syslogic IPC/COMPACT6-1E Operator's manual

u s e r d o c u m e n t a t i o n
IPC/COMPACT6-XS
DOC/COMPACT6-XSE
Revision Date Author Modification
1.0 30.07.2007 R. Newbould Preliminary
1.1 25.01.2008 R. Newbould Initial release
1.2 01.04.2008 R. Newbould Additional information reg. powering
1.3 28.10.2013 R. Newbould IPC/COMPACT6L-1G

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Contents
1 Introduction
1.1. General Remarks 5
1.2. Contents of this Documentation 5
1.3. Items delivered 5
1.3.1. IPC/COMPACT6-1E 5
1.3.2. IPC/COMPACT6-1F 6
1.3.3. IPC/COMPACT6-1G 6
1.4. Additional Products and Literature 6
1.4.1. Hardware 6
1.4.2. Software 6
1.4.3. Operating Systems 7
1.4.4. Documents 8
1.5. Safety Recommendations and Warnings 8
1.6. Electro-Static Discharge 9
1.7. Life Cycle Information 9
1.7.1. Transportation and Storage 9
1.7.2. Assembly and Installation 9
1.7.3. Operation 9
1.7.4. Maintenance and Repair 9
1.7.5. Warranty 10
1.7.6. RoHS 10
1.7.7. WEEE and Disposal 10
2 System Overview 11
2.1. IPC/COMPACT6-1E 11
2.2. IPC/COMPACT6-1F 12
2.3. IPC/COMPACT6-1G 13
3 System Configuration 14
3.1. IPC/COMPACT6-1E 15
3.1.1. CPU Configuration 15
3.1.2. Serial Interface Configuration 15
3.2. IPC/COMPACT6-1F 15
3.2.1. CPU Configuration 15
3.2.2. CAN Interface Configuration 15
3.3. IPC/COMPACT6-1G 16
3.3.1. CPU Configuration 16
3.3.2. Serial Interface Configuration 16
4 Enclosure, Assembly and Mounting 17
4.1. COMPACT6-XS Dimensions 17
4.2. Internal Cabling 17

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4.3. Serviceable Parts 18
4.4. Final Mounting of the Enclosure 19
Installation and Cabling 20
5.1. Introduction 20
5.2. Powering the IPC/COMPACT6-XS System 20
5.3. Cabling the Interfaces 21
5.3.1. IPC/COMPACT6-1E 21
5.3.2. IPC/COMPACT6-1F 22
5.3.3. IPC/COMPACT6-1G 22
5.4. Grounding 22
5.5. Cabling of Communication Links 23
6 Technical Data 2
6.1. Electrical Data 25
6.2. EMI / EMC Specification 28
6.2.1. Relevant Standards 28
6.2.2. Electromagnetic Emission 28
6.2.3. Immunity 29
6.3. Environmental Specification 29
6.4. Mechanical Data 30
7 Hardware 31
7.1. Firmware 31
8 Manufacturer Information 32
8.1. Contact 32
List of Tables
Tab. 1 Additional Documents 8
Tab. 2 Allowable configuration options 15
Tab. 3 Power connector pinout 20
Tab. 4 Weidmüller power connector 20
Tab. 5 IPC/COMPACT6-1E: Interfaces 21
Tab. 6 IPC/COMPACT6-1F: Interfaces 22
Tab. 7 IPC/COMPACT-6-1G: Interfaces 22
Tab. 8 General Absolute Maximum Ratings 26
Tab. 9 General Recommended Operating Conditions 26
Tab. 10 General Electrical Characteristics 26
Tab. 11 General Switching Characteristics 27
Tab. 12 Electromagnetic Emission 28
Tab. 13 Electromagnetic Immunity 29
Tab. 14 Hardware Revision State 31

