TQ-Systems MBa335x User manual

MBa335x
User's Manual
MBa335x UM 0202
26.10.2018

User's Manual l MBa335x UM 0202 l © 2018, TQ-Systems Gm H Page i
TABLE OF CONTENTS
1. ABOUT THIS MANUAL................................................................................................................................................................................1
1.1 Copyright and licence expenses ............................................................................................................................................................1
1.2 Registered trademarks ..............................................................................................................................................................................1
1.3 Disclaimer......................................................................................................................................................................................................1
1.4 Imprint............................................................................................................................................................................................................1
1.5 Tips on safety................................................................................................................................................................................................2
1.6 Sym ols and typographic conventions ...............................................................................................................................................2
1.7 Handling and ESD tips...............................................................................................................................................................................2
1.8 Naming of signals .......................................................................................................................................................................................3
1.9 Further applica le documents / presumed knowledge.................................................................................................................3
2. BRIEF DESCRIPTION ....................................................................................................................................................................................4
3. TECHNICAL DATA........................................................................................................................................................................................4
3.1 System architecture and functionality .................................................................................................................................................4
3.1.1 Block diagram...............................................................................................................................................................................................4
3.1.2 Functionality.................................................................................................................................................................................................5
4. ELECTRONICS ...............................................................................................................................................................................................6
4.1 System components ..................................................................................................................................................................................6
4.1.1 TQMa335x .....................................................................................................................................................................................................6
4.1.2 I2C address mapping..................................................................................................................................................................................9
4.1.3 Temperature sensor ................................................................................................................................................................................ 10
4.1.4 RTC ackup supply .................................................................................................................................................................................. 11
4.1.5 Power and Reset....................................................................................................................................................................................... 12
4.1.6 Port-Expander ........................................................................................................................................................................................... 14
4.1.7 Further configuration options ............................................................................................................................................................. 15
4.1.8 Real-Time Unit (PRU)............................................................................................................................................................................... 15
4.1.9 Power supply............................................................................................................................................................................................. 16
4.2 Communication interfaces.................................................................................................................................................................... 19
4.2.1 USB 2.0 Hi-Speed Host............................................................................................................................................................................ 19
4.2.2 USB 2.0 Hi-Speed OTG ............................................................................................................................................................................ 22
4.2.3 Ethernet 1000BASE-T.............................................................................................................................................................................. 23
4.2.4 CAN............................................................................................................................................................................................................... 25
4.2.5 RS-485.......................................................................................................................................................................................................... 27
4.2.6 RS-232.......................................................................................................................................................................................................... 28
4.2.7 LVDS............................................................................................................................................................................................................. 29
4.2.8 LVDS-CMD.................................................................................................................................................................................................. 31
4.2.9 Audio............................................................................................................................................................................................................ 33
4.2.10 SD card ........................................................................................................................................................................................................ 35
4.2.11 Mini PCIe..................................................................................................................................................................................................... 36
4.2.12 JTAG & EMU ............................................................................................................................................................................................... 38
4.2.13 Headers X4, X5, X6................................................................................................................................................................................... 40
4.3 Diagnose- and user interfaces.............................................................................................................................................................. 44
4.3.1 Diagnose LEDs .......................................................................................................................................................................................... 44
4.3.2 Navigation uttons.................................................................................................................................................................................. 46
