Panasonic TH-P42UT50D User manual

© Panasonic Corporation 2012.
Unauthorized copying and distribution is a violation
of law.
ORDER NO.PAVCTH1203005CE
Plasma Television
Model No. TH-P42UT50D
TH-P42UT50M
TH-P42UT50P
TH-P42UT50S
TH-P42UT50Z
GPF15D-A Chassis

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TABLE OF CONTENTS
PAGE
1 Safety Precautions -----------------------------------------------3
1.1. General Guidelines ----------------------------------------3
1.2. Touch-Current Check--------------------------------------3
2Warning--------------------------------------------------------------4
2.1. Prevention of Electrostatic Discharge (ESD)
to Electrostatically Sensitive (ES) Devices ----------4
2.2. About lead free solder (PbF) ----------------------------5
3 Service Navigation------------------------------------------------6
3.1. PCB Layout --------------------------------------------------6
3.2. Applicable signals------------------------------------------7
4 Specifications ------------------------------------------------------8
5 Technical Descriptions---------------------------------------- 10
5.1. Specification of KEY for DTCP-IP, One-to-
One, Widevine and Netflix ----------------------------- 10
5.2. USB HDD Recording (Z only)------------------------- 10
5.3. Panel-Type setting --------------------------------------- 10
6 Service Mode ----------------------------------------------------- 11
6.1. How to enter into Service Mode ---------------------- 11
6.2. Option - Mirror--------------------------------------------- 13
6.3. Service tool mode---------------------------------------- 13
6.4. DRV Check - USB HDD Check----------------------- 14
6.5. Hotel mode------------------------------------------------- 14
6.6. Data Copy by SD Card --------------------------------- 15
7 Troubleshooting Guide---------------------------------------- 18
7.1. Check of the IIC bus lines------------------------------ 18
7.2. Power LED Blinking timing chart --------------------- 19
7.3. No Power--------------------------------------------------- 20
7.4. No Picture -------------------------------------------------- 21
7.5. Local screen failure-------------------------------------- 22
8 Disassembly and Assembly Instructions --------------- 23
8.1. Disassembly Flow Chart for the Unit ---------------- 23
8.2. Disassembly Procedure for the Unit----------------- 24
9 Measurements and Adjustments -------------------------- 29
9.1. Adjustment ------------------------------------------------- 29
10 Block Diagram --------------------------------------------------- 31
10.1. Main Block Diagram ------------------------------------- 31
10.2. Block (1/4) Diagram ------------------------------------- 32
10.3. Block (2/4) Diagram ------------------------------------- 33
10.4. Block (3/4) Diagram ------------------------------------- 34
10.5. Block (4/4) Diagram ------------------------------------- 35
11 Wiring Connection Diagram --------------------------------- 37
11.1. Caution statement.--------------------------------------- 37
11.2. Wiring (1) --------------------------------------------------- 37
11.3. Wiring (2) --------------------------------------------------- 38
11.4. Wiring (3) --------------------------------------------------- 39
12 Schematic Diagram
13 Printed Circuit Board
14 Exploded View

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1 Safety Precautions
1.1. General Guidelines
1. When conducting repairs and servicing, do not attempt to modify the equipment, its parts or its materials.
2. When wiring units (with cables, flexible cables or lead wires) are supplied as repair parts and only one wire or some of the
wires have been broken or disconnected, do not attempt to repair or re-wire the units. Replace the entire wiring unit instead.
3. When conducting repairs and servicing, do not twist the Fasten connectors but plug them straight in or unplug them straight
out.
4. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
5. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
6. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
1.2. Touch-Current Check
1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.
2. Connect a measuring network for touch currents between each exposed metallic part on the set and a good earth ground
such as a water pipe, as shown in Figure 1.
3. Use Leakage Current Tester (Simpson 228 or equivalent) to measure the potential across the measuring network.
4. Check each exposed metallic part, and measure the voltage at each point.
5. Reserve the AC plug in the AC outlet and repeat each of the above measure.
6. The potential at any point (TOUCH CURRENT) expressed as voltage U1and U2, does not exceed the following values:
For a. c.: U1= 35 V (peak) and U2= 0.35 V (peak);
For d. c.: U1= 1.0 V,
Note:
The limit value of U2= 0.35 V (peak) for a. c. and U1= 1.0 V for d. c. correspond to the values 0.7 mA (peak) a. c. and 2.0
mA d. c.
The limit value U1= 35 V (peak) for a. c. correspond to the value 70 mA (peak) a. c. for frequencies greater than 100 kHz.
7. In case a measurement is out of the limits specified, there is a possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the customer.
Figure 1

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2Warning
2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatically
Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor [chip] components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as [anti-static (ESD protected)] can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise ham less motion such as the
brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD)
sufficient to damage an ES device).

