RF-Star RF-WM-10AFB1 User manual

RF-WM-10AFB1 Ultra-Low-Power
2.4 GHz Wi-Fi Module
Version 1.0
Shenzhen RF-star Technology Co., Ltd.
Jan. 19th, 2020

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Wi-Fi Module List
Chipset
Core
RAM
(KB)
Tx
Power
(dBm)
Model
FLASH
(Byte)
Antenna
Dimension
(mm)
Distance
(m)
Photo
CC3235S
M4
256
18
RF-WM-
3235A1S
4M
PCB
20.5  25.0
100
M4
256
18
RF-WM-
3235B1S
4M
Half-hole
20.5  17.5
100
CC3235SF
M4
256
18
RF-WM-
3235A1
4M +
1M embedded
PCB
20.5  25.0
100
M4
256
18
RF-WM-
3235B1
4M +
1M embedded
Half-hole
20.5  17.5
100
CC3200
M4
256
17
RF-WM-
3200B1
1M
Chip
20  31
100
RF-WM-
3200B1I
1M
IPEX
20  31
150
Conta
ct Me
RF-WM-
3200B2
16M
Chip
20  31
100
RF-WM-
3200B3
1M
Half-hole
20.5  17.5
100
CC3220
M4
256
17
RF-WM-
3220B1
4M
Chip /
IPEX
20  31
100
RTL8710AF
M3
512
17
RF-WM-
10AFB1
1M
IPEX
20  23
100
RTL8711AF
M3
512
17
RF-WM-
11AFB1
1M
IPEX
20  23
100
Note:
1. The communication distance is the longest distance obtained by testing the module's maximum transmission power
in an open and interference-free environment in sunny weather.
2. Click the picture to buy modules.
3. All modules with PCB / Chip antenna and IPEX connector are dispatched with PCB / Chip antenna only by default. If
IPEX connector is needed, pls check with me before quotation.

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1 Device Overview
1.1 Description
RF-WM-10AFB1 is a PCB module based on Realtek Wi-Fi SoC RTL8710AF of CortexTM-M3 core at 83 MHz. This
module has on-chip 512 KB RAM and 1 MB flash, a pin-out of peripherals of SDIO, SPI, UART, I2C, I2S, and GPIOs. It
has integrated a 40 MHz crystal, an on-board PCB antenna, and an IPEX/U.FL connector for connecting to an external
antenna. It supports 2.4 GHz 802.11 b/g/n at 20 MHz channel bandwidth with 75 Mbps maximum data rate. The module
comes with a pre-programmed serial interface data communication protocol and an AT commands set to minimizes
users’ effort to establish the data link to their existing MCUs or processors. It supports STA, AP, and STA + AP concurrent
modes, advanced security features include Wi-Fi WEP, WPA, WPA2, and WPS2 with MD5, SHA-1, SHA2-256, DES,
3DES, and AES security engines.
1.2 Key Features
•General
- CMOS MAC, baseband PHY, and RF in a
single chip for 802.11b/g/n compatible WLAN
- Complete 802.11n solution for 2.4 GHz band
- 72.2 Mbps receive PHY rate and 72.2 Mbps
transmit PHY rate using 20 MHz bandwidth
- 150 Mbps receive PHY rate and 150 Mbps
transmit PHY rate using 40 MHz bandwidth
- Compatible with 802.11n specification
- Backward compatible with 802.11b/g devices
while operating in 802.11n mode
•Standards supported
- 802.11b/g/n compatible WLAN
- 802.11e QoS Enhancement (WMM)
- 802.11i (WPA, WPA2). Open, shared key, and
pair-wise key authentication services
- Wi-Fi WPS support
- Wi-Fi direct support
- Light weight TCP/IP protocol
•WLAN MAC features
- Frame aggregation for increased MAC
efficiency (A-MSDU, A-MPDU)
- Low latency immediate High-Throughput
Block Acknowledgement (HT-BA)
- Long NAV for media reservation with CF-End
for NAV release
- PHY-level spoofing to enhance legacy
compatibility
- Power saving mechanism
•WLAN PHY features
- 802.11n OFDM
- One Transmit and One Receive path (1T1R)
- 20 MHz and 40 MHz bandwidth transmission
- Short guard interval (400 ns)
- DSSS with DBPSK and DQPSK, CCK
modulation with long and short preamble
- OFDM with BPSK, QPSK, 16QAM, and
640QAM modulation. Convolutional coding
rate: 1/2, 2/3, 3/4, and 5/6
- Maximum data rate 54 Mbps in 802.11g and
150 Mbps in 802.11n
•Peripheral interfaces
- SDIO slave
- Maximum 2 high speed UART interface with
baud rate up to 4 MHz
- 1 log UART with standard baud rate support
- Maximum 3 I2C interface
- I2S with 8/16/24/32/48/96/44.1/88.2 KHz

