RF-Star RF-WM-3220B1 Series User manual

RF-WM-3220B1 Series
Low Power Wi-Fi Module
Version 1.0
Shenzhen RF-star Technology Co., Ltd.
Jan. 19th, 2020

RF-WM-3220B1
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Wi-Fi Module List
Chipset
Core
RAM
(KB)
Tx
Power
(dBm)
Model
FLASH
(Byte)
Antenna
Dimension
(mm)
Distance
(m)
Photo
CC3235S
M4
256
18
RF-WM-
3235A1S
4M
PCB
20.5 25.0
100
M4
256
18
RF-WM-
3235B1S
4M
Half-hole
20.5 17.5
100
CC3235SF
M4
256
18
RF-WM-
3235A1
4M +
1M embedded
PCB
20.5 25.0
100
M4
256
18
RF-WM-
3235B1
4M +
1M embedded
Half-hole
20.5 17.5
100
CC3200
M4
256
17
RF-WM-
3200B1
1M
Chip
20 31
100
RF-WM-
3200B1I
1M
IPEX
20 31
150
Conta
ct Me
RF-WM-
3200B2
16M
Chip
20 31
100
RF-WM-
3200B3
1M
Half-hole
20.5 17.5
100
CC3220
M4
256
17
RF-WM-
3220B1
4M
Chip /
IPEX
20 31
100
RTL8710AF
M3
512
17
RF-WM-
10AFB1
1M
IPEX
20 23
100
RTL8711AF
M3
512
17
RF-WM-
11AFB1
1M
IPEX
20 23
100
Note:
1. The communication distance is the longest distance obtained by testing the module's maximum transmission power
in an open and interference-free environment in sunny weather.
2. Click the picture to buy modules.
3. All modules with PCB / Chip antenna and IPEX connector are dispatched with PCB / Chip antenna only by default. If
IPEX connector is needed, pls check with me before quotation.

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1 Device Overview
1.1 Module Series
Start your internet-of-things (IoT) design with a Wi-Fi CERTIFIED™ Wireless module. The SimpleLink™ Wi-Fi®
RF-WM-3220B1 series is a system-on-chip (SoC) solution, that integrates two processors of an application processor
ARM®Cortex®-M4 MCU and a network processor MCU with all Wi-Fi®and internet logical layers. RF-WM-3220B1
series modules are compatible with each other.
Table 1. Function Difference of RF-WM-3220B1 Series Module
Model
Chipset
Functions of Chipset
RF-WM-3220RB1
CC3220R
256 KB of RAM, IoT networking security and device identity/keys.
RF-WM-3220SB1
CC3220S
Builds on the CC3220R and with enhanced application level security, secure boot.
RF-WM-3220B1
CC3220SF
Builds on the CC3220R and with enhanced application level security, secure boot,
1 MB of executable flash.
1.2 Description
RF-WM-3220B1 series is a low power Wi-Fi SoC module which is based on TI SimpleLinkTM Wi-Fi®SoC CC3220S /
CC3220R / CC3220SF, which has a built-in ARM CortexTM-M4 core processor with a user-dedicated 256 KB of RAM
and an optional 1 MB of serial flash, a network processor MCU runs all Wi-Fi®and internet logical layers, and a variety
of peripherals including parallel camera interface, I2S, SD/MMC, UART, SPI, I2C, ADC and GPIOs. The ROM-based
subsystem of RF-WM-3220B1 includes an IEEE 802.11 b/g/n radio, baseband, and MAC with a powerful crypto engine.
The module supports station, access point with support of four stations, and Wi-Fi Direct™ modes. The device also
supports WPA2 personal and enterprise security and WPS 2.0. The Wi-Fi Internet-on-a-chip includes embedded IPv4
and IPv6 TCP/IP protocols. The power-management subsystem includes integrated DC-DC converters supporting a
wide range of supply voltages. This subsystem enables low-power consumption modes, such as the hibernate with
RTC mode requiring less than 4.5 μA of current. The module design provides 3 options for antenna integration,
including surface mounted chip antenna, an IPEX interface for connecting an external antenna, and a RF pad for
soldering onto the base board and routing to an on-board antenna. RF-WM-3220B1 series is pin-2-pin compatible with
RF-WM-3200B1.
1.3 Key Features
•Dual-core architecture
- User-dedicated application MCU subsystem
- Highly-integrated Wi-Fi network processor
•Rich set of IoT networking security
- Enhanced IoT networking security
- Asymmetric keys and unique device identity