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2.2. About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it's manufacture due to environmental conservation issues. For service and repair work, we'd
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB.
Caution
• Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher. Please
use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
• Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb
solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
• After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto the
opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.
However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.

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3 Service Navigation
3.1. PCB Layout
Board Name Function
P Power Supply
Non serviceable.
P-Board should be exchanged for service.
A Main AV input, processing
K Remote receiver, Power LED, C.A.T.S sensor
C1 Data Driver (Lower Right)
C2 Data Driver (Lower Left)
SN Scan Drive
SS Sustain Drive

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3.2. Applicable signals
QCOMPONENT (Y, PB, PR) (from AV2 terminal), HDMI
* Mark: Applicable input signal
QPC (from D-sub 15P)
Applicable input signal for PC is basically compatible to VESA standard timing.
QPC (from HDMI terminal)
Applicable input signal for PC is basically compatible to HDMI standard timing.
Note
• Signals other than above may not be displayed properly.
• The above signals are reformatted for optimal viewing on your display.
• PC signal is magnified or compressed for display, so that it may not show fine detail with sufficient clarity.
Signal name COMPONENT HDMI
525 (480) / 60i, 60p * *
625 (576) / 50i, 50p * *
750 (720) / 60p, 50p * *
1,125 (1,080) / 60i, 50i * *
1,125 (1,080) / 60p, 50p, 24p *
Signal name Horizontal frequency (kHz) Vertical frequency (Hz)
640 ×480 @60 Hz 31.47 59.94
800 ×600 @60 Hz 37.88 60.32
852 ×480 @60 Hz 31.44 59.89
1,024 ×768 @60 Hz 48.36 60.00
1,280 ×1,024 @60 Hz 63.98 60.02
1,280 ×768 @60 Hz 47.70 60.00
1,366 ×768 @60 Hz 48.39 60.04
Signal name Horizontal frequency (kHz) Vertical frequency (Hz)
640 ×480 @60 Hz 31.47 60.00
1,280 ×720 @60 Hz 45.00 60.00
1,920 ×1,080 @60 Hz 67.50 60.00

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4 Specifications
Sound
Speaker (160 mm ×40 mm) ×2, 8Ω
Audio output 20 W ( 10 W + 10 W )
Headphones M3 (3.5 mm) stereo mini Jack ×1
Receiving systems / Band name (Z)
PAL B/G Reception of Off air broadcasts
Digital TV 8 MHz UHF (New Zealand) free-to-air TV broadcast reception
PAL 60 Hz Playback of NTSC tape from some PAL Video recorders (VCR)
M.NTSC Playback from M.NTSC Video recorders (VCR)
NTSC Playback from NTSC Video recorders (VCR)
Receiving systems / Band name (Except Z)
Receiving Channels (Except Z)
VHF BAND
2-12 (PAL/SECAM B, K1) 0-12 (PAL B AUST.)
1-9 (PAL B N.Z.) 1-12 (PAL/SECAM D)
1-12 (NTSC M Japan) 2-13 (NTSC M USA)
UHF BAND
21-69 (PAL G, H, I/SECAM G, K, K1)
28-69 (PAL B AUST.) 13-57 (PAL D, K)
13-62 (NTSC M Japan) 14-69 (NTSC M USA)
CATV
S1-S20 (OSCAR) 1-125 (USA CATV)
C13-C49 (JAPAN) S21-S41 (HYPER)
Z1-Z37 (CHINA) 5A, 9A (AUST.)
Aerial - Rear VHF/UHF
Operating Conditions
Temperature: 0 °C - 40 °C (Except Z) 0 °C - 35 °C (Z)
Humidity: 20 % - 80 % RH (non-condensing)
Connection terminals
AV1 IN
AUDIO L - R RCA PIN Type ×2 0.5 V [rms]
VIDEO RCA PIN Type ×1 1.0 V [p-p] (75 Ω)
AUDIO OUT
AUDIO L-R RCA PIN Type ×2 0.5 V [rms] (high impedance)
AV2 IN
AUDIO L - R RCA PIN Type ×2 0.5 V [rms]
COMPONENT Y 1.0 V [p-p] (including synchronization)
PB/CB, PR/CR± 0.35 V [p-p]
VIDEO RCA PIN Type ×1 1.0 V [p-p] (75 Ω)
HDMI 1 / 2 input TYPE A Connectors
• This TV supports "HDAVI control 5" function.
PC HIGH-DENSITY D-SUB 15PIN
R,G, B: 0.7 V [p-p] (75 Ω)
HD, VD: TTL Level 2.0 - 5.0 V [p-p] (high impedance)
• Applicable input signals: VGA, SVGA, WVGA, XGA
SXGA, WXGA ...... (compressed)
Horizontal scanning frequency 31 - 69 kHz
Vertical scanning frequency 59 - 86 Hz
Card slot SD Card slot ×1
ETHERNET 10BASE-T / 100BASE-TX
USB 1 / 2 USB 2.0 TYPE A Connectors DC 5 V, Max. 500 mA
DIGITAL AUDIO OUT PCM / Dolby Digital / DTS, Fiber optic
Bluetooth wireless technology*1
Standard Compliance Bluetooth 3.0
Frequency Range 2.402 GHz - 2.480 GHz
*1: Not all the Bluetooth compatible devices are available with this TV.