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sampling rate
- Maximum 2 PCM with 8/16 KHz sample rate
- Maximum 2 SPI supported with baud rate up
to 20.8 MHz
- Support 4 PWM with configurable duration
and duty cycle from 0 ~ 100%
- Support 4 external timer trigger event (ETE
function) with configurable period in low
power mode
1.3 Applications
•Cloud connectivity
•Home automation
•Home appliances
•Access control
•Security systems
•Smart energy
•Internet gateway
•Industrial control
•Smart plug
•Smart metering
•Wireless audio
•IP network sensor nodes
1.4 Functional Block Diagram
Figure 1. Functional Block Diagram of RF-WM-10AFB1
RTL8710AF
Matching
40.0 MHz
Reset
Power Supply
3.0 V ~ 3.6 V
NFC Out
IPEX
Connector
Antenna Switch
PCB
Antenna
Antenna
Matching
GPIOs

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1.5 Part Number Conventions
The part numbers are of the form of RF-WM-10AFB1 where the fields are defined as follows:
Figure 2. Part Number Conventions of RF-WM-10AFB1
RF
WM
10AF
Company Name
RF-Star
Wireless Type
Wi-Fi Module
Chipset Model
Realtek RTL8710AF
-
-
B1
Module Version
The First Version

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Table of Contents
Wi-Fi Module List................................................................................................................................................................ 1
1 Device Overview............................................................................................................................................................. 2
1.1 Description............................................................................................................................................................ 2
1.2 Key Features ....................................................................................................................................................... 2
1.3 Applications.......................................................................................................................................................... 3
1.4 Functional Block Diagram .............................................................................................................................. 3
1.5 Part Number Conventions.............................................................................................................................. 4
Table of Contents................................................................................................................................................................ 5
Table of Figures................................................................................................................................................................... 6
Table of Tables..................................................................................................................................................................... 6
2 Module Configuration and Functions ...................................................................................................................... 7
2.1 Module Parameters........................................................................................................................................... 7
2.2 Module Pin Diagram ......................................................................................................................................... 7
2.3 Pin Functions....................................................................................................................................................... 8
2.4 Pin Multiplexing ................................................................................................................................................10
3 Specifications .................................................................................................................................................................11
3.1 Recommended Operating Conditions .....................................................................................................11
3.2 Handling Ratings..............................................................................................................................................11
3.3 RF Parameters .................................................................................................................................................11
3.3.1 RF Configuration.................................................................................................................................11
3.3.2 Transmission Distance......................................................................................................................11
4 Application, Implementation, and Layout.............................................................................................................13
4.1 Module Photos..................................................................................................................................................13
4.2 Recommended PCB Footprint....................................................................................................................13
4.3 Antenna................................................................................................................................................................14
4.4 Schematic Diagram.........................................................................................................................................15
4.5 Download and Debug Interface..................................................................................................................16
4.6 Basic Operation of Hardware Design ......................................................................................................16
4.7 Trouble Shooting..............................................................................................................................................18
4.7.1 Unsatisfactory Transmission Distance........................................................................................18
4.7.2 Vulnerable Module..............................................................................................................................18
4.7.3 High Bit Error Rate .............................................................................................................................18

