ASROCK H110M-DGS/D3 User manual

Version 1.0
Published October 2015
Copyright©2015 ASRock INC. All rights reserved.
Copyright Notice:
No part of this documentation may be reproduced, transcribed, transmitted, or
translated in any language, in any form or by any means, except duplication of
documentation by the purchaser for backup purpose, without written consent of
ASRock Inc.
Products and corporate names appearing in this documentation may or may not
be registered trademarks or copyrights of their respective companies, and are used
only for identication or explanation and to the owners’ benet, without intent to
infringe.
Disclaimer:
Specications and information contained in this documentation are furnished for
informational use only and subject to change without notice, and should not be
constructed as a commitment by ASRock. ASRock assumes no responsibility for
any errors or omissions that may appear in this documentation.
With respect to the contents of this documentation, ASRock does not provide
warranty of any kind, either expressed or implied, including but not limited to
the implied warranties or conditions of merchantability or tness for a particular
purpose.
In no event shall ASRock, its directors, ocers, employees, or agents be liable for
any indirect, special, incidental, or consequential damages (including damages for
loss of prots, loss of business, loss of data, interruption of business and the like),
even if ASRock has been advised of the possibility of such damages arising from any
defect or error in the documentation or product.
is device complies with Part 15 of the FCC Rules. Operation is subject to the following
two conditions:
(1) this device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that
may cause undesired operation.
CALIFORNIA, USA ONLY
e Lithium battery adopted on this motherboard contains Perchlorate, a toxic substance
controlled in Perchlorate Best Management Practices (BMP) regulations passed by the
California Legislature. When you discard the Lithium battery in California, USA, please
follow the related regulations in advance.
“Perchlorate Material-special handling may apply, see www.dtsc.ca.gov/hazardouswaste/
perchlorate”
ASRock Website: http://www.asrock.com

1
English
H110M-DGS/D3
Intel
H110
DDR3_B1 (64 bit, 240-pin module)
DDR3_A1 (64 bit, 240-pin module)
CMOS
Battery
ATXPWR1
Top:
RJ-45
USB 2.0
T: USB2
B: USB3
HDLE D RES ET
PLED P WRB TN
PANEL1
1
USB4_5
1
HD_AUDIO1
H110M-DGS/D3
RoHS
2
CPU_FAN1
3
5
6
1
BIOS
ROM
Audio
CODEC
PCIE2
TPMS1
1
1
USB3_3_4
PCIE1
USB 3.0
T: USB1
B: USB2
Top:
LINE I N
Cent er :
FRON T
Bott om :
MIC IN
1
ATX12V1
USB 2.0
T: USB0
B: USB1
PS2
Keyboard
/Mou se
SPK_CI1
1
16
DVI1
SATA3 _3
CHA_FAN1
SATA3 _2
SATA3 _1
SATA3 _0
4
7
8
10
11
12
1314
15
CLRMOS1
9
1.3 Motherboard Layout

2
English
No. Description
1 ATX 12V Power Connector (ATX12V1)
2 CPU Fan Connector (CPU_FAN1)
3 2 x 240-pin DDR3/DDR3L DIMM Slots (DDR3_A1, DDR3_B1)
4 Chassis Fan Connector (CHA_FAN1)
5 ATX Power Connector (ATXPWR1)
6 USB 3.0 Header (USB3_3_4)
7TPM Header (TPMS1)
8 USB 2.0 Header (USB4_5)
9 Clear CMOS Pad (CLRMOS1)
10 System Panel Header (PANEL1)
11 Chassis Intrusion and Speaker Header (SPK_CI1)
12 SATA3 Connector (SATA3_0)
13 SATA3 Connector (SATA3_1)
14 SATA3 Connector (SATA3_2)
15 SATA3 Connector (SATA3_3)
16 Front Panel Audio Header (HD_AUDIO1)

3
English
H110M-DGS/D3
1.4 I/O Panel
No. Description No. Description
1 USB 2.0 Ports (USB01) 6 USB 2.0 Ports (USB23)
2 LAN RJ-45 Port* 7 USB 3.0 Ports (USB3_12)
3 Line In (Light Blue)** 8 DVI-D Port
4 Front Speaker (Lime)** 9 PS/2 Mouse/Keyboard Port
5 Microphone (Pink)**
5
6
7
8
2
4
3
9
1
* ere are two LEDs on each LAN port. Please refer to the table below for the LAN port LED indications.
Activity / Link LED Speed LED
Status Description Status Description
O No Link O 10Mbps connection
Blinking Data Activity Orange 100Mbps connection
On Link Green 1Gbps connection
ACT/LINK LED
SPEED LED
LAN Port

