Sony Disman D-25 User manual

SERVICE MANUAL
CD section
System
Laser diode properties
Error correction
D-A conversion
Frequency response
Dynamic range
Signal-to-noise ratio
Wow and flutter
Outputs (at 9V input level)
“Measured by EIAJ CP-307
* Measured by ElAJ CP-307
General
Power requirements
Power consumption
Dimension
Weight
Supplied accessories
Note: Use only the supplied AC power adaptor or the recommended car ° 4
battery cord manutactured by Sony. Polarity of the plugs of other Sr
Manufacturers may be different. oa
CAUTION
MICROFILM result in hazardous radiation exposure.
@ Use of controls or adjustments or performance of
procedures other than those specified herein may
US Model
Canadian Model
D-25
AEP Model
UK Mode/
E Model
Australian Model
D-250
DSthan
SPECIFICATIONS
Compact disc digital audio system
Material: GaAlAs
Wavelength: 780nm
Emission duration: Continuous
Laser output: Less than 44.6 uW
*This output is the vaiue measured at a distance of about
200mm from the objective lens surface on the Optical
Pick-up Block.
Sony Super Strategy Cross Interleave Reed Solomon Code
16-bit linear, 4 fs digital filter
20-20,000 Hz +1dB*
More than 90dB*
More than 85dB
Below measurable limit *
Line output (stereo minijack)
Output level 0.7V rms at 50kilohms
Load impedance over 10 kilohms
Headphones (stereo minijack)
9mW+9mMW at 32o0hms
Supplied rechargeable battery pack BP-2 or BP-100 (optional)
DC IN 9V jack accepts:
Supplied AC power adaptor
_ Sony CPM-100P car mount plate (optional) or Sony
DCC-120A car battery cord (optional) for use on 12V car
battery
1.9W DC
Approx. 125.8x20.8 x 134.6 mm (5x74, «5% in.) (w/hid)
not incl. inclined part (depth), projecting parts and controls
Approx. 127.3x24.1x 136.2 mm (54%4*34,x5%% in.) (wih/d)
inci. projecting parts and controls
Approx. 380g (13.502), not incl. rechargeable battery
Approx. 460g (1 1b) incl. rechargeable battery
AC power adaptor (1)
Rechargeable battery pack (1)
Carrying case (1)
Connecting cord (1) (stereo miniplug <> two phono piugs)
COMPACT DISC COMPACT PLAYER
SONY.

D-25/250
TABLE OF CONTENTS
Section Title Page Section Title Page
Specifications 2. gos ek ee Site oh EA RR 1 3. ELECTRICAL ADJUSTMENTS ....... 6
1. GENERAL 4. DIAGRAMS
Location and Function of Controls ......... 2 4-).0 “Waveforms: 4) oc) kes 2548 4 Be oe 12
4-2. Semiconductor Lead Layouts ......... 13
2. SERVICING NOTES 4-3. Printed Wiring Boards .............. 14
Notes on Handling the Optical Pick-up Block... 3 4-4. Schematic Diagram ie a ae Ca 17
Flexible Circuit Board Repairing ........... 3 4-5. IC Block Diagram ................. 20
Notes on Chip Component Replacement ...... 3
Before Replacing the Optical Block ......... 3 5. EXPLODED VIEWS............... 22
Notes on Laser Diode Emission Check ....... 4 :
Laser Diode Check Procedure ............. 4 6. ELECTRICAL PARTS LIST......... 26
Service. Mode (service program) ............ 5
SECTION 1
GENERAL
| Meler-}i (ola Mr: lae Mm al Ulaveitce) a Mme) |
Oren (ce) t
HOLD switch
Slide this switch to the right so that its
Orange mark appears. This locks the
buttons to prevent
them from being accidentally
depressed.
<4 BP} (AMS/ISEARCH/
PHONES (headphones) 1! (play/pause) button
INDEX) buttons
Jack (stereo minijack)
mw STOP button
OPEN button
Display window
Normally the track number and the elapsed
Playing time are shown.
When the power is supplied through the
DC IN 9V jack, the window will light up. LINE OUT jack
VOLUME control {stereo minijack)
(for
headphones
listening)
DC
IN
9V
(external
power
input)
jack
REMOTE
control
jack
Connect the optional remote contro! kit.
EY
MODE
(AMS*/
*
AMS
is
the
abbreviation
of
Automatic
Music
Sensor.
SEARCH/INDEX)
button
ENTER/REMAIN button
PLAY MODE button

D-25/250
SECTION 2
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-
UP BLOCK
The laser diode in the optical pick-up block may
suffer electrostatic breakdown because of the poten-
tial difference generated by the charged electrostatic
load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-
down and also use the procedure in the printed
matter which is included in the repair parts.
Flexible Circuit Board Repairing
1. Keep the temperature of the soldering iron at
270° +10°C during repairing.
2. Do not touch the soldering iron more than 4
seconds or 3 times on the same conductor of
the circuit board.
3. Do not apply force on the conductor when
soldering or unsoldering.
Notes on chip component replacement
@ Never reuse a disconnected chip component.
® Notice that the minus side of a tantalum capacitor
may be damaged by heat.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK A OR DOTTED
LINE WITH MARK A ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
Before Repiacing the Optical Block
Please be sure to check thoroughly the parameters
as par the “Optical Block Checking Procedures”
(Part No.: 9-960-027-11) issued separately before
replacing the optical block.
Note and specifications required to check are given
below.
@ FOK output: IC501 (9) pin
When checking FOK, remove the lead wire to disc
motor and unsolder and open IC801 (24) pin.
@ Scarve P-to-P value: 2.95 Vp-p
@ Adjusted part for focus gain adjustment: RVS505
@ RF signal P-to-P value: 0.75 — 1.4 Vp-p
@ Traverse signal P-to-P value: 1.8 Vp-p
@ The grating holder can not repair.
@ Adjusted part for tracking gain adjustment: RV501
ATTENTION AU COMPOSANT AYANT RAPPORT
A LA SECURITE!
LES COMPOSANTS IDENTIFIES PAR UNE MARQUE /\
SUR LES DIAGRAMMES SCHEMATIQUES ET LA LISTE
DES PIECES SONT CRITIQUES POUR LA SECURITE
DE FONCTIONNEMENT. NE REMPLACER CES COM.
POSANTS QUE PAR DES PIECES SONY DONT LES
NUMEROS SONT DONNES DANS CE MANUEL 0U
DANS LES SUPPLEMENTS PUBLIES PAR SONY.