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- Software IP protection and Secure storage
•Advance low-power modes for battery
powered applications
•Built-in power management subsystem
•Chip-level Wi-Fi CERTIFIEDTM Chip
•Application microcontroller subsystem:
- ARM®Cortex® -M4 core at 80 MHz
- Embedded memory
➢256 KB RAM
➢Optional 1 MB of executable flash
➢External serial flash
- Peripherals
➢McASP supports two I2S channels
➢SD, SPI, I2C, UART
➢8-bit synchronous imager interface
➢4 general-purpose timers with 16-bit PWM
mode
➢1 watchdog timer
➢4-channel 12-bit ADCs
➢Up to 27 individually programmable,
multiplexed GPIO pins
➢Debug interfaces: JTAG, cJTAG, SWD
•Wi-Fi network processor subsystem
- Wi-Fi modes:
➢802.11b/g/n station
➢802.11b/g access point (AP) supports up
to four stations
➢Wi-Fi direct®client and group owner
- WPA2 personal and enterprise security: WEP,
WPATM / WPA2TM PSK, WPA2 enterprise
(802.1x)
- IPv4 and IPv6 TCP / IP stack
- Industry-standard BSD socket application
programming interfaces (APIs)
➢16 simultaneous TCP or UDP sockets
➢6 simultaneous TLS or SSL sockets
- IP addressing: static IP, LLA, DHCPv4,
DHCPv6 with duplicate address detection
(DAD)
- SimpleLink connection manager for
autonomous and fast Wi-Fi connections
- Flexible Wi-Fi provisioning with
SmartConfigTM technology, AP mode, and
WPS2 options
- RESTful API support using the internet HTTP
server
•Wide set of security features
- Hardware features
➢Separate execution environments
➢Device identity
➢Hardware crypto engine for advanced fast
security, including: AES, DES, 3DES,
SHA2, MD5, CRC, and Checksum
➢Initial secure programming:
- Debug security
- JTAG and Debug ports are locked
➢Personal and enterprise Wi-Fi security
➢Secure sockets (SSLv3, TLS1.0, TSL1.1,
TLS1.2)
➢HTTPS server
➢Trusted root-certificate catalog
➢TI root-of-trust public key
- Networking security
➢Personal and enterprise Wi-Fi security
➢Secure sockets (SSLv3, TLS1.0, TSL1.1,
TLS1.2)
➢HTTPS server
➢Trusted root-certificate catalog
➢TI root-of-trust public key
- Software IP protection
➢Security key storage
➢File system security

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➢Software tamper detection
➢Cloning protection
➢Secure boot: validate the integrity and
authenticity of the runtime binary during
boot
- Embedded network applications running on
the dedicated network processor
➢HTTP / HTTPS web server with dynamic
user callbacks
➢mDNS, DNS-SD, DHCP server
➢Ping
- Recovery mechanism –can recover to
factory defaults or to a complete factory
image
- Wi-Fi TX power
➢18.0 dBm @ 1 DSSS
➢14.5 dBm @ 54 OFDM
- Wi-Fi RX sensitivity
➢-96 dBm @ 1 DSSS
➢-74.5 dBm @ 54 OFDM
- Application throughput
➢UDP: 16 Mbps
➢TCP: 13 Mbps
➢Peak: 72 Mbps
•Power-Management Subsystem:
- Integrated DC/DC converters support a wide
range of supply voltage:
➢VBAT wide-voltage supply: 2.7 V ~ 3.6 V
➢VIO is always tied with VBAT
➢Preregulated 1.85 V mode
- Advanced low-power modes:
➢Shutdown: 1 µA
➢Hibernate: 4.5 µA
➢Low-power deep sleep (LPDS): 135 µA
(measured on CC3220R, CC3220S, and
CC3220SF with 256KB RAM retention)
➢RX traffic (MCU active): 59 mA @ 54
OFDM (measured on CC3220R and
CC3220S; CC3220SF consumes an
additional 10 mA)
➢TX traffic (MCU active): 223 mA @ 54
OFDM, maximum power (measured on
CC3220R and CC3220S; CC3220SF
consumes an additional 15 mA)
➢Idle connected (MCU in LPDS): 710 µA @
DTIM = 1 (measured on CC3220R and
CC3220S with 256 KB RAM retention)
1.4 Applications
•HVAC systems & thermostat
•Video surveillance
•Video doorbells
•Low-power camera
•Building security systems
•E-locks
•Access tracking
•Factory automation
•Medical and health care
•Industrial control