4
English
** To congure 7.1 CH HD Audio, it is required to use an HD front panel audio module and enable the multi-
channel audio feature through the audio driver.
Please set Speaker Conguration to “7.1 Speaker”in the Realtek HD Audio Manager.
Function of the Audio Ports in 7.1-channel Conguration:
Port Function
Light Blue (Rear panel) Rear Speaker Out
Lime (Rear panel) Front Speaker Out
Pink (Rear panel) Central /Subwoofer Speaker Out
Lime (Front panel) Side Speaker Out

5
English
H110M-DGS/D3
Chapter 1 Introduction
ank you for purchasing ASRock H110M-DGS/D3 motherboard, a reliable
motherboard produced under ASRock’s consistently stringent quality control.
It delivers excellent performance with robust design conforming to ASRock’s
commitment to quality and endurance.
In this documentation, Chapter 1 and 2 contains the introduction of the
motherboard and step-by-step installation guides. Chapter 3 contains the operation
guide of the soware and utilities. Chapter 4 contains the conguration guide of
the BIOS setup.
1.1 Package Contents
•ASRock H110M-DGS/D3 Motherboard (Micro ATX Form Factor)
•ASRock H110M-DGS/D3 Quick Installation Guide
•ASRock H110M-DGS/D3 Support CD
•2 x Serial ATA (SATA) Data Cables (Optional)
•1 x I/O Panel Shield
Because the motherboard specications and the BIOS soware might be updated, the
content of this documentation will be subject to change without notice. In case any modi-
cations of this documentation occur, the updated version will be available on ASRock’s
website without further notice. If you require technical support related to this mother-
board, please visit our website for specic information about the model you are using. You
may nd the latest VGA cards and CPU support list on ASRock’s website as well. ASRock
website http://www.asrock.com.

6
English
1.2 Specications
Platform •Micro ATX Form Factor
•Solid Capacitor design
CPU •Supports 6th Generation Intel® CoreTM i7/i5/i3/Pentium®/
Celeron® Processors (Socket 1151)
•Supports CPU up to 65W
•Supports Intel® Turbo Boost 2.0 Technology
Chipset •Intel® H110
Memory •Dual Channel DDR3/DDR3L Memory Technology
•2 x DDR3/DDR3L DIMM Slots
•Supports DDR3/DDR3L 1866(OC)/1600/1333/1066 non-
ECC, un-buered memory
•Max. capacity of system memory: 32GB
•Supports Intel® Extreme Memory Prole (XMP) 1.3 / 1.2
Expansion
Slot
•1 x PCI Express 3.0 x16 Slot (PCIE2: x16 mode)*|
* Supports NVMe SSD as boot disks
•1 x PCI Express 2.0 x1 Slot
Graphics * Intel® HD Graphics Built-in Visuals and the VGA outputs can
be supported only with processors which are GPU integrated.
•Supports Intel® HD Graphics Built-in Visuals : Intel® Quick
Sync Video with AVC, MVC (S3D) and MPEG-2 Full
HW Encode1, Intel® InTruTM 3D, Intel® Clear Video HD
Technology, Intel® InsiderTM, Intel® HD Graphics 510/530
•Pixel Shader 5.0, DirectX 12
•Max. shared memory 1792MB
•Supports DVI-D with max. resolution up to 1920x1200 @
60Hz
•Supports Accelerated Media Codecs: HEVC, VP8, VP9
•Supports HDCP with DVI-D Port
•Supports Full HD 1080p Blu-ray (BD) playback with DVI-D
Port

