Panasonic TH-50PX20U/P User manual

©2003 Matsushita Electric Industrial Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
TH-50PX20U-P
GPH6DU Chassis
High Definition Plasma Television
Specifications
Power Source AC 120 V, 50/60 Hz
Power Consumption Maximum :645 W
Stand-by condition :0.9 W
Plasma Display panel Drive method :AC type 50-inch, 16 :9 aspect ratio
Screen Size 43.54 “ (1106 mm) (W) × 24.49 “ (622 mm) (H) × 49.96 “ (1269 mm) (diagonal)
Dimensions
(W × H × D )
52.32 “ (1329mm) × 34.25 “ (870 mm) × 5.47 “ (139 mm)
Mass (Weight) 121.3 lb.(55 kg)Net
Channel Capability-181 VHF-12 :UHF-56 :Cable-125
Sound
Speaker Woofer 80mm × 2 , Tweeter 16mm × 73mm × 8
Audio Output 26W[5W+5W,8W+8W](10%THD)
Headphone M3 (3.5 mm) Jack × 1
FEATURES Two screen display fuctions 3D Y/C FILTER
BBE VIVA LINEAR PIP
CLOSED CAPTION
V
-Chip
Accessories Supplied Remote control Transmitter EUR7603ZB0
AA Battery × 2 Ferrite cores (large × 5, small × 5)
AC Cord F type Antenna Adaptor (3C-2V × 2, 5C-2V × 2)
Pedestal
Operating Conditions Temperature : 34 °F - 104 °F (0° - 40°C)
Humidity : 20 % - 80 % (non-condensing)
Connection Terminals RGB input D-SUB 15pin R, G, B /0.7 Vp-p (759)
HD, VD /1.0 -5.0 Vp-p (high impedance)
AV INPUT 1-3
V
IDEO
(Phono Jack Type)
1.0 Vp-p (759)
S-VIDEO
(Mini DIN 4-pin)
Y :1.0 Vp-p (759), C : 0.286 Vp-p
(759)
A
UDIO L-R
(Phono Jack Type × 2)
0.5 Vrms
ORDER NO. ITD0309036C1
B19 Canada: B07

