Samsung HT-D4500 User manual

HomeEntertainment
System
ModelNameHT-D4500
ModelCodeHT-D4500/EN
SERVICEMANUAL
HomeEntertainmentSystem
HT-D4500
Contents
1.Precaution
2.ProductSpecication
3.Disassembly&Reassembly
4.Troubleshooting
5.PCBDiagram
6.SchematicDiagram
RefertotheservicemanualintheGSPN(seetherearcover)formoreinformation.

Contents
Contents
1.Precaution........................................................................................................................................1−1
1.1.SafetyPrecautions...................................................................................................................1−1
1.2.ServicingPrecautions...............................................................................................................1−3
1.3.PrecautionsforElectrostaticallySensitiveDevices(ESDs)..............................................................1−4
2.ProductSpecication.........................................................................................................................2−1
2.1.ProductFeature.......................................................................................................................2−1
2.2.Specications..........................................................................................................................2−2
2.2.1.HT-D45**Specications..............................................................................................2−2
2.2.2.HT-D4200Specications..............................................................................................2−4
2.3.SpecicationsAnalysis.............................................................................................................2−6
2.4.Accessories............................................................................................................................2−7
2.4.1.SuppliedAccessories...................................................................................................2−7
3.Disassembly&Reassembly................................................................................................................3−1
3.1.OverallDisassembly&Reassembly............................................................................................3−1
4.Troubleshooting................................................................................................................................4−1
4.1.CheckpointsbyErrorMode.......................................................................................................4−1
4.1.1.NoPower...................................................................................................................4−2
4.1.2.NoSound...................................................................................................................4−4
4.1.3.DiscLoadingError......................................................................................................4−5
4.1.4.Remotedoesn’twork...................................................................................................4−6
4.1.5.NoLogo(HDMI)-LabelA...........................................................................................4−8
4.1.6.NoLogo(Component)-LabelB....................................................................................4−11
4.1.7.NoLogo(Composite)...................................................................................................4−14
4.1.8.Discskipsorfreezing...................................................................................................4−17
4.1.9.NoDiscReadingError.................................................................................................4−18
4.1.10.NetworkError.............................................................................................................4−19
4.2.Initialization&UpgradeMethods...............................................................................................4−20
4.2.1.HowtocheckF/Wversion............................................................................................4−20
4.2.2.Howtoupdatermware................................................................................................4−21
4.2.3.ColdStartMethod(InitializeSetup)................................................................................4−23
4.3.Buyer-RegionCodeSettingMethod............................................................................................4−24
4.3.1.InsertingtheRegionCodeafterreplacingtheMainPCB.....................................................4−24
4.4.Adjustment.............................................................................................................................4−28
5.PCBDiagram...................................................................................................................................5−1
5.1.WiringDiagram.......................................................................................................................5−1
5.2.FRONTPCBTop....................................................................................................................5−2
5.2.1.PinConnection...........................................................................................................5−3
5.2.2.TestPointWaveForm..................................................................................................5−4
iCopyright©1995-2011SAMSUNG.Allrightsreserved.