7
English
H110M-DGS/D3
Audio •7.1 CH HD Audio (Realtek ALC887 Audio Codec)
* To congure 7.1 CH HD Audio, it is required to use an HD
front panel audio module and enable the multi-channel audio
feature through the audio driver.
•Supports Surge Protection (ASRock Full Spike Protection)
•ELNA Audio Caps
LAN •PCIE x1 Gigabit LAN 10/100/1000 Mb/s
•Realtek RTL8111GR
•Supports Wa ke- On-WAN
•Supports Wake-On-LAN
•Supports Lightning/ESD Protection (ASRock Full Spike
Protection)
•Supports LAN Cable Detection
•Supports Energy Ecient Ethernet 802.3az
•Supports PXE
Rear Panel
I/O
•1 x PS/2 Mouse/Keyboard Port
•1 x DVI-D Port
•4 x USB 2.0 Ports (Supports ESD Protection (ASRock Full
Spike Protection))*
* ACPI wake-up function is supported on USB01 ports only.
•2 x USB 3.0 Ports (Supports ESD Protection (ASRock Full
Spike Protection))
•1 x RJ-45 LAN Port with LED (ACT/LINK LED and SPEED
LED)
•HD Audio Jacks: Line in / Front Speaker / Microphone
Storage •4 x SATA3 6.0 Gb/s Connectors, support NCQ, AHCI and
Hot Plug
Connector •1 x TPM Header
•1 x Chassis Intrusion and Speaker Header
•1 x CPU Fan Connector (4-pin) (Smart Fan Speed Control)
•1 x Chassis Fan Connector (4-pin) (Smart Fan Speed Con-
trol)
•1 x 24 pin ATX Power Connector
•1 x 4 pin 12V Power Connector
•1 x Front Panel Audio Connector

8
English
Please realize that there is a certain risk involved with overclocking, including adjusting
the setting in the BIOS, applying Untied Overclocking Technology, or using third-party
overclocking tools. Overclocking may aect your system’s stability, or even cause damage to
the components and devices of your system. It should be done at your own risk and expense.
We are not responsible for possible damage caused by overclocking.
* For detailed product information, please visit our website: http://www.asrock.com
•1 x USB 2.0 Header (Supports 2 USB 2.0 ports) (Supports
ESD Protection (ASRock Full Spike Protection))
•1 x USB 3.0 Header (Supports 2 USB 3.0 ports) (Supports
ESD Protection (ASRock Full Spike Protection))
BIOS
Feature
•AMI UEFI Legal BIOS with multilingual GUI support
•ACPI 5.0 Compliant wake up events
•SMBIOS 2.7 Support
•CPU, GT_CPU, DRAM, PCH 1.0V, VCCIO, VCCSA Voltage
Multi-adjustment
Hardware
Monitor
•CPU/Chassis temperature sensing
•CPU/Chassis Fan Tachometer
•CPU/Chassis Quiet Fan (Auto adjust chassis fan speed by
CPU temperature)
•CPU/Chassis Fan multi-speed control
•CASE OPEN detection
•Voltage monitoring: +12V, +5V, +3.3V, CPU Vcore
OS •Microso® Windows® 10 64-bit / 8.1 64-bit / 7 32-bit / 7 64-
bit
* To install Windows® 7 OS, a modied installation disk with
xHCI drivers packed into the ISO le is required. Please refer to
page 50 for more detailed instructions.
* For the updated Windows® 10 driver, please visit ASRock’s
website for details: http://www.asrock.com
Certica-
tions
•FCC, CE, WHQL
•ErP/EuP ready (ErP/EuP ready power supply is required)

9
English
H110M-DGS/D3
2.5 Onboard Headers and Connectors
System Panel Header
(9-pin PANEL1)
(see p.1, No. 10)
Connect the power
switch, reset switch and
system status indicator on
the chassis to this header
according to the pin
assignments below. Note
the positive and negative
pins before connecting
the cables.
GND RESET#
PWRBTN#
PLED-
PLED+
GND
HDLED-
HDLED+
1
GND
PWRBTN (Power Switch):
Connect to the power switch on the chassis front panel. You may congure the way to turn
o your system using the power switch.
RESET (Reset Switch):
Connect to the reset switch on the chassis front panel. Press the reset switch to restart the
computer if the computer freezes and fails to perform a normal restart.
PLED (System Power LED):
Connect to the power status indicator on the chassis front panel. e LED is on when the
system is operating. e LED keeps blinking when the system is in S1/S3 sleep state. e
LED is o when the system is in S4 sleep state or powered o (S5).
HDLED (Hard Drive Activity LED):
Connect to the hard drive activity LED on the chassis front panel. e LED is on when the
hard drive is reading or writing data.
e front panel design may dier by chassis. A front panel module mainly consists of power
switch, reset switch, power LED, hard drive activity LED, speaker and etc. When connect-
ing your chassis front panel module to this header, make sure the wire assignments and the
pin assignments are matched correctly.
Onboard headers and connectors are NOT jumpers. Do NOT place jumper caps over these
headers and connectors. Placing jumper caps over the headers and connectors will cause
permanent damage to the motherboard.