1 Applicable signals 4
2 Safety Precautions 5
2.1. General Guidelines 5
3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices 6
4 About lead free solder (PbF) 7
5 Service Hint 8
6 Location of Lead Wiring 9
6.1. Lead of Wiring (1) 9
6.2. Lead of Wiring (2) 10
6.3. Lead of Wiring (3) 11
6.4. Lead of Wiring (4) 12
6.5. Lead of Wiring (5) 13
6.6. Lead of Wiring (6) 14
7 Self-check Function 15
7.1. Self-check of the microcomputer control system (bus line)
15
7.2. Power LED Blinking timing chart 16
7.3. No Power 17
7.4. No Picture 18
7.5. Local screen failure 18
8 Serviceman Mode (Electronic Controls) 19
9 CAT (computer Aided Test) mode 21
9.1. IIC mode 21
9.2. CD mode 22
9.3. SD mode 22
9.4. IIC mode structure (following items value is sample data.)
23
10 Adjustment Procedure 24
10.1. Driver Set-up 24
10.2. Initialization Pulse Adjust 25
10.3. P.C.B. (Printed Circuit Board) exchange 26
10.4. Adjustment Volume Location 26
10.5. Test Point Location 26
11 Adjustment 27
11.1. Pedestal setting 27
11.2. NTSC panel white balance 28
11.3. HD panel white balance 29
11.4. Sub brightness setting 30
12 Hotel mode 31
13 Conductor Views 33
13.1. PF-Board 33
13.2. P-Board 34
13.3. PA-Board 36
13.4. TA and TB-Board 38
13.5. H-Board 39
13.6. DV-Board 40
13.7. DG-Board 42
13.8. D-Board 44
13.9. C1-Board 47
13.10. C2-Board 48
13.11. C3-Board 49
13.12. C4-Board 50
13.13. C5-Board 51
13.14. C6-Board 52
13.15. SC-Board 53
13.16. SU-Board 56
13.17. SD-Board 57
AV PROG.OUT
V
IDEO
(Phono Jack Type)
1.0 Vp-p (759)
A
UDIO L-R
(Phono Jack Type × 2)
0.5 Vrms
TO AUDIO AMP
A
UDIO L-R
(Phono Jack Type × 2)
0.5 Vrms
COMPONENT VIDEO Y1.0 Vp-p (including synchronization)
INPUT1-2 PB /PR ±0.35Vp-p
A
UDIO L-R
(Phono Jack Type × 2)
0.5 Vrms
HDMI INPUT HDMI type A connector
A
UDIO L-R
(Phono Jack Type × 2)
0.5 Vrms
Note:
Design and Specifications are subject to change without notice.Weight and Dimensions shown are approximate.
CONTENTS Page Page
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13.18. SS, SS2 and SS3-Board 58
13.19. JG-Board 60
13.20. G-Board 62
13.21. K and S-Board 63
14 Block and Schematic Diagrams 65
14.1. Schematic Diagram Notes 65
14.2. Main Block Diagram 66
14.3. PF-Board Block Diagram 67
14.4. PF-Board Schematic Diagram 68
14.5. P-Board Block Diagram 69
14.6. P-Board (1 of 6) Schematic Diagram 70
14.7. P-Board (2 of 6) Schematic Diagram 71
14.8. P-Board (3 of 6) Schematic Diagram 72
14.9. P-Board (4 of 6) Schematic Diagram 73
14.10. P-Board (5 of 6) Schematic Diagram 74
14.11. P-Board (6 of 6) Schematic Diagram 75
14.12. PA and G-Board Block Diagram 76
14.13. PA-Board (1 of 3) Schematic Diagram 77
14.14. PA-Board (2 of 3) Schematic Diagram 78
14.15. PA-Board (3 of 3) Schematic Diagram 79
14.16. G-Board Schematic Diagram 80
14.17. TA, TB and H-Board Block Diagram 81
14.18. TA and TB-Board Schematic Diagram 82
14.19. H-Board (1 of 2) Schematic Diagram 83
14.20. H-Board (2 of 2) Schematic Diagram 84
14.21. DV-Board Block Diagram 85
14.22. DV-Board (1 of 3) Schematic Diagram 86
14.23. DV-Board (2 of 3) Schematic Diagram 87
14.24. DV-Board (3 of 3) Schematic Diagram 88
14.25. JG-Board Block Diagram 89
14.26. JG-Board (1 of 5) Schematic Diagram 90
14.27. JG-Board (2 of 5) Schematic Diagram 91
14.28. JG-Board (3 of 5) Schematic Diagram 92
14.29. JG-Board (4 of 5) Schematic Diagram 93
14.30. JG-Board (5 of 5) Schematic Diagram 94
14.31. DG-Board Block Diagram 95
14.32. DG-Board (1 of 7) Schematic Diagram 96
14.33. DG-Board (2 of 7) Schematic Diagram 97
14.34. DG-Board (3of 7) Schematic Diagram 98
14.35. DG-Board (4 of 7) Schematic Diagram 99
14.36. DG-Board (5 of 7) Schematic Diagram 100
14.37. DG-Board (6 of 7) Schematic Diagram 101
14.38. DG-Board (7 of 7) Schematic Diagram 102
14.39. D-Board (1 of 2) Block Diagram 103
14.40. D-Board (2 of 2) Block Diagram 104
14.41. D-Board (1 of 15) Schematic Diagram 105
14.42. D-Board (2 of 15) Schematic Diagram 106
14.43. D-Board (3 of 15) Schematic Diagram 107
14.44. D-Board (4 of 15) Schematic Diagram 108
14.45. D-Board (5 of 15) Schematic Diagram 109
14.46. D-Board (6 of 15) Schematic Diagram 110
14.47. D-Board (7 of 15) Schematic Diagram 111
14.48. D-Board (8 of 15) Schematic Diagram 112
14.49. D-Board (9 of 15) Schematic Diagram 113
14.50. D-Board (10 of 15) Schematic Diagram 114
14.51. D-Board (11 of 15) Schematic Diagram 115
14.52. D-Board (12 of 15) Schematic Diagram 116
