Sony D-NE20 - Atrac Cd Walkman User manual

SERVICE MANUAL
Sony Corporation
Personal Audio Company
Published by Sony Engineering Corporation
US Model
Canadian Model
AEP Model
UK Model
D-NE20
E Model
D-NE20/NE20LS
Australian Model
D-NE20
Chinese Model
D-NE20LS
Tourist Model
D-NE20
PORTABLE CD PLAYER
9-879-267-02
2005A16-1
© 2005.01
Ver. 1.1 2005.01
SPECIFICATIONS
D-NE20/NE20LS
Model Name Using Similar Mechanism NEW
CD Mechanism Type CDM-3325ERV
Optical Pick-up Name DAX-25EV
System
Compact disc digital audio system
Laser diode properties
Material: GaAlAs
Wavelength: λ= 770 - 800 nm
Emission duration: Continuous
Laser output: Less than 44.6 µW
(This output is the value measured at a distance
of 200 mm from the objective lens surface on the
optical pick-up block with 7 mm aperture.)
D-A conversion
1-bit quartz time-axis control
Frequency response
20 - 20 000 Hz
+1
-2
dB (measured by JEITA)
Output (at 3 V input level)
Line output (stereo minijack)
Output level 0.7 V rms at 47 kΩ
Recommended load impedance over 10 kΩ
Headphones (stereo minijack)
Approx. 5 mW + Approx. 5 mW at 16 kΩ
(Approx. 1.5 mW + Approx. 1.5 mW at 16 kΩ)*
*For the customers in Europe
Optical digital output (optical output connector)
Output level: –21- –15 dBm
Wavelength: 630 - 690 nm at peak level
Power requirements
• Sony NH-14WM rechargeable battery:
1.2 V DC ×1
• LR6 (size AA) battery: 1.5 V DC ×1
• AC power adaptor (DC IN 3 V jack)
• Rated current: 1 A
Operating temperature
5°C - 35°C (41°F - 95°F)
Dimensions (w/h/d) (excluding projecting parts
and controls)
Approx. 127 ×13.1 ×132.5 mm (5 ×
17
32
×5
1
4
in.)
Mass (excluding accessories)
Approx. 116 g (4.1 oz.)
Supplied accessories
• AC power adaptor • Charging stand
• External battery • Rechargeable battery
case with cover
• Battery carrying case • Carrying pouch
• Earphones • Remote control
• CD-ROM (SonicStage)
• Operating instructions
• Installation/Operating Guide
• AC plug adaptor (Supplied with tourist model)
US and foreign patents licensed from Dolby
Laboratories.
Design and specifications are subject to change
without notice.
Photo : RED

2
D-NE20/NE20LS
CAUTION
• INVISIBLE LASER RADIATION
WHEN OPEN
• DO NOT STARE INTO BEAM OR
VIEW DIRECTLY WITH OPTICAL
INSTRUMENTS
• CLASS 1M INVISIBLE LASER
RADIATION WHEN OPEN
• DO NOT VIEW DIRECTLY WITH
OPTICAL INSTRUMENTS
Flexible Circuit Board Repairing
•Keep the temperature of the soldering iron around 270 °C
during repairing.
•Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
•Never reuse a disconnected chip component.
•Notice that the minus side of a tantalum capacitor may be
damaged by heat.
On AC power adaptor
• Use only the AC power adaptor supplied.
If your CD player is not supplied with the
one, use the AC-E30HG AC power
adaptor. Do not use any otherAC power
adaptor. It may cause a malfunction.
Polarity of the plug
• Do not touch the AC power adaptor with
wet hands.
• Connect the AC power adaptor to an easily
accessible AC outlet. Should you notice an
abnormality in the AC power adaptor,
disconnect it from the AC outlet
immediately.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0OR DOTTED LINE
WITH MARK 0ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
•Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
Terminals
• To clean the terminals
If the terminals on the charging stand become
dirty, the battery may not be charged properly.
Clean the terminals with a cotton swab or a
dry cloth periodically as illustrated below.
CAUTION
Use of controls or adjustments or performance of procedures
otherthanthosespecified herein may result in hazardous radiation
exposure.