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1.5 Functional Block Diagram
Figure 1. Functional Block Diagram of RF-WM-3220B1 Series
1.6 Part Number Conventions
The part numbers are of the form of RF-WM-3220B1 series where the fields are defined as follows:
Figure 2. Part Number Conventions of RF-WM-3220B1 Series
RF
WM
3220
RF-STAR
Company Name
Wi-Fi Module
Wireless Type
TI CC3220
Chipset
-
-
(R/S) B1
Module Version
Version Number
CC3220
GPIO
I2C
I2S
SPI
PWMADC
Camera Port
40.0 MHz
32.768 kHz
Reset
Chip
Antenna
Band Pass Filter
& ANT Matching
External Antenna
Interface
BMS
-
+
Antenna
Switch

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Table of Contents
Wi-Fi Module List................................................................................................................................................................ 1
1 Device Overview............................................................................................................................................................. 2
1.1 Module Series..................................................................................................................................................... 2
1.2 Description............................................................................................................................................................ 2
1.3 Key Features....................................................................................................................................................... 2
1.4 Applications.......................................................................................................................................................... 4
1.5 Functional Block Diagram.............................................................................................................................. 5
1.6 Part Number Conventions.............................................................................................................................. 5
Table of Contents................................................................................................................................................................ 6
Table of Figures................................................................................................................................................................... 7
Table of Tables..................................................................................................................................................................... 8
2 Module Configuration and Functions...................................................................................................................... 9
2.1 Module Parameters........................................................................................................................................... 9
2.2 Module Pin Diagram.......................................................................................................................................10
2.3 Pin Functions.....................................................................................................................................................10
3 Specifications.................................................................................................................................................................16
3.1 Absolute Maximum Ratings.........................................................................................................................16
3.2 Recommended Operating Conditions .....................................................................................................16
3.3 RF Parameters.................................................................................................................................................17
3.3.1 Current Consumption of RF-WM-3220RB1 / 3220SB1.......................................................17
3.3.2 Current Consumption of RF-WM-3220B1.................................................................................18
3.3.3 RF Configuration.................................................................................................................................22
3.3.4 Transmission Distance Test............................................................................................................22
3.4 WLAN Characteristics....................................................................................................................................22
3.4.1 WLAN Receiver Characteristics....................................................................................................22
3.4.2 WLAN Transmitter Characteristics...............................................................................................23
4 Application, Implementation, and Layout.............................................................................................................24
4.1 Module Photos..................................................................................................................................................24
4.2 Recommended PCB Footprint....................................................................................................................24
4.3 Antenna................................................................................................................................................................25

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4.4 Module Operation............................................................................................................................................26
4.4.1 SOP Configuration..............................................................................................................................26
4.4.2 Module Operation...............................................................................................................................26
4.4.2.1 Pin Application Sample........................................................................................................26
4.5 Basic Operation of Hardware Design ......................................................................................................29
4.6 Trouble Shooting..............................................................................................................................................31
4.6.1 Unsatisfactory Transmission Distance........................................................................................31
4.6.2 Vulnerable Module..............................................................................................................................31
4.6.3 High Bit Error Rate.............................................................................................................................32
4.7 Electrostatics Discharge Warnings...........................................................................................................32
4.8 Soldering and Reflow Condition.................................................................................................................32
4.9 Optional Packaging.........................................................................................................................................33
5 Certification.....................................................................................................................................................................34
5.1 RoHS....................................................................................................................................................................34
5.2 FCC.......................................................................................................................................................................34
6 Revision History............................................................................................................................................................35
7 Contact Us.......................................................................................................................................................................36
Table of Figures
Figure 1. Functional Block Diagram of RF-WM-3220B1 Series.............................................................. 5
Figure 2. Part Number Conventions of RF-WM-3220B1 Series............................................................. 5
Figure 3. Pin Diagram of RF-WM-3220B1 Series......................................................................................10
Figure 4. TX Power and IBAT vs TX Power Level Settings (1 DSSS)................................................21
Figure 5. TX Power and IBAT vs TX Power Level Settings (6 OFDM)...............................................21
Figure 6. TX Power and IBAT vs TX Power Level Settings (54 OFDM)............................................22
Figure 7. The Photos of RF-WM-3220B1......................................................................................................24
Figure 8. Recommended PCB Footprint of RF-WM-3220B1 (mm).....................................................24
Figure 9. Optional Antenna..................................................................................................................................25
Figure 10. Reference Schematic Diagram of RF-WM-3220B1.............................................................26

