Achronix Speedster7t 7t1500 User manual

Preliminary Data
Speedster7t Pin
Connectivity User Guide
(UG084)
Speedster FPGAs
Preliminary Data

Speedster7t Pin Connectivity User Guide (UG084)
Preliminary Data 2
Copyrights, Trademarks and Disclaimers
Copyright © 2020 Achronix Semiconductor Corporation. All rights reserved. Achronix, Speedcore, Speedster,
and ACE are trademarks of Achronix Semiconductor Corporation in the U.S. and/or other countries All other
trademarks are the property of their respective owners. All specifications subject to change without notice.
NOTICE of DISCLAIMER: The information given in this document is believed to be accurate and reliable.
However, Achronix Semiconductor Corporation does not give any representations or warranties as to the
completeness or accuracy of such information and shall have no liability for the use of the information contained
herein. Achronix Semiconductor Corporation reserves the right to make changes to this document and the
information contained herein at any time and without notice. All Achronix trademarks, registered trademarks,
disclaimers and patents are listed at http://www.achronix.com/legal.
Preliminary Data
This document contains preliminary information and is subject to change without notice. Information provided
herein is based on internal engineering specifications and/or initial characterization data.
Achronix Semiconductor Corporation
2903 Bunker Hill Lane
Santa Clara, CA 95054
USA
Website: www.achronix.com
E-mail : [email protected]

Speedster7t Pin Connectivity User Guide (UG084)
Preliminary Data 3
Table of Contents
Chapter - 1: Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Chapter - 2: Pin List and Connection Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Chapter - 3: Supporting Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Speedster7t Pin Connectivity User Guide (UG084)
Preliminary Data 4

Speedster7t Pin Connectivity User Guide (UG084)
Preliminary Data 5
Chapter - 1: Introduction
This user guide lists each of the I/O pin groups available in the Speedster7t 7t1500 device, their functionality and
recommended connection guidelines. Refer to the (UG087) for detailed Speedster7t Power User Guide
description on the power/ground pins.

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Preliminary Data 6
Chapter - 2: Pin List and Connection Guidelines
Pin Name Type Description and Connection Guidelines
Clock I/O Interface
CLKIO_NE_MSIO_[N/P]
Input
/Output
A group of two clock buffers in each corner of the device that can be
used either as a single pseudo differential clock I/O or two single-
ended clock I/O. The supported voltage levels are 1.5V and 1.8V. If
these I/O are not used as clock buffers, they can be used only as
reset inputs.(1)
CLKIO_NW_MSIO_[N/P]
CLKIO_SE_MSIO_[N/P]
CLKIO_SW_MSIO_[N/P]
CLKIO_NE_MSIO_ZCAL
Input Impedance calibration inputs, one for each CLKIO bank, common for
both on-die termination and output driver. (11)
CLKIO_NW_MSIO_ZCAL
CLKIO_SE_MSIO_ZCAL
CLKIO_SW_MSIO_ZCAL
CLKIO_NE_REFIO_[N/P]_0
Input
/Output
A set of eight differential reference clock input/output pairs, two in
each corner of the device. The REFIO supports the following
(1)
configurations:
LVDS and LVPECL input signals up to a frequency of 1 GHz.
The LVPECL I/O will also require board-level AC coupling
capacitors.
LVDS test output capability.
LVCMOS input/output at 1.5V and 1.8V
CLKIO_NE_REFIO_[N/P]_1
CLKIO_NW_REFIO_[N/P]_0
CLKIO_NW_REFIO_[N/P]_1
CLKIO_SE_REFIO_[N/P]_0
CLKIO_SE_REFIO_[N/P]_1
CLKIO_SW_REFIO_[N/P]_0
CLKIO_SW_REFIO_[N/P]_1
CLKIO_NE_VREF
Input
Optional external reference voltage supply to the CLKIO, typically set
to CLKIO_*_VDDIO/2 when supplied externally. When this voltage is
internally supplied by the MSIO macro, these pins should be
connected to ground.
CLKIO_NW_VREF
CLKIO_SE_VREF
CLKIO_SW_VREF