Contents
5.3.FRONTPCBBottom...............................................................................................................5−5
5.4.MAINPCBTop......................................................................................................................5−6
5.4.1.PinConnection...........................................................................................................5−7
5.4.2.TestPointWaveForm..................................................................................................5−8
5.5.MAINPCBBottom..................................................................................................................5−9
5.5.1.TestPointWaveForm..................................................................................................5−10
5.6.SMPSPCBTop.......................................................................................................................5−11
5.6.1.PinConnection...........................................................................................................5−12
5.7.SMPSPCBBottom..................................................................................................................5−13
6.SchematicDiagram...........................................................................................................................6−1
6.1.OverallBlockDiagram.............................................................................................................6−1
6.2.FRONT.................................................................................................................................6−2
6.2.1.TestPointWaveForm..................................................................................................6−3
6.3.AMPPWM............................................................................................................................6−4
6.4.TIAMP.................................................................................................................................6−5
6.5.DC-DCPOWER......................................................................................................................6−6
6.6.AUDIO/VIDEO/IPODOUTCEC...............................................................................................6−7
6.6.1.TestPointWaveForm..................................................................................................6−8
6.7.USBETHERNET....................................................................................................................6−9
6.8.IPOD.....................................................................................................................................6−10
6.9.FRONTMICOM.....................................................................................................................6−11
6.10.DIR/ADC/RXSWITCHING/D.IN..............................................................................................6−12
6.11.HDMIMICOM.......................................................................................................................6−13
6.11.1.TestPointWaveForm..................................................................................................6−14
6.12.DDR3INTERFACE.................................................................................................................6−15
6.13.INTERFACE/SATABLOCK.....................................................................................................6−16
6.14.FLASHMEMORY/EMMCMOVINAND....................................................................................6−17
6.15.FIRENCEPOWERJTAGDEBUG.............................................................................................6−18
6.16.FRONT-ENDBLOCK..............................................................................................................6−19
6.17.FIRENDRAPTOR..................................................................................................................6−20
6.18.SMPS....................................................................................................................................6−21
Copyright©1995-2011SAMSUNG.Allrightsreserved.ii

1.Precaution
1.Precaution
FollowthesesafetyinstructionswhileservicingtheESDtopreventdamageandtoprotectagainstpotentialhazards
suchaselectricalshockandX-rays.
1.1.SafetyPrecautions
1)Whenreinstallingthechassisanditsassemblies,besuretorestorealloftheprotectivedevices,includingthecontrol
knobsandthecompartmentcovers.
2)Makesurethattherearenocabinetopeningsthroughwhichpeople(particularlychildren)canmakecontactwith
dangerousinternalcomponents.
3)DesignAlterationWarning:
Neveralteroraddtothemechanicalorelectricaldesignoftheunit.
Example:Donotaddauxiliaryaudioorvideoconnectors.Suchalterationsmightcreateasafetyhazard.
Also,anydesignchangesoradditionswillvoidthemanufacturer’swarranty.
4)LeakageCurrentHotCheckFigure1.1ACLeakageTest:
WARNING
Donotuseanisolationtransformerduringthistest.Usealeakage-currenttesterorameteringsystemthatcomplies
withAmericanNationalStandardsInstitute(ANSIC101.1,LeakageCurrentforAppliances),andUnderwriters
Laboratories(ULPublicationUL1410,59.7).
Withtheunitcompletelyreassembled,plugtheACcorddirectlyintoa120VACoutlet.Withtheunit’spowerswitched
fromtheONtotheOFFposition,measurethecurrentbetweenaknowngroundandallexposedmetalparts.
KnownGrounds-Earth
KnownMetalparts-screwheads,metalcabinets,etc.
DEVICE
UNDER
TES T
LEAKAGE
CURRENT
TES TE R
TES T ALL
EXPO S ED METAL
SU RFACES
2-WIRE CORD
ALSO TES T WITH
PLUG REVERSED
(US ING AC
ADAPTER P LUG
AS R EQ UIRED)
EARTH
GROUND
(READING
SH OULD NOT BE
ABOVE 0.5mA)
Figure1.1ACLeakageTest
1-1Copyright©1995-2011SAMSUNG.Allrightsreserved.

