syslogic COMPACT4-XS Series Operator's manual

u s e r d o c u m e n t a t i o n
IPC/COMPACT4-XS
DOC/COMPACT4-XSE
Revision Date Author Modification
1.0
17.09.2010
U. Müller
1.1
10.02.2011
U. Müller
technical data corrected
1.2
26.04.2011
U. Müller
block diagrams corrected, notes added for G

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Contents
1 Introduction 5
1.1. General Remarks 5
1.2. Contents of this Documentation 5
1.3. Items delivered 6
1.3.1. IPC/COMPACT4-1E(E) 6
1.3.2. IPC/COMPACT4-1F(E) 6
1.3.3. IPC/COMPACT4-1G(E) 6
1.4. Additional Products and Literature 7
1.4.1. Hardware 7
1.4.2. Software 7
1.4.3. Operating Systems 7
1.4.4. Documents 8
1.5. Safety Recommendations and Warnings 8
1.6. Electro-Static Discharge 9
1.7. Life Cycle Information 9
1.7.1. Transportation and Storage 9
1.7.2. Assembly and Installation 9
1.7.3. Operation 9
1.7.4. Maintenance and Repair 9
1.7.5. Warranty 10
1.7.6. RoHS 10
1.7.7. WEEE and Disposal 10
2 System Overview 11
2.1. IPC/COMPACT4-1E(E) 11
2.2. IPC/COMPACT4-1F(E) 12
2.3. IPC/COMPACT4-1G(E) 13
System Configuration 14
3.1. IPC/COMPACT4-1E(E) 14
3.1.1. CPU Configuration 14
3.1.2. Serial Interface Configuration 14
3.2. IPC/COMPACT4-1F(E) 14
3.2.1. CPU Configuration 14
3.2.2. CAN Interface Configuration 14
3.3. IPC/COMPACT4-1G(E) 15
3.3.1. CPU Configuration 15
3.3.2. Serial Interface Configuration 15
4 Enclosure, Assembly and Mounting 16
4.1. COMPACT4-XS Dimensions 16
4.2. Internal Cabling 16

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4.3. Serviceable Parts 17
4.4. Final Mounting of the Enclosure 18
5 Installation and Cabling 19
5.1. Introduction 19
5.2. Powering the IPC/COMPACT4-XS System 19
5.3. Cabling the Interfaces 20
5.3.1. IPC/COMPACT4-1E(E) 20
5.3.2. IPC/COMPACT4-1F(E) 21
5.3.3. IPC/COMPACT4-1G(E) 21
5.4. Grounding 21
5.5. Cabling of Communication Links 22
6 Technical Data 24
6.1. Electrical Data 24
6.2. EMI / EMC Specification 27
6.2.1. Relevant Standards 27
6.2.2. Electromagnetic Emission 27
6.2.3. Immunity 28
6.3. Environmental Specification 28
6.4. Mechanical Data 29
7 Hardware 0
7.1. Firmware 30
8 Manufacturer Information 1
8.1. Contact 31
List of Tables
Tab. 1 Additional Documents 8
Tab. 2 Allowable configuration options CAN interface 14
Tab. 3 Allowable configuration options RS422/485 interface 15
Tab. 4 Power connector pinout 19
Tab. 5 Weidmüller power connector 19
Tab. 6 IPC/COMPACT4-1E: Interfaces 20
Tab. 7 IPC/COMPACT4-1F: Interfaces 21
Tab. 8 IPC/COMPACT4-1G: Interfaces 21
Tab. 9 General Absolute Maximum Ratings 25
Tab. 10 General Recommended Operating Conditions 25
Tab. 11 General Electrical Characteristics 25
Tab. 12 General Switching Characteristics 26
Tab. 13 Electromagnetic Emission 27
Tab. 14 Electromagnetic Immunity 28
Tab. 15 Hardware Revision State 30

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List of Figures
Fig. 1 Functional Block Diagram 11
Fig. 2 Functional Block Diagram 12
Fig. 3 Functional Block Diagram 13
Fig. 4 IPC/COMPACT4-XS 16
Fig. 5 Service of battery or Compact Flash card 17
Fig. 6 One possible way of mounting the IPC/COMPACT4-XS onto the DIN-Rail 18
Fig. 7 Front view with connector markings 20
Fig. 8 Additional grounding of the cable shields at the entry point of a cabinet. 22
Fig. 9 Non isolated communication link with common chassis potential 23
Fig. 10 Isolated communication link 23
Fig. 11 Three side view of the IPC/COMPACT4-XS enclosure 29

