Panasonic TH-50PX600U User manual

© 2006 Matsushita Electric Industrial Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
GP9DU Chassis
Digital High Definition Plasma Television
Specifications
Power Source
A
C 120 V, 50/60 Hz
Power Consumption
Maximum 525 W
Standby condition 0.2 W (Without CableCARD
TM
)
14.5 W (With CableCARD
TM
)
Plasma Displa
y
panel
Drive method
A
C type
Aspe
c
t Ratio 16 : 9
Contrast Ratio (max) 10000 : 1
V
isible screen size
(W × H × Diagonal)
(No. of pixels)
130 cmV
44.4 ” × 25.5 ” × 51.3 ” (1,130 mm × 650 mm × 1,303 mm)
1,049,088 (1,366 (W) × 768 (H)) [4,098 × 768 dots]
Sound
Speake
r
Woofer 3.2 ” (80 mm) × 2 pcs, 8 W
Spea
k
e
r
0.9 ” × 4.0 ” (23 mm × 100 mm) × 2 pcs, 8W
Audio Output 31 W [13 W + 2.5 W, 13 W + 2.5 W] (10 % THD)
PC signals VGA, SVGA, XGA
SXGA (compressed)
Horizontal scanning frequenc
y
31 - 69 kHz
Vertical scanning frequenc
y
59 - 86 Hz
Channel Capability (Digital/Analog) VHF/UHF: 2 - 69, CATV: 1 - 135
Operating Conditions Temperature: 32 °F - 104 °F (0 °C - 40 °C)
Humidity: 20 % - 80 % RH (non-condensing)
Connection Terminals
INPUT 1-3 VIDEO: RCA PIN Type × 1 1.0 V [p-p] (75 W)
S-VIDEO: Mini DIN 4-pin Y: 1.0 V [p-p] (75 W) C: 0.286 V [p-p] (75 W)
A
UDIO L-R: RCA PIN Type × 2 0.5 V [rms]
ORDER NO. MTNC060476CE
B19 Canada: B07

1 Applicable signals 5
2 Safety Precautions 6
2.1. General Guidelines 6
3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices 7
4 About lead free solder (PbF) 8
5 Service Hint 9
6 Plasma panel replacement method 10
6.1. Remove the Back cover 10
6.2. Remove the fan 10
6.3. Remove the Speaker box ass’y (left) 10
6.4. Remove the Speaker box ass’y (right) 10
6.5. Remove the rear terminal cover 10
6.6. Remove the P-Board 11
6.7. Remove the PA-Board 12
6.8. Remove the tuner unit 12
6.9. Remove the DT-Board 12
6.10. Remove the DG-Board 13
6.11. Remove the H-Board 13
6.12. Remove the HC-Board 13
6.13. Remove the D-Board 14
6.14. Remove the SU-Board 14
6.15. Remove the SD-Board 14
6.16. Remove the SC-Board 14
6.17. Remove the SS2-Board 15
6.18. Remove the SS3-Board 15
6.19. Remove the SS-Board 15
6.20. Remove the C1-Board 15
6.21. Remove the C2-Board 16
6.22. Remove the C3-Board 16
6.23. Remove the stand brackets 16
6.24. Remove the C4-Board 16
6.25. Remove the C5-Board 17
6.26. Remove the C6-Board 17
6.27. Remove the front bracket 17
6.28. Remove the G-Board and GK-Board 17
6.29. Remove the S-Board 18
6.30. Remove the GS-Board 18
6.31. Remove the Plasma panel section from the Front frame
(glass) 18
COMPONENT
V
IDEO
INPUT 1-2 Y: 1.0 V [p-p] (including synch
r
oniza
t
ion)
PB,P
R: ± 0.35 V [p-p]
A
UDIO L-R: RCA PIN Type × 2 0.5 V [rms]
HDMI 1-2 TYPE A Connector
A
UDIO L-R: RCA PIN Type × 2 0.5 V [rms]
PC D-SUB 15 PIN: R, G, B/0.7 V [p-p] (75 W)
HD, VD/1.0 - 5.0 V [p-p] (high impedance)
A
UDIO L-R: Stereo Mini Jack ( 3.5 mm) × 1
IR Blaste
r
G-LINK Jack × 1
Card slot SD CARD slot × 1, CableCARD
TM
slot × 1
A
V
PROG. OUT VIDEO: RCA PIN Type × 1 1.0 V [p-p] (75 W)
A
UDIO L-R: RCA PIN Type × 2 0.5 V [rms]
DIGITAL AUDIO OUT PCM/Dolb
y
Digital, Fibe
r
Optic
FEATURES 3D Y/C FILTER CableCARD
TM
slot
CLOSED CAPTION V-Chip Split-Screen
BBE VIVA 3D Photo Viewer TV GUIDE
Dimensions (W × H × D)
Including pedestal 49.9 ” × 34.3 ” × 15.7 ” (1,266 mm × 870 mm × 399 mm)
TV Set only 49.9 ” × 31.6 ” × 5.5 ” (1,266 mm × 802 mm × 138 mm)
Weight
Including pedestal 123.5 lb. (56 kg)
TV Set only 94.8 lb. (43 kg)
Note:
Design and Specifications are subject change without notice.