1.Precaution
5)InsulationResistanceColdCheck:
(1)Withtheunit’sACplugdisconnectedfromtheACsource,connectanelectricaljumperacrossthetwoACprongs.
(2)SetthepowerswitchtoON.(3)MeasuretheresistancebetweentheshortedACplugandanyexposedmetallicparts.
Example:screwheads,metalcabinets,antennaport,etc.Ifanyoftheexposedmetallicpartshasareturnpathtothe
chassis,themeasuredresistanceshouldbebetween1and5.2megohms.Ifthereisnoreturnpath,themeasured
resistanceshouldbe“innite.”Iftheresistanceisoutsidetheselimits,ashockhazardmightexist.SeeFigure1.2
InsulationResistanceTest
Ante nna
Term inal
ohm
Expo sed
Meta l P art
Ohmmet er
Figure1.2InsulationResistanceTest
6)Components,partsandwiringthatappeartohaveoverheatedorthatareotherwisedamagedshouldbereplacedwith
partsthatmeettheoriginalspecications.Alwaysdeterminethecauseofdamageoroverheating,andcorrectany
potentialhazards.
7)Observetheoriginalleaddress,especiallynearthefollowingareas:Antennawiring,sharpedges,andespeciallytheAC
andhighvoltagepowersupplies.Alwaysinspectforpinched,out-of-place,orfrayedwiring.
Donotchangethespacingbetweencomponentsandtheprintedcircuitboard.ChecktheACpowercordfordamage.
Makesurethatnowiresorcomponentstouchthermallyhotparts.
8)ProductSafetyNotice:
Someelectricalandmechanicalpartshavespecialsafety-relatedcharacteristicswhichmightnotbeobviousfromvisual
inspection.Thesesafetyfeaturesandtheprotectiontheygivemightbelostifthereplacementcomponentdiffersfrom
theoriginal—evenifthereplacementisratedforhighervoltage,wattage,etc.
9)Componentsthatarecriticalforsafetyareindicatedinthecircuitdiagrambyshading,or.Usereplacement
componentsthathavethesameratings,especiallyforameresistanceanddielectricstrengthspecications.A
replacementpartthatdoesnothavethesamesafetycharacteristicsastheoriginalmightcreateshock,reorother
hazards.
Copyright©1995-2011SAMSUNG.Allrightsreserved.1-2

1.Precaution
1.2.ServicingPrecautions
1)Servicingprecautionsareprintedonthecabinet.Followthem.
2)Alwaysunplugtheunit’sACpowercordfromtheACpowersourcebeforeattemptingto:(a)Removeorreinstallany
componentorassembly,(b)Disconnectanelectricalplugorconnector,(c)Connectatestcomponentinparallelwith
anelectrolyticcapacitor.
3)Somecomponentsareraisedabovetheprintedcircuitboardforsafety.Aninsulationtubeortapeissometimesused.
Theinternalwiringmaybeclampedtopreventcontactwiththermallyhotcomponents.Reinstallallsuchelements
totheiroriginalposition.
4)Afterservicing,alwayscheckthatthescrews,componentsandwiringhavebeencorrectlyreinstalled.
Makesurethattheportionaroundtheservicedparthasnotbeendamaged.
5)ChecktheinsulationbetweenthebladesoftheACplugandaccessibleconductiveparts(examples:metalpanels,
inputterminalsandearphonejacks).
6)InsulationCheckingProcedure:DisconnectthepowercordfromtheACsource.Connectaninsulationresistance
meter(500V)tothebladesoftheACplug.
TheinsulationresistancebetweeneachbladeoftheACplugandaccessibleconductiveparts(seeabove)shouldbe
greaterthan1megohm.
7)NeverdefeatanyoftheB+voltageinterlocks.DonotapplyACpowertotheunit(oranyofitsassemblies)unlessall
solid-stateheatsinksarecorrectlyinstalled.
8)Alwaysconnectatestinstrument’sgroundleadtotheinstrumentchassisgroundbeforeconnectingthepositivelead;
alwaysremovetheinstrument’sgroundleadlast.
CAUTION
Firstreadthe“SafetyPrecautions”sectionofthismanual.Ifsomeunforeseencircumstancecreatesaconictbetweenthe
servicingandsafetyprecautions,alwaysfollowthesafetyprecautions.
1-3Copyright©1995-2011SAMSUNG.Allrightsreserved.

