TQ-Systems MBa335x User manual

MBa335x
User's Manual
MBa335x UM 0202
26.10.2018

User's Manual l MBa335x UM 0202 l © 2018, TQ-Systems Gm H Page i
TABLE OF CONTENTS
1. ABOUT THIS MANUAL................................................................................................................................................................................1
1.1 Copyright and licence expenses ............................................................................................................................................................1
1.2 Registered trademarks ..............................................................................................................................................................................1
1.3 Disclaimer......................................................................................................................................................................................................1
1.4 Imprint............................................................................................................................................................................................................1
1.5 Tips on safety................................................................................................................................................................................................2
1.6 Sym ols and typographic conventions ...............................................................................................................................................2
1.7 Handling and ESD tips...............................................................................................................................................................................2
1.8 Naming of signals .......................................................................................................................................................................................3
1.9 Further applica le documents / presumed knowledge.................................................................................................................3
2. BRIEF DESCRIPTION ....................................................................................................................................................................................4
3. TECHNICAL DATA........................................................................................................................................................................................4
3.1 System architecture and functionality .................................................................................................................................................4
3.1.1 Block diagram...............................................................................................................................................................................................4
3.1.2 Functionality.................................................................................................................................................................................................5
4. ELECTRONICS ...............................................................................................................................................................................................6
4.1 System components ..................................................................................................................................................................................6
4.1.1 TQMa335x .....................................................................................................................................................................................................6
4.1.2 I2C address mapping..................................................................................................................................................................................9
4.1.3 Temperature sensor ................................................................................................................................................................................ 10
4.1.4 RTC ackup supply .................................................................................................................................................................................. 11
4.1.5 Power and Reset....................................................................................................................................................................................... 12
4.1.6 Port-Expander ........................................................................................................................................................................................... 14
4.1.7 Further configuration options ............................................................................................................................................................. 15
4.1.8 Real-Time Unit (PRU)............................................................................................................................................................................... 15
4.1.9 Power supply............................................................................................................................................................................................. 16
4.2 Communication interfaces.................................................................................................................................................................... 19
4.2.1 USB 2.0 Hi-Speed Host............................................................................................................................................................................ 19
4.2.2 USB 2.0 Hi-Speed OTG ............................................................................................................................................................................ 22
4.2.3 Ethernet 1000BASE-T.............................................................................................................................................................................. 23
4.2.4 CAN............................................................................................................................................................................................................... 25
4.2.5 RS-485.......................................................................................................................................................................................................... 27
4.2.6 RS-232.......................................................................................................................................................................................................... 28
4.2.7 LVDS............................................................................................................................................................................................................. 29
4.2.8 LVDS-CMD.................................................................................................................................................................................................. 31
4.2.9 Audio............................................................................................................................................................................................................ 33
4.2.10 SD card ........................................................................................................................................................................................................ 35
4.2.11 Mini PCIe..................................................................................................................................................................................................... 36
4.2.12 JTAG & EMU ............................................................................................................................................................................................... 38
4.2.13 Headers X4, X5, X6................................................................................................................................................................................... 40
4.3 Diagnose- and user interfaces.............................................................................................................................................................. 44
4.3.1 Diagnose LEDs .......................................................................................................................................................................................... 44
4.3.2 Navigation uttons.................................................................................................................................................................................. 46
4.3.3 Power-On and Reset- utton................................................................................................................................................................. 46
4.3.4 CAN and RS-485 termination................................................................................................................................................................ 46
4.3.5 Boot-Mode configuration...................................................................................................................................................................... 47
4.3.6 Buzzer .......................................................................................................................................................................................................... 49

User's Manual l MBa335x UM 0202 l © 2018, TQ-Systems Gm H Page ii
TABLE OF CONTENTS (continued)
5. SOFTWARE.................................................................................................................................................................................................. 50
6. MECHANICS ............................................................................................................................................................................................... 50
6.1 Dimensions ................................................................................................................................................................................................ 50
6.2 Housing....................................................................................................................................................................................................... 51
6.3 Thermal management............................................................................................................................................................................ 51
6.4 MBa335x, assem ly ................................................................................................................................................................................. 51
7. SAFETY REQUIREMENTS AND PROTECTIVE REGULATIONS......................................................................................................... 53
7.1 EMC............................................................................................................................................................................................................... 53
7.2 ESD................................................................................................................................................................................................................ 53
7.3 Operational safety and personal security......................................................................................................................................... 53
8. CLIMATIC AND OPERATIONAL CONDITIONS................................................................................................................................... 53
8.1 Protection against external effects..................................................................................................................................................... 53
8.2 Relia ility and service life ...................................................................................................................................................................... 53
9. ENVIRONMENT PROTECTION................................................................................................................................................................ 54
9.1 RoHS............................................................................................................................................................................................................. 54
9.2 WEEE®.......................................................................................................................................................................................................... 54
9.3 REACH®........................................................................................................................................................................................................ 54
9.4 EuP................................................................................................................................................................................................................ 54
9.5 Packaging................................................................................................................................................................................................... 54
9.6 Batteries ...................................................................................................................................................................................................... 54
9.6.1 General notes ............................................................................................................................................................................................ 54
9.6.2 Lithium atteries...................................................................................................................................................................................... 54
9.7 Other entries.............................................................................................................................................................................................. 54
10. APPENDIX ................................................................................................................................................................................................... 55
10.1 Acronyms and definitions ..................................................................................................................................................................... 55
10.2 References.................................................................................................................................................................................................. 57

