ACE COMPUTERS PWB411 User manual

PWB411 and PWB421 Blade Servers
User Manual
Revision 1.0
Revision Date: 03.18.2022

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The information in this User’s Manual has been carefully reviewed and is believed to be accurate. The vendor
assumes no responsibility for any inaccuracies that may be contained in this document and makes no commitment
to update or to keep current the information in this manual, or to notify any person or organization of the updates.
Please Note: For the most up-to-date version of this manual, please see our website at www.acecomputers.com.
Ace Computers reserves the right to make changes to the product described in this manual at any time and without
notice. This product, including software and documentation, is the property of Ace Computers and/ or its licensors,
and is supplied only under a license. Any use or reproduction of this product is not allowed, except as expressly
permitted by the terms of said license.
IN NO EVENT WILL Ace Computers BE LIABLE FOR DIRECT, INDIRECT, SPECIAL, INCIDENTAL, SPECULATIVE OR
CONSEQUENTIAL DAMAGES ARISING FROM THE USE OR INABILITY TO USE THIS PRODUCT OR DOCUMENTATION,
EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. IN PARTICULAR, SUPER MICRO COMPUTER, INC. SHALL
NOT HAVE LIABILITY FOR ANY HARDWARE, SOFTWARE, OR DATA STORED OR USED WITH THE PRODUCT, INCLUDING
THE COSTS OF REPAIRING, REPLACING, INTEGRATING, INSTALLING OR RECOVERING SUCH HARDWARE, SOFTWARE,
OR DATA.
Any disputes arising between manufacturer and customer shall be governed by the laws of Cook County in the State
of Illinois, USA. The State of Illinois, County of Cook shall be the exclusive venue for the resolution of any such
disputes. Ace Computer's total liability for all claims will not exceed the price paid for the hardware product.
FCC Statement: This equipment has been tested and found to comply with the limits for a Class A digital device
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference when the equipment is operated in an industrial environment. This equipment generates, uses, and can
radiate radio frequency energy and, if not installed and used in accordance with the manufacturer’s instruction
manual, may cause harmful interference with radio communications. Operation of this equipment in a residential
area is likely to cause harmful interference, in which case you will be required to correct the interference at your
own expense.
The products sold by Ace Computers are not intended for and will not be used in life support systems, medical
equipment, nuclear facilities or systems, aircraft, aircraft devices, aircraft/emergency communication devices or
other critical systems whose failure to perform be reasonably expected to result in significant injury or loss of life or
catastrophic property damage. Accordingly, Ace Computers disclaims any and all liability, and should buyer use or
sell such products for use in such ultra-hazardous applications, it does so entirely at its own risk. Furthermore, buyer
agrees to fully indemnify, defend and hold Ace Computers harmless for and against any and all claims, demands,
actions, litigation, and proceedings of any kind arising out of or related to such ultra-hazardous use or sale.
Unless you request and receive written permission from Ace Computers, you may not copy any part of this
document. Information in this document is subject to change without notice. Other products and companies
referred to herein are trademarks or registered trademarks of their respective companies or mark holders.
Printed in the United States of America
Note: This User Manual was derived from a SuperMicro User Manual, with permission from SuperMicro, to include
ACE Computers specific documentation.

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Preface
About this Manual
This manual is written for professional system integrators and PC technicians. It provides information
pertaining to EPEAT for the ACE Computers EPEAT registered servers.
Notes
If you have any questions regarding this manual or server system, please contact our support team
through Ace Computers Support page https://acecomputers.com/support/ .This manual may be
periodically updated without notice.
Please check the Ace Computers website for possible updates to the manual revision level.

