TechNexion TEP-1010-IMX6 User manual

TEP-1010-IMX6 MODULAR HMI PRODUCT MANUAL
(TEP-1010-IMX6)
VER. 1.00
August 21, 2018

TEP-1010-IMX6 HARDWARE MANUAL –VER 1.00 –AUG 21 2018
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REVISION HISTORY
Revision
Date
Originator
Notes
1.00
August 21, 2018
TechNexion
First public release

TEP-1010-IMX6 HARDWARE MANUAL –VER 1.00 –AUG 21 2018
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TABLE OF CONTENTS
1. Introduction ...............................................................................................................................................5
1.1. General Care and Maintenance .........................................................................................................5
2. TEP-1010-IMX6 Product Overview...........................................................................................................6
2.1. Functional Block Diagram ..................................................................................................................6
2.2. Dimensions.........................................................................................................................................7
2.3. Device Cut-out Dimensions For Mounting Though a Panel...............................................................8
2.4. External Connectors...........................................................................................................................9
2.5. Internal Board Connectors ...............................................................................................................10
2.5.1. Galvanic Isolated (TEP1010-IMX6x-Rxx-Exx-Lxxx-XG20-xxx-xxxx) ........................................10
2.5.2. Non-Galvanic Isolated (TEP1010-IMX6x-Rxx-Exx-Lxxx-XS20-xxx-xxxx).................................11
2.5.3. Board View Without the I/O Expansion Module.........................................................................12
3. External Connectors................................................................................................................................13
3.1. LED Light Indicator...........................................................................................................................13
3.2. Micro-SIM Connector........................................................................................................................13
3.3. MicroSD Connector..........................................................................................................................13
3.4. USB OTG (Type-C) Connector ........................................................................................................14
3.5. USB Host Connector........................................................................................................................14
3.6. HDMI (High Definition Multi-Media Interface) Connector.................................................................14
3.7. VGA (15-pin D-SUB) Connector.......................................................................................................14
3.8. Audio Connectors.............................................................................................................................15
3.9. S1 Button..........................................................................................................................................15
3.10. RST Button.....................................................................................................................................15
3.11. Power Input Connector...................................................................................................................15
3.12. Gigabit Ethernet Interface ..............................................................................................................16
3.13. Antenna Holes................................................................................................................................16
3.14. Galvanic Isolated Connectors (TEP1010-IMX6x-Rxx-Exx-Lxxx-XG20-xxx-xxxx) (optional) .........17
3.14.1. Galvanic Isolated Digital I/O Connectors (GPIO1/GPIO2) (optional) ......................................17
3.14.2. Galvanic Isolated Serial Port (RS-XXX) (optional) ..................................................................19
3.14.3. Galvanic Isolated CAN Bus Connector (CANBus) (optional) ..................................................21
3.15. Non-Galvanic Isolated Connectors (TEP1010-IMX6x-Rxx-Exx-Lxxx-XS20-xxx-xxxx) (optional)..22
3.15.1. Non-Galvanic Isolated Digital I/O Connectors (GPIO1/GPIO2) (optional) ..............................22
3.15.2. Non-Galvanic Isolated Serial Port (RS-XXX) (optional)...........................................................23
3.15.3. Non-Galvanic Isolated CAN Bus Connector (CANBus) (optional) ..........................................24
4. Internal Connectors and Expansion Options ..........................................................................................25
4.1. Mini-PCIe Connectors ......................................................................................................................25
4.2. Mini-SIM Cardslot.............................................................................................................................25

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4.3. M.2 KEY-B Slots...............................................................................................................................26
4.4. SW2 Default Boot Mode Switch .......................................................................................................26
4.5. SWITCH1 Boot Mode DIP Switch ....................................................................................................26
4.6. RTC Battery Connector....................................................................................................................26
4.7. Internal Stereo Speaker Connectors................................................................................................27
5. Mounting..................................................................................................................................................28
5.1. VESA Mounting................................................................................................................................28
5.2. Rear Mounting and Mounting Clips Installation................................................................................29
5.3. Surface Mounting and O-ring Installation.........................................................................................30
6. Ordering Information ...............................................................................................................................31
6.1. Custom Part Number Rule ...............................................................................................................31
6.2. Standard Package Contents ............................................................................................................32
7. Important Notice......................................................................................................................................33
8. DISCLAIMER ..........................................................................................................................................34