User's Manual l MBa335x UM 0202 l © 2018, TQ-Systems Gm H Page iii
TABLE DIRECTORY
Ta le 1: Terms and Conventions.....................................................................................................................................................................2
Ta le 2: Overview interfaces ............................................................................................................................................................................5
Ta le 3: Overview diagnose and user’s interfaces.....................................................................................................................................5
Ta le 4: Carrier oard mating connectors ...................................................................................................................................................6
Ta le 5: Pinout connector X1...........................................................................................................................................................................7
Ta le 6: Pinout connector X2...........................................................................................................................................................................8
Ta le 7: I2C0 slave address mapping (default assem ly)........................................................................................................................9
Ta le 8: Assem ly option for port expander and temperature sensor...............................................................................................9
Ta le 9: Electrical characteristics SE97BTP................................................................................................................................................ 10
Ta le 10: Electrical characteristics of RTCs .................................................................................................................................................. 11
Ta le 11: RTC ackup supply........................................................................................................................................................................... 11
Ta le 12: Option of reset source for MBa335x-Reset ............................................................................................................................... 12
Ta le 13: Reset/Power uttons....................................................................................................................................................................... 13
Ta le 14: Signals at Port-Expander ................................................................................................................................................................ 14
Ta le 15: Placement option PR1_UART0_CTS# ......................................................................................................................................... 15
Ta le 16: Placement option PR1_UART0_RTS# ......................................................................................................................................... 15
Ta le 17: Placement option PR1_MDIO_DATA.......................................................................................................................................... 15
Ta le 18: Parameter of protective circuit..................................................................................................................................................... 17
Ta le 19: Parameter LTC3727 (VCC3V3 & VCC5V)..................................................................................................................................... 17
Ta le 20: Parameter TPS5450 (VCC12V)....................................................................................................................................................... 18
Ta le 21: Parameter LT3503 (VCC1V5) ......................................................................................................................................................... 18
Ta le 22: Power supply connectors............................................................................................................................................................... 18
Ta le 23: Characteristics USB........................................................................................................................................................................... 19
Ta le 24: USB Hu , components.................................................................................................................................................................... 21
Ta le 25: Pinout USB-Host 1 and 2, X7 ......................................................................................................................................................... 21
Ta le 26: Pinout USB-Host 3, X8 ..................................................................................................................................................................... 21
Ta le 27: Pinout USB-Host 5, X18................................................................................................................................................................... 21
Ta le 28: Pinout USB-Host 7, X22................................................................................................................................................................... 21
Ta le 29: Characteristics USB OTG................................................................................................................................................................. 22
Ta le 30: USB Hu , component...................................................................................................................................................................... 22
Ta le 31: Pinout USB-Host OTG, X9............................................................................................................................................................... 22
Ta le 32: Placement options for PHY interrupt ......................................................................................................................................... 23
Ta le 33: Ethernet 1000BASE-T, component.............................................................................................................................................. 24
Ta le 34: Pinout X11........................................................................................................................................................................................... 24
Ta le 35: Pinout X12........................................................................................................................................................................................... 24
Ta le 36: CAN DIP switch settings, S3........................................................................................................................................................... 25
Ta le 37: Characteristics CAN.......................................................................................................................................................................... 25
Ta le 38: Placement options for DCAN1_TX and DCAN1_RX............................................................................................................... 25
Ta le 39: CAN connectors ................................................................................................................................................................................ 26
Ta le 40: Pinout CAN0, X13 ............................................................................................................................................................................. 26
Ta le 41: Pinout CAN1, X14 ............................................................................................................................................................................. 26
Ta le 42: RS-485 mode settings ..................................................................................................................................................................... 27
Ta le 43: RS-485 DIP switch settings, S4...................................................................................................................................................... 27
Ta le 44: RS-485 connector ............................................................................................................................................................................. 27
Ta le 45: Pinout RS-485, X16........................................................................................................................................................................... 27
Ta le 46: RS-232, component.......................................................................................................................................................................... 28
Ta le 47: Pinout RS-232, X15........................................................................................................................................................................... 28
Ta le 48: LVDS connector, component........................................................................................................................................................ 29
Ta le 49: Pinout LVDS, X17 .............................................................................................................................................................................. 30
Ta le 50: Placement option for LCD contrast............................................................................................................................................. 31
Ta le 51: Characteristics LVDS-CMD ............................................................................................................................................................. 31
Ta le 52: LVDS-CMD connector...................................................................................................................................................................... 32
Ta le 53: Pinout LVDS CMD, X18.................................................................................................................................................................... 32

User's Manual l MBa335x UM 0202 l © 2018, TQ-Systems Gm H Page iv
TABLE DIRECTORY (continued)
Ta le 54: Configuration line-out / headphone, X21................................................................................................................................. 33
Ta le 55: Characteristics of audio and headphone, X21......................................................................................................................... 33
Ta le 56: Characteristics of line-out, X21..................................................................................................................................................... 33
Ta le 57: Characteristics of line-in, X20........................................................................................................................................................ 33
Ta le 58: Characteristics of microphone, X19............................................................................................................................................ 33
Ta le 59: Configuration of Line-Out or Headphone, X21....................................................................................................................... 34
Ta le 60: Audio, component ........................................................................................................................................................................... 34
Ta le 61: Pinout microphone, X19................................................................................................................................................................. 34
Ta le 62: Pinout line-in, X20 ............................................................................................................................................................................ 34
Ta le 63: Pinout line-out, X21 ......................................................................................................................................................................... 34
Ta le 64: SD card connector............................................................................................................................................................................ 35
Ta le 65: Pinout SD card, X10.......................................................................................................................................................................... 35
Ta le 66: Mini PCIe, components................................................................................................................................................................... 36
Ta le 67: Pinout Mini PCIe, X22 ...................................................................................................................................................................... 37
Ta le 68: Pinout SIM card, X23........................................................................................................................................................................ 37
Ta le 69: Reset source for JTAG-Reset.......................................................................................................................................................... 38
Ta le 70: Reset source for EMU.2 ................................................................................................................................................................... 38
Ta le 71: Reset source for EMU.4 ................................................................................................................................................................... 38
Ta le 72: Reset source for EMU.3 ................................................................................................................................................................... 38
Ta le 73: JTAG connector................................................................................................................................................................................. 39
Ta le 74: Pinout JTAG, X24............................................................................................................................................................................... 39
Ta le 75: Headers, component....................................................................................................................................................................... 40
Ta le 76: Pinout header 1, X4.......................................................................................................................................................................... 41
Ta le 77: Pinout header 2, X5.......................................................................................................................................................................... 42
Ta le 78: Pinout header 3, X6.......................................................................................................................................................................... 43
Ta le 79: Meaning of diagnose LEDs ............................................................................................................................................................ 44
Ta le 80: Status LEDs, component ................................................................................................................................................................ 45
Ta le 81: Navigation uttons, component ................................................................................................................................................. 46
Ta le 82: Default oot-configuration ........................................................................................................................................................... 48
Ta le 83: DIP switch, component................................................................................................................................................................... 48
Ta le 84: Placement option for uzzer control.......................................................................................................................................... 49
Ta le 85: Buzzer, component.......................................................................................................................................................................... 49
Ta le 86: Climatic and operational conditions MBa335x ....................................................................................................................... 53
Ta le 87: Acronyms ............................................................................................................................................................................................ 55
Ta le 88: Further applica le documents..................................................................................................................................................... 57

