Asus DSEB-D16 Series User manual

Motherboard
DSEB-D16
Series
DSEB-D16
DSEB-D16/SAS

ii
E3521
First Edition V1
December 2007
Copyright © 2007 ASUSTeK COMPUTER INC. All Rights Reserved.
No part of this manual, including the products and software described in it, may be reproduced, transmitted,
transcribed, stored in a retrieval system, or translated into any language in any form or by any means,
except documentation kept by the purchaser for backup purposes, without the express written permission
of ASUSTeK COMPUTER INC. (“ASUS”).
Product warranty or service will not be extended if: (1) the product is repaired, modied or altered, unless
such repair, modication of alteration is authorized in writing by ASUS; or (2) the serial number of the
product is defaced or missing.
ASUS PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS
OR IMPLIED, INCLUDING BUT NOT LIMITED TO THE IMPLIED WARRANTIES OR CONDITIONS OF
MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. IN NO EVENT SHALL ASUS, ITS
DIRECTORS, OFFICERS, EMPLOYEES OR AGENTS BE LIABLE FOR ANY INDIRECT, SPECIAL,
INCIDENTAL, OR CONSEQUENTIAL DAMAGES (INCLUDING DAMAGES FOR LOSS OF PROFITS,
LOSS OF BUSINESS, LOSS OF USE OR DATA, INTERRUPTION OF BUSINESS AND THE LIKE),
EVEN IF ASUS HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES ARISING FROM ANY
DEFECT OR ERROR IN THIS MANUAL OR PRODUCT.
SPECIFICATIONS AND INFORMATION CONTAINED IN THIS MANUAL ARE FURNISHED FOR
INFORMATIONAL USE ONLY, AND ARE SUBJECT TO CHANGE AT ANY TIME WITHOUT NOTICE, AND
SHOULD NOT BE CONSTRUED AS A COMMITMENT BY ASUS. ASUS ASSUMES NO RESPONSIBILITY
OR LIABILITY FOR ANY ERRORS OR INACCURACIES THAT MAY APPEAR IN THIS MANUAL,
INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT.
Products and corporate names appearing in this manual may or may not be registered trademarks or
copyrights of their respective companies, and are used only for identication or explanation and to the
owners’ benet, without intent to infringe.

iii
Contents
Notices........................................................................................................ vii
Safety information .................................................................................... viii
About this guide ......................................................................................... ix
Typography .................................................................................................. x
DSEB-D16 Series specications summary .............................................. xi
Chapter 1: Product introduction
1.1 Welcome! ...................................................................................... 1-1
1.2 Package contents......................................................................... 1-1
1.3 Serial number label...................................................................... 1-2
1.4 Special features............................................................................ 1-2
1.4.1 Product highlights ........................................................... 1-2
1.4.2 Innovative ASUS features ............................................... 1-4
Chapter 2: Hardware information
2.1 Before you proceed ..................................................................... 2-1
2.2 Motherboard overview................................................................. 2-3
2.2.1 Placement direction ........................................................ 2-3
2.2.2 Screw holes .................................................................... 2-3
2.2.3 Support kits for the motherboard .................................... 2-4
2.2.4 Motherboard layouts ....................................................... 2-7
2.2.5 Layout contents............................................................... 2-9
2.3 Central Processing Unit (CPU) ................................................. 2-11
2.3.1 Installing the CPU ..........................................................2-11
2.3.2 Installing the CPU heatsink and fan.............................. 2-14
2.4 System memory ......................................................................... 2-16
2.4.1 Overview ....................................................................... 2-16
2.4.2 Memory congurations.................................................. 2-16
2.4.3 Memory mirroring and sparing technology.................... 2-18
2.4.4 Installing a DIMM .......................................................... 2-24
2.4.5 Removing a DIMM ........................................................ 2-24
2.4.6 Installing the MemCool FB-DIMM fan (optional) ........... 2-25
2.4.7 Uninstalling the optional MemCool FB-DIMM fan........... 2-27
2.5 Expansion slots.......................................................................... 2-28
2.5.1 Installing an expansion card ......................................... 2-28
2.5.2 Conguring an expansion card ..................................... 2-28
2.5.3 Interrupt assignments ................................................... 2-29