D-25/250
NOTES ON LASER DIODE EMISSION CHECK Procedrue 2 (service mode or normal operation)
Check by the curent with flows in the laser diode.
The laser beam on this model is concentrated so as to
be focused on the disc reflective surface by the objec-
tive lens in the optical pick-up block.
when checking the laser diode emission, observe,
Therefore,
from more than 30 cm away from the objective lens.
Laser Diode Check Procedure
The laser diode on this set will not emit unless the
top panel is closed and $901 (leaf SW type) is turned
on. The laser diode will always emit even if focus
search is not performed in service mode.
The laser diode is checked using the current value
which flows to the laser diode inside the UPF.
Procedure 1! (service mode or normal operation)
Check the laser diode emission with the eye.
1. Open upper panel.
2. S901 on as Fig. |.
(In service mode, this operation is not neces-
sary.)
3. Pressthe PH key.
(In service mode, this operation is not neces-
sary.)
4. Observe the objective lens and confirm that
the laser diode is emitting light. At this time,
the laser diode goes on about 10 seconds due
to focus serarch. If it does not, APC circuit
or UPF is defective.
Fig. 1 Turning S907 on
1. Close the top panel.
2. Remove the main board and read the current
value on the label affixed to the UPF.
(Label on UPF)
KSS-165A
JAPAN
$123
current value
This means 49.9 mA.
The current value varies with the set.
3. Connect a VOM as shown in Fig. 2.
4. Press the > §B key.
5. Calculate the current by the VOM reading.
VOM reading (V) + 10 = current (A)
ex. VOM reading = 0.49 V
0.49 = 10 = 0.049 (A) = 49 (mA)
6. Confirm that the ammeter reading is within
the range given below.
value on label*#, mA (25°C)
variation relative to temperature:
0.4 mA/PC
(Current increases when temperature rises
and decreases when it drops.)
If the value is more than the range given,
APC circuit has been defective or the laser
diode has deteriorated, If it is less, APC
circuit or UPF is defective.
~ servo board —
VOM
(dc 3 V range)
Fig. 2 VOM Connection

SERVICE MODE (service program)
This set has built-in service program in the micro-
computer as usual sets.
The operation method of service program is ex-
plained below.
{ ]: Main operation in service mode
for details, refer to step 2.
@ (STOP)
[servo alt off]
PER (PLAY/PAUSE)
[ FOCUS on and CLV-S ]
mode (RUN-UP mode) on
PPIIFF)
eis goes to ari)
circum ference.
KEY-MODE
king servo and
HOLD [144(FR) rec
OFF +ON eas goes to inal sled serva.on |
REMAIN circumference.
(display stop]
Be sure to set HOLD switch OFF.
If not key inputs can not be operated.
Fig. 3 Key Positions
Step 1 (Service Mode setting method)
1. Turn the HOLD switch OFF with the external
power supply not plugged in (no power applied
to set) and press the PME key.
2. Solder jumper TEST point.
(IC801 pin (9) (BAT-E) pin is grounded.
3. Plug in external power supply.
This puts the set into service mode.
— main board —
Step 2 (Service Mode operation)
1. When service mode is set, the display will
change 6 times, and those 6 changes will be
repeated over and over.
With this the LCD display should be present
in service mode. Even if LCD does not display,
other operations will be performed.
2. When DP] or Ke key is pressed, the UPF moves
to the inside or outside circumference. Tracking
servo and sled servo go off when this is done, so
press KEY-MODE to turn on the tracking servo
if necessary.
3. When REMAIN is pressed, the display stops.
When REMAIN is released, the display con-
tinues to change. This allows check of each
segment.
4. When Pf key is pressed, CLV-S (pull-in mode)
starts while performing focus search. When
there is no disc installed, focus search is re-
peated several times while disc motor is rotating.
5. When KEY-MODE is pressed, tracking servo,
sled servo and CLV-A (servo during PLAY) go
ON.
6. When 4 and 5 are performed, the disc begins to
play. At this time, the top panel should be
closed and S901 are to be ON.
7. All servo (focus, tracking, sled and spindle) go
off when Ml key is pressed. But disc motor
continues rotating for a while by inartia.
Step 3 (Service Mode release)
1. First be sure to unplug the external power
supply, then remove the TEST point solder
jumper.
2. The set will now operated normally.
TEST
Solder jumper for service mode.
Gane checking or adjusting in service Hees)
be sure to remove this solder jumper.
Fig. 4 TEST Point Position
—5—
SECTION 3
ELECTRICAL ADJUSTMENTS
Notes on Adjustment
1. Perform adjustments except for RECHARGEA-
BLE VOLTAGE ADJUSTMENT and BATTERY
DISPLAY ADJUSTMENT in service mode. Be
sure to release service mode after completing
adjustment.
(Refer to ‘Service Mode (service program)” on
page 5.)
2. Perform adjustments in the order given.
3. Use YEDS-18 disc (part No.: 3-702-101-01) unless
otherwise indicated.
4. Power supply voltage: DC 9 V
HOLD switch: OFF
PREPARATION
Put the set into service mode (see page 5) and per-
form the following checks. Repair if there are any
abnormalities.
@ Sled Motor Check
1. Press the OPEN button and open the top panel.
2. Press thepP{ , Kd keys and make sure that the
UPF moves smoothly, without catching, from the
inmost > outmost > inmost circumference.
ph: UPF moves outward
Kd: UPF moves inward
@ Focus Search Check
1. Press the OPEN button and open the top panel.
2. Press the PHB key.
continuously.)
(Focus search is performed
3. Observe the UPF objective lens and check that it
moves smoothly up and down with no catching or
noises.
4. Press the MI key.
Check that focus search operation stops. If it does
not stop, press the Mi key again longer than before.
But disc motor continues rotating for a while by
inartia.
VC (1/2 Vec) Connecting Point
FOCUS BIAS ADJUSTMENT
TRACKING BALANCE ADJUSTMENT
When the adjustments above are performed, connect
the C) side of oscilloscope to the point below.
oscilloscope
a
°
“RVSOS...” RVD!

