52
For
SD Memory
Card
For
miniSD™
Card
For
microSD™
Card
For
W-SIM
For
Memory
Stick Micro™
Combine Type
For
Express
Card™
For
Compact
Flash™
For PC cards
supporting
CardBus
For CMOS
Camera Module
For
Memory
Stick™
Soldering Conditions
Example of Reflow Soldering Condition（Reference）
1. Heating method: Double heating method with infrared heater.
2. Temperature measurement: Thermocouple 0.1 to 0.2φCA（K）or CC（T）.
3. Temperature profile（Surface of products）.
1. When soldering terminals, there is a danger that load placed on the terminals may cause rattle, deformation or
electrical degradation to occur depending on the conditions. Caution is therefore required.
2. Avoid use of water-soluble soldering flux, since it may corrode the product.
3. Check and conform to reflow soldering requirements under actual mass production conditions.
4. PC board warping may alter the characteristics. Please take this into consideration when designing patterns and
layout.
5. This product has been designed and manufactured for use in ordinary electronic equipment, such as AV equipment,
electric home appliances, office machines and communication equipment. In case of using the products for highly
sensitive applications such as medical, aviation, aerospace and security, the set makers shall require to include
measures necessary to meet product safety requirements of such specific applications. Such measure may include
additional protection circuits and redundant circuits, for example.
6. The card specifications are provided by the above manufactures. Products by other manufactures may not be
compliant with these specifications and are subject to change without prior notice.
Cautions
Small Memory Card Connectors