iv
Contents
2.5.4 PCI Express 2.0 x16 slots (x16 link) ............................. 2-29
2.5.5 PCI Express x8 slot (x8 link) ......................................... 2-29
2.5.6 PCI-X slot (for ZCR slot;
DSEB-D16/SAS only )............ 2-30
2.5.7 SODIMM socket ........................................................... 2-31
2.6 Jumpers ...................................................................................... 2-32
2.7 Connectors ................................................................................. 2-37
2.7.1 Rear panel connectors.................................................. 2-37
2.7.2 Internal connectors ....................................................... 2-38
Chapter 3: Powering up
3.1 Starting up for the rst time........................................................ 3-1
3.2 Turning off the computer............................................................. 3-2
3.2.1 Using the OS shut down function.................................... 3-2
3.2.2 Using the dual function power switch.............................. 3-2
BIOS setup
4.1 Managing and updating your BIOS ............................................ 4-1
4.1.1 Creating a bootable oppy disk....................................... 4-1
4.1.2 AFUDOS utility................................................................ 4-2
4.1.3 ASUS CrashFree BIOS 3 utility ...................................... 4-5
4.2 BIOS setup program .................................................................... 4-6
4.2.1 BIOS menu screen.......................................................... 4-7
4.2.2 Menu bar......................................................................... 4-7
4.2.3 Navigation keys............................................................... 4-7
4.2.4 Menu items ..................................................................... 4-8
4.2.5 Sub-menu items.............................................................. 4-8
4.2.6 Conguration elds ......................................................... 4-8
4.2.7 Pop-up window ............................................................... 4-8
4.2.8 Scroll bar......................................................................... 4-8
4.2.9 General help ................................................................... 4-8
4.3 Main menu .................................................................................... 4-9
4.3.1 System Date [Day xx/xx/xxxx]......................................... 4-9
4.3.2 System Time [xx:xx:xx] ................................................... 4-9
4.3.3 Floppy A [1.44 MB 3½”]................................................... 4-9
4.3.4 IDE Conguration.......................................................... 4-10
4.3.5 Primary/Third/Fourth IDE Master/Slave .........................4-11
4.3.6 System Information ....................................................... 4-12

v
Contents
4.4 Advanced menu ......................................................................... 4-14
4.4.1 CPU Conguration........................................................ 4-14
4.4.2 Chipset Conguration ................................................... 4-16
4.4.3 PCI/PnP Conguration.................................................. 4-20
4.4.4 USB Conguration ........................................................ 4-22
4.4.5 Peripheral Conguration ............................................... 4-23
4.4.6 ACPI Conguration ....................................................... 4-24
4.4.7 Power On Conguration................................................ 4-25
4.4.8 Hardware Monitor ......................................................... 4-26
4.5 Server menu ............................................................................... 4-28
4.5.1 Remote Access Conguration....................................... 4-28
4.6 Security....................................................................................... 4-30
4.7 Boot menu .................................................................................. 4-32
4.7.1 Boot Device Priority ...................................................... 4-32
4.7.2 Boot Settings Conguration .......................................... 4-33
4.8 Exit menu .................................................................................... 4-34
Chapter 5: RAID conguration
5.1 Setting up RAID............................................................................ 5-1
5.1.1 RAID denitions .............................................................. 5-1
5.1.2 Installing hard disk drives................................................ 5-2
5.1.3 Setting the RAID item in BIOS ........................................ 5-2
5.1.4 RAID conguration utilities.............................................. 5-2
5.2 LSI Software RAID Conguration Utility .................................... 5-3
5.2.1 Creating a RAID 0 or RAID 1 set .................................... 5-4
5.2.2 Creating a RAID 10 set ................................................. 5-10
5.2.3 Adding or viewing a RAID conguration ....................... 5-14
5.2.4 Initializing the logical drives .......................................... 5-17
5.2.5 Rebuilding failed drives................................................. 5-22
5.2.6 Checking the drives for data consistency ..................... 5-24
5.2.7 Deleting a RAID conguration....................................... 5-27
5.2.8 Selecting the boot drive from a RAID set...................... 5-28
5.2.9 Enabling the WriteCache .............................................. 5-29
5.3 Intel®Matrix Storage Manager Option ROM Utility ................. 5-30
5.3.1 Creating a RAID 0 set (Stripe) ...................................... 5-31
5.3.2 Creating a RAID 1 set (Mirror) ...................................... 5-33
5.3.3 Creating a RAID 10 set (Stripe + Mirror)....................... 5-34