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4.8 Electrostatics Discharge Warnings ...........................................................................................................18
4.9 Soldering and Reflow Condition.................................................................................................................19
4.10 Optional Packaging ......................................................................................................................................20
5 Revision History ............................................................................................................................................................21
6 Contact Us.......................................................................................................................................................................22
Table of Figures
Figure 1. Functional Block Diagram of RF-WM-10AFB1........................................................................... 3
Figure 2. Part Number Conventions of RF-WM-10AFB1 .......................................................................... 4
Figure 3. Pin Diagram of RF-WM-10AFB1...................................................................................................... 7
Figure 4. Photos of RF-WM-10AFB1...............................................................................................................13
Figure 5. Recommended PCB Footprint of RF-WM-10AFB1 (mm) ....................................................13
Figure 6. Specification of Antenna Seat .........................................................................................................14
Figure 7. Specification of IPEX Wire................................................................................................................14
Figure 8. Schematic Diagram of RF-WM-10AFB1 .....................................................................................15
Figure 9. Download and Debug Interface of RF-WM-10AFB1 ..............................................................16
Figure 10. Recommendation of Antenna Layout.........................................................................................17
Figure 9. Recommended Reflow for Lead Free Solder............................................................................20
Figure 12. Optional Packaging Mode ..............................................................................................................20
Table of Tables
Table 1. Parameters of RF-WM-10AFB1 ......................................................................................................... 7
Table 2. Pin Functions of RF-WM-10AFB1 ..................................................................................................... 8
Table 3. Pin Multiplexing of RF-WM-10AFB1...............................................................................................10
Table 4. Recommended Operating Conditions of RF-WM-10AFB1....................................................11
Table 5. Handling Ratings of RF-WM-10AFB1 ............................................................................................11
Table 9. Temperature Table of Soldering and Reflow................................................................................19

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2 Module Configuration and Functions
2.1 Module Parameters
Table 1. Parameters of RF-WM-10AFB1
Chipset
Realtek RTL8710AF
Supply Power Voltage
3.0 V ~ 3.6 V, recommended to 3.3 V
Frequency
2.4 GHz
Crystal
40 MHz
Package
SMT Packaging
Dimension
23.0 mm x 20.0 mm x (2.4 ± 0.1) mm
Type of Antenna
PCB antenna / IPEX connector
Operating Temperature
-20 ℃ ～ +85 ℃
Storage Temperature
-40 ℃ ～ +125 ℃
2.2 Module Pin Diagram
Figure 3. Pin Diagram of RF-WM-10AFB1

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2.3 Pin Functions
Table 2. Pin Functions of RF-WM-10AFB1
Pin
Name
Description
1
RFOUT
RF signal output pin
2
GND
Ground
3
GND
Ground
4
VDD
3.3 V power supply
5
GPIO_E4
GPIO pin, the MUX function can be referred to pin multiplexing table.
6
GPIO_E3
GPIO pin, the MUX function can be referred to pin multiplexing table.
7
GPIO_E2
GPIO pin, the MUX function can be referred to pin multiplexing table.
8
GPIO_E1
GPIO pin, the MUX function can be referred to pin multiplexing table.
9
GPIO_E0
GPIO pin, the MUX function can be referred to pin multiplexing table.
10
NC
None connect
11
CHIP_EN
Chip enable pin, can be used for reset.
12
GPIO_A0
GPIO pin, the MUX function can be referred to pin multiplexing table.
13
GPIO_A1
GPIO pin, the MUX function can be referred to pin multiplexing table.
14
GPIO_A2
GPIO pin, the MUX function can be referred to pin multiplexing table.
15
GPIO_A3
GPIO pin, the MUX function can be referred to pin multiplexing table.
16
GPIO_A4
GPIO pin, the MUX function can be referred to pin multiplexing table.
17
GPIO_A5
GPIO pin, the MUX function can be referred to pin multiplexing table.
18
GND
Ground
19
VDD
3.3 V power supply
20
NC
None connect
21
NC
None connect
22
GPIO_C5
GPIO pin, the MUX function can be referred to pin multiplexing table.
23
GPIO_C4
GPIO pin, the MUX function can be referred to pin multiplexing table.
24
GPIO_C3
GPIO pin, the MUX function can be referred to pin multiplexing table.
25
GPIO_C2
GPIO pin, the MUX function can be referred to pin multiplexing table.
26
GPIO_C1
GPIO pin, the MUX function can be referred to pin multiplexing table.