4.3.3 Power-On and Reset- utton................................................................................................................................................................. 46
4.3.4 CAN and RS-485 termination................................................................................................................................................................ 46
4.3.5 Boot-Mode configuration...................................................................................................................................................................... 47
4.3.6 Buzzer .......................................................................................................................................................................................................... 49

User's Manual l MBa335x UM 0202 l © 2018, TQ-Systems Gm H Page ii
TABLE OF CONTENTS (continued)
5. SOFTWARE.................................................................................................................................................................................................. 50
6. MECHANICS ............................................................................................................................................................................................... 50
6.1 Dimensions ................................................................................................................................................................................................ 50
6.2 Housing....................................................................................................................................................................................................... 51
6.3 Thermal management............................................................................................................................................................................ 51
6.4 MBa335x, assem ly ................................................................................................................................................................................. 51
7. SAFETY REQUIREMENTS AND PROTECTIVE REGULATIONS......................................................................................................... 53
7.1 EMC............................................................................................................................................................................................................... 53
7.2 ESD................................................................................................................................................................................................................ 53
7.3 Operational safety and personal security......................................................................................................................................... 53
8. CLIMATIC AND OPERATIONAL CONDITIONS................................................................................................................................... 53
8.1 Protection against external effects..................................................................................................................................................... 53
8.2 Relia ility and service life ...................................................................................................................................................................... 53
9. ENVIRONMENT PROTECTION................................................................................................................................................................ 54
9.1 RoHS............................................................................................................................................................................................................. 54
9.2 WEEE®.......................................................................................................................................................................................................... 54
9.3 REACH®........................................................................................................................................................................................................ 54
9.4 EuP................................................................................................................................................................................................................ 54
9.5 Packaging................................................................................................................................................................................................... 54
9.6 Batteries ...................................................................................................................................................................................................... 54
9.6.1 General notes ............................................................................................................................................................................................ 54
9.6.2 Lithium atteries...................................................................................................................................................................................... 54
9.7 Other entries.............................................................................................................................................................................................. 54
10. APPENDIX ................................................................................................................................................................................................... 55
10.1 Acronyms and definitions ..................................................................................................................................................................... 55
10.2 References.................................................................................................................................................................................................. 57

User's Manual l MBa335x UM 0202 l © 2018, TQ-Systems Gm H Page iii
TABLE DIRECTORY
Ta le 1: Terms and Conventions.....................................................................................................................................................................2
Ta le 2: Overview interfaces ............................................................................................................................................................................5
Ta le 3: Overview diagnose and user’s interfaces.....................................................................................................................................5
Ta le 4: Carrier oard mating connectors ...................................................................................................................................................6
Ta le 5: Pinout connector X1...........................................................................................................................................................................7
Ta le 6: Pinout connector X2...........................................................................................................................................................................8
Ta le 7: I2C0 slave address mapping (default assem ly)........................................................................................................................9
Ta le 8: Assem ly option for port expander and temperature sensor...............................................................................................9
Ta le 9: Electrical characteristics SE97BTP................................................................................................................................................ 10
Ta le 10: Electrical characteristics of RTCs .................................................................................................................................................. 11
Ta le 11: RTC ackup supply........................................................................................................................................................................... 11
Ta le 12: Option of reset source for MBa335x-Reset ............................................................................................................................... 12
Ta le 13: Reset/Power uttons....................................................................................................................................................................... 13
Ta le 14: Signals at Port-Expander ................................................................................................................................................................ 14
