SeaLevel 12009-001-KT User manual

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© Sealevel Systems, Inc. 12009-001-KT Manual | SL9679 10/2022
COM Express Compact Type 6
Evaluation Board
User Manual | 12009-001-KT

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© Sealevel Systems, Inc. 12009-001-KT Manual | SL9679 10/2022
Contents
CONTENTS............................................................................................................................................................................................................................2
INTRODUCTION...................................................................................................................................................................................................................4
FEATURES ...........................................................................................................................................................................................................................5
BEFORE YOU GET STARTED..............................................................................................................................................................................................6
WHATS INCLUDED .............................................................................................................................................................................................................6
CABLES...............................................................................................................................................................................................................................6
TECHNICAL SPECIFICATIONS............................................................................................................................................................................................7
DIGITAL I/O.......................................................................................................................................................................................................................8
TECHNICAL DESCRIPTIONS..............................................................................................................................................................................................9
COM EXPRESS MODULE OPTIONS......................................................................................................................................................................................9
CUSTOMER-SPECIFIED BLOCK DIAGRAM..........................................................................................................................................................................10
HEADER CONNECTORS...................................................................................................................................................................................................... 11
Input Power Connector (J7)................................................................................................................................................................................. 11
Header (P5) - Power Button & Status LEDs....................................................................................................................................................12
Header (P2) - Digital I/O & 21 VDC..................................................................................................................................................................13
Header (P1) - Serial Ports...................................................................................................................................................................................14
Ethernet Headers (P3 & P4) - Gigabit Ethernet ............................................................................................................................................15
Header (J4) Drive Voltage Level.....................................................................................................................................................................16
USB 2.0 Headers (J8, J9, & J10) - USB2.0 Ports........................................................................................................................................... 17
PORT CONNECTORS..........................................................................................................................................................................................................18
Mini DisplayPort (J6) - Video Output................................................................................................................................................................18
USB Type C (J2 & J3) - USB3.0 Ports...............................................................................................................................................................18
M.2 Connector (CN1) For Solid-State Disk..................................................................................................................................................18
ADDITIONAL FEATURES .....................................................................................................................................................................................................19
RTC Battery (BAT1)...............................................................................................................................................................................................19
Onboard Status LEDs ............................................................................................................................................................................................19
Switch (SW1) Test Enable................................................................................................................................................................................19
Switch (SW2) AT Mode.....................................................................................................................................................................................19

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© Sealevel Systems, Inc. 12009-001-KT Manual | SL9679 10/2022
Switch (SW3) RTC Reset..................................................................................................................................................................................19
SYSTEM OPERATION........................................................................................................................................................................................................20
POWER STATES................................................................................................................................................................................................................ 20
EXTERNAL POWER BUTTON.............................................................................................................................................................................................. 20
RESET BUTTON (BP1)..................................................................................................................................................................................................... 20
HARDWARE INSTALLATION............................................................................................................................................................................................21
SOFTWARE INSTALLATION ............................................................................................................................................................................................. 21
SEAMAX APPLICATION SUITE........................................................................................................................................................................................22
SEAMAX OVERVIEW ........................................................................................................................................................................................................22
SEAMAX WINDOWS INSTALLATION..................................................................................................................................................................................22
MAXSSD CONFIGURATION &DIAGNOSTIC UTILITY..........................................................................................................................................................22
MAXSSD CONNECTION TAB.............................................................................................................................................................................................23
MAXSSD DEVICE TAB......................................................................................................................................................................................................24
MAXSSD I/O MAP ......................................................................................................................................................................................................... 26
APPENDIX A TROUBLESHOOTING SERIAL COMMUNICATION ISSUES.............................................................................................................27
TROUBLESHOOTING/VERIFICATION FOR ASYNCHRONOUS SERIAL PRODUCTS ..................................................................................................................27
APPENDIX B HOW TO GET ASSISTANCE..................................................................................................................................................................30
APPENDIX C MECHANICAL DRAWING.....................................................................................................................................................................31
APPENDIX D HANDLING INSTRUCTIONS.................................................................................................................................................................32
ELECTROSTATIC DISCHARGES (ESD)................................................................................................................................................................................32
GROUNDING METHODS...................................................................................................................................................................................................32
APPENDIX E BOARD PHOTOS ....................................................................................................................................................................................33
REAR I/O CONNECTORS...................................................................................................................................................................................................33
SIDE (LEFT)I/O CONNECTORS .........................................................................................................................................................................................33
SIDE (RIGHT)I/O CONNECTORS ......................................................................................................................................................................................33
9457 TOP VIEW ..............................................................................................................................................................................................................34
9457 ADDITIONAL VIEWS................................................................................................................................................................................................35
APPENDIX F COMPLIANCE NOTICES.........................................................................................................................................................................37
WARRANTY ........................................................................................................................................................................................................................38

