Panasonic VIERA TX-P42G15B User manual

ORDER NO. PCZ0906097CE
Plasma Television
Model No. TX-P42G15B
TX-P42G15E
GPF12DE Chassis
A ARNING
This service information is desi ned for experienced repair technicians only and is not desi ned for use by the eneral public.
It does not contain warnin s or cautions to advise non-technical individuals of potential dan ers in attemptin to service a product.
Products powered by electricity should be serviced or repaired only by experienced professional technicians. Any attempt to service
or repair the product or products dealt with in this service information by anyone else could result in serious injury or death.
IMPORTANT SAFETY NOTICE
There are special components used in this equipment which are important for safety. These parts are marked by A in the Schematic
Dia rams, Circuit Board Dia rams, Exploded Views and Replacement Parts List. It is essential that these critical parts should be replaced
with manufacturer's specified parts to prevent shock, fire or other hazards. Do not modify the ori inal desi n without permission of
manufacturer.
Panasonic' © Panasonic Corporation 2009.
Unauthorized copyin and distribution is a violation
of law.
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TABLE OF CONTENTS PAGE
1 Safety Precautions----------------------------------------------------------3
1.1. General Guidelines-------------------------------------------------3
1.2. Touch-Current Check-----------------------------------------------3
2 arning-------------------------------------------------------------------------4
2.1. Prevention of Electrostatic Dischar e (ESD) to
Electrostatically Sensitive (ES) Devices ---------------------- 4
2.2. About lead free solder (PbF)-------------------------------------5
3 Service Navigation----------------------------------------------------------6
3.1. Service Hint ---------------------------------------------------------- 6
3.2. Applicable si nals--------------------------------------------------7
4 Specifications----------------------------------------------------------------8
5 Service Mode--------------------------------------------------------------- 10
5.1. How to enter into Service Mode ------------------------------ 10
5.2. Service tool mode ------------------------------------------------ 12
5.3. Hotel mode----------------------------------------------------------13
6 Troubleshooting Guide --------------------------------------------------14
6.1. Check of the IIC bus lines-------------------------------------- 14
6.2. Power LED Blinkin timin chart
----------------------------- 15
6.3. No Power------------------------------------------------------------16
6.4. No Picture-----------------------------------------------------------17
6.5. Local screen failure ---------------------------------------------- 18
7 Service Fixture & Tools -------------------------------------------------19
7.1. SC ji ----------------------------------------------------------------- 19
8 Disassembly and Assembly Instructions-------------------------20
8.1. Remove the Rear cover---------------------------------------20
8.2. Remove the Fan-------------------------------------------------20
8.3. Remove the P-Board-------------------------------------------20
8.4. Remove the Side terminal cover and Rear terminal
cover------------------------------------------------------------------20
8.5. Remove the Tuner unit ----------------------------------------- 21
8.6. Remove the XS-Board ----------------------------------------- 21
8.7. Remove the A-Board -------------------------------------------22
8.8. Remove the D-Board-------------------------------------------22
8.9. Remove the Speakers------------------------------------------22
8.10. Remove the Control button unit------------------------------23
8.11. Remove the GK-Board-----------------------------------------23
8.12. Remove the SU-Board-----------------------------------------23
8.13. Remove the SD-Board-----------------------------------------24
8.14. Remove the SC-Board-----------------------------------------24
8.15. Remove the SS2-Board---------------------------------------24
8.16. Remove the SS-Board-----------------------------------------25
8.17. Remove the Han er metals and the Stand brackets ---25
8.18. Remove the C1-Board-----------------------------------------25
8.19. Remove the C2-Board-----------------------------------------25
8.20. Remove the Plasma panel section from the
Cabinet assy ( lass)--------------------------------------------- 26
8.21. Remove the S-Board-------------------------------------------26
8.22. Remove the Front lass---------------------------------------27
8.23. Remove the K-Board-------------------------------------------27
8.24. Remove the GL-Board-----------------------------------------27
8.25. Replace the plasma panel ------------------------------------28
9 Measurements and Adjustments-------------------------------------29
9.1. Adjustment Procedure------------------------------------------29
9.2. Adjustment--------------------------------------------------------- 32
10 Block Diagram------------------------------------------------------------- 37
10.1. Main Block Dia ram---------------------------------------------37