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Figure 11. Pin Application Example of RF-WM-3220B1...........................................................................27
Figure 12. Recommendation of Antenna Layout.........................................................................................31
Figure 13. Recommended Reflow for Lead Free Solder.........................................................................33
Figure 14. Optional Packaging Mode..............................................................................................................33
Figure 15. RoHS Certificate................................................................................................................................34
Figure 16. FCC Certificate...................................................................................................................................34
Table of Tables
Table 1. Function Difference of RF-WM-3220B1 Series Module............................................................ 2
Table 2. Parameters of RF-WM-3220B1.......................................................................................................... 9
Table 3. Pin Functions of RF-WM-3220B1 Series......................................................................................10
Table 4. Absolute Maximum Ratings................................................................................................................16
Table 5. Recommended Operating Conditions of RF-WM-3220B1 Series.......................................16
Table 6. Table of Current Consumption of RF-WM-3220RB1 / 3220SB1.........................................17
Table 7. Table of Current Consumption of RF-WM-3220B1...................................................................18
Table 8. WLAN Receiver Characteristics.......................................................................................................22
Table 9. WLAN Transmitter Characteristics..................................................................................................23
Table 10. Optional Antenna Configuration.....................................................................................................25
Table 11. Temperature Table of Soldering and Reflow .............................................................................32

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2 Module Configuration and Functions
2.1 Module Parameters
Table 2. Parameters of RF-WM-3220B1
Chipset
CC3220SF
Supply Power Voltage
2.7 V ~ 3.6 V, 3.3 V is recommended
Frequency
2.4 GHz
Working Mode
802.11 b/g/n station, 802.11 b/g/n access point with support of 4 stations, Wi-Fi
Direct®Client and Group Owner
Transmit Power
+18.0 dBm @ 1 DSSS
+14.5 dBm @ 54 OFDM
Receiving Sensitivity
-95.7 dBm @ 1 DSSS
-74.0 dBm @ 54 OFDM
GPIO
29
Power Consumption
Shutdown: 1 µA
Hibernate: 4.5 µA
Low-power deep sleep (LPDS): 135 µA
Idle connected (MCU in LPDS): 710 µA @ DTIM = 1
RX traffic (MCU active): 59 mA @ 54 OFDM
TX traffic (MCU active): 223 mA @ 54 OFDM, maximum power
Crystal
40 MHz, 32.768 kHz
Package
SMT packaging, half-hole packaging
Communication Interface
UART, I2S, I2C, SPI, SD/MMC, ADC, DMA, PWM, McASP, Camera interface
Dimension
31.0 mm ×20.0 mm
Operating Temperature
-30 ℃～+85 ℃
Storage Temperature
-55 ℃～+125 ℃

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2.2 Module Pin Diagram
Figure 3. Pin Diagram of RF-WM-3220B1 Series
2.3 Pin Functions
Table 3. Pin Functions of RF-WM-3220B1 Series
Pin
Chip Pin
Name
Function
1
GND
Ground
2
RF_OUT
RF output interface
3
50
GPIO00
GPIO0
UART0_CTS
McAXR1
GT_CCP00
GSPI_CS
UART1_RTS
UART0_RTS

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McAXR0
4
53
GPIO30
GPIO30
UART0_TX
McACLK
McAFSX
GT_CCP05
GSPI_MISO
5
55
GPIO01
GPIO1
UART0_TX
pCLK Pixel (PIXCLK)
UART1_TX
GT_CCP01
6
57
GPIO02
ADC_CH0
GPIO2
UART0_RX
UART1_RX
GT_CCP02
7
58
GPIO03
ADC_CH1
GPIO3
UART1_TX
pDATA7(CAM_D3)
8
59
GPIO04
ADC_CH2
GPIO4
UART1_RX
pDATA6 (CAM_D2)
9
60
GPIO05
ADC_CH3
GPIO5
pDATA5 (CAM_D1)