Battery
Display
Adjustment
Rechargeable
Voltage
Adjustment
+6
V
Adjustment
+3.4
V
Adjustment
Adjustment
Procedure:
vom
Adjustment
Procedure:
vom
Adjustment
Procedure:
led
Adjustment
Procedure:
acre)
(de
range}
(dc
range)
main
board
main
board
+
TP
(RV)
+
7
13.4
V)0«———_—_1©
V)
=
TP
(VREF)
07-0
P16
Vio
wees
TP
(+3.4
V)
E
E
'
=
a
1€802
(7)
O~--
7
le
le
it
al
1. Connect the VOM to main board test point TP
(R.V).
2.
Apply
DC
9V
with
requrated
de
power
supply
from
external
power
jack
CN401.
F
‘
1.
Put
the
set
into
service
mode
(see
page
5).
1.
Apply
dc
+3.5
V
to
terminals
for
bult-in battery
(BP-2).
2. Insert the disc (YEDS-18) and put the set into
play mode.
3. Adjust RV801 so that main board 1C802 (11)
voltage and TP (VREF) voltage are equal.
4. If 1C802 @) voltage is heigher than TP (VREF)
voltage when turning the RV801 fully counter-
clockwise, short the jumper point (A) as shown
below and adjust RV801.
Adjustment Location: main board
1. Put the set into service mode (see page 5).
2. Connect the VOM to main board TP (+6 V).
3. Adjust RV401 for +6+40.!1 V reading on the
VOM.
2. Connect the VOM to main board test point TP
(+3.4 V).
3. Adjust the pattern connecting ( @ or ®) to
obtain 3.4 to 3.55 V reading on the VOM.
VOM reading
down
3. Adjust RV402 for 7.05 — 7.5 V reading on the
VOM.
Note:
Measure
after
the
VOM
reading
becomes
stable.
.
After
adjustment,
release
service
mode
(see
page
5).
Adjustment Location: main board
O: short X: open
4. After adjustment, release service mode (see page
5).
Adjustment Location: main board
Adjustment Location: main board
TP
(VREF)
TP(+6V)
1C802@
TP(R.V)

PLL Free Run Frequency Check and Adjustment Tracking Balance Adjustment Focus Bias Adjustment 8. Unplug the external power supply to stop spindle
Check/Adjustment
Procedure:
Conditions:
Conditions:
motor
from
rotating
and
remove
the
disc.
fi
The
set
should
be
placed
either
horizontally.
The
set
should
be
placed
either
horizontally.
9.
Remove
the
disc
and
connect
the
oscilloscope
to
requency
counter
i;
main
board
ICS02
@8)
(FE).
servo
board
:
oscilloscope
.
Adjustment
Procedure:
(DC
range)
Adjustment
Procedure:
peilomepe
TR
pi sania
I. Disconnect the jumper point @) (EFM) in the
diagram below.
(DC range] 10. Adjust RV503 again refering to the table followed.
servo board oscilloscope reading
more than +50 mV | Not adjust again.
TP
2kQ
;
;
(RE) O=—w—0 + +50 mV ~ #20 mV Adjust RVS5O3 again for +50 mV
VC (1/2 Vec) O O- reading on oscilloscope.
Sei 6. j i -
(See
page
6.)
+20
mV
~
—20
mv
Adjust
RV503
again
for
-20
mV
reading on oscilloscope.
servo board C)
TP
EL OS gen
VC (1/2 Vcc) 0-0 —
(See page 6.)
1. Connect the oscilloscope to servo board TP (TE).
2. Connect a frequency counter to servo board test
point TP (PLCK).
3. Put the set into service mode (see page 5).
oscilloscope
(DC range)
servo board
11. After adjustment, release service mode (see page
5).
1C502 @8) (FE) +
| :
VC
(1/2
Vec)
0-0
-
Adjustment
Location:
servo
board
(See page 6.)
. Put the set into service mode (see page 5).
3. Press the PPi and M4 keys to move the UPF to
the center.
4. Check that the frequency counter reading is
4.3218 +0.01 MHz. If not, adjust RV504 so that
it is 4.3218 +0.01 MHz.
. Insert the disc (YEDS-18) and close the top panel.
5. Press the POE key.
It will go from focus search to focus on, and
CLV pull-in mode state. Tracking and sled are
OFF.
5. After adjustment, release service mode (see page
5).
. Put the set into service mode (see page 5).
6. Short the jumper point shorted in step 1.
. Adjust RV502 so that the oscilloscope waveform
is symmetrical on the top and bottom in relation
to0dV.
Note: Take sweep time as long.as possible to obtain best
waveform.
. Connect the oscilloscope to servo board test point
TP (RF).
. Press the PPI and M4 keys to move the UPF to
the center. (Move the UPF to the music area on
the disc to enable easy visibility of the eye pat-
tern).
Check/Adjustment Locati
ee miceo2" Og aggre
on: servo board
ae Us oe E F
A A
1.3—2.3 Vp-pOV
OV 8
A=8
7. Unplug the external power supply to stop spindle
motor from rotating.
. Insert the disc (YEDS-18) and close the top panel.
. Press the PAB key.
[c will go from focus search to focus on, we]
CLV puil-in mode state. Tracking and sled are
OFF.
. Press the KEY-MODE button. (Tracking and sled
go ON.)
. Adjust RV503 so that the oscilloscope waveform
eye pattern is good. A good eye pattern means
that the diamond shape (0) in the center of the
waveform can be clearly distinguished.
. After adjustment, release service mode (see page
5).
Adjustment Location: servo board
RF Signal Reference Waveform (eye pattern)
VOLT/DIV: 200mV
TIME/DIV: 500nS
RK RK KY)
\Vi ny
;
TP (PLCK) RV504
EFM solder jumper point
( Disconnect for checking a
adjustment. Short after
checking and adjustment.
RF level
0.75 — 1,25 V
AMY)
A000
0000
WW)
RN
y
EFM solder
jumper point
When observing the eye pattern, set the oscillo-
scope for AC range and raise vertical sensitivity.
RVv502 TP(TE)