10.2. Block (1/5) Dia ram -------------------------------------------- 38
10.3. Block (2/5) Dia ram --------------------------------------------- 39
10.4. Block (3/5) Dia ram --------------------------------------------- 40
10.5. Block (4/5) Dia ram----------------------------------------------41
10.6. Block (5/5) Dia ram
--------------------------------------------- 42
11 iring Connection Diagram ------------------------------------------43
11.1. Caution statement.-----------------------------------------------43
11.2. Wirin (1)----------------------------------------------------------- 43
PAGE
11.3. Wirin (2)----------------------------------------------------------- 44
11.4. Wirin (3)----------------------------------------------------------- 45
11.5. Wirin (4)----------------------------------------------------------- 46
11.6. Wirin (5)----------------------------------------------------------- 47
11.7. Wirin (6)----------------------------------------------------------- 48
11.8. Wirin (7)----------------------------------------------------------- 49
11.9. Wirin (8)----------------------------------------------------------- 50
11.10. Wirin (9)------------------------------------------------------------51
12 Schematic Diagram ---------------------------------------------------- 53
12.1. Schematic Dia ram Note--------------------------------------53
12.2. P-Board (1/2) Schematic Dia ram---------------------------54
12.3. P-Board (2/2) Schematic Dia ram---------------------------55
12.4. GK, GL, K, S and XS-Board Schematic Dia ram ------ 56
12.5. A-Board (1/22) Schematic Dia ram -------------------------57
12.6. A-Board (2/22) Schematic Dia ram-------------------------58
12.7. A-Board (3/22) Schematic Dia ram-------------------------59
12.8. A-Board (4/22) Schematic Dia ram-------------------------60
12.9. A-Board (5/22) Schematic Dia ram ------------------------- 61
12.10. A-Board (6/22) Schematic Dia ram-------------------------62
12.11. A-Board (7/22) Schematic Dia ram-------------------------63
12.12. A-Board (8/22) Schematic Dia ram-------------------------64
12.13. A-Board (9/22) Schematic Dia ram-------------------------65
12.14. A-Board (10/22) Schematic Dia ram
-----------------------66
12.15. A-Board (11/22) Schematic Dia ram-----------------------67
12.16. A-Board (12/22) Schematic Dia ram-----------------------68
12.17. A-Board (13/22) Schematic Dia ram-----------------------69
12.18. A-Board (14/22) Schematic Dia ram-----------------------70
12.19. A-Board (15/22) Schematic Dia ram ----------------------- 71
12.20. A-Board (16/22) Schematic Dia ram -----------------------72
12.21. A-Board (17/22) Schematic Dia ram-----------------------73
12.22. A-Board (18/22) Schematic Dia ram-----------------------74
12.23. A-Board (19/22) Schematic Dia ram-----------------------75
12.24. A-Board (20/22) Schematic Dia ram-----------------------76
12.25. A-Board (21/22) Schematic Dia ram-----------------------77
12.26. A-Board (22/22) Schematic Dia ram-----------------------78
12.27. D-Board (1/4) Schematic Dia ram--------------------------79
12.28. D-Board (2/4) Schematic Dia ram--------------------------80
12.29. D-Board (3/4) Schematic Dia ram -------------------------- 81
12.30. D-Board (4/4) Schematic Dia ram --------------------------82
12.31. C1-Board (1/2) Schematic Dia ram-------------------------83
12.32. C1-Board (2/2) Schematic Dia ram-------------------------84
12.33. C2-Board (1/2) Schematic Dia ram-------------------------85
12.34. C2-Board (2/2) Schematic Dia ram-------------------------86
12.35. SC-Board (1/4) Schematic Dia ram------------------------87
12.36. SC-Board (2/4) Schematic Dia ram------------------------88
12.37. SC-Board (3/4) Schematic Dia ram------------------------89
12.38. SC-Board (4/4) Schematic Dia ram------------------------90
12.39. SS-Board (1/2) Schematic Dia ram ------------------------- 91
12.40. SS-Board (2/2) and SS2-Board Schematic
Dia ram ----------------------------------------------------------- 92
13 Printed Circuit Board--------------------------------------------------- 93
13.1. P-Board------------------------------------------------------------- 93
13.2. GK, K, S and SS2-Board---------------------------------------96
13.3. GL and XS-Board------------------------------------------------97
13.4. A-Board------------------------------------------------------------- 98
13.5. D-Board-----------------------------------------------------------100
13.6. C1-Board----------------------------------------------------------102
13.7. C2-Board----------------------------------------------------------103
13.8. SC-Board---------------------------------------------------------104
13.9. SS-Board----------------------------------------------------------107
14 Exploded View and Replacement Parts List ----------------- 109
14.1. Exploded View and Mechanical Replacement Parts
List------------------------------------------------------------------109
14.2. Electrical Replacement Parts List -------------------------- 116
2
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1 Safety Precautions
1.1. General Guidelines
1. When servicin , observe the ori inal lead dress. If a short circuit is found, replace all parts which have been overheated or
dama ed by the short circuit.
