Panasonic PT60LC13 - LCD User manual

ORDERNO. MKE0310854A1
B2
Multi MediaDisplay
PT-60LC13
Please fileand use thismanual togetherwiththeservice manual for
Model No. PT-50LC13, OrderNo. MKE0307850C1.
SPECIFICATIONS
1

2003 Matsushita Kotobuki Electronics Industries LTD. All rights
reserved. Unauthorizedcopying and distribution isaviolation of
law.
1. DIFFERENCES BETWEEN PT-60LC13 and PT-
50LC13
1.1. COMPARISONCHART
1.1.1. MECHANICALREPLACEMENTPARTS LIST
2

Definition ofPartssupplier:
1. Parts withmark"MKA"intheRemarks columnaresuppliedfrom
MKA.
2. Parts withoutmarkintheRemarks columnaresuppliedfromMKE.
2. EXPLODED VIEWS(CABINETSECTION)
2.1. MAINPARTSSECTION
3

2.2. DISPLAYSECTION
4

2.3. SCREENSECTION
5

3. DISASSEMBLY/ ASSEMBLYPROCEDURES
3.1. CABINETSECTION
6

-19-
REMOVAL OF THE BALLAST C.B.A. AND THE TV/TUNER UNIT FROM THE CABINET
1. Remove the Rear Cover by removing the 20 Screws (401, 464).
Fig. D1-1
401 464
Rear Cover

-20-
4. 1) Remove the Speaker-L and the Speaker-R by removing the 6 Screws (401, 450) and 6 Washers (453), and disconnect the
connectors P4553.
2) Remove the Screen Unit by removing the 22 Screws (401).
Fig. D4-4
450
401
453
453
P4553
450
453
Speaker L
401
401
Screen Unit
401
450
450
453
453
453
Speaker R
P4553
REMOVAL OF THE SCREEN UNIT AND THE SPEAKER FROM THE DISPLAY

-21-
5. Remove the 2 Screen Plate H and 2 Screen Plate V by removing 40 Screws (465), and remove the Fresnel Lens and the Lenticular
Screen.
Fig. D4-5
Reassembly Note:
Install them so that Serial No. Labels are on the each outside as shown above.
Replacement Note for Screen Unit:
The Screen Unit is supplied as a unit, or the individual parts (Fresnel Lens, Lenticular Screen) in the Screen Unit are also supplied.
When replacing the Fresnel Lens and the Lenticular Screen, take care that dust, etc., does not adhere between the Fresnel Lens
and the Lenticular Screen. Due to this risk, it is strongly recommended to replace the Screen Unit as a unit.
465
465
Escutcheon
Lenticular
Screen
Fresnel
Lens
Screen
Plate V
Screen
Plate V
Serial No.
Label
Screen
Plate H
Screen
Plate H
Serial No. Label
of Lenticular Screen
Front
Serial No. Label
of Fresnel Lens

-21-
REMOVAL OF THE MIRROR FROM THE BACK COVER
1. Remove the Screen Unit. Refer to Steps 1~4 in “REMOVAL OF THE SCREEN UNIT AND THE SPEAKER FROM THE DISPLAY.”
2. 1) Remove the 3 Mirror Holder H and the 2 Mirror Holder V Unit by removing the 15 Screws (401).
2) Remove the Mirror from the top by releasing the Back Cover slots.
Note: Be careful that the Mirror does not fall down when removing.
Fig. D4-6
Reassembly Notes for Mirror:
Install the Mirror as following procedures:
1) Place the 4 sheets on the top and bottom edges of the Mirror.
Fig. D4-7
2) Hold the sheet portions of the Mirror, and insert the Mirror from the top into the Back Cover slots carefully.
When handling the Mirror, do not touch the Mirror surface.
3) Install the 3 Mirror Holder H and the 2 Mirror Holder V on the Mirror and tighten the 15 Screws (401).
Mirror Holder
V Unit
Mirror Holder H
401
401
Back Cover slots
Mirror surface
Sheet
10 mm ~ 20 mm
10 mm ~ 15 mm
<Front View>
18 mm ~ 28 mm
15 mm ~ 20 mm
18 mm ~ 28 mm
10 mm ~ 20 mm
10 mm ~ 15 mm
SheetSheet Sheet
15 mm ~ 20 mm
Sheet
Top edge
of Mirror
Bottom edge
of Mirror
Sheet