Ta le 15: Placement option PR1_UART0_CTS# ......................................................................................................................................... 15
Ta le 16: Placement option PR1_UART0_RTS# ......................................................................................................................................... 15
Ta le 17: Placement option PR1_MDIO_DATA.......................................................................................................................................... 15
Ta le 18: Parameter of protective circuit..................................................................................................................................................... 17
Ta le 19: Parameter LTC3727 (VCC3V3 & VCC5V)..................................................................................................................................... 17
Ta le 20: Parameter TPS5450 (VCC12V)....................................................................................................................................................... 18
Ta le 21: Parameter LT3503 (VCC1V5) ......................................................................................................................................................... 18
Ta le 22: Power supply connectors............................................................................................................................................................... 18
Ta le 23: Characteristics USB........................................................................................................................................................................... 19
Ta le 24: USB Hu , components.................................................................................................................................................................... 21
Ta le 25: Pinout USB-Host 1 and 2, X7 ......................................................................................................................................................... 21
Ta le 26: Pinout USB-Host 3, X8 ..................................................................................................................................................................... 21
Ta le 27: Pinout USB-Host 5, X18................................................................................................................................................................... 21
Ta le 28: Pinout USB-Host 7, X22................................................................................................................................................................... 21
Ta le 29: Characteristics USB OTG................................................................................................................................................................. 22
Ta le 30: USB Hu , component...................................................................................................................................................................... 22
Ta le 31: Pinout USB-Host OTG, X9............................................................................................................................................................... 22
Ta le 32: Placement options for PHY interrupt ......................................................................................................................................... 23
Ta le 33: Ethernet 1000BASE-T, component.............................................................................................................................................. 24
Ta le 34: Pinout X11........................................................................................................................................................................................... 24
Ta le 35: Pinout X12........................................................................................................................................................................................... 24
Ta le 36: CAN DIP switch settings, S3........................................................................................................................................................... 25
Ta le 37: Characteristics CAN.......................................................................................................................................................................... 25
Ta le 38: Placement options for DCAN1_TX and DCAN1_RX............................................................................................................... 25
Ta le 39: CAN connectors ................................................................................................................................................................................ 26
Ta le 40: Pinout CAN0, X13 ............................................................................................................................................................................. 26
Ta le 41: Pinout CAN1, X14 ............................................................................................................................................................................. 26
Ta le 42: RS-485 mode settings ..................................................................................................................................................................... 27
Ta le 43: RS-485 DIP switch settings, S4...................................................................................................................................................... 27
Ta le 44: RS-485 connector ............................................................................................................................................................................. 27
Ta le 45: Pinout RS-485, X16........................................................................................................................................................................... 27
Ta le 46: RS-232, component.......................................................................................................................................................................... 28
Ta le 47: Pinout RS-232, X15........................................................................................................................................................................... 28
Ta le 48: LVDS connector, component........................................................................................................................................................ 29
Ta le 49: Pinout LVDS, X17 .............................................................................................................................................................................. 30
Ta le 50: Placement option for LCD contrast............................................................................................................................................. 31
Ta le 51: Characteristics LVDS-CMD ............................................................................................................................................................. 31
Ta le 52: LVDS-CMD connector...................................................................................................................................................................... 32
Ta le 53: Pinout LVDS CMD, X18.................................................................................................................................................................... 32

User's Manual l MBa335x UM 0202 l © 2018, TQ-Systems Gm H Page iv
TABLE DIRECTORY (continued)
Ta le 54: Configuration line-out / headphone, X21................................................................................................................................. 33
Ta le 55: Characteristics of audio and headphone, X21......................................................................................................................... 33
Ta le 56: Characteristics of line-out, X21..................................................................................................................................................... 33
Ta le 57: Characteristics of line-in, X20........................................................................................................................................................ 33
Ta le 58: Characteristics of microphone, X19............................................................................................................................................ 33
Ta le 59: Configuration of Line-Out or Headphone, X21....................................................................................................................... 34
Ta le 60: Audio, component ........................................................................................................................................................................... 34