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1 Introduction
1.1. General Remarks
The content and presentation of this document has been carefully checked. No responsibility is
accepted for any errors or omissions in the documentation.
Note that the documentation for the products is constantly revised and improved. The right to
change this documentation at any time without notice is therefore reserved.
Syslogic is grateful for any help referring to errors or suggestions for improvements.
This documentation may contain names, company logos and registered trademarks which are
the property of their their respecitve owners:
IBM-PC, PC/AT, PS/2 trademarks of IBM Corporation
CompactFlash trademark of SanDisk Corporation
PC/104 trademark of PC/104 Consortium
Vortex86DX trademark of DM&P Electronics
MSDOS trademark of Microsoft Corporation
1.2. Contents of this Documentation
This document addresses to system integrators, programmers and instructed installation and
maintenance personal working with systems mentioned in chapter 1.3. In the following
chapters the IPC/COMPACT4-XS stands for the COMPACT XS family with the 486DX core
based CPU boards (IPC/NETIPC-4ANx).
This documentation provides all information about the system, configuration, assembly,
cabling, installation, grounding and EMI-issues of the IPC/COMPACT4-XS. It also contains a
chapter with the technical specifications.

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1. . Items delivered
The COMPACT4-XS family is built of standard boards and components from Syslogic.
It is delivered with power connector but without external power supply and without
CompactFlash for OS/application storage.
1. .1. IPC/COMPACT4-1E(E)
– IPC/COMPACGP-2ESE
– IPC/NETIPC-4AN(E)
– 2 Slot chrome steel enclosure
– 3V Lithium Battery
1. .2. IPC/COMPACT4-1F(E)
– IPC/COMPACGP-1FE
– IPC/NETIPC-4AN(E)
– 2 Slot chrome steel enclosure
– 3V Lithium Battery
1. . . IPC/COMPACT4-1G(E)
– IPC/COMPACGP-1GE
– IPC/NETIPC-4AN(E)
– 2 Slot chrome steel enclosure
– 3V Lithium Battery

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1.4. Additional Products and Literature
1.4.1. Hardware
The following items, which have to be ordered seperately, complemend the system:
– CompactFlash
– SRAM or NVRAM
– Battery for replacement
For a complete list and more detailed information on the additional hardware products please
contact the manufacturer or your distributor
1.4.2. Software
The following software products are used together with the COMPACT base board:
– IPC/IOCOMSW-1A: Sample program code and utilities for x86
based systems
1.4. . Operating Systems
Syslogic offers an implementation for the following operting systems (OS):
Debian Linux Distribution
CNF/DEBIAN50-4A (configuration)
IPC/DEBIAN50-4A (development environment)
Microsoft DOS 6.22
CPN/MSDOS622-RTL (MSDOS Licence)
Others on request.
The COMPACT4 systems have been successfully used for applications running on old
operating systems like MSDOS (and other DOS clones), OS/2, FlexOS, OS/9, Venix and
therefore are well suited for retrofit applications.

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1.4.4. Documents
Additional documents to the hardware and software described above:
Reference Ordercode Document Manufacturer
[1] DOC/COMPACGP-1FE Documentation of the base
board
IPC/COMPACGP-2EE, -3EE
IPC/COMPACGP-1FE, -3FE
IPC/COMPACGP-1GE, -3GE
Syslogic AG
[2] DOC/IPC_NETIPC4-E User documentation of the
IPC/NETIPC-4
Syslogic AG
[3] DOC/DEBIAN50-4A User manual for the Debian
Linux Distribution
Syslogic AG
[4] DOC/IPC_IOCOMSW-E User documentation for
programming examples and
utilities
Syslogic AG
Tab 1 Additional Documents
1.5. Safety Recommendations and Warnings
The products are intended for measurement, control and communications applications in
industrial environments. The use of the products in systems in which the life or health of
persons is directly dependent (e.g. life support systems, patient monitoring systems, etc.) is not
allowed. The use of the products in potentially explosive atmospheres requires additional
external protection circuitry which is not provided with the products.
In case of uncertainty or of believed errors in the documentation please immediately contact
the manufacturer (address see chapter 8). Do not use or install the products if you are in doubt.
In any case of misuse of the products, the user is solely liable for the consequences.
The products contain electronic components which will be damaged by electrostatic
discharges. The recommendations for handling of sensitive electronic equipment must
therefore be strictly followed in all phases of the mounting and installation of the products.
The products are “CE”-certified. The “CE”-conformity, i.e. the compliance to the required
standards is only guaranteed if the corresponding mounting, installation, and cabling guidelines
are strictly observed.
The products are operated with electrical power. Before manipulating the products, they must
be disconnected from the power source and from the communication signals.