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Q3D Eyewear (Z)
Note
•Design and Specifications are subject to change without notice. Mass and Dimensions shown are approximate.
Power Consumption (Z)
Power rating AC 220-240 V, 50 / 60 Hz 1.4 A
Normal (Home) mode 112 W
Standby condition 0.4 W
Power Source (Except Z) AC 220 - 240 V, 50 / 60 Hz (Except P)
AC 110 - 240 V, 50 / 60 Hz (P)
Power Consumption (Except Z)
Power Rating 285 W
Standby condition 0.4 W
Display panel
Panel system Plasma panel
Visible screen size (diagonal) 107 cm / 42 inches
Number of pixels 2,073,600 (1,920 (W) ×1,080 (H)), [5,760 ×1,080 dots]
Dimensions (W ×H ×D) 1,009 mm ×663 mm ×320 mm (With Pedestal)
1,009 mm ×616 mm ×84 mm (TV only)
Mass 20.5 kg Net (With Pedestal)
17.5 kg Net (TV only)
Dimensions (W ×H ×D) 167.7 mm ×42.2 mm ×170.7 mm
Mass Approx. 31 g
Lens type Liquid Crystal Shutter
Usage temperature range 0 °C - 40 °C
Battery* Coin-shaped lithium battery CR2025
Operation time: Approx. 75 hours in continuous use of the battery made by Panasonic
Viewing range* Within 3.2 m from front surface of the TV
Materials Main body: Resin
Lens section: Liquid crystal glass
Communication system 2.4 GHz band FH-SS (Frequency Hopping Spread Spectrum)
* There are differences in the viewing range of the 3D Eyewear among individuals.
• The 3D Eyewear may not operate correctly at the outside of the viewing range.

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5 Technical Descriptions
5.1. Specification of KEY for DTCP-IP, One-to-One, Widevine and Netflix
5.1.1. General information:
1. EEPROM (IC8902) for spare parts has the seed of KEY for each.
2. The final KEY data will be generated by Peaks IC (IC8000) when SELF CHECK was done and are stored in both Peaks IC
(IC8000) and EEPROM (IC8902).
Four KEY are not generated for all models.
The necessary KEY are only generated and stored depend on the feature of models.
5.1.2. Replacement of ICs:
When Peaks IC (IC8000) is replaced, EEPROM (IC8902) should be also replaced with new one the same time.
When EEPROM (IC8902) is replaced, Peaks IC (IC8000) is not necessary to be replaced the same time.
After the replacement of IC, SELF CHECK should be done to generate the final KEY data.
How to SELF CHECK: While pressing [VOLUME ( - )] button on the main unit, press [MENU] button on the remote control for more
than 3 seconds.
TV will be forced to the factory shipment setting after this SELF CHECK.
5.1.3. Model and Keys:
5.2. USB HDD Recording (Z only)
5.2.1. General information:
Digital TV programmes can be recorded in USB HDD.
A One-to-One key generated in A-board by SELF CHECK binds TV and USB-HDD for communication.
That key is only one key for them. If the key is difference, TV can not access USB-HDD.
Caution:
New key will be generated by following SELF CHECK and previous TV programmes recorded in USB HDD will not be
viewed.
SELF CHECK: While pressing [VOLUME ( - )] button on the main unit, press [MENU] button on the remote control for
more than 3 seconds.
5.3. Panel-Type setting
Panel-Type setting is required after exchange the A-board.
A-board for spare parts is common use for different inch size in same series.
Go into Service Mode and confirm/select Panel-Type in OPTION to correct inch size.
Model No. Keys
One-to-One
(For USB Rec.)
DTCP-IP Widevine Netflix
TH-P42UT50D/M/P/S None None Yes Yes
TH-P42UT50Z Yes Yes Yes Yes