plug them straight in or unplug them straight
out.
4. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
5. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
6. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
1.1.1. Leakage Current Cold Check
1. Unplug the AC cord and connect a jumper between the
two prongs on the plug.
2. Measure the resistance value, with an ohmmeter,
between the jumpered AC plug and each exposed metal-
lic cabinet part on the equipment such as screwheads,
connectors, control shafts, etc. When the exposed metal-
lic part has a return path to the chassis, the reading
should be between 1Mohm and 5.2Mohm.
When the exposed metal does not have a return path to
the chassis, the reading must be .
1.1.2. Leakage Current Hot Check (See
Figure 1.)
1. Plug the AC cord directly into the AC outlet. Do not use
an isolation transformer for this check.
2. Connect a 1.5kohm, 10 watts resistor, in parallel with a
0.15μF capacitors, between each exposed metallic part
on the set and a good earth ground such as a water pipe,
as shown in Figure 1.
3. Use an AC voltmeter, with 1000 ohms/volt or more sensi-
tivity, to measure the potential across the resistor.
4. Check each exposed metallic part, and measure the volt-
age at each point.
5. Reverse the AC plug in the AC outlet and repeat each of
the above measurements.
6. The potential at any point should not exceed 0.75 volts
RMS. A leakage current tester (Simpson Model 229 or
equivalent) may be used to make the hot checks, leakage
current must not exceed 1/2 milliamp. In case a measure-
ment is outside of the limits specified, there is a possibility
of a shock hazard, and the equipment should be repaired
and rechecked before it is returned to the customer.
Figure 1

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2 Warning
2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatically
Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-
trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor [chip] components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-
num foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as [anti-static (ESD protected)] can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-
ble conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise ham less motion such as the brush-
ing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient
to damage an ES device).

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2.2. About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it's manufacture due to environmental conservation issues. For service and repair work, we'd
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB.
Caution
• Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher. Please
use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
• Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb sol-
der. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
• After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto the
opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. How-
ever, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.

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3 Service Navigation
3.1. PCB Layout
Board Name Function Board Name Function
P Power Supply C1 Data Driver (Lower Right)
P2 Power Supply C2 Data Driver (Lower Center)
A Main AV input, processing C3 Data Driver (Lower Left)
K Remote receiver, Power LED, C.A.T.S sensor SC Scan Drive
S Power Switch SS Sustain Drive
V 3D Eyewear transmitter SS2 Sustain out (Lower)
SU Scan out (Upper)
Non serviceable.
SU-Board should be exchanged for service.
SD Scan out (Lower)
Non serviceable.
SD-Board should be exchanged for service.

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3.2. Applicable signals
* Mark: Applicable input signal for Component (Y, PB, PR), HDMI and PC
Note
• Signals other than above may not be displayed properly.
• The above signals are reformatted for optimal viewing on your display.
• Computer signals which can be input are those with a horizontal scanning frequency of 15 to 110 kHz and vertical scanning fre-
quency of 48 to 120 Hz. (However, the image will not be displayed properly if the signals exceed 1,200 lines.)
horizontal frequency (kHz) vertical frequency (Hz) COMPONENT HDMI PC
525 (480) / 60i 15.73 59.94 * *
525 (480) /60p 31.47 59.94 * *
750 (720) /60p 45.00 59.94 * *
1,125 (1,080) /60i 33.75 59.94 * *
1,125 (1,080) /60p 67.43 59.94 *
1,125 (1,080) /60p 67.50 60.00 *
1,125 (1,080) /24p 26.97 23.98 *
1,125 (1,080) /24p 27.00 24.00 *
640 ×400 @70 31.47 70.08 *
640 ×480 @60 31.47 59.94 *
Macintosh13 inch (640 ×480) 35.00 66.67 *
640 ×480 @75 37.50 75.00 *
852 ×480 @60 31.44 59.89 *
800 ×600 @60 37.88 60.32 *
800 ×600 @75 46.88 75.00 *
800 ×600 @85 53.67 85.08 *
Macintosh16 inch (832 ×624) 49.73 74.55 *
1,024 ×768 @60 48.36 60.00 *
1,024 ×768 @70 56.48 70.07 *
1,024 ×768 @75 60.02 75.03 *
1,024 ×768 @85 68.68 85.00 *
Macintosh21 inch (1,152 ×870) 68.68 75.06 *
1,280 ×768 @60 47.78 59.87 *
1,280 ×1,024 @60 63.98 60.02 *
1,366 ×768 @60 48.39 60.04 *