2. After servicin , see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3. After servicin , make the followin leaka e current checks to prevent the customer from bein exposed to shock hazards.
4. When servicin , observe the ori inal lead dress. If a short circuit is found, replace all parts which have been overheated or
dama ed by the short circuit.
5. After servicin , see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
6. After servicin , make the followin leaka e current checks to prevent the customer from bein exposed to shock hazards.
1.2. Touch-Current Check
1. Plu the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.
2. Connect a measurin network for touch currents between each exposed metallic part on the set and a ood earth round
such as a water pipe, as shown in Fi ure 1.
3. Use Leaka e Current Tester (Simpson 228 or equivalent) to measure the potential across the measurin network.
4. Check each exposed metallic part, and measure the volta e at each point.
5. Reserve the AC plu in the AC outlet and repeat each of the above measure.
6. The potential at any point (TOUGH CURRENT) expressed as volta e U1 and U2, does not exceed the followin values:
For a. c.: U1 = 35 V (peak) and U2 = 0.35 V (peak);
For d. c.: U1 = 1.0 V,
Note:
The limit value of U2 = 0.35 V (peak) for a. c. and U1 = 1.0 V for d. c. correspond to the values 0.7 mA (peak) a. c. and 2.0
mA d. c.
The limit value U1 = 35 V (peak) for a. c. correspond to the value 70 mA (peak) a. c. for frequencies reater than 100 kHz.
7. In case a measurement is out of the limits specified, there is a possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the customer.
Measuring network for TOUCH CURRENTS
COLD
WATER PIPE
(EARTH GROUND)
Rs=
1500Q_L Cs= 0.22|jF
10kQ
-1 k 1
--- 1
Ro=
----------------
J 500Q'U1 =
r= 0.022|jF (V)
JQ LjJ JUUii U1 —|— и.и^гфГ ^ V J | U2 (V)
APPLIANCES
EXPOSED
METAL PARTS
Resistance values in ohms (Q)
V: Voltmeter or oscilloscope
(r.m.s. or peak readin )
Input resistance: > 1 MQ
Input capacitance: < 200 pF
Frequency ran e: 15 Hz to 1 MHz and d.c. respectively
NOTE - Appropriate measures should be taken to obtain the correct value in case of non-sinusoidal waveforms.
Fi ure 1
3
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2 arning
2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatically
Sensitive (ES) Devices
Some semiconductor (solid state) devices can be dama ed easily by static electricity. Such components commonly are called Elec
trostatically Sensitive (ES) Devices. Examples of typical ES devices are inte rated circuits and some field-effect transistors and
semiconductor [chip] components. The followin techniques should be used to help reduce the incidence of component dama e
caused by electrostatic dischar e (ESD).
1. Immediately before handlin any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touchin a known earth round. Alternatively, obtain and wear a commercially available dischar in ESD wrist strap,
which should be removed for potential shock reasons prior to applyin power to the unit under test.
2. After removin an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi
num foil, to prevent electrostatic char e buildup or exposure of the assembly.
3. Use only a rounded-tip solderin iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as [anti-static (ESD protected)] can
enerate electrical char e sufficient to dama e ES devices.