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© Sealevel Systems, Inc. 12009-001-KT Manual | SL9679 10/2022
Introduction
12009 COM Express Compact Type 6
Evaluation Board. The 12009-001-KT supports Compact Type 6 COM Express modules and provides the
smallest COM Express Type 6 footprint available. Standard features include two Gigabit Ethernet, two USB
3.0 Type C, three USB 2.0, four GPIO ports, one RS-232, one UART interface, one M.2 SATA SSD slot, and
one Mini DisplayPort. Specific features are COM Express module dependent.
-001-KT simplifies software development and prototyping while the target application
time to market. Our extensive library of proven I/O circuits including serial, analog, and digital functionality
simplifies the design process and can be easily optimized to meet the specific I/O count, voltage ranges
and connector types required for your application.
The 12009 COM Express Compact Type 6 Evaluation Board is an off-the-shelf Computer on Module (COM)
containing the functionality common to most industrial computing systems (processor, memory, graphics,
USB, Ethernet, etc.) with a custom carrier board that includes application specific I/O and interface
connectors. This combination provides the benefits of a full custom design while reducing the time, cost,
and risk of full custom system design.
COM architecture offers significant technical and business advantages including:
•Fast Time to Market
•Scalability for Easy Upgrade
•Superior Application Specific I/O
•Flexible Mechanical Configuration
•Shock and Vibration Resistant
•Extended Operating Temperature Range
•Long Term Availability and Support
•Lifecycle Management and easy technology refresh
Sealevel has partnered with the leading COM Express module manufacturers to ensure our customers
benefit from the best in the industry. This manual will focus on the higher-level features of the 12009-001-
KT carrier board interfaces and I/O.

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Features
•Designed for the congatec® conga-TC370 COM Express family
•0ºC to 70ºC wide operating temperature range
•(2) Gigabit (10/100/1000BaseT) Ethernet Headers
•(2) USB 3.0 Type-C Connectors
•(3) USB 2.0 Headers
•(4) GPIO Headers
•(1) RS-232 Header
•(1) UART Interface
•(1) Mini DisplayPort Connector
•(1) M.2 SATA SSD Interface
•Onboard LED indicators for power and COM activity
•Real-time clock
•21VDC input with locking 4-position Molex Micro-Fit connector
•95mm x 95mm dimensions
•Includes carrier board, DOM module, demonstration enclosure, and cables

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© Sealevel Systems, Inc. 12009-001-KT Manual | SL9679 10/2022
Before You Get Started
The 12009 COM Express Type 6 Evaluation Board is shipped with the following items. If any of these items
are missing or damaged, please contact Sealevel at 864.843.4343 for a replacement.
•Carrier board, COM module, and plexiglass demonstration enclosure
•128GB M.2 SSD Installed
•5V Fan with 5 Pin Molex Connector Cable Installed in Enclosure (P/N: CA807)
•SeaLATCH Panel Mount USB Type A Female to Molex 4 Pin Connector (P/N: SL-PM/x2)
•Power Supply (P/N: TR168-US Providing 60W, 21V)
Cables
•Mini DisplayPort Male to HDMI Male Cable (Audio Support) 3ft length (P/N: CA828)
•Molex Connector to 2 DB9 Connectors (P/N: CA772)
•10 Position Connector to RJ45 Ethernet Port (P/N: CA774/x2)
•Power Button and LED (P/N: CA775)
•5 Pin to 4 Pin Molex, 14.00" Long (P/N: CA471/x2)
•10 Posi
Advisory Conventions
Warning
The highest level of importance used to stress a condition where damage could result to the
product, or the user could suffer serious injury.
Important
The middle level of importance used to highlight information that might not seem obvious or a
situation that could cause the product to fail.
Note
The lowest level of importance used to provide background information, additional tips, or other
non-critical facts that will not affect the use of the product.