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List of Figures
Fig. 1 Functional Block Diagram 11
Fig. 2 Functional Block Diagram 12
Fig. 3 Functional Block Diagram 13
Fig. 4 IPC/COMPACT6-XS 17
Fig. 5 Service of battery or Compact Flash card 18
Fig. 6 One possible way of mounting the IPC/COMPACT6-XS onto the DIN-Rail 19
Fig. 7 Front view with connector markings 21
Fig. 8 Additional grounding of the cable shields at the entry point of a cabinet. 23
Fig. 9 Non isolated communication link with common chassis potential 24
Fig. 10 Isolated communication link 24
Fig. 11 Three side view of the IPC/COMPACT6-XS enclosure 30

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1Introduction
1.1. General Remarks
The content and presentation of this document has been carefully checked. No responsibility is
accepted for any errors or omissions in the documentation.
Note that the documentation for the products is constantly revised and improved. The right to
change this documentation at any time without notice is therefore reserved.
Syslogic is grateful for any help referring to errors or suggestions for improvements.
This documentation may contain names, company logos and registered trademarks which are
the property of their their respecitve owners:
IBM-PC, PC/AT, PS/2 trademarks of IBM Corporation
CompactFlash trademark of SanDisk Corporation
PC/104 trademark of PC/104 Consortium
Geode trademark of Advanced Micro Devices
(AMD)
Windows CE trademark of Microsoft Corporation
Windows XP Embedded trademark of Microsoft Corporation
1.2. Contents of this Documentation
This document addresses to system integrators, programmers and instructed installation and
maintenance personal working with systems mentioned in chapter 1.3. In the following
chapters the IPC/COMPACT6-XS stands for the COMPACT XS family with the 6
th
generation
CPU board (IPC/NETIPC-6AN).
This documentation provides all information about the system, configuration, assembly,
cabling, installation, grounding and EMI-issues of the IPC/COMPACT6-XS. It also contains a
chapter with the technical specifications.
1.3. Items delivered
The COMPACT6-XS family is built of standard boards and components from Syslogic.
1.3.1. IPC/COMPACT6-1E
–IPC/COMPACGP-2ESE
–IPC/NETIPC-6AN
–2 Slot chrome steel enclosure
–3V Lithium Battery

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1.3.2. IPC/COMPACT6-1F
–IPC/COMPACGP-1F
–IPC/NETIPC-6AN
–2 Slot chrome steel enclosure
–3V Lithium Battery
1.3.3. IPC/COMPACT6-1G
–IPC/COMPACGP-2GE
–IPC/NETIPC-6AN
–2 Slot chrome steel enclosure
–3V Lithium Battery
1.3.4. IPC/COMPACT6L-1G
–IPC/COMPACGP-2GE
–IPC/NETIPC-6ALN
–2 Slot chrome steel enclosure
–3V Lithium Battery
1.4. Additional Products and Literature
1.4.1. Hardware
The following items, which have to be ordered seperately, complemend the system:
–CompactFlash
–SRAM or NVRAM
–Battery for replacement
For a complete list and more detailed information on the additional hardware products please
contact the manufacturer or your distributor
1.4.2. Software
The following software products are used together with the COMPACT base board:
–IPC/NETIPCFW-6A: Firmware NETIPC CPU boards
–IPC/IOCOMSW-1A: Sample program code and utilities for x86 based
systems

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1.4.3. Operating Systems
Syslogic offers an implementation for the following operting systems (OS):
Debian Linux Distribution
IPC/DEBIAN-40A
Microsoft Windows CE 5.0
IPC/WINCE-50A
Microsoft Windows XP Embedded
IPC/WINXPE-6A
Others on request.