Ta le 61: Pinout microphone, X19................................................................................................................................................................. 34
Ta le 62: Pinout line-in, X20 ............................................................................................................................................................................ 34
Ta le 63: Pinout line-out, X21 ......................................................................................................................................................................... 34
Ta le 64: SD card connector............................................................................................................................................................................ 35
Ta le 65: Pinout SD card, X10.......................................................................................................................................................................... 35
Ta le 66: Mini PCIe, components................................................................................................................................................................... 36
Ta le 67: Pinout Mini PCIe, X22 ...................................................................................................................................................................... 37
Ta le 68: Pinout SIM card, X23........................................................................................................................................................................ 37
Ta le 69: Reset source for JTAG-Reset.......................................................................................................................................................... 38
Ta le 70: Reset source for EMU.2 ................................................................................................................................................................... 38
Ta le 71: Reset source for EMU.4 ................................................................................................................................................................... 38
Ta le 72: Reset source for EMU.3 ................................................................................................................................................................... 38
Ta le 73: JTAG connector................................................................................................................................................................................. 39
Ta le 74: Pinout JTAG, X24............................................................................................................................................................................... 39
Ta le 75: Headers, component....................................................................................................................................................................... 40
Ta le 76: Pinout header 1, X4.......................................................................................................................................................................... 41
Ta le 77: Pinout header 2, X5.......................................................................................................................................................................... 42
Ta le 78: Pinout header 3, X6.......................................................................................................................................................................... 43
Ta le 79: Meaning of diagnose LEDs ............................................................................................................................................................ 44
Ta le 80: Status LEDs, component ................................................................................................................................................................ 45
Ta le 81: Navigation uttons, component ................................................................................................................................................. 46
Ta le 82: Default oot-configuration ........................................................................................................................................................... 48
Ta le 83: DIP switch, component................................................................................................................................................................... 48
Ta le 84: Placement option for uzzer control.......................................................................................................................................... 49
Ta le 85: Buzzer, component.......................................................................................................................................................................... 49
Ta le 86: Climatic and operational conditions MBa335x ....................................................................................................................... 53
Ta le 87: Acronyms ............................................................................................................................................................................................ 55
Ta le 88: Further applica le documents..................................................................................................................................................... 57

User's Manual l MBa335x UM 0202 l © 2018, TQ-Systems Gm H Page v
ILLUSTRATION DIRECTORY
Illustration 1: Block diagram MBa335x ....................................................................................................................................................................4
Illustration 2: Block diagram TQMa335x.................................................................................................................................................................6
Illustration 3: Block diagram I2C us........................................................................................................................................................................9
Illustration 4: Position of temperature sensor SE97BTP (D2400) on MBa335x ........................................................................................ 10
Illustration 5: Position of temperature sensor SE97BTP (D8) on TQMa335x............................................................................................. 10
Illustration 6: RTCs supplies on TQMa335x ......................................................................................................................................................... 11
Illustration 7: Block diagram Power and Reset................................................................................................................................................... 12
Illustration 8: Position push uttons S8, S9, S10................................................................................................................................................ 13
Illustration 9: Block diagram Port-Expander....................................................................................................................................................... 14
Illustration 10: Block diagram power supply ........................................................................................................................................................ 16
Illustration 11: Position of connectors X26, X27 .................................................................................................................................................. 18
Illustration 12: Block diagram USB-Hu ................................................................................................................................................................. 19
Illustration 13: Position of USB, X4, X5, X7, X8...................................................................................................................................................... 20
Illustration 14: Position of LVDS-CMD, X18 ........................................................................................................................................................... 20
Illustration 15: Block diagram USB 2.0 Hi-Speed OTG........................................................................................................................................ 22
Illustration 16: Position of USB OTG X9................................................................................................................................................................... 22
Illustration 17: Block diagram Ethernet 1000BASE-T.......................................................................................................................................... 23