User's Manual l MBa335x UM 0202 l © 2018, TQ-Systems Gm H Page v
ILLUSTRATION DIRECTORY
Illustration 1: Block diagram MBa335x ....................................................................................................................................................................4
Illustration 2: Block diagram TQMa335x.................................................................................................................................................................6
Illustration 3: Block diagram I2C us........................................................................................................................................................................9
Illustration 4: Position of temperature sensor SE97BTP (D2400) on MBa335x ........................................................................................ 10
Illustration 5: Position of temperature sensor SE97BTP (D8) on TQMa335x............................................................................................. 10
Illustration 6: RTCs supplies on TQMa335x ......................................................................................................................................................... 11
Illustration 7: Block diagram Power and Reset................................................................................................................................................... 12
Illustration 8: Position push uttons S8, S9, S10................................................................................................................................................ 13
Illustration 9: Block diagram Port-Expander....................................................................................................................................................... 14
Illustration 10: Block diagram power supply ........................................................................................................................................................ 16
Illustration 11: Position of connectors X26, X27 .................................................................................................................................................. 18
Illustration 12: Block diagram USB-Hu ................................................................................................................................................................. 19
Illustration 13: Position of USB, X4, X5, X7, X8...................................................................................................................................................... 20
Illustration 14: Position of LVDS-CMD, X18 ........................................................................................................................................................... 20
Illustration 15: Block diagram USB 2.0 Hi-Speed OTG........................................................................................................................................ 22
Illustration 16: Position of USB OTG X9................................................................................................................................................................... 22
Illustration 17: Block diagram Ethernet 1000BASE-T.......................................................................................................................................... 23
Illustration 18: Position of X11 and X12.................................................................................................................................................................. 23
Illustration 19: Block diagram CAN .......................................................................................................................................................................... 25
Illustration 20: Position of CAN connectors and DIP switch, X13, X14, S3 ................................................................................................... 26
Illustration 21: Block diagram RS-485, X16 ............................................................................................................................................................ 27
Illustration 22: Position of RS-485, X16 ................................................................................................................................................................... 27
Illustration 23: Block diagram RS-232, X15 ............................................................................................................................................................ 28
Illustration 24: Position of RS-232, X15 ................................................................................................................................................................... 28
Illustration 25: Block diagram LVDS, X17 ............................................................................................................................................................... 29
Illustration 26: Position of LVDS, X17 ...................................................................................................................................................................... 29
Illustration 27: Block diagram LVDS-CMD, X18 .................................................................................................................................................... 31
Illustration 28: Position of LVDS-CMD, X18 ........................................................................................................................................................... 32
Illustration 29: Block diagram audio........................................................................................................................................................................ 33
Illustration 30: Position of audio jacks X19, X20, and X21................................................................................................................................. 34
Illustration 31: Block diagram SD card slot, X10................................................................................................................................................... 35
Illustration 32: Position of SD card slot, X10.......................................................................................................................................................... 35
Illustration 33: Block diagram Mini PCIe................................................................................................................................................................. 36
Illustration 34: Position of Mini PCIe, X22, X23..................................................................................................................................................... 36
Illustration 35: Block diagram JTAG ......................................................................................................................................................................... 38
Illustration 36: Position of JTAG, X24....................................................................................................................................................................... 39
Illustration 37: Position of headers X4, X5, X6 ...................................................................................................................................................... 40
Illustration 38: Position of LEDs................................................................................................................................................................................. 45
Illustration 39: Block diagram navigation uttons.............................................................................................................................................. 46
Illustration 40: Position of navigation uttons S5, S6, S7, and S10 ................................................................................................................ 46
Illustration 41: Configuration of oot loader source with DIP switches S1 and S2................................................................................... 47
Illustration 42: Position of Boot-Mode configuration DIP switches S1, S2................................................................................................... 48
Illustration 43: Block diagram uzzer...................................................................................................................................................................... 49
Illustration 44: Position of uzzer, N2400 .............................................................................................................................................................. 49
Illustration 45: MBa335x dimensions ...................................................................................................................................................................... 50
Illustration 46: MBa335x, component placement top ....................................................................................................................................... 51
Illustration 47: MBa335x, component placement ottom ............................................................................................................................... 52

User's Manual l MBa335x UM 0202 l © 2018, TQ-Systems Gm H Page vi
REVISION HISTORY
Rev. Date Name Pos. Modification
0200 05.10.2015 Petz First issue
0201 02.11.2016 Petz
All
1.4
Ta le 76
Ta le 82
Ta le 88
Typo
Updated
Information regarding pin 58 clarified
Columns added
Updated and extended
0202 26.10.2018 Petz All
9, Ta le 88
Formatting, links updated
Updated