10
English
Chassis Intrusion and
Speaker Header
(7-pin SPK_CI1)
(see p.1, No. 11)
Please connect the
chassis intrusion and the
chassis speaker to this
header.
Serial ATA3 Connectors
(SATA3_0)
(see p.1, No. 12)
(SATA3_1)
(see p.1, No. 13)
(SATA3_2)
(see p.1, No. 14)
(SATA3_3)
(see p.1, No. 15)
ese four SATA3
connectors support SATA
data cables for internal
storage devices with up to
6.0 Gb/s data transfer rate.
USB 2.0 Header
(9-pin USB4_5)
(see p.1, No. 8)
DUMMY
GNDGND
P+
P-
P+
P-
USB_PWR
USB_PWR
1
Besides four USB 2.0
ports on the I/O panel,
there is one header on this
motherboard. Each USB
2.0 header can support
two ports.
USB 3.0 Header
(19-pin USB3_3_4)
(see p.1, No. 6)
1
IntA_PB_D+
Dummy
IntA_PB_D-
GND
IntA_PB_SSTX+
GND
IntA_PB_SSTX-
IntA_PB_SSRX+
IntA_PB_SSRX-
VbusVbus
Vbus
IntA_PA_SSRX-
IntA_PA_SSRX+
GND
IntA_PA_SSTX-
IntA_PA_SSTX+
GND
IntA_PA_D-
IntA_PA_D+
Besides two USB 3.0 ports
on the I/O panel, there
is one header on this
motherboard. Each USB
3.0 header can support
two ports.
1+5V
DUMMYSIGNAL
GND DUMMY
SPEAKERDUMMY
SATA3_3 SATA3_1 SATA3_2 SATA3_0

13
H110M-DGS/D3
Deutsch
Technische Daten
Plattform •Micro-ATX-Formfaktor
•Feststoondensator-Design
Prozessor •Unterstützt die Prozessoren Intel® CoreTM i7/i5/i3/Pentium®/
Celeron® der 6. Generation (Sockel 1151)
•Unterstützt CPU bis 65 W
•Unterstützt Intel® Turbo Boost 2.0-Technologie
Chipsatz •Intel® H110
Speicher •Dualkanal-DDR3/DDR3L-Speichertechnologie
•2 x DDR3/DDR3L-DIMM-Steckplätze
•Unterstützt DDR3/DDR3L 1866(OC)/1600/1333/1066
non-ECC, ungepuerter Speicher
•Systemspeicher, max. Kapazität: 32GB
•Unterstützt Intel® Extreme Memory Prole (XMP) 1.3/1.2
Erweiter-
ungssteck-
platz
•1 x PCI-Express 3.0-x16-Steckplatz (PCIE2:x16-Modus)*|
* Unterstützt NVMe-SSD als Bootplatte
•1 x PCI-Express 2.0-x1-Steckplatz
Grak-
karte
* Integrierte Intel® HD Graphics-Visualisierung und VGA-
Ausgänge können nur mit Prozessoren unterstützt werden, die
GPU-integriert sind.
•Unterstützt integrierte Intel® HD Graphics-Visualisierung:
Intel® Quick Sync Video mit AVC, MVC (S3D) und MPEG-
2 Full HW Encode1, Intel® InTruTM 3D, Intel® Clear Video HD
Technology, Intel® InsiderTM, Intel® HD Graphics 510/530
•Pixel Shader 5.0, DirectX 12
•Max. geteilter Speicher: 1792 MB
•Unterstützt DVI-D mit maximaler Auösung von 1920 x 1200
bei 60 Hz
•Unterstützt beschleunigte Mediencodecs: HEVC, VP8, VP9
•Unterstützt HDCP mit DVI-D-Port
•Unterstützt Blu-ray- (BD) Wiedergabe (Full HD/1080p) mit
DVI-D-Port
Audio •7.1-Kanal-HD-Audio (Realtek ALC887-Audiocodec)
*Zur Konguration von 7.1-Kanal-HD-Audio müssen Sie ein HD-
Frontblenden-Audiomodul nutzen und den Mehrkanalton über den
Audiotreiber aktivieren.
•Unterstützt Überspannungsschutz (ASRock Full Spike Protection)
•ELNA-Audiokondensatoren