TEP-1010-IMX6 HARDWARE MANUAL –VER 1.00 –AUG 21 2018
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1. Introduction
1.1. General Care and Maintenance
Your device is a product of superior design and craftsmanship and should be treated with care.
The following suggestions will help you.
•Keep the device dry. Precipitation, humidity, and all types of liquids or moisture can contain
minerals that will corrode electronic circuits. If your device does get wet, allow it to dry completely.
•Do not use or store the device in dusty or dirty areas. Its parts and electronic components can be
damaged.
•Do not store the device in hot areas. High temperatures can shorten the life of electronic devices,
damage batteries, and warp or melt certain plastics.
•Do not store the device in cold areas. When the device returns to its normal temperature,
moisture can form inside the device and damage electronic circuit boards.
•Do not open the device while power is on. Otherwise electrical shock may result.
•Do not drop, knock, or shake the device. Rough handling can break internal circuit boards and
fine mechanics.
•Do not use harsh chemicals, cleaning solvents, or strong detergents to clean the device.
•Do not paint the device. Paint can clog the parts and prevent proper operation.
•Unauthorized modifications or attachments could damage the device and may violate regulations
governing radio devices.
These suggestions apply equally to your device, battery, charger, or any enhancement. If any device is
not working properly, take it to the nearest authorized service facility for service.
Regulatory information
Disposal of Waste Equipment by Users in Private Household in the European Union
This symbol on the product or on its packaging indicates that this product must not be
disposed of with your other household waste. Instead, it is your responsibility to dispose
of your waste equipment by handing it over to a designated collection point for the
recycling of waste electrical and electronic equipment. The separate collection and
recycling of your waste equipment at the time of disposal will help to conserve natural
resources and ensure that it is recycled in a manner that protects human health and the
environment. For more information about where you can drop off your waste equipment
for recycling, please contact your local city office, your household waste disposal service or the shop
where you purchased the product.
We hereby declare that the product is in compliance with the essential requirements and
other relevant provisions of European Directive 1999/5/EC (radio equipment and
telecommunications terminal equipment Directive).

TEP-1010-IMX6 HARDWARE MANUAL –VER 1.00 –AUG 21 2018
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2. TEP-1010-IMX6 Product Overview
2.1. Functional Block Diagram

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2.2. Dimensions
The following figure shows the TEP-1010-IMX6 dimensions (unit: mm):

TEP-1010-IMX6 HARDWARE MANUAL –VER 1.00 –AUG 21 2018
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2.3. Device Cut-out Dimensions For Mounting Though a Panel
The TEP-1010-IMX6 can be mounted on the front or the back of the panel. In order to mount it from the
front, a nominal rectangular cutout must be made in the panel. The following drawing shows the
dimensions of the cut-out area (unit: mm):

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2.4. External Connectors
The TEP-1010-IMX6 has a number of external connectors.
Bottom view:
1 2 4 5 7 9 10 11 12 13 14 15
3
6 8
16 17 18 19 20 21
External Connectors:
No.
Description
No.
Description
1
LED Light indicator
12
3.5mm jack Line in
2
Micro-SIM cardslot
13
3.5mm jack Mic in
3
MicroSD cardslot
14
S1 Boot Select button
4
USB OTG (Type-C) connector
15
Reset button
5
USB Host connector
16
Power Input connector
6
USB Host connector
17
LAN RJ45 connector
7
USB Host connector
18
GPIO1 connector (optional)
8
USB Host connector
19
GPIO2 connector (optional)
9
HDMI connector
20
RS-XXX (Serial Port) connector (optional)
10
VGA (15-pin D-SUB) connector
21
CAN Bus connector (optional)
11
3.5mm jack Line out

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2.5. Internal Board Connectors
The TEP-1010-IMX6 has several connectors, switches and internal expansion options.
2.5.1. Galvanic Isolated (TEP1010-IMX6x-Rxx-Exx-Lxxx-XG20-xxx-xxxx)
Rear view (opened device) with the galvanic isolated I/0 Expansion module:
K*
J*
I/O Expansion Module
I*
A B C D
E
H
F G
Internal Connectors and Switches:
No.
Description
No.
Description
A
mini-PCIe connector (PCIe + USB)
G
M.2 KEY-B slot (SATA + USB)
B
mini-PCIe connector (USB)
H
SWITCH1 Boot mode DIP switch
C
SW2 Default Boot mode switch
I*
SW1 DIP switch
D
M.2 KEY-B slot (USB)
J*
SW3 Terminator Resistor DIP switch
E
RTC Battery connector
K*
SW2 Terminator Resistor DIP switch
F
Mini-SIM cardslot
NOTE: Items marked with * are available on the galvanic isolated I/O Expansion module
(TXB-I2-GS2-GC2-GG8) (optional).