User's Manual l MBa335x UM 0202 l © 2018, TQ-Systems Gm H Page 1
1. ABOUT THIS MANUAL
1.1 Copyright and licence expenses
Copyright protected © 2018 y TQ-Systems Gm H.
This User's Manual may not e copied, reproduced, translated, changed or distri uted, completely or partially in electronic,
machine reada le, or in any other form without the written consent of TQ-Systems Gm H.
The drivers and utilities for the components used as well as the BIOS are su ject to copyrights of the respective manufacturers.
The licence conditions of the respective manufacturer are to e adhered to.
Bootloader-licence expenses are paid y TQ-Systems Gm H and are included in the price.
Licence expenses for the operating system and applications are not taken into consideration and must e calculated / declared
separately.
1. Registered trademarks
TQ-Systems Gm H aims to adhere to copyrights of all graphics and texts used in all pu lications, and strives to use original
or license-free graphics and texts.
All rand names and trademarks mentioned in this User's Manual, including those protected y a third party, unless specified
otherwise in writing, are su jected to the specifications of the current copyright laws and the proprietary laws of the present
registered proprietor without any limitation. One should conclude that rand and trademarks are rightly protected y a third
party.
1.3 Disclaimer
TQ-Systems Gm H does not guarantee that the information in this User's Manual is up-to-date, correct, complete or of good
quality. Nor does TQ-Systems Gm H assume guarantee for further usage of the information. Lia ility claims against TQ-Systems
Gm H, referring to material or non-material related damages caused, due to usage or non-usage of the information given in this
User's Manual, or due to usage of erroneous or incomplete information, are exempted, as long as there is no proven intentional
or negligent fault of TQ-Systems Gm H.
TQ-Systems Gm H explicitly reserves the rights to change or add to the contents of this User's Manual or parts of it without
special notification.
Important Notice:
Before using the Starterkit MBa335x or parts of the schematics of the MBa335x, you must evaluate it and determine if it is
suita le for your intended application. You assume all risks and lia ility associated with such use. TQ-Systems Gm H makes no
other warranties including, ut not limited to, any implied warranty of merchanta ility or fitness for a particular purpose. Except
where prohi ited y law, TQ-Systems Gm H will not e lia le for any indirect, special, incidental or consequential loss or damage
arising from the usage of the Starterkit MBa335x or schematics used, regardless of the legal theory asserted.
1.4 Imprint
TQ-Systems Gm H
Gut Delling, Mühlstraße 2
D-8 9 Seefeld
Tel: [phone]
Fax: [phone]
E-Mail: Info@TQ-Group
We : TQ-Group

User's Manual l MBa335x UM 0202 l © 2018, TQ-Systems Gm H Page 2
1.5 Tips on safety
Improper or incorrect handling of the product can su stantially reduce its life span.
1.6 Symbols and typographic conventions
Ta le 1: Terms and Conventions
Sym ol Meaning
This sym ol represents the handling of electrostatic-sensitive modules and / or components. These
components are often damaged / destroyed y the transmission of a voltage higher than a out 50 V.
A human ody usually only experiences electrostatic discharges a ove approximately 3,000 V.
This sym ol indicates the possi le use of voltages higher than 24 V.
Please note the relevant statutory regulations in this regard.
Non-compliance with these regulations can lead to serious damage to your health and also cause
damage / destruction of the component.
This sym ol indicates a possi le source of danger. Acting against the procedure descri ed can lead to
possi le damage to your health and / or cause damage / destruction of the material used.
This sym ol represents important details or aspects for working with TQ-products.
Command A font with fixed-width is used to denote commands, file names, or menu items.
1.7 Handling and ESD tips
General handling of your TQ-products
The TQ-product may only e used and serviced y certified personnel who have taken note of the
information, the safety regulations in this document and all related rules and regulations.
A general rule is: do not touch the TQ-product during operation. This is especially important when
switching on, changing jumper settings or connecting other devices without ensuring eforehand
that the power supply of the system has een switched off.
Violation of this guideline may result in damage / destruction of the MBa335x and e dangerous
to your health.
Improper handling of your TQ-product would render the guarantee invalid.
Proper ESD handling
The electronic components of your TQ-product are sensitive to electrostatic discharge (ESD).
Always wear antistatic clothing, use ESD-safe tools, packing materials etc., and operate your TQ-
product in an ESD-safe environment. Especially when you switch modules on, change jumper settings,
or connect other devices.

User's Manual l MBa335x UM 0202 l © 2018, TQ-Systems Gm H Page 3
1.8 Naming of signals
A hash mark (#) at the end of the signal name indicates a low-active signal.
Example: RESET#
If a signal can switch etween two functions and if this is noted in the name of the signal, the low-active function is marked with
a hash mark and shown at the end.
Example: C / D#
If a signal has multiple functions, the individual functions are separated y slashes when they are important for the wiring.
The identification of the individual functions follows the a ove conventions.
Example: WE2# / OE#
1.9 Further applicable documents / presumed knowledge
•Specifications and manual of the modules used:
These documents descri e the service, functionality and special characteristics of the module used (incl. BIOS).
•Specifications of the components used:
The manufacturer's specifications of the components used, for example CompactFlash cards, are to e taken note of.
They contain, if applica le, additional information that must e taken note of for safe and relia le operation.
These documents are stored at TQ-Systems Gm H.
•Chip errata:
It is the user's responsi ility to make sure all errata pu lished y the manufacturer of each component are taken note of.
The manufacturer’s advice should e followed.
•Software behaviour:
No warranty can e given, nor responsi ility taken for any unexpected software ehaviour due to deficient components.
•General expertise:
Expertise in electrical engineering / computer engineering is required for the installation and the use of the device.
The following documents are required to fully comprehend the following contents:
•MBa335x circuit diagram
•TQMa335x User's Manual
•Sitara AM335x Data Sheet
•U-Boot documentation: www.denx.de/wiki/U-Boot/Documentation
•PTXdist documentation: www.ptxdist.de
•TQ-Support Wiki: support.tq-group.com/doku.php?id=en:arm:tqma335x

User's Manual l MBa335x UM 0202 l © 2018, TQ-Systems Gm H Page 4
. BRIEF DESCRIPTION
The MBa335x is designed as a carrier oard for the TQMa335x.
All TQMa335x interfaces are availa le on the MBa335x. The AM335x CPU characteristics can e evaluated, and therefore the
software development for a TQMa335x project can e started immediately.
The MBa335x supports all TQMa335x modules with the TI CPUs AM3352, AM3354 and AM3359.
3. TECHNICAL DATA
3.1 System architecture and functionality
3.1.1 Block diagram
Illustration 1: Block diagram MBa335x