14
Deutsch
LAN •PCIE x1 Gigabit LAN 10/100/1000 Mb/s
•Realtek RTL8111GR
•Unterstützt Wake-On-WAN
•Unterstützt Wake-On-LAN
•Unterstützt Blitzschutz/Schutz gegen elektrostatische
Entladung (ASRock Full Spike Protection)
•Unterstützt LAN-Kabelerkennung
•Unterstützt energieezientes Ethernet 802.3az
•Unterstützt PXE
Rückblende,
E/A
•1 x PS/2-Maus-/Tastaturanschluss
•1 x DVI-D-Port
•4 x USB 2.0-Ports (unterstützt Schutz gegen elektrostatische
Entladung (ASRock Full Spike Protection))*
* ACPI-Weckfunktion wird nur an USB01-Ports unterstützt.
•2 x USB 3.0-Ports (unterstützt Schutz gegen elektrostatische
Entladung (ASRock Full Spike Protection))
•1 x RJ-45-LAN-Port mit LED (Aktivität/Verbindung-LED und
Geschwindigkeit-LED)
•HD-Audioanschlüsse: Line-in / Vorderer Lautsprecher /
Mikrofon
Speicher •4 x SATA-III-6,0-Gb/s-Anschlüsse, unterstützt NCQ, AHCI
und Hot-Plugging
Anschluss •1 x TPM-Stileiste
•1 x Gehäuseeingri- und Lautsprecher-Stileiste
•1 x CPU-Lüeranschluss (4-polig) (intelligente
Lüergeschwindigkeitssteuerung)
•1 x Gehäuselüeranschluss (4-polig) (intelligente
Lüergeschwindigkeitssteuerung)
•1 x 24-poliger ATX-Netzanschluss
•1 x 4-poliger 12-V-Netzanschluss
•1 x Audioanschluss an Frontblende
•1 x USB 2.0-Stileiste (unterstützt 2 USB 2.0-Ports) (unterstützt
Schutz gegen elektrostatische Entladung (ASRock Full Spike
Protection))
•1 x USB 3.0-Stileiste (unterstützt 2 USB 3.0-Ports) (unterstützt
Schutz gegen elektrostatische Entladung (ASRock Full Spike
Protection))

15
H110M-DGS/D3
Deutsch
Bitte beachten Sie, dass mit einer Übertaktung, zu der die Anpassung von BIOS-Einstellungen, die
Anwendung der Untied Overclocking Technology oder die Nutzung von Übertaktungswerkzeugen
von Drittanbietern zählen, bestimmte Risiken verbunden sind. Eine Übertaktung kann sich auf die
Stabilität Ihres Systems auswirken und sogar Komponenten und Geräte Ihres Systems beschädigen.
Sie sollte auf eigene Gefahr und eigene Kosten durchgeführt werden. Wir übernehmen keine
Verantwortung für mögliche Schäden, die durch eine Übertaktung verursacht wurden.
* Detaillierte Produktinformationen nden Sie auf unserer Webseite: http://www.asrock.com
BIOS-
Funktion
•AMI-UEFI-Legal-BIOS mit Unterstützung
mehrsprachiger grascher Benutzerschnittstellen
•ACPI 5.0-konforme Aufweckereignisse
•SMBIOS 2.7-Unterstützung
•CPU, GT_CPU, DRAM, PCH 1,0V, VCCIO, VCCSA
Mehrfachspannungsanpassung
Hard-
wareüber-
wachung
•CPU-/Gehäusetemperaturerkennung
•CPU-/Gehäuselüertachometer
•Lautloser CPU-/Gehäuselüer (automatische Anpassung der
Gehäuselüergeschwindigkeit durch CPU-Temperatur)
•CPU-/Gehäuselüer-Mehrfachgeschwindigkeitssteuerung
•Gehäuse-oen-Erkennung
•Spannungsüberwachung: +12 V, +5 V, +3,3 V, CPU Vcore
Betrieb-
ssystem
•Microso® Windows® 10, 64 Bit / 8.1, 64 Bit / 7, 32 Bit /
7, 64 Bit
* Zur Installation des Windows® 7-Betriebssystems wird ein
modiziertes Installationslaufwerk mit xHCI-Treibern in der
ISO-Datei benötigt. Detaillierte Anweisungen nden Sie auf
Seite 50.
* Einzelheiten zum aktualisierten Windows® 10-Treiber
entnehmen Sie bitte der ASRock-Webseite: http://www.asrock.com
Zerti-
zierungen
•FCC, CE, WHQL
•ErP/EuP ready (ErP/EuP ready-Netzteil erforderlich)

