TechNexion TEP1560 Series User manual

TEP-1560-BSW MODULAR HMI PRODUCT MANUAL
(TEP-1560-BSW)
VER. 1.00
March 25, 2019

TEP-1560-BSW HARDWARE MANUAL –VER 1.00 MAR 25 2019
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REVISION HISTORY
Revision
Date
Originator
Notes
1.00
March 25, 2019
TechNexion
First public release

TEP-1560-BSW HARDWARE MANUAL –VER 1.00 MAR 25 2019
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TABLE OF CONTENTS
1. Introduction ...............................................................................................................................................5
1.1. General Care and Maintenance .........................................................................................................5
2. TEP-1560-BSW Product Overview...........................................................................................................6
2.1. Functional Block Diagram ..................................................................................................................6
2.2. Dimensions.........................................................................................................................................7
2.3. Device Cut-out Dimensions For Mounting Though a Panel...............................................................8
2.4. External Connectors...........................................................................................................................9
2.5. Internal Board Connectors ...............................................................................................................10
2.5.1. Galvanic Isolated (TEP1560-xxxxx-Rxx-Lxxx-XG21- xxxx-xxx-xxxx-xxxx)...............................10
2.5.2. Non-Galvanic Isolated (TEP1010-xxxxx-Rxx-Lxxx-XS21-xxxx-xxx-xxxx-xxxx) ........................11
3. External Connectors................................................................................................................................12
3.1. LED Light Indicator...........................................................................................................................12
3.2. Micro-SIM Connector........................................................................................................................12
3.3. MicroSD Connector..........................................................................................................................12
3.4. USB OTG (Type-C) Connector ........................................................................................................13
3.5. Gigabit Ethernet Interface (LAN1/LAN2)..........................................................................................13
3.6. USB 2.0 Host Connectors ................................................................................................................13
3.7. USB 3.0 Host Connectors ................................................................................................................14
3.8. miniDP (Mini DisplayPort) Connector...............................................................................................14
3.9. HDMI (High Definition Multi-Media Interface) Connector.................................................................14
3.10. Audio Connectors...........................................................................................................................14
3.11. RST Button.....................................................................................................................................14
3.12. PWR Button....................................................................................................................................14
3.13. Power Input Connector...................................................................................................................15
3.14. Antenna Holes................................................................................................................................15
3.15. Galvanic Isolated Connectors (TEP1560-xxxxx-Rxx-Lxxx-XG21-xxxx-xxx-xxxx-xxxx) (optional).15
3.15.1. Galvanic Isolated Digital I/O Connectors (GPIO1/GPIO2) (optional) ......................................16
3.15.2. Galvanic Isolated Serial Port (RS-XXX) (optional) ..................................................................17
3.16. Non-Galvanic Isolated Connectors (TEP1560-xxxxx-Rxx-Lxxx-XS21- xxxx-xxx-xxxx-xxxx)
(optional)..................................................................................................................................................18
3.16.1. Non-Galvanic Isolated Digital I/O Connectors (GPIO1/GPIO2) (optional) ..............................19
3.16.2. Non-Galvanic Isolated Serial Port (RS-XXX) (optional)...........................................................20
4. Internal Connectors and Expansion Options ..........................................................................................21
4.1. M.2 KEY-B Slots...............................................................................................................................21
4.2. SATA 3.0 and SATA Power Connectors..........................................................................................21
4.3. RTC Battery Connector....................................................................................................................22

