Ai-Thinker NodeMCU-BU01 User manual

NodeMCU-BU01Specification V 1.0
Copyrigh t © Shenzhen Ai-Thinker Technology Co.,Ltd All Rights Reserved 2020
1
NodeMCU-BU01 SPECIFICATION
Version V1.0
Copyright ©2020

NodeMCU-BU01Specification V 1.0
Copyrigh t © Shenzhen Ai-Thinker Technology Co.,Ltd All Rights Reserved 2020
2
Disclaimer and Copyright Notice
The information in this article, including URL addresses for reference, is subject to change
without notice.
This document is provided "as is" without warranty of any kind, including any warranty of
merchantability, fitness for a particular purpose, or non-infringement, and any warranty of any
proposal, specification, or sample mentioned elsewhere. No liability is assumed in this
document, including any infringement of any patent rights arising out of the use of the
information in this document. No license is granted by estoppel or otherwise in this document,
either express or implied.
The test data obtained in this article are all obtained from the testing performed by Anxinke
Labs. Actual results may vary slightly.
The Wi-Fi Alliance member logo is owned by the Wi-Fi Alliance.
All trademark names, trademarks and registered trademarks mentioned in this article are the
property of their respective owners and are hereby declared.
The final interpretation right belongs to Shenzhen Anxinke Technology Co., Ltd.
Attention
The contents of this manual may be changed due to product version upgrades or other reasons.
Shenzhen Anxinke Technology Co., Ltd. reserves the right to modify the contents of this
manual without any notice or prompt. This manual is only used as a guide. Shenzhen Anxin Ke
Technology Co., Ltd. makes every effort to provide accurate information in this manual, but
Shenzhen An Xin Ke Technology Co., Ltd. does not ensure that the content of the manual is
completely error-free. All statements and information in this manual And recommendations do
not constitute any express or implied warranty.

NodeMCU-BU01Specification V 1.0
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Documentation/revision/ revocation resume
Version
Date
Development/revision
Developme
nt
Approval
V1.0
2020.05.20
Initial development
Xie Yiji

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Content
1.Product Overview..........................................................................................................................................5
2.Electrical parameters................................................................................................................................7
3.Appearance dimensions................................................................................................................................8
4.Definition of pins......................................................................................................................................9
5.Schematic diagrams....................................................................................................................................12
6.Design guidance..........................................................................................................................................12
7.ROLLING OF Reflow soldering................................................................................................................. 14
8.Packaging information..............................................................................................................................15
9.Contact us....................................................................................................................................................15

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1.Product Overview
NodeMCU-BU01 is designed as a development board for the BU01 module, equipped
with STM32F103C8T6MCU, peripherals to add temperature and humidity sensors and
three-dimensional acceleration sensor, for customers to develop debugging to
provide convenience.BU01 is an ultra-wideband (UWB) transceiver module based on
Decawave DW1000 design. BU01 integrated the antenna, RF circuit, power management
and clock circuits. BU01 can be used in bidirectional ranging or TDOA positioning
systems, Positioning accuracy up to 10cm, and supports data rates up to 6.8Mbps.
Characteristics
Easy integration without RF design
Extension of communications using RTLS infrastructure
Support high label density
Compliance with IEEE 802.15.4-2011UWB standards
Support 4 channels 3.5GHz to 6.5GHz
Programmable transmit power
3.3 V /5V power supply
Power consumption <1mA in sleep mode
Support for bidirectional ranging and TDOA

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Support SPI interface
Data rate 100 kbps,850kbps,6.8Mbps
Main parameters
Table 1 Key parameter descriptions
Model Name
NodeMCU-BU01
Dimensions
35*55.5(±0.2)(W*H) mm
Package
DIP-40
Antenna
PCB antenna
Frequency range
3.5GHz to 6.5GHz
Interface
The all IO of PWM/I2C/GPIO 、MCU
Operating
temperature
-40℃~85℃
Storage
environment
-40 ℃ ~ 125 ℃ , < 90%RH
Power supply
range
5V or 3.3V
Power
consumption
Development board :160 mA (with MCU, sensors)

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2.Electrical parameters
Electrical characteristics
Absolute maximum rating
Any more than the following absolute maximum ratings can cause chip damage
Name of name
Minimum value
Typical values
Maximum value
Units
Micro USB supply
voltage
-
5
-
V
Pin header 3.3 V supply
voltage
-
3.3
-
V
Operating temperature
-40
-
+85
℃
Storage temperature
-40
-
+125
℃

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3.Appearance dimensions

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4.Definition of pins
NodeMCU-BU01 module has a total of 50 interfaces, such as the pin diagram, the
pin function definition table is the interface definition.
NodeMCU-BU01 Foot Schemes
Foot function definition table
Pin No.
Item
Functional Description
1
IO7
default value is used as SYNC input. this pin can be
reconfigured as a universal I /O pin GPIO7 under
software control.
2
IO6
universal I /O pin. when powered on, it is used as the
SPIPHA (SPI phase selection) pin for configuring the
SPI mode of operation. After power on, this pin will
default to universal I /O pin.
3
IO 5
universal I /O pin. when powered on, it is used as a
SPIPOL (SPI polarity selection) pin for configuring SPI
working mode. after power on, this pin will default to