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Table of Contents
Table of Contents
Chapter 1 – Testing/Compatibility Information ...................................................................................5
1. Operating Condition Class ................................................................................................................. 5
2. Compatible Chassis’ ........................................................................................................................... 5
Chapter 2 - Illustrated System Disassembly Instructions ......................................................................6
1. Data Storage Devices ......................................................................................................................... 7
2. Memory ............................................................................................................................................. 8
3. Processor ........................................................................................................................................... 9
4. Motherboard ................................................................................................................................... 10
5. SSD Drive ......................................................................................................................................... 11
6. Blade Chassis Cover ......................................................................................................................... 12
7. Batteries .......................................................................................................................................... 13
Chapter 3 – Installation, Maintenance and Replacement Instructions ................................................ 14
3.0 Accessing the System .................................................................................................................. 14
3.1 Processor and Heatsink (Replacement/Installation) ................................................................... 15
3.2 Memory (Replacement/Installation) ........................................................................................... 20
3.3 Data Storage Devices (Replacement/Installation) ....................................................................... 21
3.4 SSD Drive (Replacement/Installation) ......................................................................................... 22
Chapter 4 – Product Take-Back, End-Of-Life Processing, and E-Waste Program .................................. 23
Chapter 5 – Product Services ............................................................................................................ 23
5.1 Where to Get Replacement Components/Product Services ....................................................... 23
5.2 Returning Merchandise for Service .................................................................................... 23

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Chapter 1 – Testing/Compatibility Information
1. Operating Condition Class
The operating condition class is A2. Based on the results of testing, it was determined that as
long as the server functions inside the Allowable Range as noted for “Operating Condition A2”
(noted in the table below), there will be no material affect to the system and will continue to
operate as intended for the entire lifecycle of the product.
The life expectancy of the server system is eight years on average. If the server runs for 24 hours
a day, seven days a week for eight years, the operating hours that the server can operate in the
allowable range for class A2 without becoming materially affected would be 70,080 hours.
2. Compatible Chassis’
The table below indicates the chassis that would qualify the associated blade server as being
Energy Star qualified.
Blade Server
Compatible Chassis
PWB411
PWBC82H822
PWB421

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Chapter 2 - Illustrated System Disassembly Instructions
Chapter 8 is intended to provide guidance to recyclers on the presence of materials and components at
the product/family level, per Article 15 of the EU WEEE Directive 2012/19/EU. The provided information
should also help direct recyclers to proper methods for removing parts and general product disassembly
instructions. This Chapter also outlines specific substances, mixtures, and components that must be
removed from any separately collected electronic waste component and shall be disposed or recovered
in compliance with Directive 2008/98/EC.
Please note: All the illustrations in the below disassembly instructions are for demonstration only. The
system and components shown in this section are a representative sample.
CAUTION: Always power off the system and unplug the power cord(s) first before disassembling the
system!
Representative Server Component Layout
Blade Components
Item
Feature
Description
1
Drive
2.5” SATA storage drive
2
CPU
Processor and heatsink
3
Memory
DIMM Slots
4
Air
Shrouds
Direct Air Flow
5
Module
Enables Broadcom RAID Controller
6
Module
Provides SATA for Third Drive
7
Chipset
Motherboard Chipset
8
Mezzanine
Add
-
on card provides one of: EDR,
HDR, M.2 Storage, Omnipath
100Gbps, or 25GbE network speed

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1. Data Storage Devices
Location: Servers are best known for their storage and interchangeability, this is most commonly
done through front hard drive bays as noted in the photo below. Some servers may also have
SSD storage, this type of storage can be found on the motherboard. It generally lays flat, parallel
to the board, rather than at a right angle. Most common applications insert one end of the SSD
into a slot on the motherboard while the alternate end is held in place with a small screw.
Type and number of fastenings: HDD = One (1) latch and four (6) Phillips screws, SSD = (1)
Phillips screw.
Tools required: Screwdriver with PH2 bit.
Procedure:
Step 1: HDD (3.5") = Push the release button on the carrier. Swing the handle fully. Grasp the
handle and pull the drive carrier out of its bay, once the drive carrier is out of the bay, the
Phillips screws can be removed.
Step 2: SSD (2.5") = Identify the SSD on the motherboard, remove the screw, and pull straight
back in a parallel position to remove the SSD from the slot on the motherboard.
Selective Treatment/Special Handling Per Annex VII, Directive 2012/19/EU: There are two
printed circuit board present that are greater than 10 square centimeters, one within the HDD
and one within SSD that must be removed separately from the data storage device and shall be
disposed or recovered in compliance with Directive 2008/98/EC.
Step 1 Step 2

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2. Memory
Location: Memory modules are found on the motherboard of the server, the number of memory
modules may vary by unit configuration but are generally found in pairs of 2.
Type and number of fastenings: Two (2) latches per memory module.
Tools required: None.
Procedure: Press both release tabs on the ends of the memory module to unlock it. Once the
module is loosened, remove it from the memory slot.
Selective Treatment/Special Handling Per Annex VII, Directive 2012/19/EU: The memory stick is
a printed circuit board greater than 10 sq. cm and shall be disposed or recovered in compliance
with EU Directive 2008/98/EC.