ORDERNO. MKE0307850C1
B2
Multi MediaDisplay
PT-50LC13
SPECIFICATIONS
2003 Matsushita Kotobuki Electronics Industries LTD. All rights
reserved. Unauthorizedcopying and distribution isaviolation of
law.
1

1. SAFETYPRECAUSIONS
1.1. GENERALGUIDELINES
1. Forcontinuedsafety, no modification ofanycircuitshouldbe
attempted.
2. Disconnect ACPlug beforedisassembling thisunit.
3. Itisadvisabletouse anisolation transformerintheACsupply
beforeservicing.
4. Whenservicing, observetheoriginal leaddress. Ifashortcircuit
isfound, replace all parts whichhavebeenoverheatedor
damagedbytheshortcircuit.
5. Afterservicing, see toitthat all theprotectivedevices suchas
insulation barriers, insulation papers, shield, and isolation R-C
combinationsetc. areproperlyinstalled.
6. Afterservicing, besuretorestorethewires, leads, insulation
barriers, shields, etc.
7. Afterservicing, make theleakagecurrentchecks topreventthe
customerfrombeing exposedtoshock hazards.
Caution:
Use aseparate Isolation Transformerforthisunitwhenservicing.
1.2. LEAKAGECURRENTCOLDCHECK
1. Unplug theACcordand connect ajumperbetweenthetwoprongs
on theplug.
2. Forphysicallyoperatedpowerswitches, turnpoweron. Otherwise
skipstep2.
3. Measuretheresistance value, withanohmmeter, betweenthe
jumperedACplug and eachexposedmetalliccabinet parton the
2

receiver, suchas screwheads, connectors, etc. Whentheexposed
metallicparthas areturnpathtothechassis, thereading should
bebetween1M and 12 M . Whentheexposedmetal does not
haveareturnpathtothechassis, thereading must beinfinity.
1.3. LEAKAGECURRENTHOTCHECK
1. Plug theACcorddirectlyintotheACoutlet.
Donotuse aisolation transformerforthischeck.
2. Connect a1.5k , 10 Wresistor, inparallel witha0.15 F
capacitor, betweeneachexposedmetallicparton theset and a
good earthground, as showninFigure1.
3. Use anACvoltmeter, with1k /Vormoresensitivity, tomeasure
thepotential across theresistor.
4. Check eachexposedmetallicpart, and measurethevoltageat
eachpoint.
5. Reverse theACplug intheACoutlet and repeat eachoftheabove
measurements.
6. Thepotential at anypointshouldnotexceed0.75 VRMS.
Aleakagecurrenttester(Simpson Model 229 equivalent) maybe
usedtomake thehotchecks. Leakagecurrentmust notexceed1/2
mA. Incase ameasurementisoutsideofthelimits specified, there
isapossibilityofshock hazard, and thereceivershouldbe
repairedand recheckedbeforeitisreturnedtothecustomer.
Figure1
1.4. UV-PRECAUTION
1. Besuretodisconnect theACPlug whenreplacing thelamp.
2. Since thelampreaches averyhigh temperatureduring its
3