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© Sealevel Systems, Inc. 12009-001-KT Manual | SL9679 10/2022
Technical Specifications
Environment & MTBF
Operating Temperature
0 to 70 ºC (32 to 158 ºF)
Storage Temperature
-40 to 105 ºC (-40 to 221 ºF)
Humidity
10 to 90% R.H. Non-Condensing (Both)
Mean Time Between Failure1
430,286 hours at 25º C ambient
Mechanical
Board Length / Envelope
3.74 inches (95 mm) / 4.80 inches (122 mm)
Board Width / Envelope
3.74 inches (95 mm) / 4.96 inches (126 mm)
Board Height / Envelope
1.18 inches (30 mm) / 1.19 inches (30 mm)
Weight2
1.69 lbs. / 0.73 kg
Power Consumption
Typical Power Draw3
9.6W
Nominal Supply Voltage
+21 VDC
Nominal Current Draw
450mA
1. Telecordia SR-332 method used.
2. Weight includes the enclosure and cabling for the fan. All other cabling and power supply are not
included.
3. Typical power consumption can vary depending on COM Express Module, memory capacity,
OS/software activity and peripheral devices. Input power (J7) is current limited by a 5A fuse.

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© Sealevel Systems, Inc. 12009-001-KT Manual | SL9679 10/2022
Digital I/O
Detailed pinout and wiring information is available in the P2 Header Digital I/O Section.
Digital Inputs
4 Channels
High-level Input Voltage (VIH)
2.02v 5.50v
Low-level Input Voltage (VIL)
0.00v 0.80v
Push Pull Outputs
2 Channels
High-level Output Voltage (VOH)
VCC 3.3v:
VCC 5.0v:
Depends on J4 VCC selection.
2.8v 3.3v
4.5v 5.0v
Low-level Output Voltage (VOL)
VCC 3.3v:
VCC 5.0v:
Depends on J4 VCC selection.
0.0v 0.25v
0.0v 0.35v
Darlington (Open Collector) Output
1 Channel
Contact Voltage
60VDC max
Max Continuous Collector Current
500mA
Max Peak Pulse Current
2000mA
Form A Solid Relay Output
1 Channel
Normal Output Voltage1
21.0v
Output Voltage Range2
20.0v 30.0v
Maximum Output Current3
1500mA
1. Sourced directly from the protected input power.
2. Depends on the input voltage (J7) provided to the device.
3. Be aware of the 5A current limit on the power input (J7) because load drawn from this output will
be reflected in the overall input current.

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© Sealevel Systems, Inc. 12009-001-KT Manual | SL9679 10/2022
Technical Descriptions
COM Express Module Options
The 9457 carrier board is compatible with the Compact form factor Type 6 COM Express modules powered
by 8th generation Intel® CoreSOC processor up to 4cores. COM Express is a widely supported
implementation of Computer on Module (COM) design. The COM Express architecture reduces the
complexity, cost and time required for custom computer system design by combining the processing,
memory, video, Ethernet, and USB functionality in a small, highly integrated module. COM Express modules
install on a carrier board that provides the application specific I/O and external connectors best suited for
the system requirements.
board and full system solutions as rapidly as possible. Common I/O features include serial, analog and
voltage range, and connector type.
The 9457 carrier board is available in the following configurations:
Sealevel
Part Number
COM Express
Module
COM Express Module Description
RAM
105809
conga-TC370/
i38145UE
COM Express Type 6 Compact module
with Intel® Corei3-8145UE and 8GB dual
channel DDR4 2400 MT/s
8GB

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© Sealevel Systems, Inc. 12009-001-KT Manual | SL9679 10/2022
Customer-Specified Block Diagram
The customer-specified block diagram is shown below with added board reference designators
(component addresses). These designators correspond to the board connectors and diagrams on the
following pages.