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1.4.4. Documents
Additional documents to the hardware and software described above:
Reference Ordercode Document Manufacturer
[1] DOC/COMPACGP-1FE Documentation of the base
board
IPC/COMPACGP-2EE, -3EE
IPC/COMPACGP-1FE, -3FE
IPC/COMPACGP-1GE, -3GE
Syslogic AG
[2] DOC/IPC_NETIPC6-E User documentation of the
IPC/NETIPC-6
Syslogic AG
[3] DOC/NETIPCFW6-E User documentation of the
firmware
Syslogic AG
[4] DOC/WINXPE-6A User manual for the XP
Embedded BSP
Syslogic AG
[5] DOC/WINCE-50A User manual for the Win CE
5.0 BSP
Syslogic AG
[6] DOC/DEBIAN-40A User manual for the Debian
Linux Distribution
Syslogic AG
[7] DOC/IPC_IOCOMSW-E User documentation for
programming examples and
utilities
Syslogic AG
Tab 1 Additional Documents
1. . Safety Recommendations and Warnings
The products are intended for measurement, control and communications applications in
industrial environments. The use of the products in systems in which the life or health of
persons is directly dependent (e.g. life support systems, patient monitoring systems, etc.) is not
allowed. The use of the products in potentially explosive atmospheres requires additional
external protection circuitry which is not provided with the products.
In case of uncertainty or of believed errors in the documentation please immediately contact
the manufacturer (address see chapter 8). Do not use or install the products if you are in doubt.
In any case of misuse of the products, the user is solely liable for the consequences.
The products contain electronic components which will be damaged by electrostatic
discharges. The recommendations for handling of sensitive electronic equipment must
therefore be strictly followed in all phases of the mounting and installation of the products.
The products are “CE”-certified. The “CE”-conformity, i.e. the compliance to the required
standards is only guaranteed if the corresponding mounting, installation, and cabling guidelines
are strictly observed.

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The products are operated with electrical power. Before manipulating the products, they must
be disconnected from the power source and from the communication signals.
The products require set-up procedures before they can be operated. Before being used in an
actual installation, they must be correctly configured. If the products are not or wrongly
configured, they may malfunction in the intended application.
The products must be assembled and installed by specially trained people. The strict
observation of the assembly and installation guidelines is mandatory.
1.6. Electro-Static Discharge
Electronic boards are sensitive to Electro-Static Discharge (ESD). Please ensure that the
product is handled with care and only in a ESD protected environment. Otherwise a proper
operation is not garanteed.
1.7. Life Cycle Information
1.7.1. Transportation and Storage
During transportation and storage the products must be in their original packing. The original
packing contains an antistatic bag and shock-absorbing material. It is recommended, to keep
the original packing in case of return of the product to the factory for repair. Note that the
packing is recyclable.
1.7.2. Assembly and Installation
Observe the EMI-precautions against static discharge. Carefully read the assembly and
installation guidelines in this document before unpacking the products. Make sure that you
have all the necessary items ready (including all the small parts).
The installation procedures must be strictly observed. Note that deviations from the installation
guidelines may result in degraded operational reliability or in unfavorable EM-radiation or
EM-susceptibility.
1.7.3. Operation
The operating environment must guarantee the environmental parameters (temperature, power
supply, etc.) specified in the technical specification section of the manuals.
The main functionality of the IPC/COMPACT6-XS is defined by the application programs
running on the system. The application programs are not part of the delivery by Syslogic but
are defined, developed and tested by the customer or a system-integrator for each specific
application. Refer to the respective documentation for more information.
1.7.4. Maintenance and Repair
The IPC/COMPACT6-XS features error- and malfunction-detection circuitry. Diagnostic
information gathered is transferred to the applications software where it can be used. In the rare
case of a module hardware-failure or malfunction, the complete module should be exchanged.

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The faulty module must be returned to the factory for repair. Please use whenever possible the
original packing for returning the product (ESD and mechanical protection).
1.7. . Warranty
Our products are covered by a world-wide manufacturers warranty. The warranty period starts
at the delivery time from our official distributor to the customer. The duration of the warranty
period is specified in the respective product catalogs and the offers. All products carry a job
number for identification. The manufacturing data and deliveries are registered in a high level
Quality Management System.
The warranty covers material and manufacturing defects. All products must be returned via the
official distributor to the factory for repair or replacement. The warranty expires immediately if
the products are damaged of operation outside of the specified recommended operating
conditions. The warranty also expires if the date code or job number listed on the product is
altered or rendered unintelligible. The warranty does not include damage due to errors in
firmware or software delivered with the products.
1.7.6. RoHS
The product of the IPC/NETIPC-6 family are designed and produced according to the
Restriction of Hazardous Substances (RoHS) Directive (2002/95/EC).
1.7.7. WEEE and Disposal
At the end of the lifespan the IPC/COMPACT6-XS must be properly disposed.
IPC/COMPACT6-XS contains a multitude of elements and must be disposed like computer
parts. The system contains a battery which should be properly disposed.
The products of the IPC/NETIPC-6 are not designed ready for operation for the end-user and
intended for consumer applications. Therefore the Waste Electrical and Electronic Equipment
(WEEE) Directive (2002/96/EC) is not applicable. But users should still dispose the product
properly at the end of life.