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McAXR1
GT_CCP05
10
61
GPIO06
GPIO6
UART0_RTS
pDATA4 (CAM_D0)
UART1_CTS
UART0_CTS
GT_CCP06
11
62
GPIO07
GPIO7
McACLKX
UART1_RTS
UART0_RTS
UART0_TX
12
63
GPIO08
GPIO8
SDCARD_IRQ
McAFSX
GT_CCP06
13
64
GPIO09
GPIO9
GT_PWM05
SDCARD_DATA0
McAXR0
GT_CCP00
14
1
GPIO10
GPIO10
I2C_SCL
GT_PWM06
UART1_TX
SDCARD_CLK
GT_CCP01

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15
2
GPIO11
GPIO11
I2C_SDA
GT_PWM07
pXCLK(XVCLK)
SDCARD_CMD
UART1_RX
GT_CCP02
McAFSX
16
3
GPIO12
GPIO12
McACLK
pVS (VSYNC)
I2C_SCL
UART0_TX
GT_CCP03
17
4
GPIO13
GPIO13
I2C_SDA
pHS (HSYNC)
UART0_RX
GT_CCP04
18
5
GPIO14
GPIO14
I2C_SCL
GSPI_CLK
pDATA8 (CAM_D4)
GT_CCP05
19
6
GPIO15
GPIO15
I2C_SDA
GSPI_MISO
pDATA9(CAM_D5)

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GT_CCP06
SDCARD_DATA0
20
7
GPIO16
GPIO16
GSPI_MOSI
pDATA10 (CAM_D6)
UART1_TX
GT_CCP07
SDCARD_CLK
21
8
GPIO17
GPIO17
UART1_RX
GSPI_CS
pDATA11 (CAM_D7)
SDCARD_CMD
22
15
GPIO22
GPIO22
McAFSX
GT_CCP04
23
16
JTAG TDI
TDI
GPIO23
UART1_TX
I2C_SCL
24
17
JTAG TDO
TDO
GPIO24
PWM0
UART1_RX
I2C_SDA
GT_CCP06
McAFSX
25
18
GPIO28
GPIO28

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26
19
JTAG TCK
TCK
GT_PWM03
27
20
JTAG TMS
TMS
GPIO29
28
29
ANTSEL1
I/O
29
30
ANTSEL2
I/O
30
32
RESET
Module reset pin, internal pull-up by default, active low
31
45
DCDC_ANA2
GPIO31
UART0_RX
McAFSX
UART1_RX
McAXR0
GSPI_CLK
DCDC_ANA2_SW_P
32
35
SOP0
SOP0
33
34
SOP1
SOP1
34
21
SOP2
GPIO25
GT_PWM02
McAFSX
TCXO_EN
SOP2
35
VCC
Power supply, 2.3 V ~ 3.6 V
36
GND
Ground

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3 Specifications
3.1 Absolute Maximum Ratings
All measurements are referenced at the device pins, unless otherwise indicated. All specifications are over process and
voltage, unless otherwise indicated.
Table 4. Absolute Maximum Ratings
Parameters
Condition
Min.
Typ.
Max.
Unit
Supply Voltage
VBAT and VIO （Chip pin: 37, 39, 44）
2.7
3.3
3.6
V
VIO ~ VBAT (differential) （Chip pin:
10, 54）
0.0
V
Digital Inputs
/
-0.5
VIO + 0.5
V
RF Pins
/
-0.5
2.1
V
Analog Pins (XTAL)
/
-0.5
2.1
V
Operating Temperature
/
-30
+25
+85
℃
Storage Temperature
/
-55
+25
+125
℃
3.2 Recommended Operating Conditions
Over operating free-air temperature range (unless otherwise noted) (1) (2)
Table 5. Recommended Operating Conditions of RF-WM-3220B1 Series
Items
Condition (3) (4)
Min.
Typ.
Max.
Unit
VBAT, VIO (shorted to VBAT) (Chip
Pin: 10, 37, 39, 44, 54)
Direct battery connection
2.1
3.3
3.6
V
Ambient Thermal Slew
/
-20
/
20
℃
Human Body Model
HBM
±2000
V
Moisture Sensitivity Level
2
Charged Device Model
±500
V
Notes：
(1) When operating at an ambient temperature of over 75 °C, the transmit duty cycle must remain below 50% to avoid
the auto-protect feature of the power amplifier. If the auto-protect feature triggers, the device takes a maximum of 60
seconds to restart the transmission.
(2) To ensure WLAN performance, ripple on the 2.7 V to 3.3 V supply must be less than ±300 mV.