Focus/Tracking Gain Adjustment
A frequency responce analyzer or CD jig is necessary
in order to perform this adjustment exactly.
However, this gain has a margin, so even if it is slight-
ly off, there is no problem. Therefore, do not per-
from this adjustment.
Focus/tracking gain determines the pick-up followup
(vertical and horizontal) relative to mechanical noise
and metchnical shock when the 2-axis device operate.
However, as these reciprocate, the adjustment is at
the point where both are satisfied.
@ When gain is high, the noise when the 2-axis device
operates increases.
@ When gain is low, it is more susceptible to mecha-
nical shock and skipping occurs more easily.
This adjustment is to be performed when replacing
the following parts:
® optical pick-up block
@® RV505 (focus gain VR)
® RV501 (tracking gain VR)
Be careful not to move RV505 (focus gain volume)
and RVSO1 (tracking gain volume) ordinarily.
On this set, it is very difficult to simplify this
adjustment. For those sets on which symptoms
such as ‘‘occasional skipping” are hard to discover,
or it is hard to tell if the set has been repaired,
use the CD jig and perform this adjustment. Refer
to the diagram below for connection of the CD jig.
The adjustment procedure is described in the sepa-
rate CD Jig Instruction Manual.
CD Jig Connecting Procedure:
Remove the solder jumpers at the TE and FE loca-
tions and connect the DC jig.
(Connect the points on both TE and FE located on
the side of IC5O1 to the output to the CD jig, and
points located on the side of volumes to the input
from the CD jig.)
— servo board —
RV505 RVS5O0)
Te
+
i
4-1. WAVEFORMS
@ WR -'.ev
APPROX. l0OmVp-p
PLAY :
wlan
TT
APPROX. 500mVp - p
-1.6V
LKAKA)
WN
i
WY)
(
B5nSEC
- Ath
1.4Vp-p
80nSEC
-—
o /\/\y
2.4Vp-p
BOnSEC
o
3.5Vp-p
Sp SEC
t+»
eo JU
3.4Vp-p
SECTION 4
DIAGRAMS
4.5uSEC
+
algae
360nSEC
el
4.4Vp-p
i50nSEC
Joey
eff.
3.4Vp-p
lOOpSEC
[-——--+}
3.4Vp-p
100pSEC
+
®
3.4Vp-p
42nSEC
be}
e ‘\/\,
2.6Vp-p
42nSEC
S| 3.4V
® NI\y @ P| mun}
1.8Vp-p
——
0.4V
-——_—+|
SySEC
° JUL
3.4Vp-p
loySEC
ef LiL
3.4Vp-p
4.5ySEC
“Ul
4.IVp-p
2t0nSEC
J\IN\y
4Vp-p
210nSEC
-—+1
@
4.4Vp-p
2. 5ySEC
“iA
DURING FOCUS
SEARCH
4.5mSEC

4-2. SEMICONDUCTOR LEAD LAYOUTS
CXA12710 IMD2
XN4609
6
5
: Cs
as 4
2
3
6
re
1
4
eas
CXA12720-2 3
SLM125YW
Cathode
Anode
MARKING SIDE VIEW
CXP5086-0470
19
TOP VIEW
MPC1715FU
Note on Schematic Diagram:
All capacitors are in uF unless otherwise noted. pF: Mur
5OWV or less are not indicated except for electrolytics
and tantalums.
All resistors are in 2 and '/,W or jess unless otherwise
specified.
% + indicates tolerance.
ame - B+ Line
[__]: adjustment for repair.
Voltages and waveforms and total current are measured
with top panel closed.
Power voltage is dc 9 V and fed with regulated dc power
supply from external power voltage jack.
Voltage and waveforms are de with respect to ground in
service mode.
no mark: stop
( ): play
Voltages are taken with a VOM (input inpedance 1 MQ).
Voltage variations may be noted due to normal produc-
tion tolerances.
Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
Signal path.
7 CD
Switch
Position
a
msi
PLAY MODE
REMAIN/ENTER
KEY MODE
p>
i
See page 5 for setup of service mode.
Note: Note:
The components identi- Les composants identifiés par
fied by mark A\ or dot- | une marque A\sont critiques
ted tine with mark pour la sécurité.
are critical for safety. Ne les remplacer que par une
Replace only with part | piéce portant le numéro spéci-
number specified. fié.
Note on Mounting Diagram:
O——— : parts extracted from the component side.
——— _ : Parts extracted from the conductor side.
M@ : parts mounted on the conductor side.
@ =: Through hole.
2 : Pattern on the side which is seen.
poo > Pattern of the rear side.
o®-—- : Components extracted from the rear side.