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Pin Name Type Description and Connection Guidelines
IEEE1149.1/1149.6 JTAG
Interface(10)
JTAG_TCK Input
Dedicated test clock used to advance the TAP controller and clock in
data on TDI input and out on TDO output. The maximum frequency
for TCK is 50MHz.
JTAG_TDI Input Serial input for instruction and test data. Data is captured on the
rising edge of the test logic clock.
JTAG_TDO Output
Serial output for data from the test logic. TDO is set to an inactive
drive state (high impedance) when data scanning is not in progress.
TDO drives out valid data on the falling edge of the TCK input.
JTAG_TMS Input
Test Mode Select (TMS) input controlling the test access port (TAP)
controller state machine transitions. This input is captured on the
rising edge of the test logic clock (TCK).
JTAG_TRSTN Input Active-low reset input used to initialize the TAP controller
Configuration Interface
FCU_CONFIG_BYPASS_CLEAR Input
Active-high input pin to bypass configuration memory clear during
device initialization. This input should be tied to GND if it is not used.
(2)
FCU_CONFIG_CLKSEL Input
Pin controlling whether the FCU clock is sourced from the TCK input
or the CPU_CLK input (see Table: FCU Configuration Clock
It should be connected to a Selection Based). (see page 16)
configurable input such as a DIP switch to toggle between modes of
operation for debug. If this is not possible or desired, tie this off to 1.8
V (FCU_CB_VDDIO) or GND based on the desired clock for the
configuration mode.(2)
FCU_CONFIG_ERR_ENC[2:0] Output
Active-high output pins highlighting the presence of a CRC,
scrubbing or other errors in the bitstream during device programming.
If asserted, it continues to stay high and users should expect that
configuration loading never complete, and user mode is never
entered (see Connect Table: Error Output Pins). (see page 16)
these pins directly to error indicator.

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Preliminary Data 8
Pin Name Type Description and Connection Guidelines
FCU_CONFIG_DONE Output
Active-high configuration done output signal indicating that bitstream
loading completed successfully and that the device is ready to enter
user mode. Once high, it stays asserted until the FCU is power
cycled or reset for a re-initialization sequence.If a device
configuration error occurs, the CONFIG_DONE output will remain
low. Holding this pin low on the board can be used as a method to
synchronize the start-up of multiple devices.
This output is an open-drain signal. In the default mode of operation,
it is recommended that this signal be connected to an LED as an
indicator on the board. In this case, use an external 10 kΩ ±5% pull-
up resistor to 3.3V and drive a 1 kΩ resistor to the input of a FET to
turn on the LED. If LED usage is not desired, this signal can be
pulled-up to 1.8V (FCU_CB_VDDIO) instead using the same 10 kΩ
pull-up resistor.
FCU_CONFIG_MODESEL_[3:0] Input
Configuration mode selection inputs to define the FPGA configuration
unit (FCU) mode of operation (see Table: FCU Mode Selection). (see
These inputs should be connected to configurable inputs page 16)
such as DIP switches to toggle between modes of operation for
debug. If this is not possible or desired, based on the config scheme,
these pins should be tied to FCU_CB_VDDIO or GND.(2)
FCU_PARTIAL_CONFIG_DONE Output
Active-high configuration done output signal indicating that bitstream
loading completed successfully for partial reconfiguration of the
device and that the device is ready to enter user mode. This output is
an open-drain signal. Connect directly to an indicator LED or
configuration controller.
FCU_CONFIG_RSTN Input
Asynchronous active-low reset input clearing the configuration
memory in the device and the logic in the FPGA configuration unit
(FCU). Pull-up/pull-down options can be done in one of two ways:
(3)
If the configuration controller will always be driving this input,
the pin can be pulleddown to GND using a 4.7 kΩ ±5% resistor
to ensure that the FPGA will be in a reset state on power-up.
If the pin may sometimes not be driven by the configuration
controller or tristated, it Is imperative that it be pulled-up to 1.8
V (FCU_CB_VDDIO) through a 4.7 kΩ ±5% resistor.
FCU_STRAP_[2:0] Output Unconnected spare outputs. Leave these pins unconnect.