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4.4. M.2 KEY-E Slot.................................................................................................................................22
4.5. CMOS Jumper..................................................................................................................................22
4.6. SO-DIMM DDR3L Slot......................................................................................................................22
4.7. Internal Stereo Speaker Connectors................................................................................................23
5. BIOS Setup .............................................................................................................................................24
5.1. Entering and Exiting BIOS................................................................................................................24
5.2. BIOS Setup Screens Overview ........................................................................................................24
5.2.1. Main ...........................................................................................................................................25
5.2.2. Chipset.......................................................................................................................................26
5.2.3. Advanced...................................................................................................................................27
5.2.4. Boot............................................................................................................................................30
5.2.5. Security......................................................................................................................................31
5.2.6. Save & Exit ................................................................................................................................32
6. Mounting..................................................................................................................................................33
6.1. VESA Mounting................................................................................................................................33
6.2. Rear Mounting and Mounting Clips Installation................................................................................34
6.3. Surface Mounting .............................................................................................................................35
7. Ordering Information...............................................................................................................................36
7.1. Custom Part Number Rule ...............................................................................................................36
7.2. Standard Package Contents ............................................................................................................37
8. Important Notice......................................................................................................................................38
9. Disclaimer ...............................................................................................................................................39

TEP-1560-BSW HARDWARE MANUAL –VER 1.00 MAR 25 2019
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1. Introduction
1.1. General Care and Maintenance
Your device is a product of superior design and craftsmanship and should be treated with care.
The following suggestions will help you.
•Keep the device dry. Precipitation, humidity, and all types of liquids or moisture can contain
minerals that will corrode electronic circuits. If your device does get wet, allow it to dry completely.
•Do not use or store the device in dusty or dirty areas. Its parts and electronic components can be
damaged.
•Do not store the device in hot areas. High temperatures can shorten the life of electronic devices,
damage batteries, and warp or melt certain plastics.
•Do not store the device in cold areas. When the device returns to its normal temperature,
moisture can form inside the device and damage electronic circuit boards.
•Do not open the device while power is on. Otherwise electrical shock may result.
•Do not drop, knock, or shake the device. Rough handling can break internal circuit boards and
fine mechanics.
•Do not use harsh chemicals, cleaning solvents, or strong detergents to clean the device.
•Do not paint the device. Paint can clog the parts and prevent proper operation.
•Unauthorized modifications or attachments could damage the device and may violate regulations
governing radio devices.
These suggestions apply equally to your device, battery, charger, or any enhancement. If any device is
not working properly, take it to the nearest authorized service facility for service.
Regulatory information
Disposal of Waste Equipment by Users in Private Household in the European Union
This symbol on the product or on its packaging indicates that this product must not be
disposed of with your other household waste. Instead, it is your responsibility to dispose
of your waste equipment by handing it over to a designated collection point for the
recycling of waste electrical and electronic equipment. The separate collection and
recycling of your waste equipment at the time of disposal will help to conserve natural
resources and ensure that it is recycled in a manner that protects human health and the
environment. For more information about where you can drop off your waste equipment
for recycling, please contact your local city office, your household waste disposal service or the shop
where you purchased the product.
We hereby declare that the product is in compliance with the essential requirements and
other relevant provisions of European Directive 2014/53/EU (Directive on the
harmonisation of the laws of the Member States relating to the making available on the
market of radio equipment and repealing Directive 1999/5/EC).

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2. TEP-1560-BSW Product Overview
2.1. Functional Block Diagram

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2.2. Dimensions
The following figure shows the TEP-1560-BSW dimensions (unit: mm):

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2.3. Device Cut-out Dimensions For Mounting Though a Panel
The TEP-1560-BSW can be mounted on the front or the back of the panel. In order to mount it from the
front, a nominal rectangular cutout must be made in the panel. The following drawing shows the
dimensions of the cut-out area (unit: mm):

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2.4. External Connectors
The TEP-1560-BSW has a number of external connectors.
Bottom view:
1 245 6 8 10 11 12 14 15 16
3 7 9 13
17 18 19 20 21
External Connectors:
No.
Description
No.
Description
1
LED Light indicator
12
3.5mm jack Line out
2
Micro-SIM cardslot
13
3.5mm jack Line in
3
MicroSD cardslot
14
3.5mm jack Mic in
4
USB OTG (Type-C) connector
15
Reset button
5
LAN2 RJ45 connector
16
Power button
6
USB 2.0 Host connector
17
Power Input connector
7
USB 2.0 Host connector
18
LAN1 RJ45 connector (PoE)
8
USB 3.0 Host connector
19
GPIO1 connector (optional)
9
USB 3.0 Host connector
20
GPIO2 connector (optional)
10
miniDP connector
21
RS-XXX (Serial Port) connector (optional)
11
HDMI connector

