
ESP-07S User Manual
1. Preambles
ESP-07S WiFi m dule is devel ped by AI-Thinker C .,Ltd, c re pr cess r ESP8266 in smaller sizes f the
m dule encapsulates Tensilica L106 integrates industry-leading ultra l w p wer 32-bit MCU micr , with
the 16-bit sh rt m de, cl ck speed supp rt 80 MHz, 160 MHz, supp rts the RTOS, integrated Wi-Fi
MAC/BB/RF/PA/LNA, n-b ard antennas.
The m dule supp rts standard IEEE802.11 b/g/n agreement, c mplete TCP/IP pr t c l stack. Users can
use the add m dules t an existing device netw rking, r building a separate netw rk c ntr ller.
ESP8266 is high integrati n wireless SOCs, designed f r space and p wer c nstrained m bile platf rm
designers. It pr vides unsurpassed ability t embed Wi-Fi capabilities within ther systems, r t
functi n as a standal ne applicati n, with the l west c st, and minimal space requirement.
Figure 1 ESP 266EX Functional Block Diagram
ESP8266EX ffers a c mplete and self-c ntained Wi-Fi netw rking s luti n; it can be used t h st the
applicati n r t ffl ad Wi-Fi netw rking functi ns fr m an ther applicati n pr cess r.
When ESP8266EX h sts the applicati n, it b ts up directly fr m an external flash. In has integrated
cache t impr ve the perf rmance f the system in such applicati ns.
Alternately, serving as a Wi-Fi adapter, wireless internet access can be added t any micr
c ntr llerbased design with simple c nnectivity (SPI/SDIO r I2C/UART interface).
ESP8266EX is am ng the m st integrated WiFi chip in the industry; it integrates the antenna switches, RF
balun, p wer amplifier, l w n ise receive amplifier, filters, p wer management m dules, it requires
minimal external circuitry, and the entire s luti n, including fr nt-end m dule, is designed t ccupy
minimal PCB area.
ESP8266EX als integrates an enhanced versi n f Tensilica’s L106 Diam nd series 32-bit pr cess r, with
n-chip SRAM, besides the Wi-Fi functi nalities. ESP8266EX is ften integrated with external sens rs and
ther applicati n specific devices thr ugh its GPIOs; c des f r such applicati ns are pr vided in
examples in the SDK.