3
D-NE20/NE20LS
TABLE OF CONTENTS
1. SERVICING NOTES ................................................ 4
2. GENERAL ................................................................... 5
3. DISASSEMBLY
3-1. Disassembly Flow ........................................................... 6
3-2. Lid Upper Assy................................................................ 7
3-3. Cabi Mid Sub Assy .......................................................... 8
3-4. EGH Board, JACK Board, JACK SUB Board,
CD Mechanism Deck (CDM-3325ERV)......................... 9
3-5. Window (LED), Button (Control) ................................... 10
3-6. Turn Table Motor Assy (M901),
Sled Motor Assy (M902),
Optical Pick-up (DAX-25EV) ......................................... 10
4. ELECTRICAL CHECKING.................................... 11
5. DIAGRAMS
5-1. Block Diagram ................................................................ 13
5-2. Printed Wiring Board – EGH Board (Side A) – ............. 14
5-3. Printed Wiring Board – EGH Board (Side B) – ............. 15
5-4. Schematic Diagram – EGH Board (1/3) –...................... 16
5-5. Schematic Diagram – EGH Board (2/3) –...................... 17
5-6. Schematic Diagram – EGH Board (3/3) –...................... 18
5-7. Printed Wiring Board – JACK Board (Side A),
JACK SUB Board, SUB Board – .................................... 19
5-8. Printed Wiring Board – JACK Board (Side B) –............ 20
5-9. Schematic Diagram – JACK Board,
JACK SUB Board, SUB Board – ................................... 21
6. EXPLODEDVIEWS
6-1. Overall Assy .................................................................... 27
6-2. Cabinet (Lower) Section.................................................. 28
6-3. CD Mechanism Section (CDM-3325ERV) ..................... 29
7. ELECTRICAL PARTS LIST .................................. 30
You can play discs on this CD player.
Audio CDs:
CD-DA format CDs
CD-DA (Compact Disc Digital Audio) is a recording standard used for Audio CDs.
ATRAC CDs:
CD-R/CD-RW on which audio data compressed in the ATRAC3plus format
has been recorded by using SonicStage*
ATRAC3plus (Adaptive Transform Acoustic Coding3plus) is audio compression
technology that satisfies the demand for high sound quality and high compression
rates. ATRAC3plus can compress audio files to about 1/20 of their original size at 64
kbps.
Bit rates and sampling frequencies this CD player can play are:
Up to 62 characters can be displayed on this CD player.
MP3 CDs:
CD-R/CD-RW on which audio data compressed in the MP3 format has
been recorded by using a software other than SonicStage*
Bit rates and sampling frequencies this CD player can play are shown below. Variable
Bit Rate (VBR) files can also be played.
This CD player conforms to Version 1.0/1.1/2.2/2.3/2.4 of the ID3 tag format. ID3 tag
is a format for adding certain information (track name, album name, artist name, etc.)
to MP3 files. Up to 64 characters of ID3 tag information can be displayed on this CD
player.
CD-Extra and Mix-Mode CDs:
CD-R/CD-RW on which CD-DA format data and CD-ROM format data are
recorded together.*
If you cannot play your CD, change the "CD-EXTRA" setting in the OPTION menu.
Then you may play your CD.
An ATRAC CD on which audio data compressed in the MP3 format has been recorded
using software other than SonicStage can also be played.
With SonicStage, you cannot create a CD on which mixed format audio data is recorded.
* Only ISO 9660 Level 1/2 and Joliet extension format discs can be played.
Music discs encoded with copyright protection technologies
This product is designed to play back discs that conform to the Compact Disc (CD)
standard. Recently, various music discs encoded with copyright protectiontechnologies
are marketed by some record companies. Please be aware that among those discs,
there are some that do not conform to the CD standard and may not be playable by
this product.
Bit rates Sampling frequencies
ATRAC3plus 48/64/256 kbps 44.1 kHz
ATRAC3 66/105/132 kbps 44.1 kHz
Bit rates Sampling frequencies
MPEG-2 Layer3 8 - 160 kbps 16/22.05/23 kHz
MPEG-2.5 Layer3 8 - 160 kbps 8/11.025/12 kHz
MPEG-1 Layer3 32 - 320 kbps 32/44.1/48 kHz