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2.5. Internal Board Connectors
The TEP-1560-BSW has several connectors, switches and internal expansion options.
2.5.1. Galvanic Isolated (TEP1560-xxxxx-Rxx-Lxxx-XG21- xxxx-xxx-xxxx-xxxx)
Rear view (opened device) with the galvanic isolated I/0 Expansion module:
IJ
Power I/O Expansion
Module A H Module
B
C D
E F G
Internal Connectors and Switches:
No.
Description
No.
Description
A
M.2 KEY-B slot (SATA + USB 2.0)
F
RTC Battery connector
B
M.2 KEY-B slot (USB 2.0)
G
M.2 KEY-E slot (PCIe + USB 2.0)
C
SATA Power connector
H
SO-DIMM DDR3L slot
D
CMOS jumper
I
Internal R speaker connector
E
SATA 3.0 connector
J
Internal L speaker connector

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2.5.2. Non-Galvanic Isolated (TEP1010-xxxxx-Rxx-Lxxx-XS21-xxxx-xxx-xxxx-xxxx)
Rear view (opened device) with the non-galvanic isolated I/0 Expansion module:
IJ
Power I/O Expansion
Module A H Module
B
C D
E F G
Internal Connectors and Switches:
No.
Description
No.
Description
A
M.2 KEY-B slot (SATA + USB 2.0)
F
RTC Battery connector
B
M.2 KEY-B slot (USB 2.0)
G
M.2 KEY-E slot (PCIe + USB 2.0)
C
SATA Power connector
H
SO-DIMM DDR3L slot
D
CMOS jumper
I
Internal R speaker connector
E
SATA 3.0 connector
J
Internal L speaker connector

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3. External Connectors
3.1. LED Light Indicator
The TEP-1560-BSW has one Power LED Light indicator. The Power LED Light indicator is lit, when the
system is powered on.
LED #
Color
Power on
Power off
1
Green
ON
OFF
3.2. Micro-SIM Connector
The TEP-1560-BSW features an external Micro-SIM cardslot for use by 3G/4G/LTE wireless module.
NOTE: This cardslot can be only used by a M.2 KEY-B 3G/4G/LTE module installed into the 3G/LTE
connector. The 3G/LTE connector can be found at location “A” in chapter 4. Internal Connectors and
Expansion Options of this manual. No M.2 KEY-B 3G/LTE module is included in this device (must be
purchased separately, not sold by TechNexion).
3.3. MicroSD Connector
The TEP-1560-BSW features a standard microSD cardslot which is connected to the Intel processor’s
(Atom x5-E8000 / Pentium N3710) integrated “Ultra Secured Digital Host Controller” (uSDHC).
The following main features are supported by uSDHC:
•Compatible with the MMC System Specification version 4.2/4.3/4.4/4.41/5.0.
•Conforms to the SD Host Controller Standard Specification version 3.0.
•Compatible with the SD Memory Card Specification version 3.0 and supports the “Extended
Capacity SD Memory Card”.
•Compatible with the SDIO Card Specification version 3.0.
•Supports 1-bit / 4-bit SD and SDIO modes
The MMC/SD/SDIO host controller can support a single MMC / SD / SDIO card or device.