vi
Contents
5.3.4 Creating a RAID 5 set (Parity) ...................................... 5-35
5.3.5 Deleting a RAID set ...................................................... 5-36
5.3.6 Resetting disks to Non-RAID ........................................ 5-37
5.3.7 Exiting the Intel®Matrix Storage Manager .................... 5-37
5.4 Global Array Manager................................................................ 5-38
5.5 LSI Logic MPT Setup Utility (DSEB-D16/SAS model only)..... 5-39
5.5.1 Integrated Mirroring....................................................... 5-39
5.5.2 Integrated Mirroring Enhanced ..................................... 5-43
5.5.3 Integrated Striping (IS) volume ..................................... 5-45
5.5.4 Managing Arrays ........................................................... 5-48
5.5.5 Viewing SAS topology................................................... 5-53
5.5.6 Global Properties .......................................................... 5-55
Chapter 6: Driver installation
6.1 RAID driver installation ............................................................... 6-1
6.1.1 Creating a RAID driver disk ............................................ 6-1
6.1.2 Installing the RAID controller driver ................................ 6-6
6.2 Intel chipset software installation ............................................ 6-13
6.3 LAN driver installation............................................................... 6-16
6.3.1 Windows 2000/Server 2003.......................................... 6-16
6.3.2 Red Hat......................................................................... 6-21
6.4 VGA driver installation............................................................... 6-22
6.4.1 Windows®2000/Server 2003 ........................................ 6-22
6.5 Management applications and utilities installation ................ 6-24
6.5.1 Running the support CD ............................................... 6-24
6.5.2 Drivers menu................................................................. 6-24
6.5.3 Management Software menu........................................ 6-25
6.5.4 Utilities menu ................................................................ 6-25
6.5.5 Contact information....................................................... 6-25
Appendix: Reference information
A.1 DSEB-D16/SAS model block diagram........................................A-1
A.2 DSEB-D16 model block diagram ................................................A-2

vii
Notices
Federal Communications Commission Statement
This device complies with Part 15 of the FCC Rules. Operation is subject to the
following two conditions:
• This device may not cause harmful interference, and
• This device must accept any interference received including interference that
may cause undesired operation.
This equipment has been tested and found to comply with the limits for a
Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are
designed to provide reasonable protection against harmful interference in a
residential installation. This equipment generates, uses and can radiate radio
frequency energy and, if not installed and used in accordance with manufacturer’
s instructions, may cause harmful interference to radio communications. However,
there is no guarantee that interference will not occur in a particular installation. If
this equipment does cause harmful interference to radio or television reception,
which can be determined by turning the equipment off and on, the user is
encouraged to try to correct the interference by one or more of the following
measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment to an outlet on a circuit different from that to which the
receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.
Canadian Department of Communications Statement
This digital apparatus does not exceed the Class B limits for radio noise emissions
from digital apparatus set out in the Radio Interference Regulations of the
Canadian Department of Communications.
This class B digital apparatus complies with Canadian ICES-003.
The use of shielded cables for connection of the monitor to the graphics card is
required to assure compliance with FCC regulations. Changes or modications
to this unit not expressly approved by the party responsible for compliance could
void the user’s authority to operate this equipment.

viii
Safety information
Electrical safety
• To prevent electrical shock hazard, disconnect the power cable from the
electrical outlet before relocating the system.
• When adding or removing devices to or from the system, ensure that the
power cables for the devices are unplugged before the signal cables are
connected. If possible, disconnect all power cables from the existing system
before you add a device.
• Before connecting or removing signal cables from the motherboard, ensure
that all power cables are unplugged.
• Seek professional assistance before using an adapter or extension cord.
These devices could interrupt the grounding circuit.
• Make sure that your power supply is set to the correct voltage in your area.
If you are not sure about the voltage of the electrical outlet you are using,
contact your local power company.
• If the power supply is broken, do not try to x it by yourself. Contact a
qualied service technician or your retailer.
Operation safety
• Before installing the motherboard and adding devices on it, carefully read all
the manuals that came with the package.
• Before using the product, make sure all cables are correctly connected and the
power cables are not damaged. If you detect any damage, contact your dealer
immediately.
• To avoid short circuits, keep paper clips, screws, and staples away from
connectors, slots, sockets and circuitry.
• Avoid dust, humidity, and temperature extremes. Do not place the product in
any area where it may become wet.
• Place the product on a stable surface.
• If you encounter technical problems with the product, contact a qualied
service technician or your retailer.
This symbol of the crossed out wheeled bin indicates that the product (electrical,
electronic equipment, and mercury-containing button cell battery) should not
be placed in municipal waste. Check local regulations for disposal of electronic
products.