Weight and Dimensions shown are approximate.
CONTENTS
Page Page
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6.32. Remove the squawker speaker 19
6.33. Remove the K-Board 19
6.34. Replace the plasma panel (finished) 20
7 Caution statement 21
7.1. Caution statement. 21
8 Location of Lead Wiring 22
8.1. Lead of Wiring (1) 22
8.2. Lead of Wiring (2)-1 23
8.3. Lead of Wiring (2)-2 24
8.4. Lead of Wiring (3)-1 25
8.5. Lead of Wiring (3)-2 26
8.6. Lead of Wiring (4)-1 27
8.7. Lead of Wiring (4)-2 28
8.8. Lead of Wiring (5) 29
9 Self-check Function 30
9.1. Check of the IIC bus lines 30
9.2. Power LED Blinking timing chart 32
9.3. No Power 33
9.4. No Picture 34
9.5. Local screen failure 35
10 Serviceman Mode 36
10.1. How to enter into Serviceman Mode 36
10.2. Contents of adjustment mode 36
10.3. Memory edit mode 37
10.4. Device data mode 38
11 Adjustment Procedure 39
11.1. Driver Set-up 39
11.2. Initialization Pulse Adjust 40
11.3. P.C.B. (Printed Circuit Board) exchange 40
11.4. Adjustment Volume Location 41
11.5. Test Point Location 41
12 Adjustment 42
12.1. White balance adjustment 42
12.2. Sub bright adjustment 44
12.3. ABL operation level adjustment 45
13 Hotel mode 46
14 Conductor Views 47
14.1. P-Board 47
14.2. PA-Board 50
14.3. H-Board 52
14.4. G and GS-Board 54
14.5. GK, HC, K and S-Board 55
14.6. DG-Board 56
14.7. DT-Board 58
14.8. D-Board 60
14.9. C1-Board 62
14.10. C2-Board 63
14.11. C3-Board 64
14.12. C4-Board 65
14.13. C5-Board 66
14.14. C6-Board 67
14.15. SC-Board 68
14.16. SU-Board 71
14.17. SD-Board 72
14.18. SS-Board 73
14.19. SS2 and SS3-Board 75
15 Block and Schematic Diagram 77
15.1. Schematic Diagram Note 77
15.2. Main Block Diagram 78
15.3. P-Board Block Diagram 79
15.4. P-Board (1 of 2) Schematic Diagram 80
15.5. P-Board (2 of 2) Schematic Diagram 81
15.6. PA-Board (1 of 2) Block Diagram 82
15.7. PA-Board (2 of 2) Block Diagram 83
15.8. PA-Board (1 of 3) Schematic Diagram 84
15.9. PA-Board (2 of 3) Schematic Diagram 85
15.10. PA-Board (3 of 3) Schematic Diagram 86
15.11. H-Board Block Diagram 87
15.12. H-Board (1 of 3) Schematic Diagram 88
15.13. H-Board (2 of 3) Schematic Diagram 89
15.14. H-Board (3 of 3) Schematic Diagram 90
15.15. G, GK, HC, K and S-Board Block Diagram 91
15.16. G-Board Schematic Diagram 92
15.17. GK, K, HC and S-Board Schematic Diagram 93
15.18. DG-Board (1 of 3) Block Diagram 94
15.19. DG-Board (2 of 3) Block Diagram 95
15.20. DG-Board (3 of 3) Block Diagram 96
15.21. DG-Board (1 of 8) Schematic Diagram 97
15.22. DG-Board (2 of 8) Schematic Diagram 98
15.23. DG-Board (3 of 8) Schematic Diagram 99
15.24. DG-Board (4 of 8) Schematic Diagram 100
15.25. DG-Board (5 of 8) Schematic Diagram 101
15.26. DG-Board (6 of 8) Schematic Diagram 102
15.27. DG-Board (7 of 8) Schematic Diagram 103
15.28. DG-Board (8 of 8) Schematic Diagram 104