16
Français
Spécications
Plateforme •Facteur de forme Micro ATX
•Conception à condensateurs solides
Processeur •Prend en charge les processeurs 6e génération Intel® CoreTM i7/
i5/i3/Pentium®/Celeron® (Socket 1151)
•Prend en charge les unités centrales jusqu’à 65W
•Prend en charge la technologie Intel® Turbo Boost 2.0
Chipset •Intel® H110
Mémoire •Technologie mémoire double canal DDR3/DDR3L
•2 x fentes DIMM DDR3/DDR3L
•Prend en charge les mémoires sans tampon non ECC DDR3/
DDR3L 1866(OC)/1600/1333/1066
•Capacité max. de la mémoire système : 32Go
•Prend en charge Intel® Extreme Memory Prole (XMP) 1.3/1.2
Fente
d’expansion
•1 x fente PCI Express 3.0 x 16 (PCIE2:mode x16)*|
* Prend en charge les SSD NVMe comme disques de démarrage
•1 x fente PCI Express 2.0 x1
Graphiques * La technologie Intel® HD Graphics Built-in Visuals et les sorties
VGA sont uniquement prises en charge par les processeurs
intégrant un contrôleur graphique.
•Prend en charge la technologie Intel® HD Graphics Built-in
Visuals : Intel® Quick Sync Video avec AVC, MVC (S3D) et
MPEG-2 Full HW Encode1, Intel® InTruTM 3D, Intel® Clear
Video HD Technology, Intel® InsiderTM, Intel® HD Graphics
510/530
•Pixel Shader 5.0, DirectX 12
•Mémoire partagée max. 1792Mo
•Prend en charge le mode DVI-D avec une résolution maximale
de 1920x1200 @ 60Hz
•Prend en charge les codecs multimédias accélérés:
HEVC, VP8, VP9
•Prend en charge HDCP via port DVI-D
•Prend en charge la lecture Blu-ray (BD) Full HD 1080p via port
DVI-D

17
H110M-DGS/D3
Français
Audio •Audio 7.1 CH HD (Codec audio Realtek ALC887)
*Pour congurer l’audio 7.1 CH HD, il est nécessaire d’utiliser un
module audio HD pour panneau frontal et d’activer la fonction
audio multicanal via le pilote audio.
•Protection contre les surtensions (Protection complète contre
les pics ASRock)
•Capuchons ELNA Audio
Réseau •PCIE x1 Gigabit LAN 10/100/1000 Mo/s
•Realtek RTL8111GR
•Prend en charge la fonction Wake-On-WAN
•Prend en charge la fonction Wake-On-LAN
•Protection contre les orages/décharges électrostatiques
(Protection complète contre les pics ASRock)
•Prend en charge la détection de câble LAN
•Prend en charge la fonction d’économie d’énergie Ethernet
802.3az
•Prend en charge PXE
Connectique
du panneau
arrière
•1 x port souris/clavier PS/2
•1 x port DVI-D
•4 x ports USB 2.0 (Protection contre les décharges
électrostatiques (Protection complète contre les pics ASRock))*
* La fonction de réveil ACPI est uniquement prise en charge sur
les ports USB01.
•2 x ports USB 3.0 (Protection contre les décharges
électrostatiques (Protection complète contre les pics ASRock))
•1 x port RJ-45 LAN avec LED (LED ACT/LIEN et LED
VITESSE)
•Connecteurs jack audio HD : Entrée ligne / haut-parleur avant /
microphone
Stockage •4 x connecteurs SATA3 6,0 Gb/s, compatibles avec les fonctions
NCQ, AHCI et «Hot Plug»
Connecteur •1 x embase TPM
•1 x prise DEL d’alimentation et emplacement sur châssis
•1 x connecteur pour ventilateur de processeur (4 broches)
(contrôle de vitesse de ventilateur intelligent)
•1 x connecteur pour ventilateur de châssis (4 broches)
(contrôle de vitesse de ventilateur intelligent)
•1 x connecteur d’alimentation ATX 24 broches
•1 x connecteur d’alimentation 12V 4 broches
•1 x connecteur audio panneau frontal