ix
About this guide
This user guide contains the information you need when installing and conguring
the motherboard.
How this guide is organized
This user guide contains the following parts:
• Chapter 1: Product introduction
This chapter describes the features of the motherboard and the new
technologies it supports.
• Chapter 2: Hardware information
This chapter lists the hardware setup procedures that you have to perform
when installing system components. It includes description of the switches,
jumpers, and connectors on the motherboard.
• Chapter 3: Powering up
This chapter describes the power up sequence and ways of shutting down
the system.
• Chapter 4: BIOS setup
This chapter tells how to change system settings through the BIOS Setup
menus. Detailed descriptions of the BIOS parameters are also provided.
• Chapter 5: RAID conguration
This chapter provides instructions for setting up, creating, and conguring
RAID sets using the available utilities.
• Chapter 6: Driver installation
This chapter provides instructions for installing the necessary drivers for
different system components.
• Appendix: Reference information
This appendix includes additional information that you may refer to when
conguring the motherboard.
Where to nd more information
Refer to the following sources for additional information and for product and
software updates.
1. ASUS websites
The ASUS website provides updated information on ASUS hardware and
software products. Refer to the ASUS contact information.
2. Optional documentation
Your product package may include optional documentation, such as warranty
yers, that may have been added by your dealer. These documents are not
part of the standard package.

x
Conventions used in this guide
To make sure that you perform certain tasks properly, take note of the following
symbols used throughout this manual.
Typography
Bold text Indicates a menu or an item to select.
Italics Used to emphasize a word or a phrase.
<Key> Keys enclosed in the less-than and greater-
than sign means that you must press the
enclosed key.
Example: <Enter> means that you must press
the Enter or Return key.
<Key1+Key2+Key3> If you must press two or more keys
simultaneously, the key names are linked with
a plus sign (+).
Example: <Ctrl+Alt+D>
Command Means that you must type the command
exactly as shown, then supply the required
item or value enclosed in brackets.
Example: At the DOS prompt, type the
command line: format A:/S
DANGER/WARNING: Information to prevent injury to yourself
when trying to complete a task.
CAUTION: Information to prevent damage to the components
when trying to complete a task.
NOTE: Tips and additional information to help you complete a
task.
IMPORTANT: Instructions that you MUST follow to complete a
task.

xi
DSEB-D16 Series specications summary
Model Name DSEB-D16/SAS DSEB-D16
Processor / System Bus 2 * Socket LGA771
Dual-Core Intel®Xeon®Processor 5000/5100/5200
Quad-Core Intel®Xeon®Processor 5300/5400
Sequence
FSB 1066/1333/1600MHz EM64T
2x2M, 4M, 6M, 8M & 12M L2 cache
Core Logic Intel®5400 Memory Controller Hub (MCH)
Intel®6321ESB I/O Controller Hub (ICH)
Form Factor SSI EEB 3.61, 12” x 13”
ASUS Features Smart Fan Smart Fan II. MemCool Support
Rack Ready (Rack
and Pedestal dual
use)
� �
ASWM2.0 � �
Memory Total Slots 16 (4-channel)
Capacity Maximum up to 128 GB
Memory Type Fully-Buffered DIMM DDR2 533/667/*800 Reg.
ECC
Memory Size 512 MB, 1 GB, 2 GB, 4 GB, (8 GB)
Expansion
Slots
(follow SSI
Location #)
Total PCI/PCI-X/
PCI-E Slots 5 5
Slot Location 1 1 * PCI-E X16 Gen2
Slot Location 2 1 * PCI-E x8 (x8 link)
Slot Location 3 1 * PCI-E X16 Gen2
Additional Slot 1 1 * PCIX
Additional Slot 2 1* SO-DIMM socket for optional ASMB3-SOL
Storage IDE Controller Intel®6321 ESB:
1 * IDE support UltraATA 33/ 66/ 100
SATA Controller
Intel®6321 ESB:
6 SATA2 300MB/s
ports
Intel®Matrix Storage
(for Windows only)
(Support RAID
Software 0, 1, 10 & 5)
Intel®6321 ESB:
6 SATA2 300MB/s
ports
Intel®Matrix Storage
(for Windows only)
(Support RAID
Software 0, 1, 10 & 5)
LSI®MegaRAID
(for Linux/Windows)
(Spport software RAID
0, 1 & 10)
*The FB-DIMM 800 MHz has to work with Intel®Xeon®5400 series CPU.