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© Sealevel Systems, Inc. 12009-001-KT Manual | SL9679 10/2022
Header Connectors
Input Power Connector (J7)
All necessary system voltages are generated from a single 21 VDC input via a 4-position Molex connector.
The design includes power protection circuits for under/over voltage and reverse voltage.
The power input is protected by a 5A current limiter.
Load from on digital output 4 (Form A) will contribute to the overall 5A max DC
current rating.
Wiring Diagram for Header (J7)
Rated Input Voltage
21 VDC
Acceptable System Input Voltage
20.5 VDC 31 VDC
DC Current Rating (21V Nominal)1
350 mA - 450 mA
1. May be higher depending on COM Express module,
input voltage, OS, load, and connected devices.
Reference
Designator
PIN
Signal
J7
1
VIN
2
GROUND
3
VIN
4
GROUND
Power Connector Header (J7)
Drawing
Power Connector Header (J7) Location

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© Sealevel Systems, Inc. 12009-001-KT Manual | SL9679 10/2022
Header (P5) - Power Button & Status LEDs
The system can be powered by an external power switch and provides for two external status LEDs on a
Tyco Micro-Match 6-pin header connector (TE Connectivity Part#7-2178711-6). Mating connector is TE
Connectivity Part# 2178712-6.
Wiring Diagram for Header (P5)
Make sure that the latch on the CA775 aligns with the notch on the lefthand side of
the P5 connector.
Pin
Signal
Notes
1
GROUND
2
External Power Button
EXT_PWR_BT_N
Ground (pin 1) with momentary switch
Hold for >1 second to activate
(Pulled up on board with 1 second debounce)
3
System Power LED Anode
5V_S5
5 V Power, 1 K resistor to power external LED
4
System Power LED Cathode
N/C
When system module is powered, Sink pin to
enable external LED by providing path to
Ground
5
5V_S5
5 V Power, 1 K resistor to power external LED
6
PWR_LED
Button and Status LED Indicator
Header (P5) Drawing
Button and Status LED Indicator
Header (P5) Location
Notch
location

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© Sealevel Systems, Inc. 12009-001-KT Manual | SL9679 10/2022
Header (P2) - Digital I/O & 21 VDC
The system has four digital inputs and four digital outputs available on Molex Milli-Grid 10-pin header
connector (Molex Part# 878331019). Digital I/O is addressed via Sealevel SeaMAX software. Mating
connector is Molex Part# 0511101060.
To view the I/O specifications, see the Digital I/O section under Technical Specifications.
The Digital I/O is not isolated from the main system power. If using a secondary power supply,
it must share the same ground reference as the main system power (J7).
Pin
Signal
Type
Notes
1
Digital
Output 1
Push-Pull Output
(TTL Compatible)
Selectable for 3.3v or 5.0v drive via J4.
2
Digital
Input 1
General Purpose Input
(TTL Compatible)
Requires external 3.3v - 5.0v.
3
Digital
Output 2
Push-Pull Output
(TTL Compatible)
Selectable for 3.3v or 5.0v drive via J4.
4
Digital
Input 2
General Purpose Input
(TTL Compatible)
Requires external 3.3v - 5.0v.
5
Digital
Output 3
Open-Collector
Sinks to GND. Darlington Transistor.
6
Digital
Input 3
General Purpose Input
(TTL Compatible)
Requires external 3.3v - 5.0v.
7
Digital
Output 4
Solid State Relay
Sourced from J7 Power Supply Input.
8
Digital
Input 4
General Purpose Input
(TTL Compatible)
Requires external 3.3v - 5.0v.
9
GND
10
21 VDC
Output
Unswitched Power Source
Sourced from J7 Power Supply Input.
Wiring Diagram for Header (P2)
Digital I/O Header (P2) Location
Digital I/O Header (P2) Drawing

