Index
1. Overall Introduction ...................................................................................................... 4
2. AT Command ................................................................................................................. 4
2.1. List of supported commands................................................................................. 4
2.2. AT Command Sets................................................................................................ 5
2.3. Default Info ......................................................................................................... 13
2.4. Pin Assignment................................................................................................... 15
3. How to Control External MCU .................................................................................... 17
3.1. How to Send AT Commands............................................................................... 17
3.2. How to Return to Flashed Default Setting........................................................... 18
3.3. How to Start Scanning........................................................................................ 20
4. Report of Data Transmission...................................................................................... 23
5. Product Dimension ..................................................................................................... 25
5.1. PCB Dimensions & Pin Indication....................................................................... 25
5.2. Recommended Layout of Solder Pad................................................................. 27
5.3. RF Layout Suggestion (aka Keep-Out Area) ...................................................... 30
5.4. Footprint & Design Guide ................................................................................... 32
6. Main Chip Solution...................................................................................................... 33
7. Shipment Packaging Information .............................................................................. 33
7.1. Marking on Metal Shield ..................................................................................... 34
7.2. Tray Info.............................................................................................................. 34
8. Specification ................................................................................................................ 35
8.1. Absolute Maximum Ratings ................................................................................ 35
8.2. Operation Conditions.......................................................................................... 35
8.3. Electrical Specifications...................................................................................... 36
9. Reference Circuit......................................................................................................... 41
10. Certification ................................................................................................................. 42
10.1. Declaration ID..................................................................................................... 42
10.2. FCC Certificate (USA) ........................................................................................ 44
10.3. TELEC Certificate (Japan).................................................................................. 45
10.4. NCC Certificate (Taiwan) .................................................................................... 46
10.5. CE Test Report (EU)........................................................................................... 48
10.6. IC Certificate (Canada)....................................................................................... 50
10.7. SRRC Certificate (China).................................................................................... 51
10.8. KC Certificate (South Korea) .............................................................................. 52
10.9. RoHS & REACH Report ..................................................................................... 53
10.10. End-Product Label.............................................................................................. 53