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3.4. USB OTG (Type-C) Connector
The TEP-1560-BSW has one USB OTG Type-C connector (USB 2.0 and USB 3.0 signals) that can be
used to connect a host computer to the unit for programming and update purposes.
Pin
#
Signal
Description
Pin
#
Signal
Description
A1
GND
Ground
B1
GND
Ground
A2
TX1+
SS differential pair #1 signal
B2
TX2+
SS differential pair #3 signal
A3
TX1-
B3
TX2-
A4
VBUS
5V Universal Serial Bus Power
B4
VBUS
5V Universal Serial Bus Power
A5
CC1
OTG detection signal port 1
B5
CC2
OTG detection signal port 2
A6
USB_D+
USB differential pair signal
port 1
B6
USB_D+
USB differential pair signal
port 2
A7
USB_D-
B7
USB_D-
A8
SBU1
Sideband use port 1
B8
SBU1
Sideband use port 2
A9
VBUS
5V Universal Serial Bus Power
B9
VBUS
5V Universal Serial Bus Power
A10
RX2-
SS differential pair #4 signal
B10
RX1-
SS differential pair #2 signal
A11
RX2+
B11
RX1+
A12
GND
Ground
B12
GND
Ground
3.5. Gigabit Ethernet Interface (LAN1/LAN2)
The TEP-1560-BSW comes with two Gigabit Ethernet RJ45 connectors. LAN1 connector can support
802.3at Power over Ethernet functionality if configured with the PoE power option (TEP1010-xxxxx-Rxx-
LPOE-xxxx-xxxx-xxx-xxxx-xxxx) by connecting it to an 802.3at compliant PoE switch or power injector.
LAN1 / LAN2:
Pin #
1000 Mbps
100 Mbps
10 Mbps
1
MDI0+
Transmit Data+
Transmit Data+
2
MDI0-
Transmit Data-
Transmit Data-
3
MDI1+
Receive Data+
Receive Data+
4
MDI2+
5
MDI2-
6
MDI1-
Receive Data-
Receive Data-
7
MDI3+
8
MDI3-
3.6. USB 2.0 Host Connectors
The TEP-1560-BSW has two USB 2.0 Host connectors (USB 2.0 signals only) to connect to a USB
peripheral such as a keyboard, mouse, USB storage device or USB hub.

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3.7. USB 3.0 Host Connectors
The TEP-1560-BSW has two USB 3.0 Host connectors (USB 2.0 and USB 3.0 signals) to connect to a
USB peripheral such as a keyboard, mouse, USB storage device or USB hub.
3.8. miniDP (Mini DisplayPort) Connector
The miniDP interface available on the TEP-1560-BSW is based on Intel HD Graphics engine integrated
into the Intel Braswell processor and can be configured to support a secondary display.
The miniDP supports the following standards & features:
•DisplayPort 1.1a
•DisplayPort Content Protection
•High-bandwidth Digital Content Protection
•Refresh rate up to 240 FPS for 1080p at 24 bpp
•Support for up to 4k x 2k and 3D video formats
•Support for up to 48 bpp Color Depth
3.9. HDMI (High Definition Multi-Media Interface) Connector
The HDMI interface available on the TEP-1560-BSW is based on Intel HD Graphics engine integrated
into the Intel Braswell processor and can be configured to support a secondary display.
The HDMI supports the following standards & features:
•High-Definition Multimedia Interface Specification, Version 1.4b
•Digital Visual Interface, Revision 1.0
•HDMI Compliance Test Specification, Version 1.4b
•Support for up to 720p at 100Hz and 720i at 200Hz or 1080p at 60Hz and 1080i/720i at 120Hz
HDTV display resolutions and up to QXGA graphic display resolutions.
•Support for 4k x 2k and 3D video formats
•Support for up to 16-bit Deep Color modes
3.10. Audio Connectors
The TEP-1560-BSW has three external 3.5mm stereo audio jacks.
Color Code
Signal
Description
Green
L/R Line out
Audio output
Blue
L/R Line in
Audio input
Pink
Mic in
Microphone input
3.11. RST Button
The TEP-1560-BSW features a “RST” button for system reset.
3.12. PWR Button
The TEP-1560-BSW features a “PWR” button for system power on. System is turned on when button is
pressed, and the Power LED Light indicator lit. If the system hangs, depressing the button for 5 seconds
powers down the system.