1.Precaution
1.3.PrecautionsforElectrostaticallySensitiveDevices(ESDs)
Somesemiconductor(“solidstate”)devicesareeasilydamagedbystaticelectricity.
SuchcomponentsarecalledElectrostaticallySensitiveDevices(ESDs).
Examplesincludeintegratedcircuitsandsomeeld-effecttransistors.Thefollowingtechniqueswillreducetheoccurrence
ofcomponentdamagecausedbystaticelectricity:
1)Immediatelybeforehandlinganysemiconductorcomponentsorassemblies,draintheelectrostaticchargefromyour
bodybytouchingaknownearthground.Alternatively,wearadischargingwrist-strapdevice.(Besuretoremoveit
priortoapplyingpower–thisisanelectricshockprecaution.)
2)AfterremovinganESD-equippedassembly,placeitonaconductivesurfacesuchasaluminumfoiltoprevent
accumulationofelectrostaticcharge.
3)Donotusefreon-propelledchemicals.ThesecangenerateelectricalchargesthatdamageESDs.
4)Useonlyagrounded-tipsolderingironwhensolderingorunsolderingESDs.
5)Useonlyananti-staticsolderremovaldevice.Manysolderremovaldevicesarenotratedas“anti-static”(thesecan
accumulatesufcientelectricalchargetodamageESDs).
6)DonotremoveareplacementESDfromitsprotectivepackageuntilyouarereadytoinstallit.
MostreplacementESDsarepackagedwithleadsthatareelectricallyshortedtogetherbyconductivefoam,aluminum
foilorotherconductivematerials.
7)ImmediatelybeforeremovingtheprotectivematerialfromtheleadsofareplacementESD,touchtheprotectivematerial
tothechassisorcircuitassemblyintowhichthedevicewillbeinstalled.
8)MinimizebodymotionswhenhandlingunpackagedreplacementESDs.Motionssuchasbrushingclothestogether,or
liftingafootfromacarpetedoorcangenerateenoughstaticelectricitytodamageanESD.
Copyright©1995-2011SAMSUNG.Allrightsreserved.1-4

2.ProductSpecication
2.ProductSpecication
2.1.ProductFeature
■NewFeaturefor2011BDHTS
•General
•2D
•FastBooting
-Someothercompany’sBDHTSisprovidingQuickStartMode,buttheyconsumealotofpowerforstandby-mode
becauseofbootingthesystemupquickly.
•FirmwareUpdate
-ByDownloaded
-DownloadinStandbyMode
•RemoteiPod/iPhonesupport(DigitalUSBAudio)
•NetworkFeature
-SearchAll
-YourVideo
•RemoteHotKey
-Netix,SmartHub,SearchAll
•BDRemoteControl
•OneFootConnection
2-1Copyright©1995-2011SAMSUNG.Allrightsreserved.

2.ProductSpecication
2.2.Specications
2.2.1.HT-D45**Specications
■BasicSpecication
PowerRequirementsAC120V ,60Hz
PowerConsumption79W
Weight7.7Ibs
Dimensions16.9(W)x2.3(H)x12.8(D)inches
OperatingTemperature
Range+41°Fto+95°F
General
OperatingHumidityRange10%to75%
Signal/noiseratio55dB
Usablesensitivity12dB FMTuner
Totalharmonicdistortion0.5%
BD(Blu-rayDisc)ReadingSpeed:9.834m/sec
DVD
(DigitalVersatileDisc)
•ReadingSpeed:6.98~7.68m/sec.
•Approx.PlayTime(SingleSided,SingleLayerDisc):135min.
CD:5inches
(COMPACTDISC)
•ReadingSpeed:4.8~5.6m/sec.
•MaximumPlayTime:74min.
Disc
CD:31/2inches
(COMPACTDISC)
•ReadingSpeed:4.8~5.6m/sec.
•MaximumPlayTime:20min.
CompositeVideo•1channel:1.0Vp-p(75Ωload)
•Blu-rayDisc:480i/DVD:480i
VideoOutput
ComponentVideo
•Y:1.0Vp-p(75Ωload)
•Pr:0.70Vp-p(75Ωload)
•Pb:0.70Vp-p(75Ωload)
•BD:480i/DVD:480p,480i
Video/AudioHDMI•1080p,1080i,720p,480p
•PCMmultichannelaudio,Bitstreamaudio,PCMaudio
Frontspeakeroutput165Wx2(3Ω)
Centerspeakeroutput170W(3Ω)
Surroundspeakeroutput165Wx2(3Ω)
Subwooferspeakeroutput170W(3Ω)
Frequencyresponse•Analoginput:20Hz~20kHz(±3dB)
•Digitalinput:20Hz~40kHz(±-4dB)
S/NRatio70dB
Channelseparation60dB
Amplier
Inputsensitivity(AUX)500mV
Copyright©1995-2011SAMSUNG.Allrightsreserved.2-2