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2.5.2. Non-Galvanic Isolated (TEP1010-IMX6x-Rxx-Exx-Lxxx-XS20-xxx-xxxx)
Rear view (opened device) with the non-galvanic isolated I/0 Expansion module:
I*
I/O Expansion
Module
A B C D
E
H
F G
Internal Connectors and Switches:
No.
Description
No.
Description
A
mini-PCIe connector (PCIe + USB)
F
Mini-SIM cardslot
B
mini-PCIe connector (USB)
G
M.2 KEY-B slot (SATA + USB)
C
SW2 Default Boot mode switch
H
SWITCH1 Boot mode DIP switch
D
M.2 KEY-B slot (USB)
I*
SW1 Terminator Resistor DIP switch
E
RTC Battery connector
NOTE: Items marked with * are available on the non-galvanic isolated I/O Expansion module
(TXB-I2-S2-C2-G8) (optional).

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2.5.3. Board View Without the I/O Expansion Module
Rear view (opened device) without the I/O Expansion module:
I* J*
K*
D
A B C
E
H
F G
Internal Connectors and Switches:
No.
Description
No.
Description
A
mini-PCIe connector (PCIe + USB)
G
M.2 KEY-B slot (SATA + USB)
B
mini-PCIe connector (USB)
H
SWITCH1 Boot mode DIP switch
C
SW2 Default Boot mode switch
I*
Internal R speaker connector
D
M.2 KEY-B slot (USB)
J*
Internal L speaker connector
E
RTC Battery connector
K*
I/O Expansion module connector
F
Mini-SIM cardslot
NOTE: Items marked with * are accessible only after removing the I/O Expansion module.

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3. External Connectors
3.1. LED Light Indicator
The TEP-1010-IMX6 has one programmable LED Light indicator.
LED #
Color
GPIO Kernel
GPIO Bank/IO
1
Green
9
1_9
3.2. Micro-SIM Connector
The TEP-1010-IMX6 features an external Micro-SIM cardslot for use by 3G/4G/LTE wireless module.
NOTE: This cardslot can be only used by a mini-PCIe 3G/4G/LTE module installed into the MPCIE1
connector. The MPCIE1 connector can be found at location “A” in chapter 4. Internal Connectors and
Expansion Options of this manual. No mini-PCIe 3G/4G LTE module is included in this device (must be
purchased separately, not sold by TechNexion).
3.3. MicroSD Connector
The TEP-1010-IMX6 features a standard microSD cardslot which is connected to the NXP i.MX6
integrated “Ultra Secured Digital Host Controller” (uSDHC).
The following main features are supported by uSDHC:
•Compatible with the MMC System Specification version 4.2/4.3/4.4/4.41/5.0.
•Conforms to the SD Host Controller Standard Specification version 3.0.
•Compatible with the SD Memory Card Specification version 3.0 and supports the “Extended
Capacity SD Memory Card”.
•Compatible with the SDIO Card Specification version 3.0.
•Supports 1-bit / 4-bit SD and SDIO modes
The MMC/SD/SDIO host controller can support a single MMC / SD / SDIO card or device.

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3.4. USB OTG (Type-C) Connector
The TEP-1010-IMX6 has one USB Type-C connector (USB 2.0 signals only) that can be used to connect
a host computer to the unit for programming and update purposes.
Pin
#
Signal
Description
Pin
#
Signal
Description
A1
GND
Ground
B1
GND
Ground
A2
NC
B2
NC
A3
NC
B3
NC
A4
VBUS
5V Universal Serial Bus Power
B4
VBUSD
5V Universal Serial Bus Power
A5
CC1
OTG detection signal
B5
CC2D
OTG detection signal
A6
USB_D+
USB differential pair signal
port 1
B6
USB_D+
USB differential pair signal
port 2
A7
USB_D-
B7
USB_D-
A8
NC
B8
NC
A9
VBUS
5V Universal Serial Bus Power
B9
VBUSD
5V Universal Serial Bus Power
A10
NC
B10
NC
A11
NC
B11
NC
A12
GND
Ground
B12
GND
Ground
3.5. USB Host Connector
The TEP-1010-IMX6 has four USB Host connectors (USB 2.0 signals only) to connect to a USB
peripheral such as a keyboard, mouse, USB storage device or USB hub.
3.6. HDMI (High Definition Multi-Media Interface) Connector
The HDMI interface available on the TEP-1010-IMX6 is based on the “HDMI transmitter” & “HDMI 3D TX
PHY” integrated into the NXP i.MX6 processor and can be configured to support a secondary display.
The HDMI supports the following standards & features:
•High-Definition Multimedia Interface Specification, Version 1.4a
•Digital Visual Interface, Revision 1.0
•HDMI Compliance Test Specification, Version 1.4a
•Support for up to 720p at 100Hz and 720i at 200Hz or 1080p at 60Hz and 1080i/720i at 120Hz
HDTV display resolutions and up to QXGA graphic display resolutions.
•Support for 4k x 2k and 3D video formats
•Support for up to 16-bit Deep Color modes
3.7. VGA (15-pin D-SUB) Connector
The VGA interface available on the TEP-1010-IMX6 can be configured to support a secondary display.