15.29. DT and GS-Board Block Diagram 105
15.30. DT-Board (1 of 7) Schematic Diagram 106
15.31. DT-Board (2 of 7) Schematic Diagram 107
15.32. DT-Board (3 of 7) Schematic Diagram 108
15.33. DT-Board (4 of 7) and GS-Board Schematic Diagram 109
15.34. DT-Board (5 of 7) Schematic Diagram 110
15.35. DT-Board (6 of 7) Schematic Diagram 111
15.36. DT-Board (7 of 7) Schematic Diagram 112
15.37. D-Board (1 of 2) Block Diagram 113
15.38. D-Board (2 of 2) Block Diagram 114
15.39. D-Board (1 of 8) Schematic Diagram 115
15.40. D-Board (2 of 8) Schematic Diagram 116
15.41. D-Board (3 of 8) Schematic Diagram 117
15.42. D-Board (4 of 8) Schematic Diagram 118
15.43. D-Board (5 of 8) Schematic Diagram 119
15.44. D-Board (6 of 8) Schematic Diagram 120
15.45. D-Board (7 of 8) Schematic Diagram 121
15.46. D-Board (8 of 8) Schematic Diagram 122
15.47. C1, C2, C5 and C6-Block Diagram 123
15.48. C3, C4, SS, SS2 and SS3-Board Block Diagram 124
15.49. C1-Board (1 of 2) Schematic Diagram 125
15.50. C1-Board (2 of 2) Schematic Diagram 126
15.51. C2-Board (1 of 3) Schematic Diagram 127
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15.52. C2-Board (2 of 3) Schematic Diagram 128
15.53. C2-Board (3 of 3) Schematic Diagram 129
15.54. C3-Board (1 of 2) Schematic Diagram 130
15.55. C3-Board (2 of 2) Schematic Diagram 131
15.56. C4-Board (1 of 2) Schematic Diagram 132
15.57. C4-Board (2 of 2) Schematic Diagram 133
15.58. C5-Board (1 of 3) Schematic Diagram 134
15.59. C5-Board (2 of 3) Schematic Diagram 135
15.60. C5-Board (3 of 3) Schematic Diagram 136
15.61. C6-Board (1 of 2) Schematic Diagram 137
15.62. C6-Board (2 of 2) Schematic Diagram 138
15.63. SS, SS2 and SS3-Board Schematic Diagram 139
15.64. SC, SU and SD-Board Block Diagram 140
15.65. SC-Board (1 of 2) Schematic Diagram 141
15.66. SC-Board (2 of 2) Schematic Diagram 142
15.67. SU-Board (1 of 2) Schematic Diagram 143
15.68. SU-Board (2 of 2) Schematic Diagram 144
15.69. SD-Board (1 of 2) Schematic Diagram 145
15.70. SD-Board (2 of 2) Schematic Diagram 146
16 Parts Location & Mechanical Replacement Parts List 147
16.1. Parts Location 147
16.2. Packing Exploded Views 148
16.3. Mechanical Replacement Parts List 149
17 Electrical Replacement Parts List 150
17.1. Replacement Parts List Notes 150
17.2. Electrical Replacement Parts List 151
4
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1 Applicable signals
5
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2.1.1. Leakage Current Cold Check
1.Unplug the AC cord and connect a jumper between the two
prongs on the plug.
2.Measure the resistance value, with an ohmmeter, between
the jumpered AC plug and each exposed metallic cabinet
part on the equipment such as screwheads, connectors,
control shafts, etc. When the exposed metallic part has a
return path to the chassis, the reading should be between
1MWand 5.2MW.