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Pin Name Type Description and Connection Guidelines
FCU_STAP_SEL Input
When asserted high, this signal enables the JTAG interface pins to
be directly connected to the JTAG controller in the SerDes PMA
blocks allowing SerDes configuration, debug and performance
monitoring directly from the JTAG interface. For bitstream download
and design debug using the JTAG interface, this pin must be held
low. For SerDes PMA debug only mode, this pin must be held high.(2)
This input must be connected to a configurable input such as a DIP
switch to toggle between modes of operation for debug. If this pin is
not used then it should be tied to GND using a 10 kΩ pull-down
resistor
FCU_CONFIG_STATUS Output
Active-high configuration status output signal indicating that the FCU
has completed initial start-up and has cleared the CMEM and is
awaiting FCU commands for bitstream programming. Once high, it
stays asserted until the FCU is power cycled or reset for a re-
initialization sequence or a CRC error is seen during bitstream load.
This output is an open-drain signal. It is recommended to connect
this signal to an LED as an indicator on the board. In this case, use
an external 10 kΩ ±5% pull-up resistor to 3.0V/3.3V and drive a 1 kΩ
resistor to the input of a FET to turn on the LED. If LED usage is not
desired, this signal can be pulled-up to 1.8V (FCU_CB_VDDIO) using
the same 10 kΩ pull-up resistor.
FCU_CONFIG_SYSCLK_BYPASS Input
Active-high bypass configuration system clock setting. Along with
CFG_CLKSEL, this setting allows for clock selection during
programming (see Table: FCU Configuration Clock Selection Based
). This input should be connected to a configurable (see page 16)
input like a DIP switch to toggle between modes of operation for
debug. If this is not possible or desired, tie this off to 1.8V
(FCU_CB_VDDIO) or GND based on the desired clock for the
configuration mode.(2)
FCU_CONFIG_USER_MODE Output
Active-high output indicating that the device has transitioned into user
mode. Once high, it stays asserted until the FCU is power cycled or
reset for a re-initialization sequence. This signal is not an open drain
output, connect this pin directly to an indicator LED or configuration
controller.
FCU_CPU_CLK Input
Input clock from external CPU. The data/address bus is synchronous
to this clock. If the CPU_CLK is not used to source the FCU clock,
then pin should be tied to GND.
FCU_CPU_CSN Input
Active-low CPU mode chip select. Connect the CSN pin directly to
the configuration controller. If this pin is not used then this pin should
be pulled HIGH using a pull-up resistor.
FCU_CPU_DQ_IN_OUT[31:0] Input
/Output
Data input/output pins shared between the CPU and flash interfaces.
The CPU interface is inaccessible when the flash mode is in use and
vice-versa. If any pins are unused based on the configuration then
they should be connected to weak pull-up resistors.(3)

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Pin Name Type Description and Connection Guidelines
FCU_CPU_DQ_VALID Output
Active-high control bit to indicate to the CPU the clock cycles when
the CPU_DQ bus has valid read-back data. Synchronous to
FCU_CPU_CLK.(3)
FCU_LOCK Output Active-high status bit to indicate the FCU lock/unlock status.(3)
FCU_STATUS_[1:0] Output FCU status bits showing the FCU state are shown in Table:
FCU_STATUS Bits. (see page 17)(3)
FCU_FLASH_CSN_[3:0] Output
Active-low chip select to enable/disable one or more of the attached
flash memory devices.For x1 mode, only CSN[0] is used, for x4 mode
connect each CSN[3:0] to a flash device. If x1 mode is used, leave
CSN[3:1] unconnected. In ×4 mode, connect all four to the individual
serial flash devices.
FCU_FLASH_HOLDN Output
Active-low hold output to flash memory device(s). This signal is used
to pause serial communications between Speedster and the flash
device without deselecting the device or stopping the serial clock.
Synchronous to FLASH_SCK.(3)
FCU_FLASH_SCK Output Clock output from FCU to flash memory device(s). Connect directly to
the flash device(s).
FCU_OSC_CLK Output
This clock is internally generated from a ring oscillator. For debug
purposes it can be bypassed and the external clock CPU_CLK can
be used. (3)
General Purpose I/O Interface
GPIO_[N0/S0]_BYTE[2:0]_VREF Input
Optional external reference voltage supply to the GPIO. Typically set
to GPIO_VDDIO/2 when supplied externally. When this voltage is
supplied internally by the MSIO macro, these pins should be
connected to ground.
GPIO_[N0/S0]_ZCAL Input Impedance calibration input, one for each GPIO bank, common for
both on-die termination and output driver.(11)
GPIO_[N0/S0]_BYTE[1:0]_BIT_
[11:0] Input
/Output
Single-ended GPIO that support multiple I/O standards at multiple
voltages. Bytes 0 and 1 contain a group of 12 I/O, and byte 2 has a
group of 8 I/O. Pseudo-differential pairs can be built using two
adjacent buffers.(1)
GPIO_[N0/S0]_BYTE2_BIT_[7:0]
SerDes
PCIe_x16