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2System Overview
2.1. IPC/COMPACT6-1E
–AMD Geode LX800 @ 0.9W with 500MHz clock
–128kB L1-Cache
–128kB L2-Cache
–256MB DDR400 SDRAM onboard memory (soldered)
–graphic controller: 1920x1440x32bpp @ 85Hz, 1600x1200x32bpp @ 100Hz
–watchdog
–RTC
–Temperature supervisor
–CompactFlash Type-II socket
–DIL-32 Socket for SRAM or NVRAM
–44pol. IDE connector
–2xUSB 2.0 interface
–PS/2 interface
–10/100 Base-T LAN controller (Intel 82551)
–PC/104 bus
–10 – 30V DC unisolated power supply
–1.44MB ROM drive
–2x RS232 interfaces (16550 compatible)
Fig. 1 Functional Block Diagram
CPU
AMD LX800 I/O Companion AMD CS5536
Super I/O
2 x 16550
1 x 8242
256MB RAM
DDR400
256MB RAM
DDR400
PCI/ISA Bridge Ethernet
Intel 82551
Firmwarehub
Boot Flash
ROM Drive
AC97 Codec
System Registers
Temperature
Sensor
LM75
PC/104 Bus
· · · · ·
· · · · ·· · · · · ··
CompactFlash
Connector
32 Pin
Socket
··
· ·
·
·
· · · · ·
· · · · ·
· · · · · · · · · · · · · · ·· · · · ·
· · · · · · · · · · · · · · ·· · · · ·
SVGA
ISA Bus
PCI Bus
LPC Bus
AC97 Audio
USB0
USB1
Ethernet
IDE
X1
COM1
X2
COM2
·····
······
······
·····
······
······
Watchdog 10..30V DC Power Supply
· ·
VDC
GND
RTC
RS232
RS232

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2.2. IPC/COMPACT6-1F
–AMD Geode LX800 @ 0.9W with 500MHz clock
–128kB L1-Cache
–128kB L2-Cache
–256MB DDR400 SDRAM onboard memory (soldered)
–graphic controller: 1920x1440x32bpp @ 85Hz, 1600x1200x32bpp @ 100Hz
–watchdog
–RTC
–Temperature supervisor
–CompactFlash Type-II socket
–DIL-32 Socket for SRAM or NVRAM
–44pol. IDE connector
–2xUSB 2.0 interface
–PS/2 interface
–10/100 Base-T LAN controller (Intel 82551)
–PC/104 bus
–10 – 30V DC unisolated power supply
–1.44MB ROM drive
–1x RS232 interfaces (16550 compatible)
–CAN 2.0B Controller (SJA1000), isolated interface
Fig. 2 Functional Block Diagram
CPU
AMD LX800 I/O Companion AMD CS5536
Super I/O
2 x 16550
1 x 8242
256MB RAM
DDR400
256MB RAM
DDR400
PCI/ISA Bridge Ethernet
Intel 82551
Firmwarehub
Boot Flash
ROM Drive
AC97 Codec
System Registers
Temperature
Sensor
LM75
PC/104 Bus
· · · · ·
· · · · · · · · · · · ·
CompactFlash
Connector
32 Pin
Socket
··
· ·
· ·
· · · · ·
· · · · ·
· · · · · · · · · · · · · · · ·· · · ·
· · · · · · · · · · · · · · · ·· · · ·
SVGA
ISA Bus
PCI Bus
LPC Bus
AC97 Audio
USB0
USB1
Ethernet
IDE
X2
COM2
·····
······
······
Watchdog 10..30V DC Power Supply
· ·
VDC
GND
RTC
RS232
RS232
CAN
Controller
SJA1000
· · · · ·
· · · ·· · · · · ·· ·
X1
CAN
· · · · ·
· · · · ·
COM1