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3.13. Power Input Connector
The TEP-1560-BSW can be powered either over the DC INPUT connector or PoE (optional) over the
RJ45 LAN1 port.
NOTE: Do not power the unit by DC input when you apply power over the Power over Ethernet (RJ45)!
Pin #
Signal
Description
1
GND
Ground
2
VCC
DC Voltage input (12V/24V/8~36VDC)
Header on TEP-1560-BSW: Molex 43045-0200 (2-pin Micro-Fit 3.0).
Cable receptacle: Molex 43025-0200 (2-pin Micro-Fit 3.0) plug with crimp contact Molex 43030-0007.
3.14. Antenna Holes
There are six antenna holes available (two each on the left side, on the right side and on the top side).
They come fitted with breakaway metal tabs. In order to utilize them, the tabs must be removed by
carefully using pincers or pliers.
3.15. Galvanic Isolated Connectors (TEP1560-xxxxx-Rxx-Lxxx-XG21-xxxx-xxx-
xxxx-xxxx) (optional)
This product is available with three optional connectors: GPIO1, GPIO2, and RS-XXX that can be ordered
in either galvanic isolated or non-galvanic isolated versions. The TEP1560-xxxxx-Rxx-Lxxx-XG21-xxxx-
xxx-xxxx-xxxx has three optional galvanic isolated connectors: GPIO1, GPIO2, and RS-XXX.
Bottom view of the galvanic isolated I/0 Expansion module (TXR-I2-GS2-GG8):
B
A
No.
Description
No.
Description
A
SW1 DIP switch
B
SW3 Terminator Resistor DIP switch

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3.15.1. Galvanic Isolated Digital I/O Connectors (GPIO1/GPIO2) (optional)
The galvanic isolated GPIO Expansion headers have the following pinout:
GPIO1:
Pin
#
Signal
Description
Voltage
Curr
ent
Max.
Interfa
ce
Source
Control
ler
SIO
Pin #
Min.
Typ.
Max.
1
GPIO1A
DIG_IN1
4.75V
5V
5.25V
300
mA
LPC
Fintek
F81804
GPIO12
2
GPIO1B
DIG_IN2
4.75V
5V
5.25V
300
mA
LPC
Fintek
F81804
GPIO17
3
GND_DIO
Ground for digital
I/O
4
GND
Common Ground
5
GPIO1C
DIG_OUT5
11.21
V
11.8V
12.39
V
125
mA
LPC
Fintek
F81804
GPIO91
6
GPIO1D
DIG_OUT6
11.21
V
11.8V
12.39
V
125
mA
LPC
Fintek
F81804
GPIO94
7
VCC_DIO
Supply input for
digital I/O
5V
12.39
V
300
mA
8
VCC
Supply output
11.4V
12V
12.6V
300
mA
GPIO2:
Pin
#
Signal
Description
Voltage
Curr
ent
Max.
Interfa
ce
Source
Control
ler
SIO
Pin #
Min.
Typ.
Max.
1
GPIO2A
DIG_IN1
4.75V
5V
5.25V
300
mA
LPC
Fintek
F81804
GPIO93
2
GPIO2B
DIG_IN2
4.75V
5V
5.25V
300
mA
LPC
Fintek
F81804
GPIO16
3
GND_DIO
Ground for digital
I/O
4
GND
Common Ground
5
GPIO2C
DIG_OUT5
11.21
V
11.8V
12.39
V
125
mA
LPC
Fintek
F81804
GPIO92
6
GPIO2D
DIG_OUT6
11.21
V
11.8V
12.39
V
125
mA
LPC
Fintek
F81804
GPIO15
7
VCC_DIO
Supply input for
digital I/O
5V
12.39
V
300
mA
8
VCC
Supply output
11.4V
12V
12.6V
300
mA
Header on TEP-1560-BSW: Molex 43045-0800 (8-pin Micro-Fit 3.0).
Cable receptacle: Molex 43025-0800 (8-pin Micro-Fit 3.0) plug with crimp contact Molex 43030-0007.