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Preliminary Data 11
Pin Name Type Description and Connection Guidelines
SRDS_N03_ATEST Output High-impedance output pin to probe/force internal analog nodes
during system bring-up.(13)
SRDS_N[3:0]_REFCLK_[N/P] Input
SerDes reference clock supplied from either a single-ended or
differential external source. There is single differential pair for each
lane. Each SerDes quad has a common reference clock. For PCIe
x16 mode, reference clocks for all the SerDes quads need to be
connected.(6,12)
SRDS_N[3:0]_RX_[N/P][3:0] Input Receive differential inputs to the SerDes. There is one differential
pair per each lane.(5)
SRDS_N[3:0]_TX_[N/P][3:0] Output Transmit differential outputs from the SerDes. There is one
differential pair per each lane.(4)
Ethernet
SRDS_N47_ATEST Output High-impedance output pin to probe/force internal analog nodes
during system bring-up.(13)
SRDS_N[5:4]_REFCLK_[N/P] Input
SerDes reference clock supplied from either a single-ended or
differential external source. There is a single differential pair for each
lane.(6,12)
SRDS_N[5:4]_RX_[N/P][3:0] Input Receive differential inputs to the SerDes. There is one differential
pair per each lane.(5)
SRDS_N[5:4]_TX_[N/P][3:0] Output Transmit differential outputs from the SerDes. There is one
differential pair per each lane.(4)
Shared PCIe_x8 and Ethernet
SRDS_N[7:6]_REFCLK_[N/P] Input
SerDes reference clock supplied from either a single-ended or
differential external source. There is one differential pair for each lane.
(6)
If configured to be PCIe compliant x8 mode, reference clocks for all 8
SerDes lanes need to be connected. If configured to operate as non-
PCIe compliant x4 mode, the unused lanes' clocks should be tied to
their own individual GND via an optional 50Ω ±1% termination
resistor.
SRDS_N[7:6]_RX_[N/P][3:0] Input Receive differential inputs to the SerDes. There is one differential
pair per each lane.(5)
SRDS_N[7:6]_TX_[N/P][3:0] Output Transmit differential outputs from the SerDes. There is one
differential pair per each lane.(4)

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Pin Name Type Description and Connection Guidelines
Miscellaneous
TS_AN_IO_[1:0] Input
/Output
Analog I/O pins used for test access and calibration. These pins are
used for internal temperature calibration purposes only. Leave
unconnected.
DDR4(9)
DDR4_S0_A17 Output Address input to SDRAM (used in x4 configuration only).(7)
DDR4_S0_ACT_N Output Active-low ACTIVATE command to SDRAM.(7)
DDR4_S0_A_[13:0] Output Bank Address inputs to SDRAM.(7)
DDR4_S0_BA_[1:0] Output Bank Select Inputs to SDRAM.(7)
DDR4_S0_BG_[1:0] Output Bank Group inputs to SDRAM.(7)
DDR4_S0_BP_ALERT_N Input
/Output
I/O signal driven by DDR4 SDRAM to signal to the host controller
when the SDRAM detects an error on the DDR interface, or, is a
signal driven by the host controller to the SDRAM during connectivity
test mode.(7)
DDR4_S0_BP_MEMRESET_L Output Active-low memory reset signal to external SDRAM.(7)
DDR4_S0_BP_VREF Input
/Output Reference Voltage to external SDRAM.(7)
DDR4_S0_BP_ZN Output External calibration resistor drive. Supported calibration resistor
values are 40Ω, 120Ω and 240Ω ±1%.
DDR4_S0_CAS_N Output
Active-low column address select signal to external SDRAM. When
ACT_N and CS_N are low, these outputs are interpreted as column
address bits. When ACT_N is high, these outputs are interpreted as
command pins to indicate READ, WRITE or other commands.(7)
DDR4_S0_CID_[2:0] Output Chip ID select for stacked components.(7)
DDR4_S0_CKE_[3:0] Output SDRAM clock enable control signal.(7)
DDR4_S0_CK_[N/P]_[3:0] Output
Differential clock inputs to DRAM. All address, command, and control
input signals are sampled on the crossing of the positive edge of
CK_T and the negative edge of CK_C.(7)