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3.8. Audio Connectors
The TEP-1010-IMX6 has three external 3.5mm stereo audio jacks.
Color Code
Signal
Description
Green
L/R Line out
Audio output
Blue
L/R Line in
Audio input
Pink
Mic in
Microphone input
3.9. S1 Button
The TEP-1010-IMX6 by default boots the unit from internal flash storage (eMMC). By pressing the “S1”
button before applying power to the unit and keeping the button pressed for 10 seconds, the unit will boot
from an alternative boot media, such as a microSD card. The primary and alternative booth media are
determined by internal DIP switch settings. Please see sections 4.4. SW2 Default Boot Mode Switch and
4.5. SWITCH1 Boot Mode DIP Switch for more details.
3.10. RST Button
The TEP-1010-IMX6 features a “RST” button for system reset.
3.11. Power Input Connector
The TEP-1010-IMX6 can be powered either over the DC INPUT connector or PoE (optional) over the
RJ45 LAN port.
NOTE: Do not power the unit by DC input when you apply power over the Power over Ethernet (RJ45)!
Pin #
Signal
Description
1
GND
Ground
2
VCC
DC Voltage input (12V/24V/8~36VDC)
Header on TEP-1010-IMX6: Molex 43045-0200 (2-pin Micro-Fit 3.0).
Cable receptacle: Molex 43025-0200 (2-pin Micro-Fit 3.0) plug with crimp contact Molex 43030-0007.

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3.12. Gigabit Ethernet Interface
The TEP-1010-IMX6 by default comes with a single Gigabit Ethernet RJ45 connector. This connector can
support 802.3at Power over Ethernet functionality if configured with the PoE power option (TEP1010-
IMX6x-Rxx-Exx-LPOE-Xxxx-xxx-xxxx) by connecting it to an 802.3at compliant PoE switch or power
injector.
Pin #
1000 Mbps
100 Mbps
10 Mbps
1
MDI0+
Transmit Data+
Transmit Data+
2
MDI0-
Transmit Data-
Transmit Data-
3
MDI1+
Receive Data+
Receive Data+
4
MDI2+
5
MDI2-
6
MDI1-
Receive Data-
Receive Data-
7
MDI3+
8
MDI3-
3.13. Antenna Holes
There are six antenna holes available (two each on the left side, on the right side and on the top side).
They come fitted with breakaway metal tabs. In order to utilize them, the tabs must be removed by
carefully using pincers or pliers.

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3.14. Galvanic Isolated Connectors (TEP1010-IMX6x-Rxx-Exx-Lxxx-XG20-xxx-xxxx)
(optional)
This product is available with four optional connectors: GPIO1, GPIO2, RS-XXX and CAN Bus that can
be ordered in either galvanic isolated or non-galvanic isolated versions. The TEP1010-IMX6x-Rxx-Exx-
Lxxx-XG20-xxx-xxxx has four optional galvanic isolated connectors: GPIO1, GPIO2, RS-XXX and CAN
Bus.
Top view of the galvanic isolated I/0 Expansion module (TXB-I2-GS2-GC2-GG8):
C
B
A
No.
Description
No.
Description
A
SW1 DIP switch
C
SW2 Terminator Resistor DIP switch
B
SW3 Terminator Resistor DIP switch
3.14.1. Galvanic Isolated Digital I/O Connectors (GPIO1/GPIO2) (optional)
The galvanic isolated GPIO Expansion headers have the following pinout:
GPIO1:
Pin
#
Signal
Description
Voltage
Current
Max.
GPIO
Kernel
GPIO
Bank/IO
Min.
Typ.
Max.
1
GPIO1A
DIG_IN1
6V
1A
161
6_1
2
GPIO1B
DIG_IN2
6V
1A
42
2_10
3
GND_DIO
Ground for digital I/O
4
GND
Common Ground
5
GPIO1C
DIG_OUT5
16V
1.7A
1
1_1
6
GPIO1D
DIG_OUT6
16V
1.7A
102
4_6
7
VCC_DIO
Supply input for digital I/O
16V
8
VCC
Supply output
12V