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2.3. IPC/COMPACT6-1G
–AMD Geode LX800 @ 0.9W with 500MHz clock
–128kB L1-Cache
–128kB L2-Cache
–256MB DDR400 SDRAM onboard memory (soldered)
–graphic controller: 1920x1440x32bpp @ 85Hz, 1600x1200x32bpp @ 100Hz
–watchdog
–RTC
–Temperature supervisor
–CompactFlash Type-II socket
–DIL-32 Socket for SRAM or NVRAM
–44pol. IDE connector
–2xUSB 2.0 interface
–PS/2 interface
–10/100 Base-T LAN controller (Intel 82551)
–PC/104 bus
–10 – 30V DC unsiolated power supply
–1.44MB ROM drive
–1x RS232 interfaces (16550 compatible)
–1x RS422/RS485 halb/full duplex, isolated interface
Fig. 3 Functional Block Diagram
CPU
AMD LX800 I/O Companion AMD CS5536
Super I/O
2 x 16550
1 x 8242
256MB RAM
DDR400
256MB RAM
DDR400
PCI/ISA Bridge Ethernet
Intel 82551
Firmwarehub
Boot Flash
ROM Drive
AC97 Codec
System Registers
Temperature
Sensor
LM75
PC/104 Bus
· · · · ·
· · · · ·· · · · · ··
CompactFlash
Connector
32 Pin
Socket
··
· ·
·
·
· · · · ·
· · · · ·
· · · · · · · · · · · · · · ·· · · · ·
· · · · · · · · · · · · · · ·· · · · ·
SVGA
ISA Bus
PCI Bus
LPC Bus
AC97 Audio
USB0
USB1
Ethernet
IDE
X1
COM1
X2
COM2
·····
······
······
·····
······
······
Watchdog 10..30V DC Power Supply
· ·
VDC
GND
RTC
RS232
RS422/485

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2.4. IPC/COMPACT6L-1G
–AMD Geode LX700 @ 0.8W with 433MHz clock
–128kB L1-Cache
–128kB L2-Cache
–128MB DDR400 SDRAM onboard memory (soldered)
–graphic controller: 1920x1440x32bpp @ 85Hz, 1600x1200x32bpp @ 100Hz
–watchdog
–RTC
–Temperature supervisor
–CompactFlash Type-II socket
–DIL-32 Socket for SRAM or NVRAM
–44pol. IDE connector
–2xUSB 2.0 interface
–PS/2 interface
–10/100 Base-T LAN controller (Intel 82551)
–PC/104 bus
–10 – 30V DC unsiolated power supply
–1.44MB ROM drive
–1x RS232 interfaces (16550 compatible)
–1x RS422/RS485 halb/full duplex, isolated interface

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3System Configuration
3.1. IPC/COMPACT6-1E
3.1.1. CPU Configuration
For detailed information on how to configure the CPU peripherals please consult the
documentation of the CPU board [2], chapter 1.4.4.
3.1.2. Serial Interface Configuration
No hardware configuration has to be done.
3.2. IPC/COMPACT6-1F
3.2.1. CPU Configuration
For detailed information on how to configure the CPU peripherals please consult the
documentation of the CPU board [2], chapter 1.4.4.
3.2.2. CAN Interface Configuration
The CAN interface has to be configure according to the customers application. Please refer to
the IPC/COMPAGP-1F documentation [1] , chapter 1.4.4, for a detailed configuration. Please
note that not all options described in the aforementioned document can be used. There are
some restrictions coming from the CPU/Chipset. The following table gives a list of the options
allowed. Otherwise a correct operation cannot be guaranteed.
Description Allowable Options Switch/Jumper Remakrs
Addressing Mode I/O
Memory
SW301-8
Memory Base Address
(only if selected)
C0000h
…
DBFFFh
SW301-7..0 Restricted
I/O Base Address
(only if selected)
7600h - Fixed
Active Termination
(120E)
On
Off
J401
Interrupt 5
6
11
15
J302 Restricted
Tab 2 Allowable configuration options