When the exposed metal does not have a return path to
the chassis, the reading must be .
Figure 1
2.1.2. Leakage Current Hot Check (See
Figure 1.)
1.Plug the AC cord directly into the AC outlet. Do not use an
isolation transformer for this check.
2.Connect a 1.5kW, 10 watts resistor, in parallel with a 0.15µF
capacitors, between each exposed metallic part on the set
and a good earth ground such as a water pipe, as shown in
Figure 1.
3.Use an AC voltmeter, with 1000 ohms/volt or more
sensitivity, to measure the potential across the resistor.
4.Check each exposed metallic part, and measure the
voltage at each point.
5.Reverse the AC plug in the AC outlet and repeat each of the
above measurements.
6.The potential at any point should not exceed 0.75 volts
RMS. A leakage current tester (Simpson Model 229 or
equivalent) may be used to make the hot checks, leakage
current must not exceed 1/2 milliamp. In case a
measurement is outside of the limits specified, there is a
possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the
customer.
2 Safety Precautions
2.1. General Guidelines
1.When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2.After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3.After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
6
TH-50PX600U

3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).
1.Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2.After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alminum
foil, to prevent electrostatic charge buildup or exposure of the assembly.
3.Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4.Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5.Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6.Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, alminum foil or comparable
conductive material).
7.Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8.Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to
damage an ES device).
7
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4 About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol stamped on the back of PCB.
Caution
·
· ·
· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher.
Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
·
· ·
· Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb
solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
·
· ·
· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto
the opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.
However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
8
TH-50PX600U

5 Service Hint
Board Name Function Board Name Function
P Power Supply C1 Data Driver (Upper Right)
PA DC-DC Converter
Speaker out, Audio AMP, Fan Control C2 Data Driver (Upper Center)
C3 Data Driver (Upper Left)
H AV Terminal, AV Switch C4 Data Driver (Lower Left)
DG Digital Signal Processor, Micom, HDMI Interface C5 Data Driver (Lower Center)
DT ATSC Interface C6 Data Driver (Lower Right)
D Format Converter, Plasma AI, Sub-Field Processor SC Scan Drive
GS SD Card Slot SU Scan out (Upper)
K Remote receiver, Power LED SD Scan out (Lower)
S Power Switch SS Sustain Drive
G Front Terminal SS2 Sustain Connector (Upper)
GK Key Switch SS3 Sustain Connector (Lower)
HC Jig Connection
9
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6.1. Remove the Back cover
1.See Service Hint (Section 5)
6.2. Remove the fan
1.Disconnect the relay couplers.
2.Remove the screws (×3 each) and remove the fans.
6.3. Remove the Speaker box ass’y
(left)
1.Unlock the cable clampers to free the cables.
2.Disconnect the relay coupler.
3.Remove the Speaker box ass’y (left).
6.4. Remove the Speaker box ass’y
(right)
1.Unlock the cable clampers to free the cable.
2.Disconnect the relay coupler.
3.Remove the Speaker box ass’y (right).
6.5. Remove the rear terminal
cover
1.Remove the screws (×6 ,×6 ,×2 ).
2.Remove the rear terminal cover.
6 Plasma panel replacement method
10
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6.6. Remove the P-Board
Caution:
To remove P.C.B. wait 1 minute after power was off for
discharge from electrolysis capacitors.
1.Disconnect the couplers (P2, P5, P9, P10, P11, P12, P23
and P25).
2.Remove the screws (×6 ) and remove the P-Board unit.
3.Remove the screws (×9 ) on the back side.
4.Remove the screws (×5 ).
5.Remove the molding props (×8 ).
6.Remove the P-Board.
Note:
When assembling the P-Board, the position of each hole of
the insulation sheets (A and B) is set to the position of each
hole of the P-Board, then assemble them. ( marks
indicate setting positions.)
11
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6.7. Remove the PA-Board
1.Unlock the cable clampers to free the cable.
2.Disconnect the couplers (PA1, PA2, PA5, PA10, PA31,
PA32, PA33, PA34 and PA40).
3.Disconnect the flexible cable (PA20).
4.Remove the screws (×4 ) and remove the earth cable.
5.Remove the PA-Board.