14.53. D-Board (13 of 15) Schematic Diagram 117
14.54. D-Board (14 of 15) Schematic Diagram 118
14.55. D-Board (15 of 15) Schematic Diagram 119
14.56. C1, C2, C3, C4, C5, and C6-Board (1 of 2) Block Diagram
120
14.57. C1, C2, C3, C4, C5, and C6-Board (2 of 2) Block Diagram
121
14.58. C1-Board (1 of 2) Schematic Diagram 122
14.59. C1-Board (2 of 2) Schematic Diagram 123
14.60. C2-Board Schematic Diagram 124
14.61. C3-Board (1 of 2) Schematic Diagram 125
14.62. C3-Board (2 of 2) Schematic Diagram 126
14.63. C4-Board (1 of 2) Schematic Diagram 127
14.64. C4-Board (2 of 2) Schematic Diagram 128
14.65. C5-Board Schematic Diagram 129
14.66. C6-Board (1 of 2) Schematic Diagram 130
14.67. C6-Board (2 of 2) Schematic Diagram 131
14.68. SC-Board Block Diagram 132
14.69. SC-Board (1 of 3) Schematic Diagram 133
14.70. SC-Board (2 of 3) Schematic Diagram 134
14.71. SC-Board (3 of 3) Schematic Diagram 135
14.72. SU-Board Block Diagram 136
14.73. SU-Board (1 of 2) Schematic Diagram 137
14.74. SU-Board (2 of 2) Schematic Diagram 138
14.75. SD-Board Block Diagram 139
14.76. SD-Board (1 of 2) Schematic Diagram 140
14.77. SD-Board (2 of 2) Schematic Diagram 141
14.78. SS, SS2 and SS3-Board Block Diagram 142
14.79. SS-Board (1 of 2) Schematic Diagram 143
14.80. SS-Board (2 of 2), SS2 and SS3-Board Schematic
Diagram 144
14.81. S and K-Board Schematic Diagram 145
15 Parts Location 147
15.1. Parts Location (1) 147
15.2. Parts Location (2) 148
15.3. Parts Location (3) 149
15.4. Parts Location (4) 150
15.5. Parts Location (5) 151
16 Mechanical Replacement Parts List 152
17 Replacement Parts List 154
17.1. Replacement Parts List Notes 154
17.2. Electrical Replacement Parts List 155
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1 Applicable signals
4
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2.1.1. Leakage Current Cold Check
1.Unplug the AC cord and connect a jumper between the two
prongs on the plug.
2.Measure the resistance value, with an ohmmeter, between
the jumpered AC plug and each exposed metallic cabinet
part on the equipment such as screwheads, connectors,
control shafts, etc. When the exposed metallic part has a
return path to the chassis, the reading should be between
1M9and 5.2M9.
When the exposed metal does not have a return path to
the chassis, the reading must be .
Figure 1
2.1.2. Leakage Current Hot Check (See
Figure 1.)
1.Plug the AC cord directly into the AC outlet. Do not use an
isolation transformer for this check.
2.Connect a 1.5k9, 10 watts resistor, in parallel with a 0.15µF
capacitors, between each exposed metallic part on the set
and a good earth ground such as a water pipe, as shown in
Figure 1.
3.Use an AC voltmeter, with 1000 ohms/volt or more
sensitivity, to measure the potential across the resistor.
4.Check each exposed metallic part, and measure the
voltage at each point.
5.Reverse the AC plug in the AC outlet and repeat each of the
above measurements.
6.The potential at any point should not exceed 0.75 volts
RMS. A leakage current tester (Simpson Model 229 or
equivalent) may be used to make the hot checks, leakage
current must not exceed 1/2 milliamp. In case a
measurement is outside of the limits specified, there is a
possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the
customer.
2 Safety Precautions
2.1. General Guidelines
1.When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2.After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3.After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
5
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3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).
1.Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2.After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alminum
foil, to prevent electrostatic charge buildup or exposure of the assembly.
3.Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4.Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5.Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6.Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, alminum foil or comparable
conductive material).
7.Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8.Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to
damage an ES device).
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4 About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol stamped on the back of PCB.
Caution