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3.3. IPC/COMPACT6-1G
3.3.1. CPU Configuration
For detailed information on how to configure the CPU peripherals please consult the
documentation of the CPU board [2] , chapter 1.4.4.
3.3.2. Serial Interface Configuration
No hardware configuration has to be done.
3.4. IPC/COMPACT6L-1G
3.4.1. CPU Configuration
For detailed information on how to configure the CPU peripherals please consult the
documentation of the CPU board [2] , chapter 1.4.4.
3.4.2. Serial Interface Configuration
No hardware configuration has to be done.

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4Enclosure, Assembly and Mounting
4.1. COMPACT6-XS Dimensions
The enclosure can house a complete industrial control system with many basic functions. The
enclosure with its internal electronic system meets EMI/RFI electromagnetic standards according
to the European ”CE”- requirements (see paragraph 1.5).
Fig 4 IPC/COMPACT6-XS
Important Notes
Before assembling the whole enclosure with th
e electronic modules please read through the
following paragraphs containing information about the assembling of the system.
4.2.
4.2.4.2.
4.2. Internal Cabling
No internal cabling has to be done.
127mm
109mm
48.1mm

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4.3. Serviceable Parts
Two parts inside IPC/COMPACT6-XS may be exchanged from time to time:
–Backup-Battery
–CompactFlash card (has to be ordered separately)
In order to exchange these parts, you must remove the cover by executing steps 1 and 2 of the
following instructions.
Important Notes
•The battery socket is coded, no wrong insertion of the backup batteryis possible.
•
Handle the flash memory module with care. A small screwdriver can help to unlock the
memory from its socket.
1. Remove 4 screws (M2.5x4, DIN965A, BN3310) on the side of the case.
2. Slide back the cover part of the case.
3. Exchange the battery or the Compact Flash card.
Fig 5 Service of battery or Compact Flash card
1 2
Battery
Compact
Flash
3

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Important Notes
When opening the enclosure you’re about to handle ESD sensitive devices. Be sure that appropriate
precautions have been made to your working environment. from its socket.
4.4. Final Mounting of the Enclosure
There are two possible ways to mount the system onto a DIN-Rail. DIN-Rail clamps can be
mounted according to Fig. 6. There are two versions of DIN-Rails available: flat C-Rails
(h=7.5mm) and normal C-Rails (h=15mm).
Important Notes
Be sure to use the correct screws; screws which are too long can damage the boards inside
of the enclosure.
Fig 6 One possible way of mounting the IPC/COMPACT6-XS onto the DIN-Rail
Cabinet-Wall
DIN-Rail
M4x5 Screw (DIN7985A, BN3334, M4x5, Form Z)
M4 Washer (8x 4.3 x 0.5, BN726, M4)
Clamp (Weidmueller, FM 4.2/TS35)
Connectors

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Installation and Cabling
.1. Introduction
Installation and cabling of the IPC/COMPACT6-XS system has to be done with great care; the
correct cabling is essential for high operational reliability and the correct grounding is
necessary for protection. To meet the requirements of "CE"-certification all cables have to be
shielded. The enclosure has to be connected to ground via the DIN-rail.
Important Notes
To meet the requirements of RFI "CE"-
cerification, correct mounting, installation and
cabling of the IPC/COMPACT6-
XS system according to these guidelines is absolutely
necessary.
.2. Powering the IPC/COMPACT6-XS System
The "logic voltage", i.e. the power driving the electronic circuits (CPU and base board) is
applied from a 24VDC power supply (10VDC...30VDC). The internal power supply converts
the input voltage to the logic voltage level. Remember that the power supply is unisolated. For
an isolated version please contact the manufacturer. The input voltage is applied with a 2pin
Weidmüller connector:
Pin Description
1 Ground
2 VDC
Tab 3 Power connector pinout
The connector can be ordered directly at your Weidmüller distributor (order code: BL3.5/2F).
Order Code Type
1606640000 BL3.5/2F
Tab 4 Weidmüller power connector