6.8. Remove the tuner unit
1.Unlock the cable clampers to free the cable.
2.Disconnect the couplers (DG5, G51, GS52, PA40 and earth
cable).
3.Disconnect the flexible cables (DG3 and PA20).
4.Remove the screws (×4 ) remove the tuner unit.
6.9. Remove the DT-Board
1.Unlock the cable clampers to free the cable.
2.Disconnect the couplers (HC06 and DT10).
3.Remove the screws (×5 ) remove the DT-Board unit.
(Be careful the coupler (DT12-DG22) when remove the DT-
Board unit.)
4.Disconnect the coupler (DT07)
5.Remove the screws (×2 ).
6.Remove the DT-Board metal cover and DT-Board.
12
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6.10. Remove the DG-Board
1.Remove the DT-Board. (See section 6.9.)
2.Remove the screws (×8 ) and remove the DT-Board
metal frame.
3.Disconnect the coupler (DG2).
4.Disconnect the flexible cables (DG1, DG15 and DG20).
5.Remove the screw (×1 ) remove the DG-Board.
6.11. Remove the H-Board
1.Unlock the cable clampers to free the cable.
2.Disconnect the couplers (H2, H40 and H51).
3.Disconnect the flexible cable (H1).
4.Remove the screws (×6 ) and remove the H-Board.
6.12. Remove the HC-Board
1.Disconnect the couple (HC06).
2.Disconnect the flexible cable (HC15).
3.Remove the screws (×2 ) and remove the HC-Board.
13
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6.13. Remove the D-Board
1.Remove the tuner unit. (See section 6.8.)
2.Disconnect the couplers (D5, D20 and D25).
3.Disconnect the flexible cables (D3, D31, D32, D33 and
D34).
4.Remove the screws (×4 ) and remove the D-Board.
6.14. Remove the SU-Board
1.Remove the screws (×3 ).
2.Remove the flexible cables (SU1, SU2, SU3 and SU4) and
remove the bridge connector (SU45).
3.Slide the SU-Board to the left to disconnect from a coupler
(SC41-SU41) on the SC-Board and remove the SU-Board.
6.15. Remove the SD-Board
1.Remove the screws (×3 ).
2.Remove the flexible cables (SD1, SD2, SD3 and SD4) and
remove the bridge connector (SD46).
3.Slide the SD-Board to the left to disconnect from a coupler
(SC42-SD42) on the SC-Board and remove the SD-Board.
6.16. Remove the SC-Board
1.Unlock the cable clampers to free the cable.
2.Disconnect the couplers (SC2, SC20 and SC23).
3.Remove the screws (×9 ) and remove the SC-Board.
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6.17. Remove the SS2-Board
1.Disconnect the coupler (SS23) and disconnect the flexible
cable (SS55).
2.Remove the screws (×2 ) and remove the SS2-Board.
6.18. Remove the SS3-Board
1.Disconnect the coupler (SS22) and disconnect the flexible
cable (SS56).
2.Remove the screws (×2 ) and remove the SS3-Board.
6.19. Remove the SS-Board
1.Remove the SS2-Board and SS3-Board. (See section 6.17.
and 6.18)
2.Disconnect the couplers (SS11, SS12, SS33, SS43 and
SS44).
3.Disconnect the flexible cables (SS51, SS52, SS53 and
SS54).
4.Remove the screws (×7 ) and remove the SS-Board.
6.20. Remove the C1-Board
1.Remove the flexible cables holder fastening screws (×6
).
2.Disconnect the flexible cables (CA1, CA2 and CA3).
3.Disconnect the flexible cable (C10).
4.Remove the screws (×5 ) and remove the C1-Board.
15
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6.21. Remove the C2-Board
1.Remove the flexible cables holder fastening screws (×8
).
2.Disconnect the flexible cables (CA4, CA5, CA6 and CA7).
3.Disconnect the flexible cables (C20, C21 and C22).
4.Remove the screws (×5 ) and remove the C2-Board.
6.22. Remove the C3-Board
1.Remove the flexible cables holder fastening screws (×8
).
2.Disconnect the flexible cables (CA8, CA9, CA10 and
CA11).
3.Disconnect the flexible cables (C31 and C32).
4.Disconnect the coupler (C33).