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3.15.2. Galvanic Isolated Serial Port (RS-XXX) (optional)
The dual 4-wire galvanic isolated serial port can be configured as follows: the primary serial port can only
be used as a standard RS-232. The secondary port can be configured either as RS-232, or RS-422 or
RS-485. This serial port is set by default as RS-232. Setting the TEP-1560-BSW in other mode will
require to open the device and adjust the internal SW1 DIP and SW3 Terminator Resistor DIP switch
settings on the TEP I/O Expansion board. The SW1 DIP switch can be found at location “A” and SW3 DIP
switch at location “B” in chapter 3.15. Galvanic Isolated Connectors (TEP1010-xxxxx-Rxx-Lxxx-XG21-
xxxx-xxx-xxxx-xxxx) (optional) of this manual.
SW1:
Pin #
RS-232 (default)
RS-422
RS-485
1-8
ON
OFF
OFF
2-7
OFF
ON
OFF
3-6
OFF
OFF
ON
4-5
-
-
-
SW3:
Pin #
ON
OFF
1-8
Enable RS-485 Terminator Resistor
Disable RS-485 Terminator Resistor
2-7
Enable RS-422 Terminator Resistor
Disable RS-422 Terminator Resistor
3-6
-
-
4-5
-
-
RS-232 + RS-232 (default setup):
Pin #
Signal
Description
Device
1
GND
Ground
2
SERIAL1A_TXD
Port#1A Transmit data (output)
COM1
3
SERIAL1A_RXD
Port#1A Receive data (input)
COM1
4
SERIAL1A_RTS
Port#1A Request-to-send (output)
COM1
5
SERIAL1A_CTS
Port#1A Clear-to-send (input)
COM1
6
GND
Ground
7
SERIAL1B_TXD
Port#1B Transmit data (output)
COM2
8
SERIAL1B_RXD
Port#1B Receive data (input)
COM2
9
SERIAL1B_RTS
Port#1B Request-to-send (output)
COM2
10
SERIAL1B_CTS
Port#1B Clear-to-send (input)
COM2

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RS-232 + RS-422:
Pin #
Signal
Description
Device
1~5
SERIAL1A
Identical as above
COM1
6
GND
Ground
7
SERIAL1B_TXD+
RS-422 Transmit positive data signal (output)
COM2
8
SERIAL1B_RXD-
RS-422 Receive negative data signal (input)
COM2
9
SERIAL1B_RXD+
RS-422 Receive positive data signal (input)
COM2
10
SERIAL1B_TXD-
RS-422 Transmit negative data signal (output)
COM2
RS-232 + RS-485:
Pin #
Signal
Description
Device
1~5
SERIAL1A
Identical as above
COM1
6
GND
Ground
7
SERIAL1B+
RS-485 positive data signal
COM2
8
NC
9
NC
10
SERIAL1B-
RS-485 negative data signal
COM2
Header on TEP-1560-BSW: Molex 43045-1000 (10-pin Micro-Fit 3.0).
Cable receptacle: Molex 43025-1000 (10-pin Micro-Fit 3.0) plug with crimp contact Molex 43030-0007.
3.16. Non-Galvanic Isolated Connectors (TEP1560-xxxxx-Rxx-Lxxx-XS21- xxxx-
xxx-xxxx-xxxx) (optional)
This product is available with three optional connectors: GPIO1, GPIO2, and RS-XXX that can be ordered
in either galvanic isolated or non-galvanic isolated versions. The TEP1560-xxxxx-Rxx-Lxxx-XS21-xxxx-
xxx-xxxx-xxxx has three optional non-galvanic isolated connectors: GPIO1, GPIO2, and RS-XXX.
Bottom view of the non-galvanic isolated I/0 Expansion module (TXR-I2-S2-G8):