4
D-NE20/NE20LS SECTION 1
SERVICING NOTES
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
During normal operation of the equipment, emission of the laser
diode is prohibited unless the upper lid is closed while turning ON
the S501. (push switch type)
The following checking method for the laser diode is operable.
• Method:
Emission of the laser diode is visually checked.
1. Open the upper lid.
2. With a disc not set, turn on the S501 with a screwdriver having
a thin tip as shown in Fig.1.
3. Press the ubutton.
4. Observing the objective lens, check that the laser diode emits
light.
When the laser diode does not emit light, automatic power
control circuit or optical pickup is faulty.
In this operation, the objective lens will move up and down 4
times along with inward motion for the focus search.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
S501
lever (lid detection)
lever (lid detection)
JACK BOARD
Fig. 1 Method to push the S501

5
D-NE20/NE20LS
SECTION 2
GENERAL This section is extracted
from instruction manual.
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Remote display

6
D-NE20/NE20LS SECTION 3
DISASSEMBLY
3-1. DISASSEMBLY FLOW
Note: Disassemble the unit in the order as shown below.
3-3. CABI MID SUB ASSY
(Page 8)
3-2. LID UPPER ASSY
(Page 7)
3-4. EGH BOARD, JACK BOARD,
JACK SUB BOARD,
CD MECHANISM DECK
(CDM-3325ERV)
(Page 9)
3-5.WINDOW(LED),
BUTTON(CONTROL)
(Page 10)
3-6.TURN TABLE MOTOR ASSY(M901),
SLED MOTOR ASSY(M902),
OPTICAL PICK-UP(DAX-25EV)
(Page 10)
SET

7
D-NE20/NE20LS
Note: Follow the disassembly procedure in the numerical order given.
3-2. LID UPPER ASSY
6
7
3
bracket (hinge R)
4 bracket (hinge L)
1 Push two knobs and
open the lid upper.
2 two screws (upper lid)
8 lid upper assy
5 Close the cover until the tip of the cover of the
top cover assembly is left open by 5 mm,
then slide the top cover assembly in the
direction of the arrow.

8
D-NE20/NE20LS
3-3. CABI MID SUB ASSY
1 screw
4 open knob (L)
5 open knob (R)
3 spring (lock claw)
6 spring (upper lid
)
7 cabi mid sub assy
spring (lock claw)
open knob (R) open knob (L)
2 eight screws
battery terminal board (+)
Note: It is recommended to visually check that the battery terminal board (+) is
installed in the specified position after assembling the cabi mid sub assy
because, in some cases, the battery terminal board (+) cannot be housed
when assembling the cabi mid sub assy.

9
D-NE20/NE20LS
3-4. EGH BOARD, JACK BOARD, JACK SUB BOARD, CD MECHANISM DECK (CDM-3325ERV)
4
6
EGH board
7 two insulators
7 insulator
8 CD mechanism deck
(CDM-3325ERV)
5 flexible board (CN601)
0 JACK board
qg JACK SUB board
qf three claws
assembly: the cable pass on three claws.
2 connector (2pin)
1 connector (4pin)
3 connector (3pin)
qd SUB board
(battery terminal board (+))
qa battery terminal
board (–)
9 Remove solder of the JACK board.
qs Remove solder of the JACK board.

10
D-NE20/NE20LS
3-5. WINDOW (LED), BUTTON (CONTROL)
1 screw
2 window (led)
3 button (control)
2 gear cover
4 optical pick-up (DAX-25EV)
3 sled motor assy (M902)
6 turn table motor assy (M901)
1 three screws
(B
1.7 × 4 )
5 three screws
(B
1.7 × 4 )
3-6. TURNTABLE MOTOR ASSY (M901), SLED MOTOR ASSY (M902), OPTICAL PICK-UP (DAX-25EV)