5. Do not use freon-propelled chemicals. These can enerate electrical char es sufficient to dama e ES devices.
6. Do not remove a replacement ES device from its protective packa e until immediately before you are ready to install it. (Most
replacement ES devices are packa ed with leads electrically shorted to ether by conductive foam, aluminum foil or compara
ble conductive material).
7. Immediately before removin the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handlin unpacka ed replacement ES devices. (Otherwise ham less motion such as the brush
in to ether of your clothes fabric or the liftin of your foot from a carpeted floor can enerate static electricity (ESD) sufficient
to dama e an ES device).
4
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Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it's manufacture due to environmental conservation issues. For service and repair work, we'd
su est the use of Pb free solder as well, althou h Pb solder may be used.
PCBs manufactured usin lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB.
Caution
• Pb free solder has a hi her meltin point than standard solder. Typically the meltin point is 50 ~ 70 °F (30~40 °C) hi her. Please
use a hi h temperature solderin iron and set it to 700 ± 20 °F (370 ± 10 °C).
• Pb free solder will tend to splash when heated too hi h (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applyin Pb sol
der. If this is not practical, be sure to heat the Pb free solder until it melts, before applyin Pb solder.
• After applyin PbF solder to double layered boards, please check the component side for excess solder which may flow onto the
opposite side. (see fi ure below)
component component
remove all of the ^1П\
excess solder
2.2. About lead free solder (PbF)
slice
\
solder
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+A +Cu (tin, silver, copper) solder. How
ever, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
5
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3 Service Navigation
3.1. Service Hint
Board Name Function
P Power Supply
A DC-DC Converter, Tuner
Speaker out, AV Terminal, AV Switch, PC
Di ital Si nal Processor, SYSTEM MPU, HDMI Switch
Peaks-AVC, Ethernet
D Format Converter, Plasma AI, Sub-Field Processor
XS Sat Tuner
GL SD LED
K Remote receiver, Power LED, C.A.T.S. sensor
S Power Switch
GK Key Switch
Board Name Function
C1 Data Driver (Lower Ri ht)
C2 Data Driver (Lower Left)
SC Scan Drive
SS Sustain Drive
SS2 Sustain out (Lower)
SU Scan out (Upper)
Non-serviceable.
SU-Board should be exchan ed for service.
SD Scan out (Lower)
Non-serviceable.
SD-Board should be exchan ed for service.
6
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3.2. Applicable signals
COMPONENT (Y, PB, PR), HDMI
* Mark: Applicable input si nal for Component (Y, PB, PR) and HDMI
Si nal name COMPONENT HDMI
525 (480) / 60i * *
525 (480) / 60p * *
625 (576) / 50i * *
625 (576) / 50p * *
750 (720) / 60p * *
750 (720) / 50p * *
1,125 (1,080) / 60i * *
1,125 (1,080) / 50i * *
1,125 (1,080) / 60p *
1,125 (1,080) / 50p *
1,125 (1,080) / 24p *
PC (from D-sub 15P)
Applicable input si nal for PC is basically compatible to VESA standard timin .
Si nal name Horizontal frequency (kHz) Vertical frequency (Hz)
640 x 400 @70 Hz 31.47 70.07
640 x 480 @60 Hz 31.47 59.94
640 x 480 @75 Hz 37.50 75.00
800 x 600 @60 Hz 37.88 60.32
800 x 600 @75 Hz 46.88 75.00
800 x 600 @85 Hz 53.67 85.06
852 x 480 @60 Hz 31.44 59.89
1,024 x 768 @60 Hz 48.36 60.00
1,024 x 768 @70 Hz 56.48 70.07
1,024 x 768 @75 Hz 60.02 75.03
1,024 x 768 @85 Hz 68.68 85.00
1,280 x 768 @60 Hz 47.70 60.00
1,280 x 1,024 @60 Hz 63.98 60.02
1,366 x 768 @60 Hz 48.39 60.04
Macintosh13 inch (640 x 480) 35.00 66.67
Macintosh16 inch (832 x 624) 49.73 74.55
Macintosh21 inch (1,152 x 870) 68.68 75.06
PC (from HDMI terminal)
Applicable input si nal for PC is basically compatible to HDMI standard timin .