J
————
-
~~
=
a
—
—
———
ete
|
—
ie
—=
Wie
|
(i
a
(3
|
13
a
|
t
T
r
~
Ss
[A
D817
B86
4-3.
PRINTED
WIRING
BOARD
‘ae
®
Semiconductor
Location
|
|
[ Ref. No. | Location ] Ref. No. | | B |
i | |
D401 | D-20. | Q101 | B2 is eG
D403, «D-18 =, Q201 BB |
D405 | HS | Q301 B5
D406 | G5 | 2401 D-18 a
D407, 1-4 | Q402 D-18
D408 —s-4 | Q403 H-6 ae
b40g9
G5:
40s
H-9
je
Oo
D410
DS
ee
G8
Cc
as
D411
DS
|
Q407
C-4
pe
:
D412,
6
0408
B-4
nfl
Lovee
PEACHES
D413,
|
£4
Q409
H-4
|
SAA
nner
positon
}
D414.
D4
Q410
H-5
en
—
=
D415.
D4
Q411
HS
oro
sem
eA
Ope
ctrl
agit
@,
0412
@
con,
Oe
OL
|S
OS
RR]
FH
=
D485
=
D5
|
Q412
|
15
needy
D501 | 1-16 | 0413 | ~D-18 me le
D502,—=—C 1-16 | 414 D5 D
D503. | ~H16 | Q415 C5
D504 G19 | O46 C5
D801 CBOE 417, C4
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|
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|
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4-4. SCHEMATIC DIAGRAM
@ See page 13 for notes.
3 4 5
[SERVO BOARD (1/2)]
{C501
RF AMP. SIGNAL PROCESSOR.
MIDPOINT VOLTAGE REGULATOR
@ See page 12 for waveforms.
Qs01
AUTOMATIC.
POWER CONTROL
R510 106 Q501
XN4609
TRACK | NGI
BALANCE
RVSO2 22
C501 0. te
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CXAT2710
LASER DIODE
i
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PROCESSOR, CLV SERVO
SLED/CLV/PLL SERVO
C527 2200
RS26
47K
Donor
R521
22k
126
22
C524
22 AV
R523 2. 7k
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= 2
607 1009
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RV301 280596 oy
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ay
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D806 R808
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LIMIT SWITCH
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Ls 9 INNER POSITION)
LV
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1S SHUT)
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RESISTOR
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4010W pays
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(4dN) 420/q dn-yaId seoIId0
RF
| SUMMING
Ae service.
5-1.
MIRROR
COMPA-
RATOR
TE DEFECT MIRR cP cB
ey 2U01
e@ The construction parts of an assembled
Part are indicated with a collation num- e
ber in the remark column.
e@ Items marked “*” are not stocked since
they are seldom required for routine t
Some delay should be antici-
pated when ordering these items.
Part No.
X-4921-211-1
X-4921-235-1
4-920-2 72-01
4-92 4-1 42-01
4-924-] 42-11
4-92 4-1 43-01
4-924-1 43-11
4-92 4-1 44-01
X49] 7-704-1
X-4921-21 6-1
X-4921-231-1
X~4921-237-1
4-912-641 -01
4-92 4-1 64-01
4-92 4-1 64-21
pseog yoel
pseog afqixaly AI»
pseog 3/9!xaly NOV
components used on the set.
Color
Example:
Cabinet's Color
14
18
2uU01,
(8085)
YIUMS G1OH on
{LO8QN)
ajnpowl GOT
pseog onsas
(106s)
Y22IMS JOOP
pseog afqixajy ureus
S}NOAE] 10] 0//YD}IMS/P120g Dd e@
SECTION 5
EXPLODED VIEWS
NOTE:
@
The
mechanical
parts
with
no
reference
@
Due
to
standardization,
parts
with
part
number
in
the
exploded
views
are
not
number
suffix
-XX
and
-X
may
be
dif-
supplied.
ferent
from
the
parts
specified
in
the
Indication of Appearance Parts
(RED) ...KNOB, BALANCE (WHITE)
t
Parts’ Color
The components identified by
mark or dotted line with mark
are critical for safety.
Replace only with part number
specified.
L |
Les composants identifiés par une
marque sont critiques pour la
sécurité.
Ne les remplacer que par une
piéce portant le numéro spéci fé.
Rem
(TITAN)...LID, BATTERY CASE
Description Remarks | No. Part No. Description
(BLACK)...ORNAMENT ASSY (BLACK), BUTTON 12 4-92 4-1 65-01
(TITAN)...ORNAMENT ASSY (TITAN), BUTTON 13 3-703-81 6-71
3-703 -81 6-72
RETAINER, SPRING, SWITCHING
(BLACK)...HINGE (LEFT) 14 3-895-823~-4]
(TITAN)...HINGE (LEFT) 3-895-823-51
(BLACK)...HINGE (RIGHT) 15 3~703-81 6-01
(TITAN)...HINGE (RIGHT) 3-703-81 6-02
SHAFT , FULCRUM 16 3-703-81 6-41
BRACKET ASSY, SWITCHING PLATE 3-703~81 6-42
PLATE (B) ASSY, SWITCHING
7 3-31 8-2 03-71
(BLACK)...PANEL ASSY, BOTTOM 9 3-31 8-203-72
{(TITAN)...PANEL ASSY (TITAN), BOTTOM 9
18 A-3043-233-A
FOOT, RUBBER A-3043-238-A
(BLACK)...LID, BATTERY CASE 19 4-885-83 8-00
CHIP, LOCK, BATTERY CASE LID
(TITAN)...SCREW (MI .4X3.0), SPECIAL
(BLACK)...SCREW (MI .4X3.0), SPECIAL
(BLACK)...SCREW (B1.4X4), TAPPING
(TITAN)...SCREW (B1.4X4), TAPPING
(TITAN)...SCREW (MI.4X2.0), SPECIAL
(BLACK)...SCREW (M1.4X2.0), SPECIAL
(TITAN)...SCREW (MI.4X2.5), SPECIAL
(BLACK)...SCREW (Ml.4X2.5), SPECIAL
(BLACK}...SCREW (Bl.7X5)}, TAPPING
(TITAN)...SCREW (Bl.7X5), TAPPING
(BLACK)...PANEL, UPPER
(TITAN)...PANEL, UPPER
(AEP .UK)...LABEL, CLASS 1

D-25/250
SCREW (MI .4X3), TOOTHED LOCK
SHEET, ADHESIVE, CHASSIS COVER
SCREW (Ml .4X2.0), SPECIAL HEAD
PLATE, SLIDE, SWITCHING PLATE
SHEET, INSULATING, PC BOARD
SCREW (Bl .7X4), TAPPING
CHIP, HOLDING, TERMINAL
No. Part No. Description
101 3-831-441-XX CUSHION, SPEAKER
102 3~33 5-797-21
108 4-92 4-139-01
104 4-92 4-138-01 COVER, CHASSIS
105 4-917-745-01 SPRING
106 3-703-81 6-02
107) = *4-917-753-01 SPRING
108 4-91 7-751-01
109 -*4-924-1 41-01
110 = *4-924-145-01 SHEET, CASE (LOWER)
WwW 3-31 8-2 03-62
112 4-92 4-134-01
113 4-924-136-01 SPRING, COMPRESSION
114 4-924-137-01 PLATE, CONNECTION
15 4~924-135-01 PIN, TERMINAL
116 4-924-169-01 CASE, BATTERY
W7 4-92 4-133-01
CHIP, FIXED, BOTTOM PANEL
Remarks No. Part No. Description Remarks
118 3-703-816-42 SCREW (M1 .4X2.5), SPECIAL HEAD
119 4-924-155-01 KNOB, VOLUME
120 3-703-816-41 SCREW (M1 .4X2.5), SPECIAL HEAD
121 *X-4921-210-1 CHASSIS ASSY, MAIN
123 3-831-441-11 CUSHION (B)
124 *4-924-182-01 SPACER, LCD
125 *4-926-105-01 SHEET, INSULATING, SERVO PCB
126 *4-926-102-01 COVER (A), FLEXIBLE INSULATING
127. *A-3039-683-A PAPER (B) ASSY, SHIELD
901 *A-3015-732-A PC BOARD ASSY, SERVO
902 *A-3015-733-A. PC BOARD ASSY, MAIN
903 *1-629-281-11 PC BOARD, JACK
904 1-625-584-11 PC BOARD, CONNECTION FLEXIBLE
905 1-625-585-11 PC BOARD, KEY SWITCH FLEXIBLE
906 1-625-586-11 PC BOARD, JACK FLEXIBLE
ND801 1-808-290-11 LCD MODULE

No.
5]
52
53
54
55
56
57
Part No.
Description
9-91 1 -840-XX
4-91 7-727-01
4-92 4-130-01
4-92 4130-21
4-92 4-1 31-01
4-92 4-1 40-01
4-926 -] 41-01
3-831 -441-XX
CUSHION, LID
SPRING, COMPRESSION
(BLACK)...BUTTON, OPEN
(TITAN)...BUTTON, OPEN
LEVER, LOCK
SPRING, COMPRESSION
COVER, MD
CUSHION
—23-—
D-25/250
Remarks
(TITAN)...SCREW (M1.4X3.0), SPECIAL HEAD
(BLACK)...SCREW (Ml .4X3.0), SPECIAL HEAD
(BLACK)...SCREW (MI .4xX5.0), SPECIAL HEAD
(TITAN)...SCREW (M1 .4X5.0), SPECIAL HEAD
SCREW (BL.4X3), TAPPING
(BLACK)...CABINET ASSY
(TITAN)...CABINET ASSY
Remarks No. Part No. Description
58 3-703-81 6-71
3-703-81 6-72
59 3-703-81 6-21
3-703-81 6-22
60 3-895-823-11
61 X-4921-217-1
X-4921-238-1
62 X-4917~723-1 INSULATOR ASSY
63 4-908-711-01
LABEL, CAUTION, LENS