NodeMCU-BU01Specification V 1.0
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universal I /O pin.
4
IO4
universal I /O pin.
5
IRQ
The interrupt request output from the DWM1000 to the
host processor and is connected to the MCU PB0. by
default, the IRQ is a high-level efficient output, but
can be configured as low-level valid if required. to
run correctly in SLEEP and DEEPSLEEP mode, it should
be configured to run efficiently at high levels. this
pin will float in hibernation and DEEPSLEEP states and
may cause a pseudo interrupt unless it is pulled low.
This pin can be reconfigured as a generic I /O line
GPIO8. when no IRQ function is used
6
CLK
SPI clock and connected to MCU PA5
7
MISO
SPI data output and connected to MCU PA6
8
MOSI
SPI data input and connected to MCU PA7
9
CSN
SPI chip select and connect with MCU PA4. this is a low
level effective enable input. SPICSn jumps from high
to low indicate the beginning of a new SPI transaction.
SPICSn can also be used as a wake-up signal to get DW1000
out of sleep or sleep state.
10
PA3
PA3 on the MCU
11
PB1
PB1 on the MCU
12
PB10
PB10 on the MCU
13
PB11
PB11 on the MCU
14
LED1
PA2, connection LED1 on the MCU
15
LED2
PA1, connection LED2 on the MCU
16
BTN
PA0, connection BTN keys on the MCU
17
RESET
Reset pin on MCU, connect reset button
18
GND
Ground
19
GND
Ground
20
V3.3
3.3 V Power supply
21
V5
5V power supply

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22
V3.3
3.3 V Power supply
23
GND
Ground grounding
24
VBAT
Vbat MCU battery power
25
SCL
SCL pin on MCU, default pull up 3.3 V, internal connect
sensor SCL pin
26
SDA
SDA pin on MCU, default pull up 3.3 V, internal connect
sensor SDA pin
27
PB8
PB8 on the MCU
28
PB9
PB9 on the MCU
29
PB5
PB5 on the MCU
30
PB4
PB4 on the MCU
31
PB3
PB3 on the MCU
32
PA15
PA15 on the MCU
33
V3.3
3.3 V Power supply
34
RST
Reset pin on BU01 and connected to MCU PB12
35
WAKEUP
the wake-up pin on the BU01 and is connected to the PB13
of the MCU. when set to a valid high level state, the
WAKEUP pin brings the DW1000 into working mode from a
dormant or DEEPSLEEP state. If not used, the pin can
be grounded
36
EXTON
The EXTON pin on the BU01 is connected to the MCU PB14
and the external device is enabled. position and remain
active during wake-up until the device enters sleep
mode. can be used to control external DC-DC converters
or other circuits not required when the device is in
sleep mode to minimize power consumption
37
U1RX
UART1-RX on the MCU
38
U1TX
UART1-TX on the MCU
39
PA8
PA8 on the MCU
40
PB15
PB15 on the MCU
DIO
Swdio
SWDIO feet on MCU, default flash pin
CLK
Swclk
SWDIO feet on MCU, default flash pin

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BT0
BOOT0
BOOT0 foot on MCU, control MCU start mode
BT1
BOOT1
BOOT1 foot on MCU, control MCU start mode
RESET keys
RESET
Reset button
BTN/PA0 keys
BTN/PA0
Press button to pull up PA0 pin
BOOT pin controls start-up mode:
BOOT0
BOOT1
MODE
0
x
FLASH
1
1
SRAM
1
0
ISP
5.Schematic diagrams
6.Design guidance
1. Antenna layout requirements
It is forbidden to place metal parts around the antenna, and to put away from
high frequency devices.
2、Power supply

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Programme I:
Standard Micro USB interface power supply
Programme II:
Pin 3.3 V Power supply
(1)、 recommend 3.3 V voltage, peak over 500mA current
(2)、 recommend the use of LDO power supply; if used DC-DC the recommended ripple
is controlled within 30mV.
(3)、DC-DC power supply circuit is suggested to reserve the position of dynamic
response capacitance, which can optimize the output ripple when the load changes
greatly.
(4),3.3 V The proposed addition of ESD devices.

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7.ROLLING OF Reflow soldering

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8.Packaging information
as shown below, the NodeMCU-BU01 packing is electrostatic bag packing.
9.Contact us
Official website: https://www.ai-thinker.com
Development DOCS：https://docs.ai-thinker.com
Official Forum: http://bbs.ai-thinker.com
Sample purchase: https://anxinke.taobao.com
Business cooperation: sa[email protected]
Technical support: [e-mail]
Company Address: Room410, Building C, Huafeng Intelligence Innovation Port,
Gushu, Xixiang, Baoan District, Shenzhen China 518000
Tel :[phone]