User's Manual l MBa335x UM 0202 l © 2018, TQ-Systems Gm H Page 5
3.1.2 Functionality
The system core is the TQMa335x processor module with a Texas Instruments Sitara AM335x CPU.
The TQMa335x connects all peripheral components to each other.
In addition to the standard communication interfaces like USB, Ethernet, RS-232, RS-485, LVDS etc. all other availa le signals of
the TQMa335x are routed to 2.54 mm standard headers.
The following interfaces / functions and user's interfaces are provided on the MBa335x.
Ta le 2: Overview interfaces
Interface Qty. Type of connector Remark
USB 2.0 Hi-Speed host 2 USB receptacle Type-A Dual port receptacle, right angle
USB 2.0 Hi-Speed host 1 USB receptacle Type-A Single port receptacle, right angle
USB 2.0 Hi-Speed host 1 Header –
USB 2.0 Hi-Speed OTG 1 USB receptacle micro-AB –
Ethernet 1000BASE-T 1 RJ45 receptacle Receptacle with integrated magnetics
CAN 2 Phoenix asic housing Straight version, gal. separated
RS-485 1 Phoenix asic housing Straight version, gal. separated
RS-232 1 D-Su 9-pin connector Right angle, De ug-UART
LVDS 1 DF19 receptacle LVDS data
LVDS-CMD 1 DF19 receptacle LVDS control lines
Audio Out 3 Jack 3.5 mm
1 × Line-out (stereo)
1 × Line-in (stereo)
1 × Microphone (mono)
SD card 1 Push-Pull type –
1 Mini PCIe –
PCIe 1 SIM card holder –
JTAG 1 20-pin header, 2.54 mm pitch –
EMU 1 8-pin header, 2.54 mm pitch –
Headers 3 Header, 2.54 mm pitch
- USB Host 6, Host 4
- Test
- I2C0, I2C1, I2C2
- MCASP0
- RES1, RES2
- UART0, UART3, UART4
- SPI0, SPI1
- Timer
- Touch
- LCD-CTRL, LCD-DATA
- CLKOUT
- ANALOG
1 DC jack (2.5 mm / 5.5 mm) – Power In
(VIN = 24 V ±5 % DC) 1 DC jack 2-pin (screw terminals) –
Power Out header 1 Header, 2.54 mm pitch - 3.3 V @ 2 A - 5 V @ 2 A
- 12 V @ 3 A
Backup supply 1 8-pin header, 2.54 mm pitch –
Battery holder 1 CR2032 holder Backup attery RTC
Ta le 3: Overview diagnose and user’s interfaces
Interface Qty. Component Remark
Status-LEDs 18 Chip LEDs Among others Power-LEDs, LEDs at GPIOs, …
Temperature sensor 1 SE97BTP –
Power / reset utton 3 Push utton –
Navigation uttons 3 Push utton –
Boot-Mode configuration 16 DIP switch –
CAN and RS-485 termination 4 DIP switch –
Signal generator 1 Buzzer –

User's Manual l MBa335x UM 0202 l © 2018, TQ-Systems Gm H Page 6
4. ELECTRONICS
4.1 System components
4.1.1 TQMa335x
Illustration 2: Block diagram TQMa335x
The TQMa335x with the AM335x CPU is the central system component. It provides DDR3L-SDRAM, eMMC, NOR flash and
EEPROM memory. All voltages required y the TQMa335x are derived from the supply voltage of 3.3 V.
The availa le signals are routed to two connectors on the MBa335x. More detailed information is to e taken from the
accompanying TQMa335x User's Manual.
The TQMa335x oot ehaviour can e customised. The required oot-mode configuration can e set with DIP switches, see
section 4.3.5. The connector used on the MBa335x is shown in Ta le 4.
If a different oard-to- oard distance is required, higher connectors can e used. Suita le types are to e taken from Ta le 4.
Ta le 4: Carrier oard mating connectors
Manufacturer Pin count / Part num er Remark Stack height (X)
120-pin: 5177986-5 On MBa335x 5 mm
120-pin: 1-5177986-5 – 6 mm
120-pin: 2-5177986-5 – 7 mm
TE connectivity
120-pin: 3-5177986-5 – 8 mm
The pins assignment listed in Ta le 5 and Ta le 6 refer to the corresponding standard BSP of TQ-Systems Gm H.
Information regarding I/O in Ta le 5 and Ta le 6 refer to the CPU pins.
Attention: Availa le interfaces
Depending on the selected TQMa335x, not all interfaces are availa le.
Availa le interfaces are to e taken from this User's Manual and the TQMa335x pinout ta le.