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The products require set-up procedures before they can be operated. Before being used in an
actual installation, they must be correctly configured. If the products are not or wrongly
configured, they may malfunction in the intended application.
The products must be assembled and installed by specially trained people. The strict
observation of the assembly and installation guidelines is mandatory.
1.6. Electro-Static Discharge
Electronic boards are sensitive to Electro-Static Discharge (ESD). Please ensure that the
product is handled with care and only in a ESD protected environment. Otherwise a proper
operation is not garanteed.
1.7. Life Cycle Information
1.7.1. Transportation and Storage
During transportation and storage the products must be in their original packing. The original
packing contains an antistatic bag and shock-absorbing material. It is recommended, to keep
the original packing in case of return of the product to the factory for repair. Note that the
packing is recyclable.
1.7.2. Assembly and Installation
Observe the EMI-precautions against static discharge. Carefully read the assembly and
installation guidelines in this document before unpacking the products. Make sure that you
have all the necessary items ready (including all the small parts).
The installation procedures must be strictly observed. Note that deviations from the installation
guidelines may result in degraded operational reliability or in unfavorable EM-radiation or
EM-susceptibility.
1.7. . Operation
The operating environment must guarantee the environmental parameters (temperature, power
supply, etc.) specified in the technical specification section of the manuals.
The main functionality of the IPC/COMPACT4-XS is defined by the application programs
running on the system. The application programs are not part of the delivery by Syslogic but
are defined, developed and tested by the customer or a system-integrator for each specific
application. Refer to the respective documentation for more information.
1.7.4. Maintenance and Repair
The IPC/COMPACT4-XS features error- and malfunction-detection circuitry. Diagnostic
information gathered is transferred to the applications software where it can be used. In the rare
case of a module hardware-failure or malfunction, the complete module should be exchanged.
The faulty module must be returned to the factory for repair. Please use whenever possible the
original packing for returning the product (ESD and mechanical protection).

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1.7.5. Warranty
Our products are covered by a world-wide manufacturers warranty. The warranty period starts
at the delivery time from our official distributor to the customer. The duration of the warranty
period is specified in the respective product catalogs and the offers. All products carry a job
number for identification. The manufacturing data and deliveries are registered in a high level
Quality Management System.
The warranty covers material and manufacturing defects. All products must be returned via the
official distributor to the factory for repair or replacement. The warranty expires immediately if
the products are damaged of operation outside of the specified recommended operating
conditions. The warranty also expires if the date code or job number listed on the product is
altered or rendered unintelligible. The warranty does not include damage due to errors in
firmware or software delivered with the products.
1.7.6. RoHS
The product of the IPC/ COMPACT4-XS family are designed and produced according to the
Restriction of Hazardous Substances (RoHS) Directive (2002/95/EC).
1.7.7. WEEE and Disposal
At the end of the lifespan the IPC/COMPACT4-XS must be properly disposed.
IPC/COMPACT4-XS contains a multitude of elements and must be disposed like computer
parts. The system contains a battery which should be properly disposed.
The products of the IPC/ COMPACT4-XS family are not designed ready for operation for the
end-user and intended for consumer applications. Therefore the Waste Electrical and Electronic
Equipment (WEEE) Directive (2002/96/EC) is not applicable. But users should still dispose the
product properly at the end of life.

