19 19
CFD-S03CP/S03CPL
CFD-S03CP/S03CPL
6-3. CIRCUIT BOARDS LOCATION • NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
For schematic diagrams.
Note:
•All capacitors are in µF unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
•All resistors are in Ωand 1/4W or less unless otherwise
specified.
•f: internal component.
•C: panel designation.
For printed wiring boards.
Note:
•X: parts extracted from the component side.
•Y: parts extracted from the conductor side.
•W: indicates side identified with part number.
•f: internal component.
•: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
•A: B+ Line.
•H: adjustment for repair.
•Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
– BD83S Board –
no mark : CD PLAY
– MAIN (1/3) Board –
no mark : FM
():AM
– MAIN (2/3), (3/3) and Other Boards –
no mark : FM
():PB
<>:REC
[]:CD PLAY
•Voltagesare taken witha VOM (Inputimpedance 10 MΩ).
Voltagevariationsmaybe noted dueto normal production
tolerances.
•Waveforms are taken with a oscilloscope.
Voltagevariationsmaybe noted dueto normal production
tolerances.
•Circled numbers refer to waveforms.
•Signal path.
F: FM
f: AM
E: PB
a: REC
J: CD PLAY
•Abbreviation
CND : Canadian model.
CET : East European & Russian model.
E41 : AC 230V area in E model.
E92 : AC 120V area in E model.
AUS : Australian model.
KR : Korea model
MX : Mexican model.
SP : Singapore model.
IT : Italian model.
AR : Argentina model.
TH : Thai model.
TW : Taiwan model.
C
B
These are omitted.
E
Q
B
These are omitted.
C
Q
Q
E
BCE
Caution:
Pattern face side: Partsonthe pattern faceside seen from
(Conductor Side) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Component Side) the parts face are indicated.
• Waveforms
— BD83S Board — (CD PLAY)
— MAIN Board —
•Abbreviation
CND : Canadian model.
CET : East European & Russian model.
E41 : AC 230V area in E model.
E92 : AC 120V area in E model.
AUS : Australian model.
KR : Korea model
MX : Mexican model.
SP : Singapore model.
IT : Italian model.
AR : Argentina model.
TH : Thai model.
TW : Taiwan model.
HEADPHONE board
PANEL board
KEY-1 board
KEY-2 board
MAIN board
BATTERY-1 board
BATTERY-2 board
TC board
BD83S board
POWER board
1.1 Vp-p
Approx. 150 mVp-p
5
IC201 u; (RFACO)
500 mV/div, 0.5
µ
sec/div
1.7 V
Approx. 1 Vp-p
1.7 V
4
IC201 tg (FEO)
100 mV/div, 5 msec/div
3
IC201 td (TEO)
1 V/div, 5 msec/div1 V/div, 10
µ
sec/div
1 V/div, 200 nsec/div
3.2 Vp-p
2
IC201 5(BCK)
0.47
µ
sec
3.2 Vp-p
1
IC201 1(LRCK)
22.6
µ
sec
3.3 Vp-p
16.95 MHz
6
IC201 <z/, (XTAO)
1 V/div, 20 nsec/div
+0.3
–0.2
2.2 Vp-p
1IC1 w; (X OUT)
1 V/div, 5
µ
sec/div
75 kHz
3.4 Vp-p
4.13 MHz (AM)
4.17 MHz (EXCEPT AM)
2IC801 os (X1)
1 V/div, 100 nsec/div
— TC Board — (REC)
18.2
µ
sec
3.5 Vp-p
1
Q301 C
1 V/div, 10
µ
sec/div
18.2
µ
sec
35 Vp-p
2
HRP301 (YEL)
10 V/div, 10
µ
sec/div
Ver. 1.2
Note:
The components identi-
fied by mark 0or dotted
linewith mark 0arecriti-
cal for safety.
Replace only with part
number specified.
Note:
Lescomposants identifiés par
une marque 0sont critiques
pour la sécurité.
Ne les remplacer que par une
piéce portant le numéro
spécifié.
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