operation, waituntil ithas completelycooledoff whenreplacing
theLampUnit.
3. Thelampemits small amounts ofUV-Radiation.
Avoiddirect-eyecontact bycovering theLampand wearing theUV
cutprotectiveglass.
4. Thehigh pressurelampinvolves arisk ofexplosion.
Figure2
2. PREVENTIONOFELECTROSTATICDISCHARGE
(ESD) TO ELECTROSTATICALLYSENSITIVE (ES)
DEVICES
Somesemiconductor (solidstate)devices canbedamagedeasilybystaticelectricity. Such
componentscommonlyarecalledElectrostaticallySensitive (ES)Devices. Examples oftypical
ES devices areintegratedcircuitsand somefield-effecttransistorsand semiconductor "chip"
components. Thefollowing techniques shouldbeusedtohelpreduce theincidence of
componentdamagecausedbyelectro staticdischarge(ESD).
1. Immediatelybeforehandling anysemiconductorcomponentor
semiconductor-equippedassembly, drainoff anyESDon your
bodybytouching aknownearthground. Alternatively, obtainand
wearacommerciallyavailabledischarging ESDwrist strap, which
shouldberemovedforpotential shock reasonspriortoapplying
powertotheunitundertest.
2. Afterremoving anelectrical assemblyequippedwithES devices,
place theassemblyon aconductivesurface suchas aluminum
foil, topreventelectrostaticchargebuildup orexposureofthe
4

assembly.
3. Use onlyagrounded-tipsoldering iron tosolderorunsolderES
devices.
4. Use onlyanantistaticsolderremoval device. Somesolderremoval
devices notclassifiedas "antistatic(ESDprotected)"cangenerate
electrical chargesufficienttodamageES devices.
5. Donotuse freon-propelledchemicals. These cangenerate
electrical charges sufficienttodamageES devices.
6. DonotremoveareplacementES device fromits protective
packageuntil immediatelybeforeyou arereadytoinstall it. (Most
replacementES devices arepackagedwithleadselectrically
shortedtogetherbyconductivefoam, aluminumfoil orcomparable
conductivematerial).
7. Immediatelybeforeremoving theprotectivematerial fromthe
leadsofareplacementES device, touchtheprotectivematerial to
thechassisorcircuitassemblyintowhichthedevice will be
installed.
CAUTION:
Besureno powerisappliedtothechassisorcircuit, and observe
all othersafetyprecautions.
8. Minimizebodilymotionswhenhandling unpackagedreplacement
ES devices. (Otherwise harmless motion suchas thebrushing
togetherofyourclothes fabricorthelifting ofyourfootfroma
carpetedfloorcangenerate staticelectricity(ESD)sufficientto
damageanES device).
3. ABOUTLEADFREE SOLDER (PbF)
5

4. SERVICE NOTES
5. DISASSEMBLY/ASSEMBLYPROCEDURES
5.1. CABINETSECTION
6. ADJUSTMENTPROCEDURES
7. TROUBLESHOOTING HINTSFORBLOCK LEVEL
REPAIR
8. BLOCK DIAGRAMS
9. SCHEMATICDIAGRAMS
9.1. SCHEMATICDIAGRAMAND CIRCUITBOARD LAYOUTNOTES
9.2. INTERCONNECTIONSCHEMATICDIAGRAM
9.3. FRONTJACK SCHEMATICDIAGRAM
9.4. NETWORK / THERMISTOR1/ THERMISTOR2/ OPERATION/
COVERSWITCH SCHEMATICDIAGRAMS
9.5. AUDIO AMPSCHEMATICDIAGRAM
9.6. TUNERSCHEMATICDIAGRAM
9.7. VOLTAGECHART
10. CIRCUITBOARD LAYOUT
6

10.1. FRONTJACK C.B.A. / OPERATIONC.B.A. / NETWORK C.B.A.
10.2. AUDIO AMPC.B.A. / THERMISTOR1C.B.A. / THERMISTOR2
C.B.A. / COVERSWITCH C.B.A.
10.3. TUNERC.B.A.
11. EXPLODED VIEWS
11.1. MAINPARTSSECTION
7

11.2. FRONTAND BASE SECTION
8

11.3. DISPLAYSECTION
9

11.4. SCREENSECTION
10