D-25/250
NOTE:
SECTION 6
ELECTRICAL PARTS LIST
@ Due to standardization, replacements in the parts
list may be different from the parts specified in
the diagrams or the components used on the set.
e@ Items marked “*" are not stocked since they
are seldom required for routine service.
Some
delay should be anticipated when ordering these
items.
e If there are two or more same circuits in a set
such as a stereophonic machine, only typical
circuit parts may be indicated and capacitors and
resistors in other same circuits may be omitted.
Description
Ref.No. Part No.
901 = *A-3015-732-A
902 *A=-3015-733-A
903. *1-629-281-11
904 1 -625-584-11
905 1-625-585-11
906 1-625-586-1 1
910 A.8-848-096—11
C101. —s- 1-1 63=129-00
C102. 1-135-149-21
C103. =: 1-163-209--00
C104) =: 1-163 -212-00
C105 1-1 63-11 7-00
C106 = 1-163-129-00
C107. 1-135-130-11
C108 = 1-135-149-21
C109 =—-:1-124-225-00
C110. 1=163-009-11
C111. -1=163-125-00
C113. 1=163-209-00
C201 =: 1-163-129-00
C202) =: 1-135-149-21
C203 =: 1-163-209-00
C204 = 1-163-212-00
C205 1-163-117-00
C206 =1-163-129-00
C207) -1-135-130-11
C208 = =1-135-149-21
C209 = 1-124-225-00
C210 = 1-163-009-11
C211 = 1-1 63-125-00
C213. -1-163-209-00
C301 = 1-135-1 61-21
C302 = 1-135-161-21
C303) 1=135=1 62-21
C304 = 1-131-381-00
C305 = =1-135-162-21
C306 = 3=135-161-21
C307) = 1=135-161-21
C308 1-135-161-21
C401 =: 1=124-225-00
C402. =—«1-135-103-00
C403 =—- 1-13 5-091 -00
C404) -1-135-1 74-11
C405 1-135-130-11
C406 = 1=-135-1 08-00
C407: 1=135-1 62-21
PC BOARD ASSY, SERVO
PC BOARD ASSY, MAIN
PC BOARD, JACK
PC BOARD, CONNECTION FLEXIBLE
PC BOARD, KEY SWITCH FLEXIBLE
PC BOARD, JACK FLEXIBLE
DEVICE, OPTICAL KSS-165A
CERAMIC CHIP 330PF 5%
TANTAL. CHIP 2.2MF 20%
CERAMIC CHIP 0.001 SMF 5%
CERAMIC CHIP 0.002MF
CERAMIC CHIP 100PF 5%
CERAMIC CHIP 330PF 5%
TANTAL. CHIP 4.7MF 20%
TANTAL. CHIP 2.2MF 20%
ELECT 100MF 20%
CERAMIC CHIP 0.001MF 10%
CERAMIC CHIP 220PF 5%
CERAMIC CHIP 0.001 SMF 5%
CERAMIC CHIP 330PF 5%
TANTAL. CHIP 2.2MF 20%
CERAMIC CHIP 0.001 5MF 5%
CERAMIC CHIP 0.002MF
CERAMIC CHIP 100PF 5%
CERAMIC CHIP 330PF 5%
TANTAL. CHIP 4.7MF 20%
TANTAL. CHIP 2.2MF 202%
ELECT 1 00MF 20%
CERAMIC CHIP 0.001MF 10%
CERAMIC CHIP 220PF 5%
CERAMIC CHIP 0.001 SMF 5%
TANTAL. CHIP 22MF 20%
TANTAL. CHIP 22MF 20%
TANTAL. CHIP 33MF 20%
TANTALUM 47MF 10%
TANTAL. CHIP 33MF 20%
TANTAL. CHIP 22MF 20%
TANTAL. CHIP -22MF 20%
TANTAL. CHIP 22MF 20%
ELECT 1 O0MF 20%
TANTAL. CHIP 3.3MF 20%
TANTAL. CHIP 1MF 20%
TANTAL. CHIP 1 OMF 20%
TANTAL. CHIP 4.7MF 20%
TANTAL. CHIP 3.3MF 20%
TANTAL. CHIP 33MF 20%
CAPACITORS:
MF: uF, PF: wk.
RESISTORS
e All resistors are in ohms.
e@ F: nonflammable
COILS
@ MMH: mH, UH: wH
SEMICONDUCTORS
In each case, U: yw, for example:
VA...: pA..., UPA...: uPA...,
UPC...: uPC, UPD...: uPD...
The components
mark
identified by
or dotted line with mark
are Critical for safety.
eplace onty with part number
specified,
Les composants identifiés par une
sont critiques pour la
marque
sécurité.
Ne les rempiacer que par une
piéce portant le numéro spécifié.
Ref.No. Part No. Description
C408 = 1=135-1 74-11 TANTAL. CHIP 1 OMF
C409 =: 1=135-159-21 TANTAL. CHIP 10MF
C410 ~=1-163-037-11 CERAMIC CHIP 0.022MF
C411 1-126-357-11 ELECT 1 50MF
C412 = 1-135-103-00 TANTAL. CHIP 3.3MF
C413) -1=-131-365-00 TANTALUM 1 OMF
C414 = 1-135-149-21 TANTAL. CHIP 2.2MF
50V C415 =: 1-135-174-11 TANTAL. CHIP 10MF
6.3V C416 = 1-135-149-21 TANTAL. CHIP 2.2MF
50V
C501 = 1-163-038-00 CERAMIC CHIP 0.1MF
50V C502 = 1-163-989-11 CERAMIC CHIP 0.033MF
50V C503: 1-163-021-00 CERAMIC CHIP 0.01MF
50V
C504 = 1-135-145-11 TANTAL. CHIP 0.47MF
6.3V C505 1-163-127-00 CERAMIC CHIP 270PF
6.3V C506 + =1-163-038-00 CERAMIC CHIP O0.1MF
6.3V
C507): 1-135-162-21 TANTAL. CHIP 33MF
50V C508 1-163-038-00 CERAMIC CHIP 0.1MF
50V C509 = 1-135-157-21 TANTAL. CHIP 22MF
50V
C510 =1-163-021-00 CERAMIC CHIP 0.01MF
50V C511 =: 1-163-095-00 CERAMIC CHIP 12PF
6.3V C512, 1-135-162-21 TANTAL. CHIP 33MF
50V
C513: 1-163~021-00 CERAMIC CHIP 0.01MF
50V C514 = 1=135-162-21 TANTAL. CHIP 33MF
50V C515 =1-163-038-00 CERAMIC CHIP 0.1MF
50V
C517 = 1-163-038-00 CERAMIC CHIP 0.1MF
6.3V C518 =1-163-037-11 CERAMIC CHIP 0.022MF
6.3V C519 = 1-163-117-00 CERAMIC CHIP 100PF
6.3V
C520 = 1=135-130-11 TANTAL. CHIP 4.7MF
50V C521 = 1-163+038-00 CERAMIC CHIP 0.1MF
50V C522) -1-135-157-21 TANTAL. CHIP 22MF
50V
C523) 1-163-117-00 CERAMIC CHIP 100PF
6.3V C524 =1-135-157-21 TANTAL. CHIP 22MF
6.3V C5259 -1=135-130-11 TANTAL. CHIP 4.7MF
4v
C526 4 =1=163-081-00 CERAMIC CHIP 0.22MF
10V C527 = =1-163-125-00 CERAMIC CHIP 220PF
ay C528 = =1-135-162-21 TANTAL. CHIP 33MF
6.3V
€529 = 1-163-809-11 CERAMIC CHIP 0.047MF
6.3V C530 1-163-023-00 CERAMIC CHIP 0.01 5MF
6.3V C531 =: 1-135-157-21 TANTAL. CHIP 22MF
6.3V
C632 1-163-009-11 CERAMIC CHIP 0.001 MF
4y C533. 1-163-989-11 CERAMIC CHIP 0.033MF
16V C534 = 1-162-637-11 CERAMIC CHIP 0.47MF
10V
C535 1-163-009-11 CERAMIC CHIP 0.001MF
6.3V C536 1-163-038-00 CERAMIC CHIP 0.1MF
4yv C537 = 1-163-021-00 CERAMIC CHIP 0.01MF
4yv
20%
20%
10%
20%
20%
10%
20%
20%
20%
10%
10%
20%
5%
20%
20%
10%
5%
20%
10%
20%
102
5%
20%
20%
5%
20%
20%
5%
20%
10%
10%
20%
10%
10%
10%
10%
10V
16V
25V
16V
4v
16V
6.3V
lov
6.3V
25V
25V
50V
25V
50V
25V
ay
25V
ay
50V
50V
ay
50V
av
25V
25V
25V
50V
6.3V
25V
ay
50V
6.3V
25V
50V
av
25V
50¥
ay
50V
25V
16V
50V
25V
50V