xii
DSEB-D16 Series specications summary
*Specications are subject to change without notice.
Storage SAS Controller LSI 1068 PCI-X 8-port
SAS controller:
LSI®Integrated RAID
0, 1, 1E support
Optional LSI®ZCR
(Zero-Channel-RAID)
PCI-X card:
(For upgrade to
support hardware
RAID 0, 1, 10, 5, 50)
--
Networking LAN Intel®6321+ Intel® 82563EB Dual Port GbE
Intel® 82573 GbE * 2
Graphic VGA XGI Z9s PCI Display Controller 32MB
Onboard I/O
Connectors
Floppy Connector 1 1
PSU Connector 24-pin ATX power connector + 8-pin ATX 12V
power connector + 4-pin ATX 12V power connector
Management
Connector SO-DIMM socket for ASMB3-SOL
USB Connectors 1 (support 2 USB ports)
Fan Header 10*4-Pin
SMBus 2 2
Chassis Intruder 1 1
Front LAN LED 2 2
Serial Port Header 1 1
Rear I/O
Connectors
External Serial
Port 1 1
External USB Port 2 2
VGA Port 1 1
RJ-45 4 4
RJ-45 for iKVM 1 1
PS/2 KB/Mouse 1 1
Management
Solution
Software ASWM2.0
Out of Band
Remote
Management
Optional (ASMB3-SOL/ASMB3-iKVM)
Monitoring CPU Temperature � �
FAN RPM � �
Environment Operation temperature: 10℃ ~ 35℃
Non operation temperature: -40℃ ~ 70℃
Non operation humidity: 20% ~ 90% ( Non
condensing)

1
Product
introduction
This chapter describes the motherboard
features and the new technologies it supports.

ASUS DSEB-D16 Series
Chapter summary 1
1.1 Welcome! ...................................................................................... 1-1
1.2 Package contents......................................................................... 1-1
1.3 Serial number label...................................................................... 1-2
1.4 Special features............................................................................ 1-2

ASUS DSEB-D16 Series 1-1
1.1 Welcome!
Thank you for buying an ASUS®DSEB-D16 series motherboard!
The motherboard delivers a host of new features and latest technologies, making it
another standout in the long line of ASUS quality motherboards!
Before you start installing the motherboard, and hardware devices on it, check the
items in your package with the list below.
1.2 Package contents
Check your motherboard package for the following items.
If any of the above items is damaged or missing, contact your retailer.
Retail Pack Bulk Pack
DSEB-D16/
SAS DSEB-D16 DSEB-D16/ SAS DSEB-D16
Cables
SATA signal cable 6 6 -- --
SATA power cable 3 3 -- --
Mini SAS to SATA
cable 2 -- -- --
2-in-1 cable set
(IDE + FDD cable) 1 1 -- --
Accessories
IO shield 1 1 1 1
CEK spring 2 2 2 2
ZCR Mylar 1 -- 1 --
ZCR Riser Card
for 1U 1 -- 1 --
ZCR holder for 1U
with screws 1 -- 1 --
ZCR holder for 2U
and above with
screws
1 -- 1 --
Application CD Support CD 1 1 1 1
Documentation User Guide 1 1 1 1
Packing Qty. 3pcs per
carton
3pcs per
carton
10pcs per
carton
10pcs per
carton

1-2 Chapter 1: Product introduction
1.4 Special features
1.4.1 Product highlights
Latest processor technology
The motherboard comes with two LGA-771 sockets that support Dual-Core
Intel® Xeon™ processors with 1600/1333/1066 MHz Front Side Bus (FSB).
Dual-core processors contain two physical CPU cores to meet demands for
more powerful processing. Intel®Xeon™ processors incorporate the Intel®
Hyper-Threading Technology and Extended Memory 64-bit Technology (EM64T).
The EM64T enables the support for 64-bit operation system, such as 64-bit
Windows®and Linux.
Intel® 5400 and Intel®6321ESB chipset
The Intel®5400 Memory Controller Hub (MCH) and the Intel®6321ESB provide the
vital interfaces for the motherboard.
The MCH provides the processor, quadri-channel FB-DIMM memory support, and
PCI Express interfaces. The Intel®6321ESB is a new generation server class I/O
controller hub that provides the interface for PCI 2.3, PCI Express, and PCIX.
Intel®EM64T
The motherboard supports Intel®processors with the Intel®EM64T (Extended
Memory 64 Technology). The Intel®EM64T feature allows your computer to run on
64-bit operating systems and access larger amounts of system memory for faster
and more efcient computing.
Enhanced Intel SpeedStep®Technology (EIST)
The Enhanced Intel SpeedStep®Technology (EIST) intelligently manages the
CPU resources by automatically adjusting the CPU voltage and core frequency
depending on the CPU loading and system speed or power requirement.
1.3 Serial number label
Before requesting support from the ASUS Technical Support team, you must take
note of the motherboard's serial number containing 12 characters xxM0Axxxxxxx
shown as the gure below. With the correct serial number of the product, ASUS
Technical Support team members can then offer a quicker and satisfying solution
to your problems.
xxM0Axxxxxxx
DSEB-D16 Made
in
China
合格