·

Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher.
Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).


·

Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb
solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.


·

After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto
the opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.
However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
7
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5 Service Hint
Board Name Function Board Name Function
C1 DATA DRIVER (UPPER RIGHT) PF LINE FILTER
C2 DATA DRIVER (UPPER CENTER) SC SCAN DRIVE
DDIGTAL SIGINAL PROCESS SD SCAN OUT (DOWN)
DG DIGTAL CORE MICOM SS SUSTAIN DRIVE
GFRONT TERMINAL, SWITCH SS2 SUSTAIN CONNECTION (UP)
HREAE TERMINAL SS3 SUSTAIN CONNECTION (DOWN)
KLED, REMOTE, SU SCAN OUT (UP)
PPOWER SUPPLY TA MAIN TUNER
PA DC/DC, AUDIO TB SUB TUNER
C3 DATA DRIVER (UPPER LEFT) JG PC/SD CARD
C4 DATA DRIVER (LOWER LEFT) DV HDMI
C5 DATA DRIVER (LOWER CENTER) SPOWER SW
C6 DATA DRIVER (LOWER RIGHT)
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6 Location of Lead Wiring
6.1. Lead of Wiring (1)
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6.2. Lead of Wiring (2)
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6.3. Lead of Wiring (3)
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6.4. Lead of Wiring (4)
12
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6.5. Lead of Wiring (5)
13
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6.6. Lead of Wiring (6)
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7 Self-check Function
When symptoms like “the power fails sometimes” or “sometimes there is no picture and/or sound” can not be confirmed at the
time of servicing, the self-check function can be used to confirm the occurrence and to find the defective circuit.
In case of “power failure”, flashing of the “POWER” indication (red) at the front of the unit can be used to narrow down the +B
line.
7.1. Self-check of the microcomputer control system (bus line)
Indicaton method
Press the “ACTION” button in the control panel of the unit simultaneously with the “POWER” button in the control panel of the
unit. Hold them few seconds.
Return to he normal screen
Press any button on the unit or in the remote control.
Screen Display
Display Ref. No. Description Board
MEMORY IC002 EEPROM for Main MPU DG
SOUND IC2401 Sound Control H
YUV_SW IC4301 YUV switch H
GC2M1 IC4501 Global Core 2 for main DG
GC2S1 IC4502 Global Core 2 for sub DG
EXDAC2 IC5011 EXDAC DV
TNR1 TNR201 Tuner 1 TA
MTS IC4205 Multiplex sound H
EXDAC IC8031 External I/O DG
GC2M2 IC4501 Global Core 2 for main DG
GC2S2 IC4502 Global Core 2 for sub DG
PANEL ----- Panel -----
TNR2 TNR251 Tuner 2 TB
AVSW IC4302 AV switch H
CONV IC3801 Convert Micom DG
SND2 IC4203 BBE H
HDMI IC5003 HDMI Recelver DV
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7.2. Power LED Blinking timing chart
1.Subject
Information of LED Flashing timing chart.
2.Contents
When an abnormality has occurred the unit, the protection circuit operates and reset to the stand by mode. At this time, the
defective block can be identified by the number of blinkes of the Power LED on the front panel of the unit.
3.Remarks
Above Fan function is operated during the fans are installed.
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7.3. No Power
First check point
There are following 3 states of No Power indication by power LED.
1.No lit
2.Green is lit then turns red blinking a few seconds later.
3.Only red is lit.
1.No lit
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7.4. No Picture
7.5. Local screen failure
Plasma display may have local area failure on the screen. Fig - 1 is the possible defect P.C.B. for each local area.
Fig - 1
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8 Serviceman Mode (Electronic Controls)
This Receiver has electronic technology using the I2C BUS Concept. It performs as a control function and it replaces many
mechanical controls. Instead of adjusting mechanical controls individually, many of the control function are now performed by
using “On Screen Display Menu”. (The Serviceman Adjustment Mode.)
Note
It is suggested that the technician reads all the way through and understand the following the procedure for Entering/Exiting the
Serviceman Mode; then proceed with the instructions working the Receiver. When becoming familiar with the procedure, the
Flow Chart for Serviceman Mode may be used as a quick guide.
Quick Entry to Serviceman Mode:
At times when minor adjustments need to be done to the electronic controls, the method of Entering the serviceman Mode
without removal of the cabinet back is as follows using the Remote Control:
1.Select SET-UP icon and select CABLE mode.
2.Select TIMER icon and set SLEEP time for 30 Min.
3.Press ACTION button and CH button to exit menus.
4.Tune to the Channel 124.
5.Adjust VOLUME to minimum (0).
6.Press the VOL button (decrease) on Receiver. Red “CHK” appears in upper corner.
7.Press the Power Button on the Remote Control to select one of 3 Serviceman Adjustment Modes.
a.Serviceman H ADJUSTMENT.
b.Serviceman V ADJUSTMENT.
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For Adjustments:
MAIN
ITEM SUB ITEM ORIGINAL VALUE EEPROM ADRESS DEFAULT LEVEL
SLEEVE SUB
HHPOS 15 1C CE
HWID 15 1B 2B
HP OF 15 61 FC
HW OF 15 60 00
VVPOS 15 1E 0C
VWID 15 D1
VP OF 15 20
VW OF 15 29
OTHER SOSSW 01 97 01
POFWT 15 89 0A
PSRVS
SPDYN 15 86 -00
EEP AREA 15 9C ALL
IN EX 15 9D
EX IN 15 9E
c.Serviceman OTHER ADJUSTMENT.
Exiting the Serviceman Mode:
Press the Power buttons on the Receiver.
1.Press Channel Up/Down on the Remote Control to select one of the available Service Adjustments (ain Fig.1).
Note:
Write Down the original value set (bin Fig.1) for each address before modifying anything. It is easy to erroneously adjust
the wrong item.
2.Press Volume Up/Down on the Remote Control to adjust the level of the selected Service Adjustment (bin Fig.1).
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