2.ProductSpecication
■HT-D4500SpeakerSpecication
5.1chspeakersystem
Speakersystem
FrontSurroundCenterSubwoofer
Impedance3Ω3Ω3Ω3Ω
Frequencyrange140Hz~20kHz140Hz~20kHz140Hz~20kHz40Hz~160Hz
Outputsoundpressure
level86dB/W/M86dB/W/M86dB/W/M88dB/W/M
Ratedinput165W165W170W170W
Maximuminput330W330W340W340W
Dimensions
(WxHxD)
Front:3.54x5.5x2.75inches
Surround:3.0x4.2x2.75inches
Center:8.97x3.03x2.75inches
Subwoofer:6.61x13.78x11.22inches
Speaker
Weights
Front:0.94Ibs
Surround:0.73Ibs
Center:1.06Ibs
Subwoofer:8.38Ibs
2-3Copyright©1995-2011SAMSUNG.Allrightsreserved.

2.ProductSpecication
2.2.2.HT-D4200Specications
■BasicSpecication
Weight3.5kg
Dimensions429.3(W)x58.4(H)x325.1(D)mm
OperatingTemperature
Range+5°Cto+35°C
General
OperatingHumidityRange10%to75%
Signal/noiseratio55dB
Usablesensitivity12dB FMTuner
Totalharmonicdistortion0.5%
BD(Blu-rayDisc)ReadingSpeed:9.834m/sec
DVD
(DigitalVersatileDisc)
•ReadingSpeed:6.98~7.68m/sec.
•Approx.PlayTime(SingleSided,SingleLayerDisc):135min.
CD:12cm
(COMPACTDISC)
•ReadingSpeed:4.8~5.6m/sec.
•MaximumPlayTime:74min.
Disc
CD:8cm
(COMPACTDISC)
•ReadingSpeed:4.8~5.6m/sec.
•MaximumPlayTime:20min.
CompositeVideo•1channel:1.0Vp-p(75Ωload)
•Blu-rayDisc:576i/480i/DVD:576i/480i
VideoOutput
ComponentVideo
•Y:1.0Vp-p(75Ωload)
•Pr:0.70Vp-p(75Ωload)
•Pb:0.70Vp-p(75Ωload)
•BD:576i/480i/DVD:576p/480p,576i/480i
Video/AudioHDMI•1080p,1080i,720p,576p/480p
•PCMmultichannelaudio,Bitstreamaudio,PCMaudio
Frontspeakeroutput165Wx2(3Ω)
Subwooferspeakeroutput170W(3Ω)
Frequencyresponse•Analoginput:20Hz~20kHz(±3dB)
•Digitalinput:20Hz~40kHz(±-4dB)
S/NRatio70dB
Channelseparation60dB
Amplier
Inputsensitivity(AUX)500mV
Copyright©1995-2011SAMSUNG.Allrightsreserved.2-4

2.ProductSpecication
■HT-D4200SpeakerSpecication
2.1chspeakersystem
Speakersystem
FrontSubwoofer
Impedance3Ω3Ω
Frequencyrange140Hz~20kHz40Hz~160Hz
Outputsoundpressurelevel86dB/W/M88dB/W/M
Ratedinput165W170W
Maximuminput330W340W
Dimensions
(WxHxD)
Front:90x139x70mm
Subwoofer:168x350x285mm
Speaker
WeightsFront:0.42kg
Subwoofer:3.62kg
2-5Copyright©1995-2011SAMSUNG.Allrightsreserved.