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GPIO2:
Pin
#
Signal
Description
Voltage
Current
Max.
GPIO
Kernel
GPIO
Bank/IO
Min.
Typ.
Max.
1
GPIO2A
DIG_IN1
6V
1A
165
6_5
2
GPIO2B
DIG_IN2
6V
1A
164
6_4
3
GND_DIO
Ground for digital I/O
4
GND
Common Ground
5
GPIO2C
DIG_OUT5
16V
1.7A
162
6_2
6
GPIO2D
DIG_OUT6
16V
1.7A
163
6_3
7
VCC_DIO
Supply input for digital I/O
16V
8
VCC
Supply output
12V
Header on TEP-1010-IMX6: Molex 43045-0800 (8-pin Micro-Fit 3.0).
Cable receptacle: Molex 43025-0800 (8-pin Micro-Fit 3.0) plug with crimp contact Molex 43030-0007.

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3.14.2. Galvanic Isolated Serial Port (RS-XXX) (optional)
The dual 4-wire galvanic isolated serial port can be configured as follows: the primary serial port can only
be used as a standard RS-232. The secondary port can be configured either as RS-232, or RS-422 or
RS-485. This serial port is set by default as RS-232. Setting the TEP-1010-IMX6 in other mode will
require to open the device and adjust the internal SW1 DIP and SW3 Terminator Resistor DIP switch
settings on the TEP I/O Expansion board. The SW1 DIP switch can be found at location “A” and SW3 DIP
switch at location “B” in chapter 3.14. Galvanic Isolated Connectors (TEP1010-IMX6x-Rxx-Exx-Lxxx-
XG20-xxx-xxxx) (optional) of this manual.
SW1:
Pin #
RS-232 (default)
RS-422
RS-485
1-8
ON
OFF
OFF
2-7
OFF
ON
OFF
3-6
OFF
OFF
ON
4-5
-
-
-
SW3:
Pin #
ON
OFF
1-8
Enable RS-485 Terminator Resistor
Disable RS-485 Terminator Resistor
2-7
Enable RS-422 Terminator Resistor
Disable RS-422 Terminator Resistor
3-6
-
-
4-5
-
-
RS-232 + RS-232 (default setup):
Pin #
Signal
Description
Device
1
GND
Ground
2
SERIAL1A_TXD
Port#1A Transmit data (output)
ttymxc0
3
SERIAL1A_RXD
Port#1A Receive data (input)
ttymxc0
4
SERIAL1A_RTS
Port#1A Request-to-send (output)
ttymxc0
5
SERIAL1A_CTS
Port#1A Clear-to-send (input)
ttymxc0
6
GND
Ground
7
SERIAL1B_TXD
Port#1B Transmit data (output)
ttymxc1
8
SERIAL1B_RXD
Port#1B Receive data (input)
ttymxc1
9
SERIAL1B_RTS
Port#1B Request-to-send (output)
ttymxc1
10
SERIAL1B_CTS
Port#1B Clear-to-send (input)
ttymxc1

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RS-232 + RS-422:
Pin #
Signal
Description
Device
1~5
SERIAL1A
Identical as above
ttymxc0
6
GND
Ground
7
SERIAL1B_TXD+
RS-422 Transmit positive data signal (output)
ttymxc1
8
SERIAL1B_RXD-
RS-422 Receive negative data signal (input)
ttymxc1
9
SERIAL1B_RXD+
RS-422 Receive positive data signal (input)
ttymxc1
10
SERIAL1B_TXD-
RS-422 Transmit negative data signal (output)
ttymxc1
RS-232 + RS-485:
Pin #
Signal
Description
Device
1~5
SERIAL1A
Identical as above
ttymxc0
6
GND
Ground
7
SERIAL1B+
RS-485 positive data signal
ttymxc1
8
NC
9
NC
10
SERIAL1B-
RS-485 negative data signal
ttymxc1
NOTE: SERIAL1A port can act by default as serial debug console.
Header on TEP-1010-IMX6: Molex 43045-1000 (10-pin Micro-Fit 3.0).
Cable receptacle: Molex 43025-1000 (10-pin Micro-Fit 3.0) plug with crimp contact Molex 43030-0007.