11
D-NE20/NE20LS
SECTION 4
ELECTRICAL CHECKING
The CD section adjustments are done automatically in this set.
In case of operation check, confirm that RF level.
Precautions for Check
1. Perform check in the order given.
2. UseYEDS-18 disc (Part No.: 3-702-101-01) unless otherwise
indicated.
3. Power supply voltage requirement : DC1.5V in battery termi-
nals.
VOLUME button : Minimum
HOLD switch : OFF
Checking Location:
TP608
IC604
(RF)
TP602
(GND A)
[EGH BOARD] (SIDE B)
RF Level Check
Condition:
• Hold the set in horizontal state.
Connection:
Procedure:
1. Connect the oscilloscope to the test points TP608 (RF) and
TP602 (GND A) on the EGH board.
2. Set a disc. (YEDS-18)
3. Press the ubutton.
4. Check the oscilloscope waveform is as shown below.
A good eye pattern means that the diamond shape (◊) in the
center of the waveform can be clearly distinguished.
RF Signal referenceWaveform (Eye Pattern)
VOLT/DIV : 100 mV (With the 10:1 probe in use)
TIME/DIV : 500 ns
To watch the eye pattern, set the oscilloscope to AC range and
increase the vertical sensitivity of the oscilloscope for easy
watching.
5. Stop revolving of the disc motor by pressing the xbutton.
Oscilloscop
e
(AC range)
+
–
EGH board
TP608 (RF)
TP602 (GND A)
2 k
Ω
RF level
0.55 to 0.6 Vp-p

12
D-NE20/NE20LS SECTION 5
DIAGRAMS
Note on PrintedWiring Boards.
•X: parts extracted from the component side.
•Y: parts extracted from the conductor side.
•: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
Caution:
Pattern face side: Partsonthe patternface side seen from
(Side B) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Side A) the parts face are indicated.
•These boards are multi-layer printed board. However, the paterns
of intermediate-layer have not been included in the diagram.
•Waveforms
– EGH Board –
540 mVp-p
1 TP608 (RF)
3.0 Vp-p
2 IC603 <z/b> EXTAL
44.1 ns
200 mV/DIV, 400 ns/DIV
1 V/DIV, 20 ns/DIV
Note on Schematic Diagrams.
•All capacitors are in µF unless otherwise noted. (p: pF) 50 WV or
less are not indicated except for electrolytics and tantalums.
•All resistors are in Ωand 1/4W or less unless otherwise specified.
• f: internal tolerance.
•C: panel designation.
•A: B+ Line.
•Total current is measured with CD installed.
•Power voltage is dc 1.5 V and fed with regulated dc power supply
from battery terminals.
•Voltages and waveforms are dc with respect to ground in playback
mode.
no mark : CD PLAY
∗ : Impossible to measure
•Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal production toler-
ances.
•Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production toler-
ances.
•Circled numbers refer to waveforms.
•Signal path.
J: CD
c: DIGITAL OUT
•Abbreviation
CH : Chinese model
EE : East European model
JE :Tourist model
KR : Korean model
Note: The components identified by mark 0or dotted
line with mark 0are critical for safety.
Replace only with part number specified.