User's Manual l MBa335x UM 0202 l © 2018, TQ-Systems Gm H Page 7
Ta le 5: Pinout connector X1
Ball I/O Level Group Signal Pin Signal Group Level I/O Ball
– P 0 V Power DGND 1 2 DGND Power 0 V P –
– I 3.3 V CONFIG PMIC_SLEEP 3 4 PMIC_PWRON CONFIG 3.3 V I –
– O 3.3 V CONFIG RTC_INT# 5 6 PMIC_INT CONFIG 3.3 V O –
U18 I/O 3.3 V GPIO GPIO1_28 7 8 TEMP_OS# CONFIG 3.3 V O –
V6 I/O 3.3 V GPIO GPIO1_29 9 10 PWRONRST_IN# CONFIG 3.3 V I –
T13 I/O 3.3 V GPIO GPIO2_0 11 12 PWRONRST_OUT# CONFIG 3.3 V O –
C5 I 1.8 V CONFIG EXT_WAKEUP 13 14 EXTINT# CONFIG 3.3 V O B18
– P 0 V Power DGND 15 16 DGND Power 0 V P –
R17 A 3.3 V USB USB_OTG.D_P 17 18 USB_H.D_P USB 3.3 V A N17
R18 A 3.3 V USB USB_OTG.D_N 19 20 USB_H.D_N USB 3.3 V A N18
– P 0 V Power DGND 21 22 DGND Power 0 V P –
P18 A 3.3 V USB USB1_CE 23 24 USB0_CE USB 3.3 V A M15
P17 A 3.3 V USB USB_OTG.ID 25 26 USB0_ID USB 3.3 V A P16
T18 A 3.3 V USB USB1_VBUS 27 28 USB0_VBUS USB 3.3 V A P15
F15 O 3.3 V USB USB_OTG.PWR_EN 29 30 USB0_DRVBUS USB 3.3 V O F16
– P 0 V Power DGND 31 32 DGND Power 0 V P –
C15 I 3.3 V UART UART3.RX 33 34 UART3.TX UART 3.3 V O C18
G16 I/O 3.3 V MMC MMC0.DAT0 35 36 MMC0.DAT2 MMC 3.3 V I/O F18
G15 I/O 3.3 V MMC MMC0.DAT1 37 38 MMX0.DAT3 MMC 3.3 V I/O F17
– P 0 V Power DGND 39 40 DGND Power 0 V P –
G17 I/O 3.3 V MMC MMC0.CLK 41 42 MMC0.CMD MMC 3.3 V I/O G18
– P 0 V Power DGND 43 44 DGND Power 0 V P –
H17 I/O 3.3 V SPI SPI1.MOSI 45 46 SPI1.MISO SPI 3.3 V I/O J15
H16 I/O 3.3 V SPI SPI1.SCLK 47 48 SPI1.CS0 SPI 3.3 V I/O H18
– P 0 V Power DGND 49 50 DGND Power 0 V P –
D18 O 3.3 V CAN DCAN0_TX 51 52 DCAN1_TX CAN 3.3 V O E18
D17 I 3.3 V CAN DCAN0_RX 53 54 DCAN1_RX CAN 3.3 V I E17
– P 0 V Power DGND 55 56 DGND Power 0 V P –
D14 O 3.3 V DIV CLKOUT.2 57 58 CLKOUT.1 DIV 3.3 V O A15
– P 0 V Power DGND 59 60 DGND Power 0 V P –
D12 I/O 3.3 V Audio MCASP0.AXR0 61 62 MCASP0_FSR Audio 3.3 V I/O C13
D13 I/O 3.3 V Audio MCASP0_AXR1 63 64 MCASP0.FSX Audio 3.3 V I/O B13
C12 I/O 3.3 V Audio MCASP0.AXR2 65 66 MCASP0.ACLKR Audio 3.3 V I/O B12
A14 I/O 3.3 V Audio MCASP0_AXR3 67 68 MCASP0.ACLKX Audio 3.3 V I/O A13
– P 0 V Power DGND 69 70 DGND Power 0 V P –
C9 AIN 1.8 V ADC ANALOG.AIN7 71 72 ANALOG.AIN3 ADC 1.8 V AIN A7
A8 AIN 1.8 V ADC ANALOG.AIN6 73 74 ANALOG.AIN2 ADC 1.8 V AIN B7
– P 0 V Power DGND 75 76 DGND Power 0 V P –
B8 AIN 1.8 V ADC ANALOG.AIN5 77 78 ANALOG.AIN1 ADC 1.8 V AIN C7
C8 AIN 1.8 V ADC ANALOG.AIN4 79 80 ANALOG.AIN0 ADC 1.8 V AIN B6
– P 0 V Power DGND 81 82 DGND Power 0 V P –
B17 I/O 3.3 V SPI SPI0.MISO 83 84 SPI0.MOSI SPI 3.3 V I/O B16
A17 I/O 3.3 V SPI SPI0.SCLK 85 86 SPI0.CS0 SPI 3.3 V I/O A16
– P 0 V Power DGND 87 88 DGND Power 0 V P –
– – – n.c. RES1.SPARE1 89 90 RES1.SPARE2 n.c. – – –
D16 I/O 3.3 V I2C I2C1.SDA 91 92 I2C1.SCL I2C 3.3 V I/O D15
E15 I 3.3 V UART UART0.RX 93 94 UART0.TX UART 3.3 V O E16
– P 0 V Power DGND 95 96 DGND Power 0 V P –
A10 I/O 3.3 V CONFIG WARMRST# 97 98 JTAG.TRST# JTAG 3.3 V I B10
A11 O 3.3 V JTAG JTAG.TD0 99 100 JTAG.EMU1 JTAG 3.3 V I/O B14
B11 I 3.3 V JTAG JTAG.TDI 101 102 JTAG.EMU0 JTAG 3.3 V I/O C14
C11 I 3.3 V JTAG JTAG.TMS 103 104 DGND Power 0 V P –
– P 0 V Power DGND 105 106 JTAG.TCK JTAG 3.3 V I A12
– P 1.5 V CONFIG TEST.VDDS-DDR 107 108 DGND Power 0 V P –
– P 1.8 V CONFIG TEST.VDDS 109 110 RES1.SPARE3 n.c. – – –
– P 1.8 V CONFIG TEST.VDD-PLL 111 112 RES1.SPARE4 n.c. – – –
– P 1.8 V CONFIG TEST.VDD-USB 113 114 TEST.VDD-CORE CONFIG 1.1 V P –
– P 1.8 V CONFIG TEST.VDDA-ADC 115 116 TEST.VDDS-MPU CONFIG 1.1 V P –
– P 1.8 V CONFIG TEST.VDDS-RTC 117 118 DGND Power 0 V P –
– P 0 V Power DGND 119 120 DGND Power 0 V P –