ASUS DSEB-D16 Series 1-3
FB-DIMM memory support
This motherboard supports fully buffered DIMMs (FB-DIMMs), the latest memory
solution that extends memory capacity and provide high-speed, high-density
system memory peformance. FB-DIMMs use Advanced Memory Buffer (AMB)
chips that transmit signals between the memory modules and controllers with
improved signal integrity and reduced errors.
PCIe 2.0
This motherboard supports the latest PCIe 2.0 device for twice the current speed
and bandwidth. This enhances system performance while still providing backward
compatibility to PCIe 1.0 devices.
Serial Attached SCSI (SAS) technology support
(DSEB-D16/SAS model only)
SAS is the latest storage interface for enterprise-class storage devices. Building
on and improving the parallel SCSI foundation, SAS is the new industry standard
that includes Serial ATA interoperability, and is projected to be the succesor of the
Ultra320 SCSI technology.
Zero-Channel RAID (ZCR) solution
(DSEB-D16/SAS model only)
The motherboard comes with a ZCR socket for an optional Zero-Channel RAID
card, allowing RAID 0 (striping), RAID 1 (mirroring), RAID 10, and RAID 5
congurations. The ZCR capability provides a cost-effective high-performance and
added reliability.
82563/82573 LAN solution
The motherboard comes with a dual-port 82563EB network connection and
two single-port 82573 L network connection to provide a total solution for your
networking needs. See page 2-33 for the location of the LAN ports. See section 2.6
Jumpers for details on Gigabit LAN settings.
Serial ATA II technology
The motherboard supports the Serial ATA II 3 Gb/s technology through 6321ESB
Serial ATA interfaces. The Serial ATA II specication provides twice the bandwidth
of the current Serial ATA products with a host of new features, including Native
Command Queuing (NCQ), Power Management (PM) Implementation Algorithm,
and Hot Swap. Serial ATA allows thinner, more exible cables with lower pin count
and reduced voltage requirements.

1-4 Chapter 1: Product introduction
USB 2.0 technology
The motherboard implements the Universal Serial Bus (USB) 2.0 specication,
dramatically increasing the connection speed from the 12 Mbps bandwidth on USB
1.1 to a fast 480 Mbps on USB 2.0. USB 2.0 is backward compatible with USB 1.1.
Temperature, fan, and voltage monitoring
The CPU temperature is monitored by the W83793G chip to prevent overheating
and damage. The system fan rotations per minute (RPM) is monitored for timely
failure detection. The chip monitors the voltage levels to ensure stable supply of
current for critical components.
Intel®IOAT2
Intel®I/O Acceleration Technology (IOAT) is an integrated server platform I/O
solution that addresses all segments of the server I/O bottleneck problem using
TCP/IP without requiring any modication of existing or future applications.
Intel® IOAT is a system-wide solution that increases CPU efciency and delivers
data to/from applications faster than current server platforms.
All High-quality Conductive Polymer Capacitors
This motherboard uses all high-quality conductive polymer capacitors onboard for
durability, improved lifespan, and enhanced thermal capacity.
90% + Power Efciency
Compared with the non-green design platform, ASUS's new green motherboard
design helps improve power efciency to 90%. The motherboard, with less power
comsumption loss, saves you more watts and more money.
1.4.2 Innovative ASUS features
ASUS Smart Fan technology
The ASUS Smart Fan technology smartly adjusts the fan speeds according to the
system loading to ensure quiet, cool, and efcient operation.

2
Hardware
information
This chapter lists the hardware setup
procedures that you have to perform
when installing system components. It
includes description of the jumpers and
connectors on the motherboard.

ASUS DSEB-D16 Series
Chapter summary 2
2.1 Before you proceed ..................................................................... 2-1
2.2 Motherboard overview................................................................. 2-3
2.3 Central Processing Unit (CPU) ................................................. 2-11
2.4 System memory ......................................................................... 2-16
2.5 Expansion slots.......................................................................... 2-28
2.6 Jumpers ...................................................................................... 2-32
2.7 Connectors ................................................................................. 2-37