18
Français
Il est important de signaler que l’overcloking présente certains risques, incluant des modica-
tions du BIOS, l’application d’une technologie d’overclocking déliée et l’utilisation d’outils
d’overclocking développés par des tiers. La stabilité de votre système peut être aectée par ces
pratiques, voire provoquer des dommages aux composants et aux périphériques du système.
L’overclocking se fait à vos risques et périls. Nous ne pourrons en aucun cas être tenus pour
responsables des dommages éventuels provoqués par l’overclocking.
* pour des informations détaillées de nos produits, veuillez visiter notre site: http://www.asrock.com
•1 x embase USB 2.0 (2 ports USB 2.0 pris en charge)
(Protection contre les décharges électrostatiques (Protection
complète contre les pics ASRock))
•1 x embase USB 3.0 (2 ports USB 3.0 pris en charge)
(Protection contre les décharges électrostatiques (Protection
complète contre les pics ASRock))
Caractéri-
stiques du
BIOS
•BIOS UEFI AMI avec prise en charge d’interface graphique
multilingue
•Compatible ACPI 5.0 Wake Up Events
•Compatible SMBIOS 2.7
•Réglage de la tension CPU, GT_CPU, DRAM, PCH 1,0V,
VCCIO, VCCSA
Surveillance
du matériel
•Détection de la température du processeur/châssis
•Tachéomètre ventilateur processeur/châssis
•Ventilateur silencieux processeur/châssis (réglage automatique
de la vitesse du ventilateur du châssis d’après la température du
processeur)
•Contrôle simultané des vitesses des ventilateurs processeur/
châssis
•Détection CHASSIS OUVERT
•Surveillance de la tension d’alimentation : +12V, +5V, +3,3V,
CPU Vcore
Système
d’exploitation
•Microso® Windows® 10 64 bits / 8.1 64 bits / 7 32 bits /
7 64 bits
* Pour installer Windows® 7, un disque d'installation modié avec
les pilotes xHCI intégrés au chier ISO est requis. Reportez-vous à
la page 50 pour des instructions plus détaillées.
* Pour le pilote mis à jour pour Windows® 10, veuillez visiter le site
Web d'ASRock pour plus de détails: http://www.asrock.com
Certications •FCC, CE, WHQL
•ErP/EuP Ready (alimentation ErP/EuP ready requise)

19
H110M-DGS/D3
Italiano
Speciche
Piattaforma •Fattore di forma Micro ATX
•Design condensatore solido
CPU •Supporta processori 6th Generation Intel® CoreTM i7/i5/i3/
Pentium®/Celeron® (Socket 1151)
•Supporto di CPU no a 65W
•Supporta la tecnologia Intel® Turbo Boost 2.0
Chipset •Intel® H110
Memoria •Tecnologia con memoria DDR3/DDR3L a doppio canale
•2 alloggi DIMM DDR3/DDR3L
•Supporta la memoria DDR3/DDR3L
1866(OC)/1600/1333/1066 non ECC, senza buer
•Capacità max. della memoria di sistema: 32 GB
•Supporta Intel® Extreme Memory Prole (XMP) 1.3 / 1.2
Alloggio
d’espansione
•1 x Alloggio PCI Express 3.0 x16 (PCIE2:modalità x16)*|
* Supporto di SSD NVMe come disco d’avvio
•1 alloggio PCI Express 2.0 x1
Graca *Le uscite Intel® HD Graphics Built-in Visualse VGA possono
essere supportate solo con processori dotati di GPU integrata.
•Supporta la videograca integrata della scheda video HD Intel®:
Intel® Quick Sync Video con AVC, MVC (S3D) e MPEG-2 Full
HW Encode1, Intel® InTruTM 3D, tecnologia Intel® Clear Video
HD, Intel® InsiderTM, Intel® HD Graphics 510/530
•Pixel Shader 5.0, DirectX 12
•Memoria condivisa max. 1792 MB
•Supporta DVI-D con una risoluzione max. no a 1920 x 1200 a
60 Hz
•Supporto accelerazione codec multimediale: HEVC, VP8, VP9
•Supporto di HDCP con le porte DVI-D
•Supporta Blu-ray (BD) Full HD 1080p, riproduzione con porte
DVI-D
Audio •Audio HD 7.1 CH (codec audio Realtek ALC887)
* Per congurare l’audio HD 7.1 canali, è necessario utilizzare un
modulo pannello frontale audio HD ed attivare la funzione audio
multicanale tramite il driver audio.
•Supporto protezione da sovratensione (protezione completa
ASRock dai picchi di corrente)
•Cappucci audio ELNA