Si nal name Horizontal frequency (kHz) Vertical frequency (Hz)
640 x 480 @60 Hz 31.47 60.00
750 (720) / 60p 45.00 60.00
1,125 (1,080) / 60p 67.50 60.00
Note
• Si nals other than above may not be displayed properly.
• The above si nals are reformatted for optimal viewin on your display.
• PC si nal is ma nified or compressed for display, so that it may not be possible to show fine detail with sufficient clarity.
7
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4 Specifications
Power Source
Power Consumption
Power Consumption in Standby condition
Display panel
Aspect Ratio
Visible screen size
Number of pixels
Sound Speaker
Audio Output
Headphones
PC signals
Receiving Systems / Band name (B only)
Receiving Systems / Band name (E only)
Satellite dish input
AC 220-240 V, 50 / 60 Hz
350 W
0.4 W (Without monitor out recordin )
32 W (With monitor out recordin )
16:9
106 cm (dia onal) 921 mm (W) x 518 mm (H)
2,073,600 (1,920 (W) x 1,080 (H)) [5,760 x 1,080 dots]
140 mm x 35 mm x 2 pcs, 6 Q
20 W ( 10 W + 10 W ), 10 % THD
M3 (3.5 mm) stereo mini Jack x 1
VGA, SVGA, WVGA, XGA
SXGA, W XG A ...... (compressed)
Horizontal scannin frequency 31 - 69 kHz
Vertical scannin frequency 59 - 86 Hz
DVB-S / S2
(freesat Other Sat.) :
DVB-T :
PAL I :
PAL 525/60 :
M.NTSC :
NTSC (AV input only) :
freesat services via Satellite dish input.
Receiver frequency ran e - 950 MHz to 2,150 MHz
LNB Power and Polarisation - Vertical: +13 V
Horizontal: +18 V
Current: Max. 500 mA
(overload protection)
22 kHz Tone - Frequency: 22 kHz ± 2 kHz
Amplitude: 0.6 V ± 0.2 V
Symbol Rate - Max. 30 MS/s
FEC Mode - 1/2, 3/5, 2/3, 3/4, 4/5, 5/6, 8/9, 9/10
Demodulation - QPSK, 8PSK
Not available for DiSEqC control.
Di ital terrestrial services via UHF aerial input.
UHF E21-68
Playback of NTSC tape from some PAL Video recorders (VCR)
or NTSC disc playback from DVD player and recorder.
Playback from M.NTSC Video recorders (VCR).
Playback from NTSC Video recorders (VCR).
PAL B, G, H, I, VHF E2 - E12
SECAM B, G, SECAM L, L’ : VHF H1 - H2 (ITALY)
VHF A - H (ITALY)
UHF E21 - E69
CATV (S01 - S05)
CATV S1 - S10 (M1 - M10)
CATV S11 - S20 (U1 - U10)
CATV S21 - S41 (Hyperband)
PAL D, K, SECAM D, K : VHF R1 - R2
VHF R3 - R5
VHF R6 - R12
UHF E21 - E69
Playback of NTSC tape from some PAL Video recorders (VCR)
Di ital terrestrial services
Di ital cable services
Di ital satellite services
Receiver frequency ran e - 950 MHz to 2,150 MHz
LNB Power and Polarisation - Vertical: +13 V
Horizontal: +18 V
Current: Max. 500 mA
(overload protection)
22 kHz Tone - Frequency: 22 kHz ± 2 kHz
Amplitude: 0.6 V ± 0.2 V
Symbol Rate - Max. 30 MS/s
FEC Mode - 1/2, 3/5, 2/3, 3/4, 4/5, 5/6, 8/9, 9/10
Demodulation - QPSK, 8PSK
DisEqC - Version 1.0
Playback from M.NTSC Video recorders (VCR).
NTSC (AV input only) : Playback from NTSC Video recorders (VCR).
• TV si nals may not be received in some areas.