1313
D-NE20/NE20LS
D-NE20/NE20LS
5-1. BLOCK DIAGRAM
RSTB5
55
WAKE38
RECHARGEABLE
BATTERY
NH-14WM
1PCS. 1.2V
(FOR STAND CHARGER)
REG
Q402
54
CRF
64
DCIN
50
RS
78
PWRSW1
53
CINW
10
VM-U
101
SW
105
VIN
7
VM-VW
81
PWRSW2
IC401(2/2)
POWER CONTROL
Q403
CHARGE
SWITCH
49
CHGSW
70
VIN12
66
VO2
61
VIN34
VM2325
VM2
22
VCC266
J402
(FOR STAND CHARGER)
J401
67
BATM1
VIN
RMCRB
39
CHGWON
SWITCH
Q401
SWITCH
Q404
VCC1VCC1
VCC2
74
VCC1
98
VM327
VCC297
VD B3
VD T
2
LATCHB
32
84
97
85
86
128
102
127
111106
105
151
144
139
140
142
141
112
LINEOUT
(OPTICAL)
J301
VCC1
R-CH
R-CH
R-CH
109
VCC2
SWITCH
Q406
LED DRIVER
OPR
Q601
D501
VDD CONTROLLER
Q402,403
MUTING CONTROL
Q302,303
MUTING
CONTROL
Q304,305
IN1
3
MCK
1
EN2
11
EN1
4
VDD0
VDD0
7
8
6
OUT1
HP AMP
IC3007
SYSTEM CONTROLLER
IC603
ADDSEL0
NCS1
NRD
KEY CONTROLLER
IC401
BUFFER
IC403
VG
24
27
32
19
.
XWE
15
LDQW
14
XCAS
16
XCS
18
XRAS
17
CLK
35
CKE
34
UDQW
36
DQ16
DQ1
SDDQ16
SDDQ1
A1-A19
D0-D-15
SDA11
SDA0 A11
A0
S-RAM
IC604
2,3,5,
6,8,9,
11,12,
39,40,
42,43,
45,46,
48,49,
12,13,
15,16,
21,22,
18,19,
25-28,
30,31,
34,36,
51,52,
57,58,
60,61,
63,64,
66,67,
69,70,
DOUT
PF6/DBG6/X PLUG DTC
PF7/DBG7/X METAL DTC
AOUTL
AOUTR
PWML
XTAN
EXTAL
RFAC
RFDC
FE(A)
SE(B)
FE(A)
SE(B)
CE(E)
TE(F)
167 FFDR
PWMR
DAMPCLK
PJ7/MON7(MON CK)
PJ6/MON6(MONDO)
33
XSDWE
40
SOUDQW
41
XSDCAS
42
XSXCS
44
XSDRAS
47
SDCLK
45
SDCKE
48
SDUDQW
129 218
PD4/INT4
XRST
AN6
XADEVENT
212
204
195
203
PE2/DTCK
8
AN4
197
P15
77
PG3
185
P14/AIFPCMD
78238
183 182
PG5 PG6
194
AN7
202
41
WAKE
132
PF2/DBG2
201
AN0
175
PC3/XCS0
LED2 LED1
S502
S501
(OPEN/CLOSE) > HOLD
ON
OFF
SWITCH
Q602
SWITCH
Q401
SWITCH
Q405
POWER
CONTROLLER
IC402
+2V REG
IC606
X601
22.579MHz
168 FRDR
165 TFDR
166 TRDR
163 SFDR
164 SRDR
169 MDP
OPTICAL PICK-UP
BLOCK
(DAX-25EV)
RF
A
B
E
F
F+
F-
T+
T-
S+
S-
LD
DETECTOR
LASER
DIODE
VCC
PD
FOCUS
C0IL
TRACKING
COIL
SLED
MOTOR M
SPINDLE
MOTOR
VCC1
VCC3 2V
COIL/MOTOR DRIVER
IC401(1/2)
PAPC
89
63
13
17
42
F13
41
R13
43
44
34
47
48
VAPC
F12
R12
APWM
35
PWM
FO1
21 FO2
RO1
26
28
FO3
RO3
24 RO2
F11
R11
171 C176
33
SYNC
181 PG7
37
COLDST
177 PC1/SO0
36
DATA
178 PC0/SCK0
30
CLOCK
214 PD2/INT2/ECIN
199 AN2
23
FG
12 CPV1
107 CPW1
8CPU1
11 COM
9UO
6VO
4WO
M902
M901 U
COM
V
W
FUNCTION
KEY
S503,504,506,508,510
200 AN1
FUNCTION
KEY
S505,507,509
• R-CH is omitted due to same as L-CH.
• Signal Path
: CD
: DIGITAL OUT
W401
W402
MUTE
Q307
MUTE
Q306
A19
22
CE
31
OE
37
A0-A15
P2ROM
IC605
JE, HK, KR, CH
1,2
5-8,
11-15,
17-20,
23-25,
30
D0-D15
26-29,
32-35,
38,39,
41,42,
44-47
219
237
240
255
EEPROM
IC602
6
5
2
1
SCK
DI
DO
XCS
176 PC2/SI0
4PE3
RF AMP
IC601
10
12
11
15
SENB
SDATA
SCLK
RFOUT
17 RFIN 75 P17/AIFBCK