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Header (P1) - Serial Ports
The carrier board has two serial ports intended for debugging purposes. Port 1 is a standard RS-232 serial
port, while Port 2 is a CMOS serial port. Transmit, Receive, and Ground are available on a Tyco Micro-MaTch
6-pin header connector (TE Connectivity Part# 7-2178711-6). Modem control signals are not implemented.
The serial ports are derived from the COM Express module and are enumerated by the operating system via
the standard Intel serial port driver. Mating connector is TE Connectivity Part# 2178712-6.
Pin
Signal
Notes
1
TX 1
Port 1 Transmit (RS232)
2
RX 1
Port 1 Receive (RS232)
3
GND
Ground
4
GND
Ground
5
GND
Ground
6
GND
Ground
7
TX 2
Port 2 Transmit (3.3V CMOS)
8
RX 2
Port 2 Receive (3.3V CMOS)
Do not connect an RS232 device to the CMOS port. RS232 signal levels exceed that of CMOS
and therefore may damage the CMOS port.
Serial Ports Header (P1) Location
Serial Ports Header (P1) Drawing

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Ethernet Headers (P3 & P4) - Gigabit Ethernet
The carrier board has two Gigabit Ethernet (10/100/1000) network ports on Samtec Tiger Eye (Samtec
Part# TFM-105-02-L-DH-TR) latching headers with LED status indicators for link and activity on the PCB.
One Gigabit Ethernet port is derived from the COM Express module while the other is an Intel I210IT PCIe
NIC on the carrier board. Mating connector is Samtec Part# SFSDT-05-28-G-03.25-S
Reference
Designator
PIN
Signal
P3
1
NIC1 0A P
2
NIC1 0A N
3
NIC1 1A P
4
NIC1 1A N
5
NIC1 2A P
6
NIC1 2A N
7
NIC1 3A P
8
NIC1 3A N
9
GROUND
10
GROUND
P4
1
GBE0 MDI0A P
2
GBE0 MDI0A N
3
GBE0 MDI1A P
4
GBE0 MDI1A N
5
GBE0 MDI2A P
6
GBE0 MDI2A N
7
GBE0 MDI3A P
8
GBE0 MDI3A N
9
GROUND
10
GROUND
Wiring Diagram for Header (P3 & P4)
Ethernet NIC Header (P4) Location
Ethernet NIC Header (P3) Location
Ethernet NIC Header (P3 & P4)
Drawing

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Header (J4) Drive Voltage Level
The 3-position header (J4) is used to select the drive voltage level (3.3 V or 5 V) for the two push-pull digital
outputs (OUT1A, OUT2A). With the supplied shunt, you can short Pin 1 and Pin 2 (of J4) to produce a 5 V
drive voltage on the push-pull outputs. Alternatively, you can use the shunt to short Pin 2 and Pin 3 (of J4)
to produce a 3.3 V drive voltage on the push-pull outputs.
Reference
Designator
PIN
Signal
J4
1
5V_S0
2
PUSH-PULL DIGITAL OUTPUT
SUPPLY VOLTAGE (VCC)
3
3V3_S0
Wiring Diagram for Header (J4)
Drive Voltage Level Header
(J4) Drawing
Drive Voltage Level Header (J4) Location

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USB 2.0 Headers (J8, J9, & J10) - USB2.0 Ports
Three standard USB 2.0 ports are available on rugged latching headers. These ports are derived from the
COM Express module. One is required to power the fan.
Reference
Designator
PIN
Signal
J8
1
VBUS
2
USB2B_N
3
USB2B_P
4
GND
5
SHIELD
J9
1
VBUS
2
USB3B_N
3
USB3B_P
4
GND
5
SHIELD
J10
1
VBUS
2
USB5B_N
3
USB5B_P
4
GND
5
SHIELD
Wiring Diagram for USB 2.0 Headers (J8, J9, & J10)
USB 2.0 Headers (J8, J9, & J10)
Drawings
USB 2.0 Headers (J8, J9, & J10) Location