Female F-type 75 Q
PAL 525/60 :
DVB-T :
DVB-C :
DVB-S / S2 :
M.NTSC :
8
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Aerial input
Operating Conditions
Connection Terminals
AV1 (Scart terminal)
AV2 (Scart terminal)
AV3 VIDEO
S-VIDEO
AUDIO L - R
COMPONENT
VIDEO
AUDIO L - R
Others
HDMI1 / 2 / 3 / 4
PC
Card slot
ETHERNET
Output
AUDIO L - R
DIGITAL AUDIO OUT
Dimensions ( x H x D)
Mass
Note
UHF (B only), VHF/UHF (E only)
Temperature:
Humidity: 0 °C - 3 5°C 20 % - 80 % RH (non-condensin )
21 Pin terminal (Audio/Video in, Audio/Video out, RGB in, Q-Link)
21 Pin terminal (Audio/Video in, Audio/Video out, RGB in, S-Video in, Q-Link)
1.0 V [p-p] (75 Q)
Y:1.0 V [p-p] (75 Q) C:0.286 V [p-p] (75 Q)
0.5 V [rms]
1.0 V [p-p] (includin synchronization)
± 0.35 V [p-p]
0.5 V [rms]
RCA PIN Type x 1
Mini DIN 4-pin
RCA PIN Type x 2
Y
Pb, Pr
RCA PIN Type x 2
TYPE A Connectors HDMI™ (Version 1.3a with Deep Colour x.v.Colour™)
• This TV supports [HDAVI Control 4] function.
HIGH-DENSITY D-SUB 15PIN R, G, B/ 0.7 V [p-p] (75 Q)
HD, VD/TTL Level 2.0 - 5.0 V [p-p] (hi h impedance)
SD Card slot x 1
RJ45, IEEE802.3 10BASE-T/ 100BASE-TX
RCA PIN Type x 2 0.5 V [rms] (hi h impedance)
PCM / Dolby Di ital, Fiber optic
1.029 mm x 702 mm x 332 mm (With Pedestal)
1.029 mm x 661 mm x 97 mm (TV only)
27.0 k Net (With Pedestal)
25.0 k Net (TV only)
1 Desi n and Specifications are subject to chan e without notice. Mass and Dimensions shown are approximate.
1 This equipment complies with the EMC standards listed below.
EN55013, EN61000-3-2, EN61000-3-3, EN55020, EN55022, EN55024.
9
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5 Service Mode
5.1. How to enter into Service Mode
While pressin [VOLUME ( - )] button of the main unit, press [0] button of the remote control three times within 2 seconds.
Software version ■
Picture adjustment ----------
White balance adjustment
Option settin -----------------
A i -------------------------------
Service tool
SERVICE
ADJUST
WB-ADJ
OPTION
AGING
SRV-TOOL
1
Peaks SOFT *.*** OPTION 1 1c
Peaks EEP OPTION 2 ef
LSI DATA OPTION 3 01
STBY SOFT Model ID 05
STBY EEP 02203100
STBY ROMCOR 00000040
PDP SOFT RB Cn+ 000
PDP EEP
PDP FPGA
PDP PDROM
Press
[1]
Button
I Sub Item
1 1
Ia d ju s t" i '
'CONTRAST i '0000i
YMAX
5.1.1. Key command
[1] button...Main items Selection in forward direction
[2] button...Main items Selection in reverse direction
[3] button...Sub items Selection in forward direction
[4] button...Sub items Selection in reverse direction
[RED] button...All Sub items Selection in forward direction
[GREEN] button...All Sub items Selection in reverse direction
[VOL] button...Value of sub items chan e in forward direction ( + in reverse direction ( - )
10
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5.1.2. Contents of adjustment mode
• Value is shown as a hexadecimal number.
• Preset value differs dependin on models.
• After enterin the adjustment mode, take note of the value in each item before startin adjustment.