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3. Processor
Location: The processor is found on the motherboard of the server. As shown in the photo
below, the processor is located under the heat sink. The heatsink can look more like a fin type
thermal transfer device, or a rotating fan with a thermal transfer plate. There can be more than
one processor per motherboard.
Type and number of fastenings: Four (4) T30 Torx screws.
Tools required: Screwdriver with T30 Torx bit.
Procedure: Remove the screws as marked in the illustration below. After removing the screws,
lift the processor heatsink module off the processor socket. Unsnap corners A and B, then C and
D of the latch. Push the latch out from the bottom.
Selective Treatment/Special Handling Per Annex VII, Directive 2012/19/EU: The CPU does not
contain any printed circuit boards.

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4. Motherboard
Location: The motherboard is generally centrally located within the unit. Standard practice
would be to remove all the components, peripherals, and add-ons from the motherboard before
removal of the motherboard for processing.
Type and number of fastenings: 10 Phillips screws.
Tools required: Screwdriver with PH2 bit.
Procedure: Remove all 10 Phillips screws. Lift the motherboard from its base.
Selective Treatment/Special Handling Per Annex VII, Directive 2012/19/EU: The motherboard is
a circuit board that is greater than 10 sq. cm and should be disposed or recovered in compliance
with Directive 2008/98/EC.
A lithium battery resides on the motherboard. The battery must be removed separately from
the motherboard and shall be disposed or recovered in compliance with Directive 2008/98/EC.
Refer to section 9 for specific instructions on remove and disposal of LiON batteries.
 Handle used batteries carefully. Do not damage the battery in any way; a
damaged battery may release hazardous materials into the environment. Do not
discard a used battery in the garbage or a public landfill. Please comply with the
regulations set up by your local hazardous waste management agency to
dispose of your used battery properly.
Motherboard

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5. SSD Drive
Location: Certain configurations of server may include a SSD drive. It is used for add-on types of
components; it is attached directly to the motherboard.
Type and number of fastenings: One (1) socket located on the motherboard and one (1) plastic
plug
Tools required: None.
Procedure: Remove the plastic plug from the SSD/Motherboard. Carefully pull the SSD card up
and away from the Socket to remove from the motherboard.
Selective Treatment/Special Handling Per Annex VII, Directive 2012/19/EU: The SSD Drive is a
circuit board greater than 10 sq. cm and shall be disposed or recovered in compliance with
Directive 2008/98/EC.

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6. Blade Chassis Cover
Location: The chassis cover is located on the upright, top side of the server, and it approximately
2/3 the size of the entire top, as noted in the illustration below.
Type and number of fastenings: One (1) Phillips Head Screw.
Tools required: Phillips Head Screw Driver.
Procedure: To remove the cover, remove the screw as illustrated below. Slide the Cover toward
the rear and lift it off.
Selective Treatment/Special Handling Per Annex VII, Directive 2012/19/EU: None

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7. Batteries
Location: The battery is located on the motherboard, see illustration below.
Type and number of fastenings: One (1) latch.
Tools required: None.
Procedure: Push aside the small clamp that covers the edge of the battery. When the battery is
released, lift it out of the holder.
Selective Treatment/Special Handling Per Annex VII, Directive 2012/19/EU: A lithium battery
resides on the motherboard. The battery must be removed from separately from the
motherboard and shall be disposed or recovered in compliance with Directive 2008/98/EC.
Removal instructions for the motherboard lithium battery are outlined below.
 Handle used batteries carefully. Do not damage the battery in any way; a damaged battery may
release hazardous materials into the environment. Do not discard a used battery in the garbage
or a public landfill. Please comply with the regulations set up by your local hazardous waste
management agency to dispose of your used battery properly.