5.Remove the screws (×5 ) and remove the C3-Board.
6.23. Remove the stand brackets
1.Remove the plasma panel section from the servicing stand
and lay on a fiat surface such as a table (covered) with the
plasma panel surface facing downward.
2.Remove the stand brackets (left, right) fastening screws (×6
each) and remove the stand brackets (left, right).
6.24. Remove the C4-Board
1.Remove the stand bracket (left). (See section 6.23.)
2.Remove the flexible cables holder fastening screws (×8
).
3.Disconnect the flexible cables (CB8, CB9, CB10 and
CB11).
4.Disconnect the flexible cables (C41 and C42).
5.Disconnect the couplers (C43 and C44).
6.Remove the screws (×5 ) and remove the C4-Board.
16
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6.25. Remove the C5-Board
1.Remove the flexible cables holder fastening screws (×8
).
2.Disconnect the flexible cables (CB4, CB5, CB6 and CB7).
3.Disconnect the flexible cables (C50, C51 and C52).
4.Remove the screws (×5 ) and remove the C5-Board.
6.26. Remove the C6-Board
1.Remove the stand bracket (right). (See section 6.23.)
2.Remove the flexible cables holder fastening screws (×6
).
3.Disconnect the flexible cables (CB1, CB2 and CB3).
4.Disconnect the flexible cable (C60).
5.Remove the screws (×5 ) and remove the C6-Board.
6.27. Remove the front bracket
1.Unlock the cable clampers to free the cable.
2.Disconnect the couplers (G1 and G51).
3.Remove the screws (×2 ) and remove the front bracket.
6.28. Remove the G-Board and GK-
Board
1.Remove the front bracket. (See section 6.27.)
2.Remove the screws (×3 ) and remove the front side
metal frame.
3.Remove the screws (×3 ) and disconnect the couplers
(G3-GK3).
4.Remove the G-Board and GK-Board.
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6.29. Remove the S-Board
1.Disconnect the coupler (S1).
2.Remove the screws (×2 ) and remove the S-Board metal
frame.
3.Remove the screws (×2 ) and remove the S-Board.
6.30. Remove the GS-Board
1.Remove the stand bracket R. (See section 6.23.)
2.Unlock the cable clampers to free the cable.
3.Disconnect the coupler (G52).
4.Remove the screws (×3 ).
5.Remove the SD card unit.
6.Remove the screws (×2 ) and remove the GS-Board
cover.
7.Remove the GS-Board.
6.31. Remove the Plasma panel
section from the Front frame
(glass)
1.Remove the front frame and the plasma panel fastening
screws (×12 ).
2.Remove the front frame and the stand brackets fastening
screws (×2 ).
3.For leaving the plasma panel from the front frame, pull the
bottom of the front frame forward, lift, and remove.
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6.32. Remove the squawker speaker
1.Remove the front frame. (See section 6.31.)
2.Remove the screws (×12 ).
3.Remove the glass holder R and L.
4.Remove the screws (×2 ).
5.Remove the squawker speaker.
6.33. Remove the K-Board
1.Remove the front frame. (See section 6.31.)
2.Remove the glass holder R and L. (See section 6.32.)
3.Remove the screws (×3 )
4.Remove the bottom shield.
5.Remove the screws (×5 )
6.Remove the glass holder bottom R and L.
7.Remove the screws (×9 )
8.Remove the glass holder bottom.
9.Remove the screws (×2 ).
10.Disconnect the couplers (K1 and K2).
11.Remove the K-board.
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6.34. Replace the plasma panel
(finished)
1.Place the new plasma panel (finished) on the flat surface of
the table (covered by a soft cloth), with the plasma panel
surface facing downward.
2.Attach the C1, C2, C3, C4, C5 and the C6-Board, connect
the flexible cables (×22) from the Plasma panel to the C1,
C2, C3, C4, C5 and the C6-Board, and fit the flexible cable
holders.
3.Attach the Hooks (left, right) and fit the stand brackets (L,
R) to the new plasma panel.
4.Place the plasma panel section on the servicing stand.
5.Attach the front frame and each P.C.Board and so on, to
the new plasma panel.
* When fitting the front frame, be careful to allow any
debris, dust or handling residue to remain between the
front glass and plasma panel.
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TH-50PX600U