1414
D-NE20/NE20LS
D-NE20/NE20LS
5-2. PRINTED WIRING BOARD – EGH BOARD (SIDE A) –
:Uses unleaded solder.
IC3007
IC403
IC603**CSP
(Chip Size Package)
IC602
IC601
IC605
IC606
**CSP
(Chip Size Package)
R622
EGH BOARD (SIDE A)
A
JACK
BOARD
CN9002
(Page 19)
OPTICAL PICK-UP
BLOCK
(DAX-25EV)
1-863-862- (11)
11
EXCEPT
AEP, UK, EE
AEP, UK, EE
JE, HK, KR, CH
• Semiconductor
Location
Ref. No. Location
IC403 D-4
IC601 C-9
IC602 D-8
IC603 C-7
IC605 C-10
IC606 A-7
IC3007 D-3
Q601 C-5

1515
D-NE20/NE20LS
D-NE20/NE20LS
5-3. PRINTEDWIRING BOARD – EGH BOARD (SIDE B) –
:Uses unleaded solder.
IC401
IC402
IC604 **CSP
(Chip Size Package)
R624
R625
R621
C631
R616
C617
1-863-862- (11)
11
EGH BOARD (SIDE B)
(RF)
(GND A)
1
3
5
4
• Semiconductor
Location
Ref. No. Location
D401 C-8
D405 A-8
IC401 C-9
IC402 C-8
IC604 B-3
Q401 D-8
Q402 C-6
Q403 D-7
Q404 B-8
Q405 B-8
Q406 B-7
Q602 C-6

1616
D-NE20/NE20LS
D-NE20/NE20LS
5-4. SCHEMATIC DIAGRAM – EGH BOARD (1/3) –
21
17
18
IC401
Q405
Q404
Q401
D405
TP618
R414
C401
C415
C434
C432
L408
C418
R430 C419
C421
R431 R436
R432
C420
R404
C422 C445
R429
R427
R426
R446
C446
C414
R424
R437
C413
C411
C412
FB401
C447
L403
L401
C408
L410
TP405
C440 C441 C442 C443
C429
C427
C426
C437
C448
FB402
TP404
L404
L407
R406
R407
C428
C430
R417
R421
R401
R405
R408
C435
C402
C405
C449
C439
L405 L402
R423
C431
C423
C450
L409
R409
TP403
R402
R435
C444
L406
C424
R428
C416
C417
C410
C409
CN9001
SC901590VAR2
QS6K1
QS6K1
DTC115TE-TL
MA785-(TX),SO
4.7k
0.1
0.01
2.2
10
0.1
1M 0.01
1
1M
1k
1k 0.1
1M
10.1
22k
2.2M
47k
10k
1
4700p
1M
1k
0.01
0.1
0.1
0H
1
0.22
VIN
47
6.3V 0.1 0.1 0.1
22
6.3V
22
6.3V
47
6.3V
47
6.3V
0.1
0
P_GND
0
0
10
6.3V
47
6.3V
100
100k
100k
100k
100k
4.7
0.01
0.047
100p
0.22
4.7k
47
6.3V
47
6.3V
1
47k
VCC1
100k
47k
47
6.3V
0.22
47k
0.22
0.22
0.01
0.01
50P

