Panasonic TX-PR46G10 User manual

ORDER NO.PCZ0903031CE
Plasma Television
Model No. TX-PR46G10
GPF12DE C assis
A WARNING
This service information is desi ned for experienced repair technicians only and is not desi ned for use by the eneral public.
It does not contain warnin s or cautions to advise non-technical individuals of potential dan ers in attemptin to service a product.
Products powered by electricity should be serviced or repaired only by experienced professional technicians. Any attempt to service
or repair the product or products dealt with in this service information by anyone else could result in serious injury or death.
IMPORTANT SAFETY NOTICE
There are special components used in this equipment which are important for safety. These parts are marked by A in the Schematic
Dia rams, Circuit Board Dia rams, Exploded Views and Replacement Parts List. It is essential that these critical parts should be replaced
with manufacturer's specified parts to prevent shock, fire or other hazards. Do not modify the ori inal desi n without permission of
manufacturer.
Panasonic' © Panasonic Corporation 2009.
Unauthorized copyin and distribution is a violation
of law.

1 Safety Precautions
1.1. General Guidelines
1. When servicin , observe the ori inal lead dress. If a short circuit is found, replace all parts which have been overheated or
dama ed by the short circuit.
2. After servicin , see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3. After servicin , make the followin leaka e current checks to prevent the customer from bein exposed to shock hazards.
4. When servicin , observe the ori inal lead dress. If a short circuit is found, replace all parts which have been overheated or
dama ed by the short circuit.
5. After servicin , see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
After servicin , make the followin leaka e current checks to prevent the customer from bein exposed to shock hazards.6
1.2. Touc -Current C eck
1. Plu the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.
2. Connect a measurin network for touch currents between each exposed metallic part on the set and a ood earth round
such as a water pipe, as shown in Fi ure 1.
3. Use Leaka e Current Tester (Simpson 228 or equivalent) to measure the potential across the measurin network.
4. Check each exposed metallic part, and measure the volta e at each point.
5. Reserve the AC plu in the AC outlet and repeat each of the above measure.
6. The potential at any point (TOUGH CURRENT) expressed as volta e U1 and U2, does not exceed the followin values:
For a. c.: U1 = 35 V (peak) and U2 = 0.35 V (peak);
For d. c.: U1 = 1.0 V,
Note:
The limit value of U2 = 0.35 V (peak) for a. c. and U1 = 1.0 V for d. c. correspond to the values 0.7 mA (peak) a. c. and 2.0
mA d. c.
The limit value U1 = 35 V (peak) for a. c. correspond to the value 70 mA (peak) a. c. for frequencies reater than 100 kHz.
7. In case a measurement is out of the limits specified, there is a possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the customer.
Measuring network for TOUCH CURRENTS
COLD
WATER PIPE
(EARTH GROUND)
Rs=
1500Q_ L Cs= 0.22|jF10kQ
-1 k 1
------ 1
Ro=
----------------
J 500Q'U1 =
r= 0.022|jF (V)
JQ LjJ JUUii U1 —|— и.и^гфГ ^ V J | U2 (V)
APPLIANCES
EXPOSED
METAL PARTS
Resistance values in ohms (Q)
V: Voltmeter or oscilloscope
(r.m.s. or peak readin )
Input resistance: > 1 MQ
Input capacitance: < 200 pF
Frequency ran e: 15 Hz to 1 MHz and d.c. respectively
NOTE - Appropriate measures should be taken to obtain the correct value in case of non-sinusoidal waveforms.
Fi ure 1
2

2 Warning
2.1. Prevention of Electrostatic Disc arge (ESD) to Electrostatically
Sensitive (ES) Devices
Some semiconductor (solid state) devices can be dama ed easily by static electricity. Such components commonly are called Elec
trostatically Sensitive (ES) Devices. Examples of typical ES devices are inte rated circuits and some field-effect transistors and
semiconductor [chip] components. The followin techniques should be used to help reduce the incidence of component dama e
caused by electrostatic dischar e (ESD).
1. Immediately before handlin any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touchin a known earth round. Alternatively, obtain and wear a commercially available dischar in ESD wrist strap,
which should be removed for potential shock reasons prior to applyin power to the unit under test.
2. After removin an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi
num foil, to prevent electrostatic char e buildup or exposure of the assembly.
3. Use only a rounded-tip solderin iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as [anti-static (ESD protected)] can
enerate electrical char e sufficient to dama e ES devices.
5. Do not use freon-propelled chemicals. These can enerate electrical char es sufficient to dama e ES devices.
6. Do not remove a replacement ES device from its protective packa e until immediately before you are ready to install it. (Most
replacement ES devices are packa ed with leads electrically shorted to ether by conductive foam, aluminum foil or compara
ble conductive material).
7. Immediately before removin the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handlin unpacka ed replacement ES devices. (Otherwise ham less motion such as the brush
in to ether of your clothes fabric or the liftin of your foot from a carpeted floor can enerate static electricity (ESD) sufficient
to dama e an ES device).
3

Note: Lead is listed as (Pb) in t e periodic table of elements.
In t e information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
T e Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
T at is Tin (Sn), Silver (Ag) and Copper (Cu) alt oug ot er types are available.
This model uses Pb Free solder in it's manufacture due to environmental conservation issues. For service and repair work, we'd
su est the use of Pb free solder as well, althou h Pb solder may be used.
PCBs manufactured usin lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB.
Caution
• Pb free solder has a hi her meltin point than standard solder. Typically the meltin point is 50 ~ 70 °F (30~40 °C) hi her. Please
use a hi h temperature solderin iron and set it to 700 ± 20 °F (370 ± 10 °C).
• Pb free solder will tend to splash when heated too hi h (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applyin Pb sol
der. If this is not practical, be sure to heat the Pb free solder until it melts, before applyin Pb solder.
• After applyin PbF solder to double layered boards, please check the component side for excess solder which may flow onto the
opposite side. (see fi ure below)
component component
remove all of the ^1П\
excess solder
2.2. About lead free solder (PbF)
slice
\
solder
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+A +Cu (tin, silver, copper) solder. How
ever, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
4

3 Service Navigation
3.1. Service Hint
Board Name Function Board Name Function
P Power Supply C1 Data Driver (Lower Ri ht)
C2 Data Driver (Lower Center)
A DC-DC Converter, Tuner
Speaker out, AV Terminal, AV Switch, PC
Di ital Si nal Processor, SYSTEM MPU, HDMI Switch
Peaks-AVC, Ethernet
Format Converter, Plasma AI, Sub-Field Processor
C3 Data Driver (Lower Left)
SC Scan Drive
SS Sustain Drive
SS2 Sustain out (Lower)
GL SD LED SU Scan out (Upper)
None serviceable.
SU-Board should be exchan ed for service.
K Remote receiver, Power LED, C.A.T.S sensor
S Power Switch
GK Key Switch SD Scan out (Lower)
None serviceable.
SD-Board should be exchan ed for service.
5