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2 System Overview
2.1. IPC/COMPACT4-1E(E)
– DM&P Vortex86DX processor with 800MHz clock (600MHz for E-
version)
– 32kB L1-Cache
– 256kB L2-Cache
– 256MB DDR2 SDRAM onboard memory (soldered)
– graphic controller: 1280x1024 resolution @ 75Hz
– watchdog
– RTC
– Temperature supervisor
– CompactFlash Type-I socket
– DIL-32 Socket for SRAM or NVRAM
– 44 pin IDE connector
– 2xUSB 2.0 interface
– PS/2 interface
– 10/100 Base-T LAN controller
– PC/104 bus
– 10–30V DC unisolated power supply
– 2x RS232 interfaces (16550 compatible)
Fig. 1 Functional Block Diagram
DRAM Controller
DDR2
CompactFlash
DIL32
Boot Block Flash Nonvolatile
Memory Socket
32 - 512 kByte
SRAM/EEPROM/Flash
DiskOnChip
Boot Loader
BIOS
1.44MByte ROM Drive
EIDE Controller
SVGA Controller
4 MByte Memory
Analog CRT
18 Bit LCD
Keyboard/Mouse
COM1
COM2
(16550A, RS232)
(16550A, RS232)
486 Core
32-Bit Processor
x86 compatible
Floating Point Unit
32k L1 Cache
256k L2 Cache
(8242, PS/2)
Ethernet
(10/100 MBit)
Temperature
Supervisor
Real Time Clock
(Year 2000 ready)
Timer, DMA,
Interrupt Controller
(8254, 2x8237, 2x8259)
Bus
Controller
256 MByte DRAM
(PIO and DMA Mode)
Connector
Watchdog
USB0 / USB1
(OHCI/EHCI)
Power
(10..30V DC)

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2.2. IPC/COMPACT4-1F(E)
– DM&P Vortex86DX processor with 800MHz clock (600MHz for E-
version)
– 32kB L1-Cache
– 256kB L2-Cache
– 256MB DDR2 SDRAM onboard memory (soldered)
– graphic controller: 1280x1024 resolution @ 75Hz
– watchdog
– RTC
– Temperature supervisor
– CompactFlash Type-I socket
– DIL-32 Socket for SRAM or NVRAM
– 44 pin IDE connector
– 2xUSB 2.0 interface
– PS/2 interface
– 10/100 Base-T LAN controller
– PC/104 bus
– 10–30V DC unisolated power supply
– 1x RS232 interfaces (16550 compatible)
– CAN 2.0B Controller (SJA1000), isolated interface
Fig. 2 Functional Block Diagram
DRAM Controller
DDR2
CompactFlash
DIL32
Boot Block Flash Nonvolatile
Memory Socket
32 - 512 kByte
SRAM/EEPROM/Flash
DiskOnChip
Boot Loader
BIOS
EIDE Controller
SVGA Controller
4 MByte Memory
Analog CRT
18 Bit LCD
Keyboard/Mouse
COM1
COM2
(16550A, RS232)
(16550A, RS232)
486 Core
32-Bit Processor
x86 compatible
Floating Point Unit
32k L1 Cache
256k L2 Cache
(8242, PS/2)
Ethernet
(10/100 MBit)
Temperature
Supervisor
Real Time Clock
(Year 2000 ready)
Timer, DMA,
Interrupt Controller
(8254, 2x8237, 2x8259)
Bus
Controller
256 MByte DRAM
(PIO and DMA Mode)
Connector
Watchdog
USB0 / USB1
(OHCI/EHCI)
CAN
(SJA1000, ISO)
Power
(10..30V DC)