Illustration 18: Position of X11 and X12.................................................................................................................................................................. 23
Illustration 19: Block diagram CAN .......................................................................................................................................................................... 25
Illustration 20: Position of CAN connectors and DIP switch, X13, X14, S3 ................................................................................................... 26
Illustration 21: Block diagram RS-485, X16 ............................................................................................................................................................ 27
Illustration 22: Position of RS-485, X16 ................................................................................................................................................................... 27
Illustration 23: Block diagram RS-232, X15 ............................................................................................................................................................ 28
Illustration 24: Position of RS-232, X15 ................................................................................................................................................................... 28
Illustration 25: Block diagram LVDS, X17 ............................................................................................................................................................... 29
Illustration 26: Position of LVDS, X17 ...................................................................................................................................................................... 29
Illustration 27: Block diagram LVDS-CMD, X18 .................................................................................................................................................... 31
Illustration 28: Position of LVDS-CMD, X18 ........................................................................................................................................................... 32
Illustration 29: Block diagram audio........................................................................................................................................................................ 33
Illustration 30: Position of audio jacks X19, X20, and X21................................................................................................................................. 34
Illustration 31: Block diagram SD card slot, X10................................................................................................................................................... 35
Illustration 32: Position of SD card slot, X10.......................................................................................................................................................... 35
Illustration 33: Block diagram Mini PCIe................................................................................................................................................................. 36
Illustration 34: Position of Mini PCIe, X22, X23..................................................................................................................................................... 36
Illustration 35: Block diagram JTAG ......................................................................................................................................................................... 38
Illustration 36: Position of JTAG, X24....................................................................................................................................................................... 39
Illustration 37: Position of headers X4, X5, X6 ...................................................................................................................................................... 40
Illustration 38: Position of LEDs................................................................................................................................................................................. 45
Illustration 39: Block diagram navigation uttons.............................................................................................................................................. 46
Illustration 40: Position of navigation uttons S5, S6, S7, and S10 ................................................................................................................ 46
Illustration 41: Configuration of oot loader source with DIP switches S1 and S2................................................................................... 47
Illustration 42: Position of Boot-Mode configuration DIP switches S1, S2................................................................................................... 48
Illustration 43: Block diagram uzzer...................................................................................................................................................................... 49
Illustration 44: Position of uzzer, N2400 .............................................................................................................................................................. 49
Illustration 45: MBa335x dimensions ...................................................................................................................................................................... 50
Illustration 46: MBa335x, component placement top ....................................................................................................................................... 51
Illustration 47: MBa335x, component placement ottom ............................................................................................................................... 52

User's Manual l MBa335x UM 0202 l © 2018, TQ-Systems Gm H Page vi
REVISION HISTORY
Rev. Date Name Pos. Modification
0200 05.10.2015 Petz First issue
0201 02.11.2016 Petz
All
1.4
Ta le 76
Ta le 82
Ta le 88
Typo
Updated
Information regarding pin 58 clarified
Columns added
Updated and extended
0202 26.10.2018 Petz All
9, Ta le 88
Formatting, links updated
Updated

User's Manual l MBa335x UM 0202 l © 2018, TQ-Systems Gm H Page 1
1. ABOUT THIS MANUAL
1.1 Copyright and licence expenses
Copyright protected © 2018 y TQ-Systems Gm H.
This User's Manual may not e copied, reproduced, translated, changed or distri uted, completely or partially in electronic,
machine reada le, or in any other form without the written consent of TQ-Systems Gm H.
The drivers and utilities for the components used as well as the BIOS are su ject to copyrights of the respective manufacturers.
The licence conditions of the respective manufacturer are to e adhered to.
Bootloader-licence expenses are paid y TQ-Systems Gm H and are included in the price.
Licence expenses for the operating system and applications are not taken into consideration and must e calculated / declared
separately.
1. Registered trademarks
TQ-Systems Gm H aims to adhere to copyrights of all graphics and texts used in all pu lications, and strives to use original
or license-free graphics and texts.
All rand names and trademarks mentioned in this User's Manual, including those protected y a third party, unless specified
otherwise in writing, are su jected to the specifications of the current copyright laws and the proprietary laws of the present
registered proprietor without any limitation. One should conclude that rand and trademarks are rightly protected y a third
party.
1.3 Disclaimer
TQ-Systems Gm H does not guarantee that the information in this User's Manual is up-to-date, correct, complete or of good
quality. Nor does TQ-Systems Gm H assume guarantee for further usage of the information. Lia ility claims against TQ-Systems
Gm H, referring to material or non-material related damages caused, due to usage or non-usage of the information given in this
User's Manual, or due to usage of erroneous or incomplete information, are exempted, as long as there is no proven intentional
or negligent fault of TQ-Systems Gm H.
TQ-Systems Gm H explicitly reserves the rights to change or add to the contents of this User's Manual or parts of it without
special notification.
Important Notice:
Before using the Starterkit MBa335x or parts of the schematics of the MBa335x, you must evaluate it and determine if it is
suita le for your intended application. You assume all risks and lia ility associated with such use. TQ-Systems Gm H makes no
other warranties including, ut not limited to, any implied warranty of merchanta ility or fitness for a particular purpose. Except
where prohi ited y law, TQ-Systems Gm H will not e lia le for any indirect, special, incidental or consequential loss or damage
arising from the usage of the Starterkit MBa335x or schematics used, regardless of the legal theory asserted.