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Preliminary Data 13
Pin Name Type Description and Connection Guidelines
DDR4_S0_CS_N_[3:0] Output
Active-low chip select signals to external SDRAM. All commands are
masked when CS_n is registered HIGH. CS_N provides external
rank selection on systems with multiple ranks.(7)
DDR4_S0_UDQS_N_[8:0] Input
/Output Data Mask and data bus inversion signals to SDRAM.(7)
DDR4_S0_DQ_[8:0]_[7:0] Input
/Output SDRAM data bus.(7)
DDR4_S0_LDQS_[N/P]_[8:0] Input
/Output SDRAM data strobe signals.(7)
DDR4_S0_ODT_[3:0] Output
SDRAM on-die termination control signal. ODT resistances can be
configured to one of these values (open, 240, 120, 80, 60, 48, 40)
pulled up to DDR4_S0_VDDQ.
DDR4_S0_PAR Output Command/Address Parity input to SDRAM.(7)
DDR4_S0_RAS_N Output
Active-low row address select signal to external SDRAM. When
ACT_N and CS_N are low, these outputs are interpreted as row
address bits. When ACT_N is high, these outputs are interpreted as
command pins to indicate READ, WRITE or other commands.(7)
DDR4_S0_DM_DBI_UDQS_P_[8:
0]
Input
/Output SDRAM data strobe signals.(7)
DDR4_S0_WE_N Output Active-low write enable signal.(7)
GDDR6
GDDR6_[E/W][3:0]_C[1:0]
_SD_CABI_N Output Active-low command address bus Inversion input to GDDR6 memory.
(8)
GDDR6_[E/W][3:0]_C[1:0]
_SD_CA_[9:0] Output Command Address inputs to GDDR6 memory.(8)
GDDR6_[E/W][3:0]_C[1:0]
_SD_CKE_N Output Active-low clock enable input to GDDR6 memory.(8)
GDDR6_[E/W][3:0]_C[1:0]
_SD_DBI_N_[1:0]
Input
/Output Active-low data bus inversion inputs to GDDR6 memory.(8)
GDDR6_[E/W][3:0]_C[1:0]
_SD_DQ_[15:0]
Input
/Output Bidirectional data input/output.(8)
GDDR6_[E/W][3:0]_C[1:0]
_SD_EDC_[1:0] Input Error detection code from GDDR6 memory.(8)

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Preliminary Data 14
Pin Name Type Description and Connection Guidelines
GDDR6_[E/W][3:0]_C[1:0]
_SD_WCK_[N/P]_[1:0] Output Differential data clock inputs to memory.(8)
GDDR6_[E/W] [3:0]_RREF Input Reference resistor for ZQ calibration. Nominal 240Ω to ground ±1%
tolerance.
GDDR6_[E/W] [3:0]_SD_CLK_[N
/P] Output Differential clock inputs to memory.(8)
GDDR6_[E/W] [3:0]
_SD_RESET_N Output Active-low Reset to GDDR6 memory.(8)
GDDR6_E2_ATESTCA Input Analog voltage monitor for CA signals.(13)
GDDR6_E2_ATESTDQL Input Analog voltage monitor for lower DQ signals.(13)
GDDR6_E2_ATESTDQR Input Analog voltage monitor for higher DQ signals.(13)
GDDR6_W1_ATESTCA Input Analog voltage monitor for CA signals.(13)
GDDR6_W 1_ATESTDQL Input Analog voltage monitor for lower DQ signals.(13)
GDDR6_W 1_ATESTDQR Input Analog voltage monitor for CA signals.(13)