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3.3 RF Parameters
3.3.1 Current Consumption of RF-WM-3220RB1 / 3220SB1
Table 6. Table of Current Consumption of RF-WM-3220RB1 / 3220SB1
When measured on the RF-WM-3220B1 reference design with TA= 25 ℃, VBAT= 3.6 V with DC/DC enabled unless
otherwise noted.
Parameter
Test Conditions(1) (2)
Min.
Typ.
Max.
Unit
MCU ACTIVE
NWP
Active
TX
1 DSSS
TX power level = 0
272
mA
TX power level = 4
190
mA
6 OFDM
TX power level = 0
248
mA
TX power level = 4
182
mA
54 OFDM
TX power level = 0
223
mA
TX power level = 4
160
mA
RX
1 DSSS
59
mA
54 OFDM
59
mA
NWP idle connected (3)
15.3
mA
MCU SLEEP
NWP
Active
TX
1 DSSS
TX power level = 0
269
mA
TX power level = 4
187
mA
6 OFDM
TX power level = 0
245
mA
TX power level = 4
179
mA
54 OFDM
TX power level = 0
220
mA
TX power level = 4
157
mA
RX
1 DSSS
56
mA
54 OFDM
56
mA
NWP idle connected (3)
12.2
mA
MCU LPDS
NWP
Active
TX
1 DSSS
TX power level = 0
266
mA
TX power level = 4
184
mA
6 OFDM
TX power level = 0
242
mA

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TX power level = 4
176
mA
54 OFDM
TX power level = 0
217
mA
TX power level = 4
154
mA
RX
1 DSSS
53
mA
54 OFDM
53
mA
NWP LPDX (4)
0.25
mA
NWP idle connected (3)
0.825
mA
MCU Shutdown
MCU shutdown
1
µA
MCU Hibernate
MCU hibernate
4.5
µA
Peak Calibration Current (5)
VBAT = 3.6 V
420
mA
VBAT = 3.3 V
450
mA
Notes：
(1) TX power level = 0 implies maximum power. TX power level = 4 implies output power backed off approximately 4
dB.
(2) The CC3220x system is a constant power-source system. The active current numbers scale based on the VBAT
voltage supplied.
(3) DTIM = 1
(4) LPDS current does not include the external serial flash. The LPDS number reported is with retention of 64 KB MCU
SRAM. The CC3220 device can be configured to retain 0 KB, 64 KB, 128 KB, 19 2KB or 256 KB SRAM in LPDS. Each
64 KB retained increases LPDS current by 4 μA.
(5) The complete calibration can take up to 17 mJ of energy from the battery over a time of 24 ms. Calibration is
performed sparingly, typically when coming out of Hibernate and only if temperature has changed by more than 20°C or
the time elapsed from prior calibration is greater than 24 hours.
3.3.2 Current Consumption of RF-WM-3220B1
Table 7. Table of Current Consumption of RF-WM-3220B1
When measured on the RF-WM-3220B1 reference design with TA= 25 ℃, VBAT= 3.6 V with DC/DC enabled unless
otherwise noted.
Parameter
Test Conditions(1) (2)
Min.
Typ.
Max.
Unit
MCU ACTIVE
NWP
TX
1 DSSS
TX power level = 0
286
mA

RF-WM-3220B1
www.szrfstar.com V1.0 - Jan., 2020
Shenzhen RF-star Technology Co., Ltd. Page 19 of 37
Active
TX power level = 4
202
mA
6 OFDM
TX power level = 0
255
mA
TX power level = 4
192
mA
54 OFDM
TX power level = 0
232
mA
TX power level = 4
174
mA
RX
1 DSSS
74
mA
54 OFDM
74
mA
NWP idle connected (3)
25.2
mA
MCU SLEEP
NWP
Active
TX
1 DSSS
TX power level = 0
282
mA
TX power level = 4
198
mA
6 OFDM
TX power level = 0
251
mA
TX power level = 4
188
mA
54 OFDM
TX power level = 0
228
mA
TX power level = 4
170
mA
RX
1 DSSS
70
mA
54 OFDM
70
mA
NWP idle connected (3)
21.2
mA
MCU LPDS
NWP
Active
TX
1 DSSS
TX power level = 0
266
mA
TX power level = 4
184
mA
6 OFDM
TX power level = 0
242
mA
TX power level = 4
176
mA
54 OFDM
TX power level = 0
217
mA
TX power level = 4
154
mA
RX
1 DSSS
53
mA
54 OFDM
53
mA
NWP LPDX (4)
120 µA at 64 KB
135
µA