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Port Connectors
The following I/O connectors use industry standard pin outs for maximum compatibility. All other
connectors use non-standard or custom pin outs and are detailed after the following table.
Mini DisplayPort (J6) - Video Output
The carrier board includes a Mini DisplayPort connector. The graphics capabilities are dependent on the
COM Express module installed.
USB Type C (J2 & J3) - USB3.0 Ports
The carrier board includes two standard USB 3.0 ports on reversible type C connectors. These ports are
derived from the COM Express module.
M.2 Connector (CN1) For Solid-State Disk
The carrier board has a single M.2 SATA SSD connector for adding solid-state disk storage. The M.2
connector is located on the bottom of the carrier board, adjacent to the RTC Battery. The carrier board can
support type 2242, and 2260 M.2 SSD modules. The maximum capacity and throughput are dependent on
the M.2 SSD module and COM Express module installed.
Function
Connector Type
Digital Video Output
Mini-DisplayPort
USB 3.0 Device
USB Type C
Digital Video Output Mini-DisplayPort
Location
2 USB 3.0 Type Locations

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Additional Features
RTC Battery (BAT1)
The carrier board includes a non-rechargeable, long-life Lithium battery (3V CR2450N) for maintaining
RTC/CMOS settings.
Onboard Status LEDs
The carrier board includes several status LEDs to show system status or alert to potential problems. The
LED location on the board and their functions are detailed in the table below.
LED
Signal
Notes
D25
Computer Power On
Lights green when system is powered on
D30
SATA Activity
Pulses green to show M.2 SATA SSD activity
D24
Board Controller Heartbeat
Pulses green to confirm system heartbeat
D22
Board Controller Power Good
Lights green to confirm acceptable DC input range
D23
Computer Boot Problem
Lights red if there is a boot-related issue
Switch (SW1) Test Enable
The switch (SW1) is used for manufacturing testing and debugging purposes. The switch is shipped in the
Normal position and should not be changed in the field.
Switch (SW2) AT Mode
The switch (SW2) is used for manufacturing testing and debugging purposes. The switch is shipped in the
position that is NOT AT Mode and should not be changed in the field.
Switch (SW3) RTC Reset
The switch (SW3) is used for manufacturing testing and debugging purposes. The switch is shipped in the
NORMAL position. Moving the switch to RST (Reset) position will disconnect the battery from the COM
Express module, thus clearing RTC/CMOS settings.

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System Operation
Power States
The 12009-001-KT is designed to operate in four Power States as defined by ACPI.
S0 Fully powered and operational
S3 Suspended to memory (known as sleep in Windows)
S4 Suspended to disk (known as Hibernate in Windows)
S5 Powered down in standby (Windows Shutdown)
The system can transition from S0 to any of the three listed standby states (S3, S4, or S5) by either software
command or an external Power Button (connected to Header P4). The system can then be awoken from
either listed sleep/standby state by holding the Power Button for >3 seconds. The system can also be
awoken from S3 or S4 with a USB input device such as a HID compliant keyboard or mouse.
The fan will remain on after the shutdown of the 12009-001-KT. You may safely
disconnect the fan when the 12009-001-KT is powered down and reconnect it when
ready to use the 12009-001-KT.
For a USB device to be used to wake the computer, it must be present when the computer
enters the sleep state and must remain connected for the duration of the sleep state.
External Power Button
An external power button (connected to Header P5, pins 1 & 2) can be used to turn the system on, shut the
system down or place the computer in sleep states S3 or S4 (depending on OS support and configuration).
The power button can also wake the system up from sleep states S3 or S4.
The power button has a one-second hardware debounce/delay built in to prevent an accidental shutdown. This
delay is always present so the power button must be held for >1 second before system power up, power down,
sleep or wake occurs.
Reset Button (BP1)
Centered below the SSD, the dual stage reset button provides two functions.
1) Holding the switch for at least 1 second and releasing within 5 seconds will perform a hard reset
of the COM Express module only.
2) Holding the switch for at least 5 seconds and releasing will perform a full hardware reset of the
entire system (CPU included).
Any momentary press of the switch for less than 1 second will be ignored.
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