Main item Sub item Sample data Remark
ADJUST CONTRAST 234
COLOR 2B
TINT 00
Video-Gain 2 199
SUB-BRT 800
H-POS 0
H-AMP 0
V-POS 0
V-AMP 0
WB-ADJ R-CUT 80
G-CUT 80
B-CUT 80
R-DRV F1
G-DRV FC
B-DRV DO
ALL-CUT 80
ALL-DRV FC
OPTION Panel-Type 42FHD Factory
Boot ROM Preset
STBY-SET 00
EMERGENCY ON
Y/С Delay 0
OPT 1 00011100
OPT 2 11101111
OPT3 00000001
AGING RGBW
Vertical line
All white (COUNTER)
All white
All red
All reen
All blue
ON/OFF
Dia onal lamp W
Dia onal lamp R
Dia onal lamp G
Dia onal lamp В
1% WINDOW
COLOR BAR
A В zone/checkerd 4 trio
SCROLL BAR
2dot width border
Low setup red
Low setup reen
Low setup blue
SRV-TOOL see next
Destinations UK Conti. EU
Check sum 6515 6523
EDID e2 2b1b0bfb
5.1.3. How to exit
Switch off the power with the [POWER] button on the main unit or the [POWER] button on the remote control.
11
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5.2. Service tool mode
5.2.1. How to access
1. Select [SRV-TOOL] in Service Mode.
2. Press [OK] button on the remote control.
Display of TD2Microcode version —
Display of Flash ROM maker code -
Display of SOS History
---------------
SRV-TOOL
TD2Microcode:00500995
Flash ROM : AD - F1
PTCT : 00 . 00 . 00 . 00 . 00 Time 00000:40 On/Off 0000022 . POWER ON Time, On/Off
Press [MUTE] button (3sec)
5.2.2. Display of SOS History
SOS History (Number of LED blinkin ) indication.
From left side; Last SOS, before Last, three occurrence before, 2nd occurrence after shipment, 1st occurrence after shipment.
This indication will be cleared by [Self-check indication and forced to factory shipment settin ].
5.2.3. PO ER ON Time, On/Off
Note : To display Time, On/Off menu, hi hli ht position, then press MUTE for 3sec.
Time : Cumulative power on time, indicated hour : minute by decimal
On/Off : Number of On/Off switchin by decimal
Note : This indication will not be cleared by either of the self-checks or any other command.
5.2.4. Exit
1. Disconnect the AC cord from wall outlet or switch off the power with [ Power ] button on the main unit.
12
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5.3. Hotel mode
1. Purpose
Restrict a function for hotels.
2. Access command to the Hotel mode setup menu
In order to display the Hotel mode setup menu, please
enter the followin command (within 2 second).
[TV] : Vol. [Down] + [REMOTE] : AV (3 times)
Then, the Hotel mode setup menu is displayed.
Hotel Mode
Hotel Mode
1 Off _______________________ |
Initial INPUT
1 Off 1
Intial POS
1 Off 1
Intial VOL Level
Г о т |
Maximum Vol Level
1 63 |
Button Lock
Г о т |
Remote Lock
Г Ш |
Select
^o E X IT
иой- Chan e
~ °RETURN
3. To exit the Hotel mode setup menu
Disconnect AC power cord from wall outlet.
4. Explain the Hotel mode setup menu
item Function
Hotel Mode Select hotel mode ON/OFF
Initial INPUT Select input si nal modes.
Set the input, when each time power is switched
on.
Selection :
Off/Analo ue/DVB-S/DVB-T/AV1/AV2/AV2S/AV3/
AV3S/COMPONENT/PC/HDMI1/HDMI2/HDMI3/
HDMI4
• Off: ive priority to a last memory. However,
Euro model is compulsorily set to TV.
• AVnS/AVnC: only Euro model selectable
• PC: selectable with VGA option
Initial POS Select pro ramme number.
Selection :
Off/0 to 99
• Off: ive priority to a last memory
Initial VOL level Adjust the volume when each time power is
switched on.
Selection/Ran e :
Off/0 to 63
• Off: ive priority to a last memory
Maximum VOL
level Adjust maximum volume. Ran e :
0 to 63
Button lock Select local key conditions.
Selection :
Off/SETUP/MENU/ALL
• Off: alto ether valid
• SETUP: only F-key is invalid
(Tunin uide(menu) can not be selected.)
• MENU: only F-key is invalid
(only Volume/Mute can be selected.)
• ALL: alto ether invalid.
Remote lock Select remote control key conditions.
Selection :
Off/SETUP/MENU
• Off: alto ether valid
• SETUP: only Setup menu is invalid
• MENU: Picture/Sound/Setup menu are invalid
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6 Troubleshooting Guide
Use the self-check function to test the unit.