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27
GPIO_C0
GPIO pin, the MUX function can be referred to pin multiplexing table.
28
GPIO_B3
GPIO pin, the MUX function can be referred to pin multiplexing table.
29
GPIO_B2
GPIO pin, the MUX function can be referred to pin multiplexing table.
30
GPIO_B1
GPIO pin, the MUX function can be referred to pin multiplexing table.
31
GPIO_B0
GPIO pin, the MUX function can be referred to pin multiplexing table.
32
NC
None connect
33
NC
None connect
34
GND
Ground

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2.4 Pin Multiplexing
Table 3. Pin Multiplexing of RF-WM-10AFB1
Pin name
JTAG
SDIO
UART Group
I2C Group
SPI Group
I2S Group
PCM Group
PWM
ETE
WKDT D SLP
WKDT D SBY
GPIO INT
GPIO_A0
SD_D2
UART2_IN
SPI1_MISO
GPIO_INT
GPIO_A1
SD_D3
UART2_CTS
SPI1_MOSI
GPIO_INT
GPIO_A2
SD_CMD
UART2_RTS
SPI1_CLK
GPIO_A3
SD_CLK
GPIO_A4
SD_D0
UART2_OUT
SPI1_CS
GPIO_A5
SD_D1
WKDT0
GPIO_B0
UART_LOG_OUT
ETE0
GPIO_B1
UART_LOG_IN
ETE1
WKDT0
GPIO_B2
I2C3_SCL
ETE2
GPIO_B3
I2C3_SDA
ETE3
GPIO_INT
GPIO_C0
UART0_IN
SPI0_CS0
I2S1_WS
PCM1_SYNC
PWM0
ETE0
GPIO_C1
UART0_CTS
SPI0_CLK
I2S1_CLK
PCM1_CLK
PWM1
ETE1
GPIO_INT
GPIO_C2
UART0_RTS
SPI0_MOSI
I2S1_SD_TX
PCM1_OUT
PWM2
ETE2
GPIO_C3
UART0_OUT
SPI0_MISO
I2S1_MCK
PCM1_IN
PWM3
ETE3
GPIO_INT
GPIO_C4
I2C1_SDA
SPI0_CS1
I2S1_SD_RX
GPIO_INT
GPIO_C5
I2C1_SCL
SPI0_CS2
GPIO_INT
GPIO_E0
JTAG_TRST
UART0_OUT
I2C2_SCL
SPI0_CS0
PCM0_SYNC
PWM0
GPIO_E1
JTAG_TDI
UART0_RTS
I2C2_SDA
SPI0_CLK
PCM0_CLK
PWM1
GPIO_INT
GPIO_E2
JTAG_TDO
UART0_CTS
I2C3_SCL
SPI0_MOSI
PCM0_OUT
PWM2
GPIO_INT
GPIO_E3
JTAG_TMS
UART0_IN
I2C3_SDA
SPI0_MISO
PCM0_IN
PWM3
WKDT3
GPIO_INT
GPIO_E4
JTAG_CLK
SPI0_CS1
Note: PH = Pull-High, HI = High-Impedance

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3 Specifications
3.1 Recommended Operating Conditions
Functional operation does not guarantee performance beyond the limits of the conditional parameter values in the table
below. Long-term work beyond this limit will affect the reliability of the module more or less.
Table 4. Recommended Operating Conditions of RF-WM-10AFB1
Items
Condition
Min.
Typ.
Max.
Unit
Operating Supply Voltage
Battery Mode
3.0
3.3
3.6
V
Operating Temperature
/
-20
+25
+85
℃
Environmental Hot Pendulum
/
-20
+20
℃/min
3.2 Handling Ratings
Table 5. Handling Ratings of RF-WM-10AFB1
Items
Condition
Min.
Typ.
Max.
Unit
Storage Temperature
Tstg
-55
+25
+125
℃
Human Body Model
HBM
4000
V
Moisture Sensitivity Level
2
Charged Device Model
750
V
3.3 RF Parameters
3.3.1 RF Configuration
Wireless Mode
Transmission Rate
(Modulation)
Tx Power (Typical)
Rx Sensitivity (Typical)
IEEE802.11 B
11 Mbps @ CCK
17.0 dBm
-82 dBm
IEEE802.11 G
54 Mbps @ OFDM
13.5 dBm
-69 dBm
IEEE802.11 N
HT20 @ MCS7
13.5 dBm
-66 dBm
IEEE802.11 N
HT40 @ MCS7
13.5 dBm
-63 dBm
3.3.2 Transmission Distance
The transmission distance test was conducted in the outdoor open area, and two RF-WM-10AFB1 modules were marked
as A0 and B0 respectively. And the simultaneous bidirectional communication test was conducted under the modules
with external rod antenna and PCB antenna. The test results are as follows:

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Test conditions:
1. Outside and open air
2. Transmission distance: 100 meters
3. Data packet: 100 bytes
Wi-Fi Module
UDP Socket Communication
TCP Socket Communication
Sending
Packet
Receiving
Packet
Number of
Packet
Loss
Packet
Loss
Rate
Sending
Packet
Receiving
Packet
Number
of Packet
Loss
Packet
Loss
Rate
PCB
Antenna
A0→B0
1000
1000
0
0%
1000
1000
0
0%
A0B0
1000
1000
0
0%
1000
1000
0
0%
External
Antenna
A0→B0
1000
1000
0
0%
1000
1000
0
0%
A0B0
1000
1000
0
0%
1000
1000
0
0%

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4 Application, Implementation, and Layout
4.1 Module Photos
Figure 4. Photos of RF-WM-10AFB1
4.2 Recommended PCB Footprint
Figure 5. Recommended PCB Footprint of RF-WM-10AFB1 (mm)

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4.3 Antenna
RF-WM-10AFB1 module is integrated the IPEX version 1 antenna seat, the specification of antenna seat is as follow:
Figure 6. Specification of Antenna Seat
The specification of IPEX wire end is as follow:
Figure 7. Specification of IPEX Wire

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4.4 Schematic Diagram
Figure 8. Schematic Diagram of RF-WM-10AFB1

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4.5 Download and Debug Interface
Figure 9. Download and Debug Interface of RF-WM-10AFB1
Regarding the download and debugging methods of the module, please cooperate with the RF-DK-871xB1 development
board provided by RF-star. For related information, please refer to the "RF-DK-871xB1 development board user manual".
4.6 Basic Operation of Hardware Design
1. It is recommended to offer the module with a DC stabilized power supply, a tiny power supply ripple coefficient and
the reliable ground. Please pay attention to the correct connection between the positive and negative poles of the
power supply. Otherwise, the reverse connection may cause permanent damage to the module;
2. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged
if the voltage exceeds the maximum value. Please ensure the stable power supply and no frequently fluctuated
voltage.
3. When designing the power supply circuit for the module, it is recommended to reserve more than 30% of the margin,
which is beneficial to the long-term stable operation of the whole machine. The module should be far away from the
power electromagnetic, transformer, high-frequency wiring and other parts with large electromagnetic interference.
4. The bottom of module should avoid high-frequency digital routing, high-frequency analog routing and power routing.
If it has to route the wire on the bottom of module, for example, it is assumed that the module is soldered to the Top
Layer, the copper must be spread on the connection part of the top layer and the module, and be close to the digital
part of module and routed in the Bottom Layer (all copper is well grounded).
5. Assuming that the module is soldered or placed in the Top Layer, it is also wrong to randomly route the Bottom Layer
or other layers, which will affect the spurs and receiving sensitivity of the module to some degrees;

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6. Assuming that there are devices with large electromagnetic interference around the module, which will greatly affect
the module performance. It is recommended to stay away from the module according to the strength of the
interference. If circumstances permit, appropriate isolation and shielding can be done.
7. Assuming that there are routings of large electromagnetic interference around the module (high-frequency digital,
high-frequency analog, power routings), which will also greatly affect the module performance. It is recommended
to stay away from the module according to the strength of the interference. If circumstances permit, appropriate
isolation and shielding can be done.
8. It is recommended to stay away from the devices whose TTL protocol is the same 2.4 GHz physical layer.
9. The antenna installation structure has a great influence on the module performance. It is necessary to ensure the
antenna is exposed and preferably vertically upward. When the module is installed inside of the case, a high-quality
antenna extension wire can be used to extend the antenna to the outside of the case.
10. The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly
weakened.
11. The recommendation of antenna layout.
The inverted-F antenna position on PCB is free space electromagnetic radiation. The location and layout of antenna
is a key factor to increase the data rate and transmission range.
Therefore, the layout of the module antenna location and routing is recommended as follows:
(1) Place the antenna on the edge (corner) of the PCB.
(2) Make sure that there is no signal line or copper foil in each layer below the antenna.
(3) It is the best to hollow out the antenna position in the following figure so as to ensure that S11 of the module
is minimally affected.
(4) The impedance of external IPEX interface is 50 Ω.
Figure 10. Recommendation of Antenna Layout
Note: The hollow-out position is based on the antenna used.