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4 Specifications
QTV
QWireless LAN Adaptor
Power Source AC 120 V, 60 Hz
Power Consumption
Rated Power Consumption 399 W
Standby condition 0.2 W
Plasma Display panel
Drive method AC type
Aspect Ratio 16:9
Visible screen size 50 inch class (49.9 inches measured diagonally)
(W ×H ×Diagonal) 43.5 inch ×24.4 inch ×49.9 inch (1,105 mm ×622 mm ×1,268 mm)
(No. of pixels) 2,073,600 (1,920 (W) ×1,080 (H)) [5,760 ×1,080 dots]
Sound Audio Output 20 W [ 10 W + 10 W ] ( 10 % THD )
PC signals VGA, SVGA, XGA, WXGA, SXGA
Horizontal scanning frequency 31 - 69 kHz
Vertical scanning frequency 59 - 86 Hz
Channel Capability (Digital/Analog) VHF/ UHF: 2 - 69, CATV: 1 - 135
Operating Conditions Temperature: 32 °F - 104 °F (0 °C - 40 °C)
Humidity: 20 % - 80 % RH (non-condensing)
Connection Terminals
VIDEO IN VIDEO: RCA PIN Type ×1 1.0 V [p-p] (75 Ω)
AUDIO L-R: RCA PIN Type ×2 0.5 V [rms]
COMPONENT IN Y: 1.0 V [p-p] (including synchronization)
PB, PR: ±0.35 V [p-p]
AUDIO L-R: RCA PIN Type ×2 0.5 V [rms]
HDMI 1- 4 TYPE A Connector ×4
This TV supports [HDAVI Control 5] function.
USB 1- 3 USB 2.0 Type A connector x 3 (DC 5 V MAX500mA)
PC D-SUB 15 PIN: R, G, B / 0.7 V [p-p] (75 Ω)
HD, VD / 1.0 - 5.0 V [p-p] (high impedance)
LAN (for VIERA Connect) RJ45 (10BASE-T/100BASE-TX)
Card slot SD CARD slot ×1
DIGITAL AUDIO OUT PCM / Dolby Digital, Fiber Optic
FEATURES 3D Y/C FILTER
CLOSED CAPTION V-Chip
VIERA Connect Media player
3D IMAGE VIEWER HDAVI Control 5
Dimensions (W ×H ×D)
Including pedestal 46.4 inch ×29.7 inch ×13.2 inch (1,177 mm ×753 mm ×335 mm)
TV Set only 46.4 inch ×28.3 inch ×1.5 (2.3) inch (1.177 mm ×718 mm ×37 (58) mm)
Mass Including pedestal 65.1 lb. (29.5 kg)
TV Set only 56.3 lb. (25.5 kg)
Note
• Design and Specifications are subject to change without notice. Mass and Dimensions shown are approximate.
Power supply DC 5 V (USB powered) 500 mA
Antenna Tx 1, Rx 2
Interface USB 2.0
Standard Compliance IEEE802.11n / IEEE802.11a / IEEE802.11g / IEEE802.11b
Transmission system MISO-OFDM system, OFDM system, DSSS system
Frequency Range IEEE802.11n / IEEE802.11a:
5.150 GHz - 5.725 GHz for EU Countries
5.150 GHz - 5.850 GHz for USA, Canada
5.250 GHz - 5.850 GHz for Taiwan
IEEE802.11g / IEEE802.11b / IEEE802.11n:
2.412 GHz - 2.472 GHz for EU countries
2.412 GHz - 2.462 GHz USA, Canada, Taiwan
Transfer rate (standard)* IEEE802.11n: Tx Max. 150 Mbps, Rx Max. 300 Mbps
IEEE802.11g / IEEE802.11a: Max. 54 Mbps
IEEE802.11b: Max. 11 Mbps
Access Mode Infrastructure mode
Security WPA2-PSK (TKIP/AES)

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WPA-PSK (TKIP/AES)
WEP (64 bit / 128 bit)
Dimensions (W ×H ×D) 1.18 inch ×0.42 inch ×3.73 inch (30.00mm ×10.72 mm ×94.85 mm)
Mass 0.88 oz (25g) Net
*Transfer rates are theoretical values; however, actual communication rate will vary according to communication environment or
connected equipment.

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5 Technical Descriptions
5.1. Specification of KEY for DTCP-IP, WMDRM and Widevine
5.1.1. General information:
1. EEPROM (IC8902) for spare parts has the seed of KEY for each DTCP-IP for DLNA, WMDRM for Netflix and Widevine for
CinemaNow.
2. The final KEY data will be generated by Peaks IC (IC8000) when SELF CHECK was done and are stored in both Peaks IC
(IC8000) and EEPROM (IC8902).
5.1.2. Replacement of ICs:
When Peaks IC is replaced, EEPROM should be also replaced with new one the same time.
When EEPROM is replaced, Peaks IC is not necessary to be replaced the same time.
After the replacement of IC, SELF CHECK should be done to generate the final KEY data.
How to SELF CHECK: While pressing [VOLUME ( - )] button on the main unit, press [MENU] button on the remote control for
more than 3 seconds.
TV will be forced to the factory shipment setting after this SELF CHECK.