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2. . IPC/COMPACT4-1G(E)
– DM&P Vortex86DX processor with 800MHz clock (600MHz for E-
version)
– 32kB L1-Cache
– 256kB L2-Cache
– 256MB DDR2 SDRAM onboard memory (soldered)
– graphic controller: 1280x1024 resolution @ 75Hz
– watchdog
– RTC
– Temperature supervisor
– CompactFlash Type-I socket
– DIL-32 Socket for SRAM or NVRAM
– 44 pin IDE connector
– 2xUSB 2.0 interface
– PS/2 interface
– 10/100 Base-T LAN controller
– PC/104 bus
– 10–30V DC unsiolated power supply
– 1x RS232 interfaces (16550 compatible)
– 1x RS422/RS485 half/full duplex, isolated interface
Fig. 3 Functional Block Diagram
DRAM Controller
DDR2
CompactFlash
DIL32
Boot Block Flash Nonvolatile
Memory Socket
32 - 512 kByte
SRAM/EEPROM/Flash
DiskOnChip
Boot Loader
BIOS
1.44MByte ROM Drive
EIDE Controller
SVGA Controller
4 MByte Memory
Analog CRT
18 Bit LCD
Keyboard/Mouse
COM1
COM2
(16550A, RS232)
(16550A, RS422/485)
486 Core
32-Bit Processor
x86 compatible
Floating Point Unit
32k L1 Cache
256k L2 Cache
(8242, PS/2)
Ethernet
(10/100 MBit)
Temperature
Supervisor
Real Time Clock
(Year 2000 ready)
Timer, DMA,
Interrupt Controller
(8254, 2x8237, 2x8259)
Bus
Controller
256 MByte DRAM
(PIO and DMA Mode)
Connector
Watchdog
USB0 / USB1
(OHCI/EHCI)
Power
(10..30V DC)

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System Configuration
.1. IPC/COMPACT4-1E(E)
.1.1. CPU Configuration
For detailed information on how to configure the CPU peripherals please consult the
documentation of the CPU board [2], chapter 1.4.4.
.1.2. Serial Interface Configuration
No hardware configuration has to be done.
.2. IPC/COMPACT4-1F(E)
.2.1. CPU Configuration
For detailed information on how to configure the CPU peripherals please consult the
documentation of the CPU board [2], chapter 1.4.4.
.2.2. CAN Interface Configuration
The CAN interface has to be configured according to the customers application. Please refer to
the IPC/COMPAGP-1F documentation [1] , chapter 1.4.4, for a detailed configuration. Please
note that not all options described in the aforementioned document can be used. There are
some restrictions coming from the CPU/Chipset. The following table gives a list of the options
allowed. Otherwise a correct operation cannot be guaranteed.
Description Allowable Options Switch/Jumper Remarks
Addressing Mode I/O
Memory
SW301-8
Memory Base Address
(only if selected)
C0000h
…
DBFFFh
SW301-7..0 Restricted
I/O Base Address
(only if selected)
7600h - Fixed
Active Termination
(120E)
On
Off
J401
Interrupt 5
6
11
15
J302 Restricted
Tab 2 Allowable configuration options CAN interface

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. . IPC/COMPACT4-1G(E)
. .1. CPU Configuration
For detailed information on how to configure the CPU peripherals please consult the
documentation of the CPU board [2] , chapter 1.4.4.
. .2. Serial Interface Configuration
The RS422/485 interface has to be configured according to the customers application. Please
refer to the IPC/COMPAGP-1G documentation [1] , chapter 1.4.4, for a detailed configuration.
Please note that not all options described in the aforementioned document can be used. There
are some restrictions coming from the CPU/Chipset. The following table gives a list of the
options allowed. Otherwise a correct operation cannot be guaranteed.
Description Allowable Options Switch/Jumper Remarks
I/O Base Address 2F8h (COM2) - Fixed
Interrupt 3 (COM2) - Fixed
Duplex half/full S301-1..4
Termination 120E/100E/none S301-5/6
Pullup/down 470E/none S301-7/6
Tab. 3 Allowable configuration options RS422/485 interface
Important Notes
• The current version of the IPC/COMPACT4-1G(E) does not support Echo
Cancellation. Every character sent out will immediately show up in the receive buffer
and must be removed by the application.
• The current version of the IPC/COMPACT4-1G(E) does not support automatic driver
enable control for the transmitter, instead the driver enable is controlled by the RTS
signal under application software control.
In case of full duplex operation, RTS should be activated to enable the transmitter
constantly. In case of half duplex operation, application software must enable the
transmitter before sending charac
ters and disable the transmitter after the last character
has been sent. A small delay has to be added before disabling the transmitter because
of the time needed to put the last character serialized out to the line (depending on
baud rate setting).