No.
201
203
204
205
206
208
209
210
5-4. MECHANISM SECTION (CDM-150)
f
Part No.
202
Description
4-91 7-622-01
4-91 7-611 -01
X-491 7-725-1
4-921-299-01
4-921 -2 92-01
3-31 5~3 84-11]
4-921 -2 90-01
4-921 ~-287-01
4-91 2-432-01
RETAINER, FLEXIBLE
SHAFT (A)
CHASSIS ASSY, MD
SCREW (1.7X8), SPECIAL
GEAR (B)
WASHER, STOPPER
SPRING
BRACKET, MOTOR
SCREW (BY .4X5), TAPPING
D-25/250
Remarks
SCREW, PRECISION +P 1.7X3
SCREW, PRECISION +P 2X3
DEVICE, OPTICAL KSS-165A
MOTOR ASSY, CLY (SPINDLE MOTOR)
MOTOR SUB ASSY, FEED (SLED MOTOR)
Remarks No. Part No. Description
2i1 4-921-294-01 RACK (A)
212 7-671-111-11 STEEL, BOUL 1.5MM
213 4-921-296-01 SPRING
214 7-62 7-552-38
215 7-62 7-553-38
910 A\.8-848-096-11
M901 A-3133-335-A
M902 A-3133-334-A
$902 1-571-099-11 SWITCH (LIMIT)
Note:
The components identi-
fied by mark or dot-
ted line with mark
are critical for safety.
Replace only with part
number specified.
Note:
Les composants identifiés par
une marque sont critiques
pour la sécurité.
Ne ies remplacer que par une
piéce portant le numéro spéci-
fié.