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3.16.1. Non-Galvanic Isolated Digital I/O Connectors (GPIO1/GPIO2) (optional)
The non-galvanic isolated GPIO Expansion headers have the following pinout:
GPIO1:
Pin
#
Signal
Description
Voltage
Curr
ent
Max.
Interfa
ce
Source
Control
ler
SIO
Pin #
Min.
Typ.
Max.
1
GPIO1A
DIG_IN1/OUT1
3.14V
3.3V
3.46V
12
mA
LPC
Fintek
F81804
GPIO12
2
GPIO1B
DIG_IN2/OUT2
3.14V
3.3V
3.46V
12
mA
LPC
Fintek
F81804
GPIO17
3
NC
4
GND
Common Ground
5
GPIO1C
DIG_IN5/OUT5
3.14V
3.3V
3.46V
12
mA
LPC
Fintek
F81804
GPIO91
6
GPIO1D
DIG_IN5/OUT6
3.14V
3.3V
3.46V
12
mA
LPC
Fintek
F81804
GPIO94
7
NC
8
VCC
Supply output
11.4V
12V
12.6V
300
mA
GPIO2:
Pin
#
Signal
Description
Voltage
Curr
ent
Max.
Interfa
ce
Source
Control
ler
SIO
Pin #
Min.
Typ.
Max.
1
GPIO2A
DIG_IN1/OUT1
3.14V
3.3V
3.6V
12
mA
LPC
Fintek
F81804
GPIO93
2
GPIO2B
DIG_IN2/OUT2
3.14V
3.3V
3.6V
12
mA
LPC
Fintek
F81804
GPIO16
3
NC
4
GND
Common Ground
5
GPIO2C
DIG_IN5/OUT5
3.14V
3.3V
3.6V
12
mA
LPC
Fintek
F81804
GPIO92
6
GPIO2D
DIG_IN5/OUT6
3.14V
3.3V
3.6V
12
mA
LPC
Fintek
F81804
GPIO15
7
NC
8
VCC
Supply output
11.4V
12V
12.6V
300
mA
Header on TEP-1560-BSW: Molex 43045-0800 (8-pin Micro-Fit 3.0).
Cable receptacle: Molex 43025-0800 (8-pin Micro-Fit 3.0) plug with crimp contact Molex 43030-0007.

TEP-1560-BSW HARDWARE MANUAL –VER 1.00 MAR 25 2019
Page 20 of 39
3.16.2. Non-Galvanic Isolated Serial Port (RS-XXX) (optional)
The dual 4-wire non-galvanic isolated serial port are configured as follows: the primary and the secondary
serial port can only be used as a standard RS-232.
RS-232 + RS-232:
Pin #
Signal
Description
Device
1
GND
Ground
2
SERIAL1A_TXD
Port#1A Transmit data (output)
COM1
3
SERIAL1A_RXD
Port#1A Receive data (input)
COM1
4
SERIAL1A_RTS
Port#1A Request-to-send (output)
COM1
5
SERIAL1A_CTS
Port#1A Clear-to-send (input)
COM1
6
GND
Ground
7
SERIAL1B_TXD
Port#1B Transmit data (output)
COM2
8
SERIAL1B_RXD
Port#1B Receive data (input)
COM2
9
SERIAL1B_RTS
Port#1B Request-to-send (output)
COM2
10
SERIAL1B_CTS
Port#1B Clear-to-send (input)
COM2
Header on TEP-1560-BSW: Molex 43045-1000 (10-pin Micro-Fit 3.0).
Cable receptacle: Molex 43025-1000 (10-pin Micro-Fit 3.0) plug with crimp contact Molex 43030-0007.