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Chapter 3 – Installation, Maintenance and Replacement
Instructions
This chapter provides instructions on installing and replacing main system components. To prevent
compatibility issues, only use components that match the specifications and/or part numbers given.
Installation or replacement of most components require that the power first be removed from the
system. Please follow the procedures given in each section.
Additional information regarding replacement components/availability can be found in Chapter 5 below.
3.0 Accessing the System
The blade cover can be removed to access the mainboard and install processors, memory, modules, the
onboard battery, etc.
 To remove the cover, remove the screw as illustrated below. Slide the cover toward the rear and
lift it off.
 To replace the cover, fit the six studs on the inside of the cover into the slots of the chassis, then
slide the cover toward the front of the blade to lock it into place. Replace the locking screw.

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3.1 Processor and Heatsink (Replacement/Installation)
The processor (CPU) and processor carrier should be assembled together first to form the processor
carrier assembly. This will be attached to the heatsink to form the processor heatsink module (PHM)
before being installed onto the CPU socket.
The Processor Carrier Assembly
The processor carrier assembly is comprised of the processor and the processor carrier.
1. Hold the processor with the land grid array (LGA, gold contacts) facing down. Locate the gold
triangle at the corner of the processor and the corresponding hollowed triangle on the
processor carrier as shown below. These triangles indicate the location of pin 1.
2. Turn the processor over (with the fold LGA up). Locate the CPU keys on the processor and the
four latches on the carrier as shown below.

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3. Locate the lever on the carrier and, if necessary, press it down as shown below.
4. Align the CPU keys on the processor (A & B) with those on the carrier (a & b) as shown below.
5. Carefully place one end of the processor under latch 1 on the carrier, and then press the other
end down until it snaps into latch 2 and is properly seated on the carrier.

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The Processor Heatsink Module (PHM)
After creating the processor carrier assembly, mount the heatsink onto the carrier assembly to form the
processor heatsink module (PHM).
Note: If this is a new heatsink, the thermal grease has been pre-applied. Otherwise, apply the proper
amount of thermal grease to the underside of the heatsink.
1. Turn the heatsink over with the thermal grease facing up. Note the tow triangle cutouts (A, B)
located at the diagonal corners of the heatsink as shown in the drawing below.
2. On the processor carrier assembly, find pin 1, as noted by triangles. Hold the processor carrier
assembly over so that the gold LGA is facing up.
3. Align clip “a” (pin 1) on the carrier assembly with the triangular cutout A on the heatsink and b,
c, d on the carrier assembly with B, C, D on the heatsink.
4. Push the carrier assembly onto the heatsink, making sure that all four clips on each corner are
properly secured.

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Installing the PHM into the CPU Socket
1. Remove the plastic protective cover from the CPU socket. Gently squeeze the grip tabs then pull
the cover off.
2. Locate the threaded fasteners (a, b, c, d) on the CPU socket.

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3. Locate four PEEK nuts (A, B, C, D) and four rotating wires (1, 2, 3, 4) on the heatsink as shown
below.
4. Check the rotating wires (1, 2, 3, 4) are in the unlatched position as shown.
5. Align nut A (next to the triangles and pin 1) on the heatsink with threaded fastener “a” on the
CPU socket. Also align nuts B, C, D on the heatsink with threaded fasteners b, c, d on the CPU
socket.
6. Gently place the heatsink on the CPU socket, making sure that each nut is properly aligned with
its corresponding threaded fastener.

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7. Press all four rotating wires outward to latch the PHM onto the CPU socket.
8. With a t30-bit screwdriver, tighten all PEEK nuts in the sequence of A, B, C, and D with even
pressure not greater than 12 lbf-in.
3.2 Memory (Replacement/Installation)
Type and number of fastenings: Two (2) latches per memory module.
Tools required: None.
Procedure:
1. Once you have followed the entire disassembly instructions under the Memory
Disassembly Section (Chapter 2) above, unpack the new memory.
2. Ensure the notches on both sides line up with the release tabs, apply light pressure and
push down to secure the memory notches into the release tabs (outlined below).