Speedster7t Pin Connectivity User Guide (UG084)
Preliminary Data 15
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
Pin Name Type Description and Connection Guidelines
Table Notes
Unused I/O can be left unconnected.
Do not leave this/these pin(s) unconnected.
Connect directly to the configuration controller.
These pins should be AC coupled. Leave all unused transmit pins unconnected.
Connect unused receive pins to GND via an optional 50Ω ±1% termination resistor.
Connect these clocks for all SerDes lanes used in the interface.
Connect to the appropriate signals on the DDR4 DIMM.
Connect to the appropriate GDDR6 memory signals.
If the DDR4 interface is not used, the DDR PHY can be set in bypass mode where the unused DDR4
I/O can be used as special-purpose I/O for low-speed applications such as boundary scan, DC I/O
parametric testing, SoC-level ATPG I/O and DDR4 memory connectivity testing. The direction of
these pins is retained from that of the DDR4 interface. The user can either use all DDR I/O as
special-purpose I/O or use the entire set for DDR4 interfacing, but a combination of both is not
allowed.
The JTAG interface pins should be brought out to a JTAG header on the board, and the connections
must adhere to the JTAG interface standard. These JTAG pins should never be left unconnected and
should be connected to a JTAG header even when not used.
Requires an off-chip precision resistor 240Ω ±1% terminated to ground.
Unused clocks should be tied to their own individual GND via an optional 50Ω ±1% termination
resistor.
Connect directly to observation point.

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Preliminary Data 16
Chapter - 3: Supporting Tables
Table 1: FCU Configuration Clock Selection Based on SYSCLK_BYPASS and CLKSEL Pin Selections
SYSCLK_BYPASS CFG_CLKSEL CFG_MODESEL[3:0] Configuration Clock
0 0 0000, 0001, 0010
1000 to 1101 On-chip Oscillator
1 0 0000, 0001, 0010,1000 to 1101 CPU clock
X 0 0011, 01XX CPU clock
X 1 XXXX JTAG TCK
Table 2: Error Output Pins Indicating Various Error Messages During Bitstream Programming
FCU_CONFIG_ERR_ENC
[2:0] Status Priority
001 CRC error. 0
(Lowest)
010 Single-bit/multiple-bit scrubbing error. 1
011 Secure boot failure or a security error. 2
100 Efuse PUF enrollment error. 3
101 Asserted when AXI interface of IP configuration space register block does
not receive a ready from the master.
4
(Highest)
Other Undefined.
Table 3: FCU Mode Selection Based on MODESEL Pins
Configuration Mode CFG_MODESEL[3:0]
Flash Serial ×1 0001
Flash Serial ×4 0010
CPU ×1,×8,×16,×32,×128 0011 to 0111

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Preliminary Data 17
Configuration Mode CFG_MODESEL[3:0]
Flash Dual ×1 1000
Flash Dual ×1 1001
Flash Quad ×1 1010
Flash Quad ×4 1011
Flash Octa ×1 1100
Flash Octa ×4 1101
JTAG Always active mode
Table 4: FCU_STATUS Bits Indicating FCU State
FCU_STATUS State
11 fcu_locked
10 sync_found
01 ID found
00 instance ID found / FCU unlocked

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Preliminary Data 18
Chapter - 4: Revision History
Version Date Description
1.0 24 May 2019 Initial Achronix release.
1.1 11 Jun 2019
Removed double prefixes from FCU, JTAG and TS pin names.
Renamed UDQS_T signals in DDR4 interface to DM_DBI_UDQS_T
and DM_DBI_UDQS_C signals to UDQS_C.
Updated FCU Io pins to include strap signals, stap_sel and error status
signals
Updated GDDR6 ATEST signals for the East and West sides.
1.2 21 Apr 2020
Reverted some of the clock or High-Z signals to be input or output.
Updated connection guidelines for a few FCU_* pins.
Updates to the to the CLKIO_* pin description to include additional
supported standards and use-cases.
Corrections to the FCU_CONFIG_ERR_ENC[2:0] bit status to match
hardware.
Updated DDR I/O in bypass mode use cases
1.3 08 May 2020 Complete restructuring of the user guide for better readability.
Updated connection guidelines for DDR4 I/O in bypass mode.
Table of contents