2.ProductSpecication
2.3.SpecicationsAnalysis
ModelNameHT-D45**/HT-D4200HT-D5500HT-C5500
Photo
Prole25Blu-ray2.0fromthe
beginning
DVD,CDOOO
MP3,JPGO
(MP4,MKV ,WMA,WMV)
O
(MP4,MKV ,WMA,WMV)
O
(MP4,MKV ,WMA,WMV)
USBHOSTOOO
iPod/iPhone
O
(onlyDigitalUSBAUDIO
support)
O
(DigitalUSBAUDIO,
CompositeVideoWith
NewCradle)
O
(AnalogVideo&Audio)
DivXO
(DivX-HDsupport)
O
(DivX-HDsupport)
O
(DivX-HDsupport)
MemorySlotInternalStorageSupportInternalStorageSupportX
(ExternalUSBsupport)
DLNA,WidgetO
(SmartHub)
O
(SmartHub)O
2D/3D2D3D
(2D→3DConvergence)2D
SMPS
1trans
Stand-ByPower
Consumption0.7W
DualFreeV oltage
2trans
Stand-ByPower
Consumption0.45W
DualFreeV oltage
2trans
Stand-ByPower
Consumption0.27W)
DECKDrawtype
PlasticCover
Drawtype
PlasticCover
Drawtype
PlasticCover
PickUp6GVEPickup6GVEPickup5GVEPickup
FrontMicomSANYOSANYOSANYO
MAINCHIPSAMSUNGSOCSAMSUNGSOCBCM7630
WirelessRearSpeakerHT-D4500doesnotsupport
wireless.
Ready/Included
(SWA-5000)
Ready
(SWA-5000)
WiFiLanDongleReadyBuilt-InReady/Built-In
HDMIINX/X/XX/2inputs/2inputsX
2inputs
Main↔LoaderOneBoard(S-A TA)OneBoard(S-ATA)OneBoard(S-A TA)
TIP
O:FeatureIncluded,X:NotIncluded
Copyright©1995-2011SAMSUNG.Allrightsreserved.2-6

2.ProductSpecication
2.4.Accessories
2.4.1.SuppliedAccessories
AccessoriesItemItemcodeRemark
RemoteControlAH59-02345A
Batteries(AAAsize)4301-000116
VideoCableAH39-40001V
FMAntennaAH42-00021A
User’sManualAH68-02406M
LocalSamsungDealer
2-7Copyright©1995-2011SAMSUNG.Allrightsreserved.

3.Disassembly&Reassembly
3.Disassembly&Reassembly
3.1.OverallDisassembly&Reassembly
CAUTION
•Becarefultofollowthedisassemblysequence
describedinthemanual.Otherwise,theproductmay
bedamaged.
•Besuretocarefullyreadandunderstandthesafety
instructionsbeforeperforminganyworkastheIC
chipsonthePCBarevulnerabletostaticelectricity.
•Inordertoassemblereversetheorderofdisassembly.
CAUTION
Becarefulnottomakeanyscratchesasyouremovethem.
1.Unfasten3screwsontherearsideforTopCover.
:BH,+,B,M3,L10,ZPC(BLK),SWRCH18A
2.Unfasten2screwsonthesideforTopCover.
:BH,+,B,M3,L10,ZPC(BLK),SWRCH18A
3.TodisassembleFrontCover,release3hooksonthe
Bottomandoneoneachside.(R/L)
4.Afterunfastenallthehooksonthetopside,thenyou
canpullouttheFrontCoverAssy.Andbesureto
unfasten1wires.
5.Unfasten3screwsand2holderfortakingoutVFD
Cover.
:BH,+,B,M3,L10,ZPC(BLK),SWRCH18A
Copyright©1995-2011SAMSUNG.Allrightsreserved.3-1