20
Italiano
LAN •PCIE x 1 LAN Gigabit 10/100/1000 Mb/s
•Realtek RTL8111GR
•Supporta Wake-On-WAN
•Supporta Wake-On-LAN
•Supporto la protezione da fulmini/scariche elettrostatiche
(ESD) (protezione completa ASRock dai picchi di corrente)
•Supporta il rilevamento cavo LAN
•Supporta Energy Ecient Ethernet 802.3az
•Supporta PXE
I/O pannello
posteriore
•1 x porta mouse/tastiera PS/2
•1 x porta DVI-D
•4 x Porte USB 2.0 (supporto protezione da scariche
elettrostatiche (ESD) (protezione completa ASRock dai picchi
di corrente))*
* La funzione di attivazione ACPI è supportata solo sulle porte
USB01.
•2 x Porte USB 3.0 (supporto protezione da scariche
elettrostatiche (ESD) (protezione completa ASRock dai picchi
di corrente))
•1 x porta LAN RJ-45 con LED (ACT/LINK LED e SPEED
LED)
•Connettori audio HD: Ingresso linea / altoparlante frontale /
microfono
Archiviazione •4 x connettori SATA3 6,0 Gb/s supportano NCQ, AHCI e Hot
Plug
Connettore •1 x Collettore TMP
•1 x collegamento altoparlante e intrusione telaio
•1 x Connettore ventola CPU (4 pin) (Smart Fan Speed Control)
•1 x connettore ventola telaio (4 pin) (Smart Fan Speed Control)
•1 x connettore alimentazione ATX 24 pin
•1 x Connettore alimentazione 12V 4-pin
•1 x connettore audio pannello frontale1 x Collettore USB 2.0
(supporta 2 porte USB 2.0) (supporto protezione da scariche
elettrostatiche (ESD) (protezione
completa ASRock dai picchi di corrente))
•1 x Collettore USB 3.0 (supporta 2 porte USB 3.0) (supporto
protezione da scariche elettrostatiche (ESD) (protezione
completa ASRock dai picchi di corrente))

21
H110M-DGS/D3
Italiano
Prestare attenzione al potenziale rischio previsto nella pratica di overclocking, inclusa la
regolazione delle impostazioni nel BIOS, l'applicazione di tecnologia di Untied Overclocking o
l'utilizzo di strumenti di overclocking di terze parti. L'overclocking può inuenzare la stabilità
del sistema o perno provocare danni ai componenti e ai dispositivi del sistema. Occorre
eseguirlo a proprio rischio e spese. Non ci riterremo responsabili per possibili danni provocati da
overclocking.
* Per informazioni dettagliate sul prodotto, visitare il nostro sito Web: http://www.asrock.com
Funzionalità
BIOS
•AMI UEFI Legal BIOS con interfaccia di supporto multilingue
•Eventi di riattivazione conformi a ACPI 5.0
•Supporto di SMBIOS 2.7
•Regolazione variabile tensione CPU, GT_CPU, DRAM,
PCH 1,0V, VCCIO, VCCSA
Hardware
Monitor
•Rilevamento temperatura CPU/telaio
•Tachimetro ventola CPU/telaio
•Ventola silenziosa CPU/telaio (regolazione automatica velocità
in base alla temperatura della CPU)
•Ventola CPU/telaio con controllo di varie velocità
•Rilevamento CASE OPEN
•Monitoraggio tensione: +12 V, +5 V, +3,3 V, CPU Vcore
SO •Microso® Windows® 10 64-bit / 8.1 64-bit / 7 32-bit / 7 64-bit
* Per installare Windows® 7, è necessario un disco di installazione
modicato con i driver xHCI integrati nel le ISO. Fare
riferimento a pagina 50 per altre istruzioni dettagliate.
* Per il driver aggiornato di Windows® 10, visitare il sito ASRock
all’indirizzo: http://www.asrock.com
Certica-
zioni
•FCC, CE, WHQL
•ErP/EuP Ready (è necessaria alimentazione ErP/EuP ready)