Alps Electric SCNA Series User manual

36
For
SD Memory
Card
For
miniSD™
Card
For
microSD™
Card
For
W-SIM
For
Memory
Stick Micro™
Combine Type
For
Express
Card™
For
Compact
Flash™
For PC cards
supporting
CardBus
For CMOS
Camera Module
For
Memory
Stick™
Minimum mounting area for compact devices.
Minimized mounting area prevents negation of size
advantage of the card.
●
Features
For mobile phones, personal digital assistants, digital still
cameras, compact audio equipment
●
Applications
Memory Stick Micro™
Standard mount
Surface mounting type
Push-push type
250V AC 1minute
Applicable media
Structure
Items Specifications
Media ejection
structure
Mounting type
Mounting style
−25℃to ＋60℃
1,000MΩmin.
40mΩmax.
12,000cycles
Operating
temperature range
Performance
Contact resistance
（Initial）
Insertion and
removal cycle
Voltage proof
Insulation resistance
（Initial）
Typical Specifications
Standard mount
Media ejection structure
Push-push type
Mounting system Stand-off（mm）
0
Product No.
SCNA1A0300
Packing system
Taping
Product Line
Connector for Memory Stick Micro™
SCNA Series

37
For
SD Memory
Card
For
miniSD™
Card
For
microSD™
Card
For
W-SIM
For
Memory
Stick™
For
Memory
Stick Micro™
Combine Type
For
Express
Card™
For
Compact
Flash™
For PC cards
supporting
CardBus
For CMOS
Camera Module
Standard mount
Connector for Memory Stick Micro™ SCNA Series
14.7
13.2 9.15
7.8
5.95
3.85
1.4
11-0.6
6.72
0.9G10=9
5.92
6.57
7.62
7.77 6.57
4.47
3.12
3.07
P0.9
7.77
13.9
12.35
10.75
10.45
7.854.72.7
15.5
14.9
2.9 0.3 1.3
4-1.2
7.1
7.1
7.92
6.57
4.4
2.8
2.01
0.41
No parts area
Ground pattern possible area
No Pattern area
Land area
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
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
 G 



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
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


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



  

 
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   
Dimensions
PC board mounting hole dimensions
（Viewed from the mounting face side）
Unit:mm
Style

52
For
SD Memory
Card
For
miniSD™
Card
For
microSD™
Card
For
W-SIM
For
Memory
Stick Micro™
Combine Type
For
Express
Card™
For
Compact
Flash™
For PC cards
supporting
CardBus
For CMOS
Camera Module
For
Memory
Stick™
Soldering Conditions
Example of Reflow Soldering Condition（Reference）
1. Heating method: Double heating method with infrared heater.
2. Temperature measurement: Thermocouple 0.1 to 0.2φCA（K）or CC（T）.
3. Temperature profile（Surface of products）.
200
100
240℃(max.)
230℃(min.)
150℃
180℃
Time (s)
10 sec.(max.)
90±30 sec.
Room
temperature
Temperature (˚C )
Pre-heating
Heating time sec.
1. When soldering terminals, there is a danger that load placed on the terminals may cause rattle, deformation or
electrical degradation to occur depending on the conditions. Caution is therefore required.
2. Avoid use of water-soluble soldering flux, since it may corrode the product.
3. Check and conform to reflow soldering requirements under actual mass production conditions.
4. PC board warping may alter the characteristics. Please take this into consideration when designing patterns and
layout.
5. This product has been designed and manufactured for use in ordinary electronic equipment, such as AV equipment,
electric home appliances, office machines and communication equipment. In case of using the products for highly
sensitive applications such as medical, aviation, aerospace and security, the set makers shall require to include
measures necessary to meet product safety requirements of such specific applications. Such measure may include
additional protection circuits and redundant circuits, for example.
6. The card specifications are provided by the above manufactures. Products by other manufactures may not be
compliant with these specifications and are subject to change without prior notice.
Cautions
Small Memory Card Connectors