3.Disassembly&Reassembly
6.Unfasten4screwsand2wiresforthedeckdisassembly,
andthentakeouttheDeck.
:BH,+,B,M3,L10,ZPC(BLK),SWRCH18A
7.ForMainAssy,unfasten2connectorsconnectedto
SMPSAssyand1connectorsconnectedtoFan.and3
screwsoneachside.
8.ForMainAssy,unfasten3screwsontherearside.
(Tuner,SPKJack,A VJack)
:BH,+,B,M3,L10,ZPC(BLK),SWRCH18A
9.FortheSMPSAssy,unfasten4screwsoneachside.
:BH,+,-,B,M3,L8,ZPC(WHT),SWRCH18A,
ROUNDTYPE
10.Youcantakeoutthefanafterunfastening2screws.
:BH,+,B,M3,L10,ZPC(BLK),SWRCH18A
11.Then,onlytheBottomChassisisleft.
3-2Copyright©1995-2011SAMSUNG.Allrightsreserved.

4.Troubleshooting
4.Troubleshooting
4.1.CheckpointsbyErrorMode
OscilloscopeSettingValuesNormalVoltage24MHz32.768KHz
V oltage/DIV2V/div0.5V/div0.5V/div
TIME/DIV100ms/div10ns/div5us/div
Copyright©1995-2011SAMSUNG.Allrightsreserved.4-1

4.Troubleshooting
4.1.1.NoPower
No Powe r De te cte d
(Sta nd by LED OFF)
Yes
No No
Che ck ma in as s y - s pe cially
check around MICOM IC. (Vcc)
Re place ICM823.
5.6V output
ch eck (C ON3, pin1,2)
→ 5 .6?
Yes
Re place SMPS ASS’Y.
No
Re place Diode .
Re place Fus e. (5A 250V)
Re place ICA801.
Re place MA801.
No Re place compone nt
if it ha s proble m.
Che ck
Switch ing IC (ICA801)
short test pin 8. to pin 1, 2, 3,
4, 5, 6, 7 → OK (m eans
notsh ort)?
Che ck MA801.
a ll pins ar e no t sh orte d to
ea ch othe r.
Che ck
input voltage of ICM823.
(Cathode of
DM824 → 6~16V?)
Che ck
diode s (DM824,DM829,
DM830,DR3502)
→ OK?
Che ck primary s ide .
Fus e (FS801S) → O K?
Che ck
comp one nts around IC.
RA805, DA805, RA807,
RA809.
Yes
Yes
Yes
Yes
Yes
No
No
No
4-2Copyright©1995-2011SAMSUNG.Allrightsreserved.

4.Troubleshooting
■BDHTSSMPSconsistsof2converters
•Mainconverter
•ICM801,TS802S
•Makesvoltagesformainboard
•Worksalways,butonly5.4Visoutputinstand-bymode
•Amplierconverter
•ICA801,MA801,TA801S
•MakesamplierPVDDvoltage
•Worksafterpoweron
No5.4Voutput
•CheckfuseFP801S
•ICM801pin2over1V
•ICM801pin7:14~18V
→
→
→
Replaceifopen
Checkforshortage
Checksecondarydiodesdirection(DM825/826):replaceICM1
Novoltageafterpoweron
•No12V
•No-28V(-VP)
•No-12V
•No4.1V(±VFD)
•Noallabovevoltages
→
→
→
→
→
CheckMM821
CheckTRM824,TRM825
CheckICM821,TRM821,TRM822
CheckTRM823
CheckTRM826,Ponsignal(CN803pin4)
NoPVDDvoltage
•ICA801pin62~4V
•ICA1pin714~19V
•
•
••ICA11V<pin2<4.2V
→
→
→
→
→
CheckTRA802
CheckTRA801/802
CheckOCM801
CheckMA801,TA801S,DRA821/822
Checkforshortage
ReplaceICA1
Copyright©1995-2011SAMSUNG.Allrightsreserved.4-3

4.Troubleshooting
4.1.2.NoSound
Cha nge MAIN P CB.
No
No
Cha nge AMP P CB.
Yes
Yes
L2001 ~ L2006 S igna l OK?
R1026 ~ R1 031 S igna l OK?
There is n o au dio sound from speake r
Check the signal from jack and if
not, change AMP.
4-4Copyright©1995-2011SAMSUNG.Allrightsreserved.