1717
D-NE20/NE20LS
D-NE20/NE20LS
5-5. SCHEMATIC DIAGRAM – EGH BOARD (2/3) –
16
18
C602
RB601
Q602
IC601
TP601
TP604
TP609
TP622
TP623
TP624
TP625
TP626
TP629
C678
C664
TP615
TP614
TP612
TP613
TP616
TP619
TP620
TP607
TP621
TP611
TP610
IC606
Q601
CN601
C694
C609
C611
C604
C613
R617
R601
R615
R616
C605
C607
C631
C619
C695
C618
C617
C626
C629
C649 C654
C653
C650C648
C610 C603
C659
R642
R650
R639
R637
R635
R628
R629
R621
R618
R624
R614
C677
C680
C681
C667
R653
R613
R644
R604
R612
R606
C639 C645
TP617
R610
R636
R655
R611
C608
R602
C614
C627
R625 C646
R620
R623
R651
R634
IC602
R608
R603
TP627
TP630
TP602
C612
R609
C606
TP608
C601
C676
IC603
R649
X601
470p
22k
2SA1832FV
(TH3SONY)
CXD9839K-G
OPGSW
OPSTB
TEST
MON1
MON2
MON3
MON4
MON5
PI1
22
6.3V
47
6.3V
CS
DO
SK
DI
GND
EXT_FLASH&SRAM_V
PD7
PD5
PD1
XC6213B212NR
XP4214-TXE
15P
0.1
2200p
0.01
0.1
0.1
10k
220k
220k
470k
0.22
0.01
0.1
4700p
4700p
4700p
4700p
1
0.1
0.47 0.1
0.47
4700p0.1
11
0.1
47k
100k
47k
220k
1M
2.2k
2.2k
1k
1k
10k
0
0.1
6p
6p
0.1
10k
0
47
220k
EXCEPT
AEP, UK, EE
AEP, UK, EE
100k
0
0.1 0.22
VCC2
22k
100k
100k
0
22p
10k
0.047
226.3V
10k 0.1
47k
10k
100k
10k
AK6510CL-L
47k
10
ADDSEL_1
ADDSEL_0
GND_A
0.1
22k
0.01
RF
22
6.3V
0.1
CASINO1
22k
22.579MHz
R622 220k
•See page 12 forWaveforms. •See page 22 for IC Block Diagram. •See page 22 for IC Pin Function Description.

1818
D-NE20/NE20LS
D-NE20/NE20LS
5-6. SCHEMATIC DIAGRAM – EGH BOARD (3/3) –
16
17
IC403
Q406
C202
C103
C102
C404
L412
IC605
JE, HK, KR, CH
IC604
Q402
IC3007
IC402
C689
C687
R607 R420
R410
R412
R415
R418
R419
R201
R101
R302
R403
C425
C436
C201
FB201
FB101
C3089
C403
D401
R411
R413
C433
C438
R102
R202
R619
C686
Q403
LMV301MGX/NOPB
DTA115TE
220
4V
220
4V
100
4V
100
6.3V
MR27T1602F
MSM56X16160F-20T
EMX1T2R
NJU8713V-TE2
NCP1400ASN22T1G
0.1
0.1
0
10k
47k
2.2k
100
22k
1k
100
100
100
100k
1
0.47
1
0H
0H
0.1
10
RB521S-30FTE61
10k
10k
0.047
1
100k
100k
0H
47
6.3V
EMT1T2R
•See page 22 for IC Block Diagrams.

1919
D-NE20/NE20LS
D-NE20/NE20LS
5-7. PRINTEDWIRING BOARD – JACK BOARD (SIDE A), JACK SUB BOARD, SUB BOARD –
:Uses unleaded solder.
IC401
JACK BOARD (SIDE A)
S501
(OPEN/CLOSE)
D501
TP9007
OPR
J301
2/ LINE OUT
(OPTICAL)
AEGH BOARD
CN9001
(Page 14)
M901
SPINDLE
MOTOR
M902
SLED
MOTOR
J402
(FOR STAND CHARGER)
SUB BOARD
RECHARGEABLE
BATTERY
NH-14WM
1.2V 1350mAh
JACK SUB BOARD
J401
(FOR STAND CHARGER)
1-864-412- (11)
11
1-864-413- (11)
11
1-864-411- (11)
11
D401
1
3
6
4
• Semiconductor
Location
Ref. No. Location
D401 F-8
D402 E-8
D501 A-3
D901 B-3
D903 C-3
D905 F-7
D906 F-8
IC401 E-7
Q301 B-4
Q302 C-4
Q306 B-3
Q307 B-3
Q401 E-7
Q402 F-8
Q403 E-6

2020
D-NE20/NE20LS
D-NE20/NE20LS
5-8. PRINTED WIRING BOARD – JACK BOARD (SIDE B) –
:Uses unleaded solder.
EXCEPT
AEP,EE,UK
JACK BOARD (SIDE B)
S502
ON
OFF
HOLD
^+= p
VOL
1-864-411- (11)
11
• Semiconductor
Location
Ref. No. Location
D902 C-3
D904 D-6
Q303 C-7
Q304 C-7
Q305 D-7
Ver. 1.1