User's Manual l MBa335x UM 0202 l © 2018, TQ-Systems Gm H Page 8
Ta le 6: Pinout connector X2
Ball I/O Level Group Signal Pin Signal Group Level I/O Ball
– P 3.3 V Power VCC3V3_TQMA335X 1 2 VCC3V3_TQMA335X Power 3.3 V P –
– P 3.3 V Power VCC3V3_TQMA335X 3 4 VCC3V3_TQMA335X Power 3.3 V P –
– P 3.3 V Power VCC3V3_TQMA335X 5 6 VCC3V3_TQMA335X Power 3.3 V P –
– P 0 V Power DGND 7 8 DGND Power 0 V P –
– P 0 V Power DGND 9 10 DGND Power 0 V P –
– P 0 V Power DGND 11 12 DGND Power 0 V P –
– P 3.3 V Power VBACKUP_RTC 13 14 VBACKUP_PMIC Power 3.3 V P –
– P 0 V Power DGND 15 16 DGND Power 0 V P –
C17 I/O 3.3 V I2C I2C0.SDA 17 18 VDDSH3V3 Power 3.3 V P –
C16 I/O 3.3 V I2C I2C0.SCL 19 20 RES2.SPARE1 n.c. – – –
– P 0 V Power DGND 21 22 DGND Power 0 V P –
K18 I 3.3 V RGMII RGMII_1.TCLK 23 24 RGMII_1.RCLK RGMII 3.3 V I L18
– P 0 V Power DGND 25 26 DGND Power 0 V P –
J16 O 3.3 V RGMII RGMII_1.TCTL 27 28 RGMII_1.RCTL RGMII 3.3 V I J17
K17 O 3.3 V RGMII RGMII_1.TD0 29 30 RGMII_1.RD0 RGMII 3.3 V I M16
K16 O 3.3 V RGMII RGMII_1.TD1 31 32 RGMII_1.RD1 RGMII 3.3 V I L15
K15 O 3.3 V RGMII RGMII_1.TD2 33 34 RGMII_1.RD2 RGMII 3.3 V I L16
J18 O 3.3 V RGMII RGMII_1.TD3 35 36 RGMII_1.RD3 RGMII 3.3 V I L17
– P 0 V Power DGND 37 38 DGND Power 0 V P –
M18 O 3.3 V MII ENET_MDC 39 40 ENET_MDIO MII 3.3 V I/O M17
T17 I 3.3 V UART UART4.RX 41 42 UART4.TX UART 3.3 V O U17
– P 0 V Power DGND 43 44 DGND Power 0 V P –
U15 O 3.3 V RGMII RGMII_2.TCLK 45 46 RGMII_2.RCLK RGMII 3.3 V I T15
– P 0 V Power DGND 47 48 DGND Power 0 V P –
R13 O 3.3 V RGMII RGMII_2.TCTL 49 50 RGMII_2.RCTL RGMII 3.3 V I V14
V15 O 3.3 V RGMII RGMII_2.TD0 51 52 RGMII_2.RD0 RGMII 3.3 V I V17
R14 O 3.3 V RGMII RGMII_2.TD1 53 54 RGMII_2.RD1 RGMII 3.3 V I T16
T14 O 3.3 V RGMII RGMII_2.TD2 55 56 RGMII_2.RD2 RGMII 3.3 V I U16
U14 O 3.3 V RGMII RGMII_2.TD3 57 58 RGMII_2.RD3 RGMII 3.3 V I V16
– P 0 V Power DGND 59 60 DGND Power 0 V P –
U7 I/O 3.3 V MMC MMC1.DAT0 61 62 MMC1.DAT4 MMC 3.3 V I/O U8
V7 I/O 3.3 V MMC MMC1.DAT1 63 64 MMC1.DAT5 MMC 3.3 V I/O V8
R8 I/O 3.3 V MMC MMC1.DAT2 65 66 MMC1.DAT6 MMC 3.3 V I/O R9
T8 I/O 3.3 V MMC MMC1.DAT3 67 68 MMC1.DAT7 MMC 3.3 V I/O T9
– P 0 V Power DGND 69 70 DGND Power 0 V P –
V9 I/O 3.3 V MMC MMC1.CMD 71 72 MMC1.CLK MMC 3.3 V I/O U9
– P 0 V Power DGND 73 74 DGND Power 0 V P –
V12 O 3.3 V LCD LCD_MCLK 75 76 LCD_HSYNC LCD 3.3 V O R5
– P 0 V Power DGND 77 78 DGND Power 0 V P –
V5 O 3.3 V LCD LCD_PCLK 79 80 LCD_AC_BIAS_EN# LCD 3.3 V O R6
– P 0 V Power DGND 81 82 DGND Power 0 V P –
U10 O 3.3 V LCD LCD_DAT23 83 84 LCD_DAT22 LCD 3.3 V O T10
T11 O 3.3 V LCD LCD_DAT21 85 86 LCD_DAT20 LCD 3.3 V O U12
T12 O 3.3 V LCD LCD_DAT19 87 88 LCD_DAT18 LCD 3.3 V O R12
V13 O 3.3 V LCD LCD_DAT17 89 90 LCD_DAT16 LCD 3.3 V O U13
– P 0 V Power DGND 91 92 DGND Power 0 V P –
T5 I/O 3.3 V LCD/ BOOT LCD_DAT15 93 94 LCD_DAT14 LCD/ BOOT 3.3 V I/O V4
V3 I/O 3.3 V LCD/ BOOT LCD_DAT13 95 96 LCD_DAT12 LCD/ BOOT 3.3 V I/O V2
U4 I/O 3.3 V LCD/ BOOT LCD_DAT11 97 98 LCD_DAT10 LCD/ BOOT 3.3 V I/O U3
U2 I/O 3.3 V LCD/ BOOT LCD_DAT9 99 100 LCD_DAT8 LCD/ BOOT 3.3 V I/O U1
– P 0 V Power DGND 101 102 DGND Power 0 V P –
T4 I/O 3.3 V LCD/ BOOT LCD_DAT7 103 104 LCD_DAT6 LCD/ BOOT 3.3 V I/O T3
T2 I/O 3.3 V LCD/ BOOT LCD_DAT5 105 106 LCD_DAT4 LCD/ BOOT 3.3 V I/O T1
R4 I/O 3.3 V LCD/ BOOT LCD_DAT3 107 108 LCD_DAT2 LCD/ BOOT 3.3 V I/O R3
R2 I/O 3.3 V LCD/ BOOT LCD_DAT1 109 110 LCD_DAT0 LCD/ BOOT 3.3 V I/O R1
– P 0 V Power DGND 111 112 DGND Power 0 V P –
– – – n.c. RES2.SPARE2 113 114 RES2.SPARE3 n.c. – – –
R7 I/O 3.3 V DIV TIMER.4 115 116 TIMER.6 DIV 3.3 V I/O U6
T6 I/O 3.3 V DIV TIMER.5 117 118 TIMER.7 DIV 3.3 V I/O T7
– P 0 V Power DGND 119 120 DGND Power 0 V P –