Ref.No. Part No. Description
C538 1-135-157-21 TANTAL. CHIP 10MF
C539 = 1-135-157-21 TANTAL. CHIP 10MF
C540 = 1-163-117-00 CERAMIC CHIP 100PF
C541 ~=—- 1-163-038-00 CERAMIC CHIP 0.1 MF
C542 =: 1-163-809-11 CERAMIC CHIP 0.047MF
C543. =-1-163-009-11 CERAMIC CHIP 0.001 MF
C545 = 1-131-381-00 TANTALUM 47MF
C546 = =1-135-091-00 TANTAL. CHIP IMF
C547 =: 1-135-174-11 TANTAL. CHIP 1 OMF
C548 1-163-081-00 CERAMIC CHIP 0.22MF
C549 =: 1=163-986-00 CERAMIC CHIP 0.027MF
C550 = 1-162-638-11 CERAMIC CHIP 1MF
C551 =: 1-163-038-00 CERAMIC CHIP 0.1MF
C552 = 1-163-038-00 CERAMIC CHIP 0.1MF
C553. —- 1-162-638-11 CERAMIC CHIP 1MF
C554 1-162-638-11 CERAMIC CHIP IMF
C555 ~—-1-163-009-11 CERAMIC CHIP 0.001MF
C556 1-163-038-00 CERAMIC CHIP 0.1MF
C557 =: 1=135-1 74-11 TANTAL. CHIP 1 OMF
C558 1-135-091-00 TANTAL. CHIP IMF
C559 1-163-133-00 CERAMIC CHIP 470PF
C560 =1-124-576-11 ELECT 220MF
C601 = 1-162-638-11 CERAMIC CHIP IMF
C602 1-163-095-00 CERAMIC CHIP 12PF
C603 =: 1-163-095~00 CERAMIC CHIP 12PF
C604 =: 1-163-117-00 CERAMIC CHIP 100PF
C605 1-163-117-00 CERAMIC CHIP 100PF
C606 1-163-117-00 CERAMIC CHIP 100PF
C607 =: 1-163-117-00 CERAMIC CHIP 100PF
C801 =: 1-135-157-21 TANTAL. CHIP 22MF
C802. =: 1-163-038-00 CERAMIC CHIP 0.1MF
C803: 1-135-149-21 TANTAL. CHIP 2.2MF
C804 =: 1~135-149-21 TANTAL. CHIP 2.2MF
C805 = 1-163=113-00 CERAMIC CHIP 68PF
C806 = 1-163-113-00 CERAMIC CHIP 68PF
C808 = 1~162-638-11 CERAMIC CHIP IMF
C809 =1-163-021-00 CERAMIC CHIP 0.01MF
C810 =: 1-163-009-11 CERAMIC CHIP 0.001 MF
C811: 1-135-162-21 TANTAL. CHIP 33MF
C813: 1-163-038-00 CERAMIC CHIP 0.1MF
C814 = 1-135-103-00 TANTAL. CHIP 3.3MF
C815 = 1-162-637-11 CERAMIC CHIP 0.47MF
C816 = 1-163-038-00 CERAMIC CHIP 0.1MF
C817 =: 1~163-038-00 CERAMIC CHIP 0.1MF
C818 1-163-038-00 CERAMIC CHIP 0.1MF
C819 = 1=135-174-11 TANTAL. CHIP 1OMF
CN401 1-535-608-21 TERMINAL, BATTERY
CNS5O1 = 1-563-546-11 HOUSING, CONNECTOR 12P
CN502 1-563-552-11 SOCKET, CONNECTOR 4P
D401 = 8-719-938-78 DIODE SBl0-O5PCP
0403. 8-719-100-05 DIODE 182837
D405 = 8-719-938-75 DIODE SBOS-O5CP
D406 = 8719-100-05 DIODE 182837
D407 = 8-71 9-105-63 DIODE RD4.3M-B1
D408 = 8-71 9-800-76 DIODE 18226
D409 = 8-71 9-938-78 DIODE SBl0-O5PCP
D410 8719-800-76 DIODE 1$S226
D411 8-719-100-05 DIODE 192837
20%
20%
5%
10%
10%
10%
20%
20%
10%
10%
20%
20%
5%
20%
5%
5%
5%
5%
5%
5%
20%
20%
20%
5%
5%
10%
10%
20%
20%
20%
Ref.No.
4v D412
ay D413
50V pal4
25V D415
25V D485
50V 0501
10V D502
16V D503
1ov D504
25V
D801
eM D802
D803
any D804
0805
a 0807
Bey 0808
D809
TOV pgio
16V D811
50V D813
- D814
“16V D816
50V D817
oy D818
D819
50V 0820
50V D821
50V Hoy
ay D823
25V
ay | bes
6.3V
s0V 1302
50V
ae 1303
IC501
ELM 1502
ne 1€503
1€504
re 1¢505
1601
16V ee
1¢602
oe 1¢801
aM 1¢802
10V J301
3302
3401
J801
JR8O2
JR804
L402
L403
L501
L502
L503
1504
1505
Part No.
8-71 9-1 00-05
8-71 9-93 8-78
8-71 9-93 8-72
8-71 9~1 00-05
8-71 9-1 05-73
8-71 9-93 8-72
8-71 9-93 8-72
8-71 9-93 8-72
8-71 9-93 8-72
8-71 9-1 00-05
8-71 9-1 00-05
8-71 9-1 00-05
8-71 9-1 00-05
8-71 9-93 8-72
8-71 9-93 8-72
8-71 9-1 00-05
8-71 9-93 8-72
8-71 9-1 00-05
8-71 9-1 05-91
8-71 9-800-76
8-71 9-1 00-03
8-71 9-1 00-05
8-71 9-970-11
8-71 9-970-11
8-71 9-970-11
8-71 9-970-11
8-71 9-970-11
8-71 9-970-11
8-71 9-106-70
8-71 9-1 06-70
8-71 9-1 00-05
8-71 9-1 00-05
8-759-983 -79
8-759-630-75
8-759-946-27
8-752-033-55
8-752-033-54
8-759-970-89
8-759-030—17
8-759-23 0-43
8-759-947-02
8-752-323-65
8~752-808-85
8-759-700-90
1-563-2 80-21
1-563-2 80-11
1-562-961-11
1-563-2 80-31
1-216-2 96-00
1-216-2 96-00
1-412-1 42-11
1-41 2-031-11
1=412-02 9-11
1=412-1 42-11
1-412-032-21
1412-1 42-1]
1412-1 42-11
D-25/250
Description
DIODE
DIODE
DIODE
182837
SBI 0-O5PCP
$B01~05CP
DIODE
DIODE
DIODE
18287
RD4.7M-B2
SB01 -O5CP
DIODE
DIODE
DIODE
SBO1-O5CP
$B01 -O5CP
SBO} -O5CP
DIODE
DIODE
DIODE
1S2837
182837
182837
DIODE
DIODE
DIODE
182837
$B01-O5¢P
$BO1 -05CP
DIODE
DIODE
DIODE
182837
$B01 -O5CP
182 837
DIODE
DIODE
DIODE
RDS .6M—B2
1$S226
182835
182837
SLM-125YW
SLM-125YW
DIODE
DIODE
DIODE
DIODE
DIODE
DIODE
SLM-12 5YW
SLM=125YW
SLM-12 5YW
SLM-1 25YW
ROI 2M-B1
RO12M-B1
DIODE
DIODE
DIODE
DIODE
DIODE
182837
182.837
IC PCM-66P
IC M51 568FP
IC CXD131 60M
IC CXA1271Q
IC CXAl272Q-Z
IC BAI 03 58F
IC MPCI71 SFU
IC TC7SO4F
IC CxD1125Q
IC CXK581 6M-1 5L
IC CXP5086-047Q
IC NJM2901M
JACK (LINE OUT)
JACK (PHONES)
JACK (DC IN 9V)
JACK (REMOTE)
METAL GLAZE 0 5%
METAL GLAZE 0 5%
1 /8W
1 /8W
INDUCTOR
INDUCTOR
INDUCTOR
CHIP
CHIP
CHIP
1 00UH
47UH
1QUH
INDUCTOR
INDUCTOR
INDUCTOR
INDUCTOR
CHIP
CHIP
CHIP
CHIP
100UH
1O0UH
1Q0UH
100UH