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4 Enclosure, Assembly and Mounting
4.1. COMPACT4-XS Dimensions
The enclosure can house a complete industrial control system with many basic functions. The
enclosure with its internal electronic system meets EMI/RFI electromagnetic standards according
to the European ”CE”- requirements (see paragraph 1.5).
Fig 4 IPC/COMPACT4-XS
Important Notes
Before assembling the whole enclosure with the electronic modules please read through the
following paragraphs containing information about the assembling of the system.
4.2. Internal Cabling
No internal cabling has to be done.
127mm
109mm
48.1mm

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4. . Serviceable Parts
Two parts inside IPC/COMPACT4-XS may be exchanged from time to time:
– Backup-Battery
– CompactFlash card (has to be ordered separately)
In order to exchange these parts, you must remove the cover by executing steps 1 and 2 of the
following instructions.
Important Notes
• The battery socket is coded, no wrong insertion of the backup battery is possible.
• Handle the flash memory module with care. A small sc
rewdriver can help to
unlock the memory from its socket.
1. Remove 4 screws (M2.5x4, DIN965A, BN3310) on the side of the case.
2. Slide back the cover part of the case.
3. Exchange the battery or the Compact Flash card.
Fig 5 Service of battery or Compact Flash card
1 2
Battery
Compact
Flash
3

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Important Notes
When opening the enclosure you’re about to handle ESD sensitive devices. Be sure that appropriate
precautions have been made to your working environment. from its socket.
4.4. Final Mounting of the Enclosure
There are two possible ways to mount the system onto a DIN-Rail. DIN-Rail clamps can be
mounted according to Fig. 6. There are two versions of DIN-Rails available: flat C-Rails
(h=7.5mm) and normal C-Rails (h=15mm).
Important Notes
Be sure to use the correct screws; screws which are too long can damage the boards inside
of the enclosure.
Fig 6 One possible way of mounting the IPC/COMPACT4-XS onto the DIN-Rail
Cabinet-Wall
DIN-Rail
M4x5 Screw (DIN7985A, BN3334, M4x5, Form Z)
M4 Washer (8x 4.3 x 0.5, BN726, M4)
Clamp (Weidmueller, FM 4.2/TS35)
Connectors

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5 Installation and Cabling
5.1. Introduction
Installation and cabling of the IPC/COMPACT4-XS system has to be done with great care; the
correct cabling is essential for high operational reliability and the correct grounding is
necessary for protection. To meet the requirements of "CE"-certification all cables have to be
shielded. The enclosure has to be connected to ground via the DIN-rail.
Important Notes
To meet the requirements of RFI "CE"-
cerification, correct mounting, installation and
cabling of the IPC/COMPACT4-XS system accordin
g to these guidelines is absolutely
necessary.
5.2. Powering the IPC/COMPACT4-XS System
The "logic voltage", i.e. the power driving the electronic circuits (CPU and base board) is
applied from a 24VDC power supply (10VDC...30VDC). The internal power supply converts
the input voltage to the logic voltage level. Remember that the power supply is unisolated. For
an isolated version please contact the manufacturer. The input voltage is applied with a 2pin
Weidmüller connector:
Pin Description
1 Ground
2 VDC
Tab 4 Power connector pinout
The connector can be ordered directly at your Weidmüller distributor (order code: BL3.5/2F).
Order Code Type
1606640000 BL3.5/2F
Tab 5 Weidmüller power connector

IPC/COMPACT4-XS: user documentation
DOC/COMPACT4-XSE; V1 2
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When selecting the 24VDC power supply the maximum power dissipation of the system has to
be considered.
Important Notes
Please make sure that the input voltage does not exceed 30V otherwise the base board
could get damaged. If the input voltage drops below 10V th
e system doesn’t work
properly, correct operation cannot be guaranteed. The best efficiency of the power
supply can be achieved if the external input voltage is around 24V. Therfore the power
loss of the power supply circuitry is at its minimum. When opera
ting the system at high
temperatures please make sure that the power supply is around 24V.
5. . Cabling the Interfaces
Fig 7 Front view with connector markings
5. .1. IPC/COMPACT4-1E(E)
Connector Marking Interface Type
X1 COM1 (RS232)
X2 COM1 (RS232)
Tab 6 IPC/COMPACT4-1E: Interfaces