1.4 Imprint
TQ-Systems Gm H
Gut Delling, Mühlstraße 2
D-8 9 Seefeld
Tel: [phone]
Fax: [phone]
E-Mail: Info@TQ-Group
We : TQ-Group

User's Manual l MBa335x UM 0202 l © 2018, TQ-Systems Gm H Page 2
1.5 Tips on safety
Improper or incorrect handling of the product can su stantially reduce its life span.
1.6 Symbols and typographic conventions
Ta le 1: Terms and Conventions
Sym ol Meaning
This sym ol represents the handling of electrostatic-sensitive modules and / or components. These
components are often damaged / destroyed y the transmission of a voltage higher than a out 50 V.
A human ody usually only experiences electrostatic discharges a ove approximately 3,000 V.
This sym ol indicates the possi le use of voltages higher than 24 V.
Please note the relevant statutory regulations in this regard.
Non-compliance with these regulations can lead to serious damage to your health and also cause
damage / destruction of the component.
This sym ol indicates a possi le source of danger. Acting against the procedure descri ed can lead to
possi le damage to your health and / or cause damage / destruction of the material used.
This sym ol represents important details or aspects for working with TQ-products.
Command A font with fixed-width is used to denote commands, file names, or menu items.
1.7 Handling and ESD tips
General handling of your TQ-products
The TQ-product may only e used and serviced y certified personnel who have taken note of the
information, the safety regulations in this document and all related rules and regulations.
A general rule is: do not touch the TQ-product during operation. This is especially important when
switching on, changing jumper settings or connecting other devices without ensuring eforehand
that the power supply of the system has een switched off.
Violation of this guideline may result in damage / destruction of the MBa335x and e dangerous
to your health.
Improper handling of your TQ-product would render the guarantee invalid.
Proper ESD handling
The electronic components of your TQ-product are sensitive to electrostatic discharge (ESD).
Always wear antistatic clothing, use ESD-safe tools, packing materials etc., and operate your TQ-
product in an ESD-safe environment. Especially when you switch modules on, change jumper settings,
or connect other devices.

User's Manual l MBa335x UM 0202 l © 2018, TQ-Systems Gm H Page 3
1.8 Naming of signals
A hash mark (#) at the end of the signal name indicates a low-active signal.
Example: RESET#
If a signal can switch etween two functions and if this is noted in the name of the signal, the low-active function is marked with
a hash mark and shown at the end.
Example: C / D#
If a signal has multiple functions, the individual functions are separated y slashes when they are important for the wiring.
The identification of the individual functions follows the a ove conventions.
Example: WE2# / OE#
1.9 Further applicable documents / presumed knowledge
•Specifications and manual of the modules used:
These documents descri e the service, functionality and special characteristics of the module used (incl. BIOS).
•Specifications of the components used:
The manufacturer's specifications of the components used, for example CompactFlash cards, are to e taken note of.
They contain, if applica le, additional information that must e taken note of for safe and relia le operation.
These documents are stored at TQ-Systems Gm H.
•Chip errata:
It is the user's responsi ility to make sure all errata pu lished y the manufacturer of each component are taken note of.
The manufacturer’s advice should e followed.
•Software behaviour:
No warranty can e given, nor responsi ility taken for any unexpected software ehaviour due to deficient components.
•General expertise:
Expertise in electrical engineering / computer engineering is required for the installation and the use of the device.
The following documents are required to fully comprehend the following contents:
•MBa335x circuit diagram
•TQMa335x User's Manual
•Sitara AM335x Data Sheet
•U-Boot documentation: www.denx.de/wiki/U-Boot/Documentation
•PTXdist documentation: www.ptxdist.de
•TQ-Support Wiki: support.tq-group.com/doku.php?id=en:arm:tqma335x