User's Manual l MBa335x UM 0202 l © 2018, TQ-Systems Gm H Page 9
4.1.2 I2C address mapping
Illustration 3: Block diagram I2C us
Only I2C0 is used on the MBa335x y default. I2C1 is used neither on the MBa335x nor on the TQMa335x y default.
I2C0 and I2C1 are routed to headers on the MBa335x.
Ta le 7 shows the slave addresses used for this us as well as the components on the TQMa335x.
The temperature sensor/EEPROM, as well as oth port expanders can e controlled with I2C1 y an assem ly option on the
MBa335x. See Ta le 8 for the required assem ly option to use the I2C1 us.
Ta le 7: I2C0 slave address mapping (default assem ly)
Hardware Component Ref. Address
EEPROM (M24C64) – 0x50 / 101 0000b
EEPROM (SE97BTP) – 0x57 / 101 0111b
Temperature sensor (SE97BTP) – 0x1F / 001 1111b
RTC (DS1339U) – 0x68 / 110 1000b
PMIC (TPS659) – 0x2D / 010 1101b
TQMa335x
PMIC (TPS659) – 0x12 / 001 0010b
Audio codec (TLV320) N2200 0x18 / 001 1000b
EEPROM (SE97BTP) D2400 0x51 / 101 0001b
Temperature sensor (SE97BTP) D2400 0x19 / 001 0001b
Port expander (PCA9554) outputs D900 0x20 / 010 0000b
MBa335x
Port expander (PCA9554) inputs D901 0x21 / 010 0001b
Ta le 8: Assem ly option for port expander and temperature sensor
Option R900 R901 R902 R903 R2400 R2405 R2406 R2411
Port-Expander at I2C0 (Default assem ly) 0 Ω NP 0 Ω NP
Port-Expander at I2C1 NP 0 Ω NP 0 Ω X
Temperature sensor at I2C0 (Default assem ly) 0 Ω NP 0 Ω NP
Temperature sensor at I2C1 X NP 0 Ω NP 0 Ω
Attention:
Attention when using I2C0. Since the PMIC can e addressed via this interface,
errors on the us can lead to an insta le TQMa335x!

User's Manual l MBa335x UM 0202 l © 2018, TQ-Systems Gm H Page 10
4.1.3 Temperature sensor
SE97BTP temperature sensors with integrated EEPROM are availa le on the TQMa335x and the MBa335x to monitor
temperatures. Both sensors are connected to I2C0 or I2C1. Each of them has an individual device address
(see 4.1.2 for address mapping).
Ta le 9: Electrical characteristics SE97BTP
Parameter Value Range
Accuracy ±2 °C
±3 °C
+40 °C to +125 °C
–40 °C to +125 °C
Resolution 0.125 °C 11 it
The SE97BTP on the top side of the MBa335x is located etween the connectors for the TQMa335x;
the SE97BTP on the TQMa335x is on the ottom side of the module.
Illustration 4: Position of temperature sensor SE97BTP (D2400) on MBa335x
Illustration 5: Position of temperature sensor SE97BTP (D8) on TQMa335x

User's Manual l MBa335x UM 0202 l © 2018, TQ-Systems Gm H Page 11
4.1.4 RTC ackup supply
The MBa335x does not provide an RTC. On the TQMa335x the following RTCs are availa le, which are supplied y the MBa335x in
case of a ackup:
•RTC in the CPU AM335x
•RTC in the PMIC TPS65910
•RTC DS1339U (optional)
A coin cell on the MBa335x supplies the RTC on the TQMa335x. With jumper X3 the coin cell either supplies the PMIC and with it
the CPU-internal RTC, or the optional RTC DS1339U.
Technical information a out the PMIC power modes, as well as the CPU, is provided in the data sheets (see (1), (2), and (3)).
Illustration 6: RTCs supplies on TQMa335x
The following ta le shows the electrical characteristics of the RTCs.
Ta le 10: Electrical characteristics of RTCs
RTC Parameter Min. Typ. Max. Unit
Backup voltage VBACKUP_PMIC 2.21 – 3.0 V
PMIC / AM335x Current consumption – 25 – µA
Backup voltage VBACKUP_RTC 1.3 3.0 3.7 V
DS1339U Current consumption – 0.4 1.0 µA
The RTC on the MBa335x is on the ottom side, near the audio codec.
The header for the attery supply is on the top side, next to the SD card holder.
Ta le 11: RTC ackup supply
Manufacturer / Num er Description
Sony / CR2032 Lithium attery 3.0 V, 220 mAh
RENATA / SMTU2032 CR2032 attery holder
1: Threshold VBNPR of TPS65910.

User's Manual l MBa335x UM 0202 l © 2018, TQ-Systems Gm H Page 12
4.1.5 Power and Reset
Illustration 7: Block diagram Power and Reset
The MBa335x provides several options to trigger a complete or partial reset of the TQMa335x.
Two reset sources are availa le to reset sections of the circuitry on the MBa335x.
•WARMRST#: Reset output of the AM335x; Low-active
•PWRONRST_OUT#: Reset output of the PMIC; Low-active; default assem ly
Depending on the assem ly option (see Ta le 12) oth signals can e used as STKRST# signal to reset the following components
on the MBa335x:
•USB 2.0 Hi-Speed Hu USB2517 (D1600)
•Ethernet 1 PHY KSZ9031 (D1400)
•Ethernet 2 PHY KSZ9031 (D1600)
•Reset output at LVDS-CMD (X18)
•Audio-Codec TLV320A (N2200)
•Mini PCIe (X22)
For external components PWRONRST_OUT is routed to connector X4.
Ta le 12: Option of reset source for MBa335x-Reset
Option R427 R428
STKRST# at WARMRST# 0 Ω NP
STKRST# at PWRONRST_OUT# (Default assem ly) NP 0 Ω
The signal PMIC_SLEEP can e set with port expander D900. A falling edge triggers the PMIC Sleep Mode (see (3)).
With the three uttons S8, S9 and S10 on the MBa335x different power modes can e entered or left.
•S8 (PWRON): PMIC starts from OFF/SLEEP state (PMIC de ounces signal)
•S9 (EXT_WAKEUP): External Wake event of the AM335x
•S10 (PWRONRST_IN#): CPU-Reset; generates Reset on MBa335x via STKRST#

User's Manual l MBa335x UM 0202 l © 2018, TQ-Systems Gm H Page 13
Illustration 8: Position push uttons S8, S9, S10
Ta le 13: Reset/Power uttons
Manufacturer / Num er Description
Knitter Switch / TSS 61N Push utton
Knitter Switch / TMSE 10J-RA Push utton
S9
S8
S10