FMC700 User Manual r1.0
Oct 2012 www.abaco.com - 3 -
Table of Contents
Acronyms and related documents..................................................................................... 4
1.1 Acronyms................................................................................................................ 4
1.2 Related Documents................................................................................................. 4
2General description..................................................................................................... 5
3Installation ................................................................................................................... 5
3.1 Requirements and handling instructions.................................................................. 5
4Design .......................................................................................................................... 6
4.1 Physical specifications ............................................................................................ 6
4.1.1 Board Dimensions............................................................................................ 6
4.1.2 Cooling Fan...................................................................................................... 6
5Signals.......................................................................................................................... 7
5.1 User Defined Signal ................................................................................................ 7
5.1.1 HPC HA Signal................................................................................................. 7
5.1.2 HPC LA Signal................................................................................................. 8
5.1.3 LPC LA Signal.................................................................................................. 8
5.1.4 CLK Signal....................................................................................................... 8
5.2 GTX ........................................................................................................................ 9
5.2.1 HPC GTX Signal.............................................................................................. 9
5.2.2 LPC GTX Signal............................................................................................... 9
5.3 Miscellaneous signals ............................................................................................10
5.3.1 PRSNT............................................................................................................10
5.3.2 JTAG...............................................................................................................10
5.3.3 I2C Bus...........................................................................................................10
5.3.4 GA...................................................................................................................11
5.3.5 Power Good Signals .......................................................................................11
6Power...........................................................................................................................11
6.1 HPC Power Signal .................................................................................................11
6.2 LPC Power Signal..................................................................................................11
6.3 VIO_B_M2C...........................................................................................................11
7Layers and Stack up...................................................................................................11
8Environment................................................................................................................11
8.1 Temperature ..........................................................................................................11
8.2 Cooling...................................................................................................................12
8.2.1 Convection cooling..........................................................................................12
9Safety...........................................................................................................................12
10 EMC .............................................................................................................................12
11 Warranty......................................................................................................................12
Appendix A FMC700 Pinout............................................................................................13