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4.7 Trouble Shooting
4.7.1 Unsatisfactory Transmission Distance
1. When there is a linear communication obstacle, the communication distance will be correspondingly weakened.
Temperature, humidity, and co-channel interference will lead to an increase in communication packet loss rate. The
performances of ground absorption and reflection of radio waves will be poor, when the module is tested close to
the ground.
2. Seawater has a strong ability to absorb radio waves, so the test results by seaside are poor.
3. The signal attenuation will be very obvious, if there is a metal near the antenna or the module is placed inside of the
metal shell.
4. The incorrect power register set or the high data rate in an open air may shorten the communication distance. The
higher the data rate, the closer the distance.
5. The low voltage of the power supply is lower than the recommended value at ambient temperature, and the lower
the voltage, the smaller the power is.
6. The unmatchable antennas and module or the poor quality of antenna will affect the communication distance.
4.7.2 Vulnerable Module
1. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged
if the voltage exceeds the maximum value. Please ensure the stable power supply and no frequently fluctuated
voltage.
2. Please ensure the anti-static installation and the electrostatic sensitivity of high-frequency devices.
3. Due to some humidity sensitive components, please ensure the suitable humidity during installation and application.
If there is no special demand, it is not recommended to use at too high or too low temperature.
4.7.3 High Bit Error Rate
1. There are co-channel signal interferences nearby. It is recommended to be away from the interference sources or
modify the frequency and channel to avoid interferences.
2. The unsatisfactory power supply may also cause garbled. It is necessary to ensure the power supply reliability.
3. If the extension wire or feeder wire is of poor quality or too long, the bit error rate will be high.
4.8 Electrostatics Discharge Warnings
The module will be damaged for the discharge of static. RF-star suggest that all modules should follow the 3 precautions
below:
1. According to the anti-static measures, bare hands are not allowed to touch modules.

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2. Modules must be placed in anti- static areas.
3. Take the anti-static circuitry (when inputting HV or VHF) into consideration in product design.
Static may result in the degradation in performance of module, even causing the failure.
4.9 Soldering and Reflow Condition
1. Heating method: Conventional Convection or IR/convection.
2. Solder paste composition: Sn96.5 / Ag3.0 / Cu0.5
3. Allowable reflow soldering times: 2 times based on the following reflow soldering profile.
4. Temperature profile: Reflow soldering shall be done according to the following temperature profile.
5. Peak temperature: 245 ℃.
Table 6. Temperature Table of Soldering and Reflow
Profile Feature
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Sn63 / Pb37
Sn96.5 / Ag3.0 /
Cu0.5
Min. Preheating Temperature (Tmin)
100 ℃
150 ℃
Max. Preheating Temperature (Tmax)
150 ℃
200 ℃
Preheating Time (Tmin to Tmax) (t1)
60 s ~ 120 s
60 s ~ 120 s
Average Ascend Rate (Tmax to Tp)
Max. 3 ℃/s
Max. 3 ℃/s
Liquid Temperature (TL)
183 ℃
217 ℃
Time above Liquidus (tL)
60 s ~ 90 s
30 s ~ 90 s
Peak Temperature (Tp)
220 ℃ ~ 235 ℃
230 ℃ ~ 250 ℃
Average Descend Rate (Tpto Tmax)
Max. 6 ℃/s
Max. 6 ℃/s
Time from 25 ℃ to Peak Temperature (t2)
Max. 6 minutes
Max. 8 minutes
Time of Soldering Zone (tP)
20±10 s
20±10 s