1. Checkin the IIC bus lines
2. Power LED Blinkin timin
6.1. Check of the IIC bus lines
6.1.1. How to access
Self-check indication only:
Produce TV reception screen, and while pressin [VOLUME ( - )] button on the main unit, press [OK] button on the remote control
for more than 3 seconds.
Self-check indication and forced to factory shipment settin :
Produce TV reception screen, and while pressin [VOLUME ( - )] button on the main unit, press [MENU] button on the remote con
trol for more than 3 seconds.
6.1.2. Screen display
6.1.3. Check Point
Confirm the followin parts if NG was displayed.
Display Ref. No. Description P.C.B.
ADV IC4510 AD/HDMI A-Board
ADAV IC2106 Sound Processor A-Board
TUN TU8301 Tuner A-Board
GENX IC1100 GenX (STB MCU) A-Board
MEM1 IC1101 EEPROM (GenX) A-Board
MEM2 IC8502 EEPROM (Peaks) A-Board
AVSW IC3001 Audio/Video SW A-Board
PDP-PANEL IC9003 MICOM A-Board
OFDM IC8301 Di ital demodulator A-Board
TEMP IC4800 Temp Sensor A-Board
GC6 IC5100 Global core A-Board
VIF TU8301 Tuner A-Board
LAN IC8503 Ethernet control A-Board
2nd FE TU6801 SAT Tuner XS-Board
6.1.4. Exit
Disconnect the AC cord from wall outlet or switch off the power with [ Power ] button on the main unit.
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6.2. Power LED Blinking timing chart
1. Subject
Information of LED Flashin timin chart.
2. Contents
When an abnormality has occurred the unit, the protection circuit operates and reset to the stand by mode. At this time, the
defective block can be identified by the number of blinks of the Power LED on the front panel of the unit.
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6.3. No Power
First check point
There are followin 2 states of No Power indication by power LED.
1. No lit
2. Red is lit then turns red blinkin a few seconds later. (See 6.2.)
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6.4. No Picture
No Picture
Check NG
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6.5. Local screen failure
Plasma display may have local area failure on the screen. Fi -1 is the possible defect P.C.B. for each local area.
Fi -1
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7 Service Fixture & Tools
7.1. SC jig
Purpose:
To find the failure board (SC or SU/SD) when the power LED is blinkin 7 times.
SC jig:
Jumper connector to connect to SC50 connector on SC board
Part number:
TZSC09187
How to use:
Caution: Remove SC jig from SC board after inspection.
1. Remove all connector between SC board and SU/SD board to isolate SC board from both SU and SD board electrically.
Note: The board will be dama ed if all connector is not removed (for example; remove connector only for SU board and stay
connectin with SD board. The board will be dama ed.)
2. Connect SC ji to connector SC50 at left bottom side of SC board
3. Turn of the TV/Display Unit and confirm the power LED blinkin .
LED blinkin : Possible cause of failure is in SC board
No LED blinkin (Li htin or no li htin ): Possible cause of failure is in SU or SD board
4. After inspection, turn off the TV/Display Unit and wait a few minutes to dischar e.
5. Remove SC ji from SC board.
Remark: This SC ji can be used for all 2009 Plasma TV and Plasma Display.
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8 Disassembly and Assembly Instructions
8.1. Remove the Rear cover
1. See Service Hint (Section 3)
8.2. Remove the Fan
1. Unlock the cable clampers to free the cable.
2. Remove the screws (x3 ^ ) .
3. Remove the relay connectors and remove the Fan unit.
4. Remove the screw (x1
5. Remove the Fan.
Relay connector
) on the back side.
8.3. Remove the P-Board
Caution:
To remove P.C.B. wait 1 minute after power was off for dis
char e from electrolysis capacitors.
1. Unlock the cable clampers to free the cable
2. Disconnect the connectors (P2, P6, P7, P9, P11, P25,
P34 and P35).
3. Remove the screws (x9 and remove the P-Board.
8.4. Remove the Side terminal
cover and Rear terminal cover
1. Remove the claw(x1 ^ ) .
2. Remove the Side terminal cover.
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