BroadLink ML3362T-P User manual

YUECHUANGKONGJIAN
Features
Support IEEE802.11 b/g/n standards
Support WEP, WPA and WPA2 encryption
Support UART/PWM/ADC/GPIO/I2C
interfaces
Support STA/AP/AP+STA modes
Support SmartConfig
Support TLS/SSL protocols
Support PCB antenna
3.3V power supply
Wi-Fi related features
Support 802.11 b/g/n with 20M
and 40M bandwidth
Support station and soft AP
Support SmartConfig and AP
configuration
Integrated balun/PA/LNA
TCP/IP stack optimized for IoT
application
PCB antenna
Peripheral
2x UART
1x I2C
1x SPI
4x PWM
Up to 14GPIOs
Working temperature: -10℃to +105℃
Stamp style SMD for surface mounting
production
Applications
Smart transportation
Smart home / appliances
Instruments
Health care
Industrial automation
Intelligent security
Smart energy
Models
Model
Antenna type
Note
ML3362T-P
PCB antenna
Default
Version:RGBCW-US3335 Release date:Sep. 12,
2020
ML3362T-P
Embedded
Wi-Fi Module
Product
Manual

- 2 -
Content
1. Overview............................................................................................................................ - 3 -
2. Basic Specifications............................................................................................................ - 3 -
2.1. Power Consumption................................................................................................... - 3 -
2.2. Working Environment ................................................................................................ - 4 -
3. Radio Specifications........................................................................................................... - 4 -
3.1. Basic Radio Specification ............................................................................................ - 4 -
3.2. Radio Performance..................................................................................................... - 5 -
3.2.1. IEEE 802.11b ........................................................................................................ - 5 -
3.2.2. IEEE 802.11g ........................................................................................................ - 5 -
3.2.3 IEEE802.11n.......................................................................................................... - 6 -
4. ML3362T-P Hardware Information ................................................................................... - 8 -
4.1. Footprint Sequence .................................................................................................... - 8 -
4.2. Footprint Definitions .................................................................................................. - 9 -
4.3. PCB Antenna............................................................................................................. - 10 -
4.4. Mechanical Dimensions............................................................................................ - 12 -
4.5. Recommended Pad Size ........................................................................................... - 13 -
5. Reference Design............................................................................................................. - 14 -
5.1. UART Interface Design.............................................................................................. - 14 -
5.2. Power Supply Requirement...................................................................................... - 15 -
Revision History................................................................................................................... - 16 -
Copyrights............................................................................................................................ - 16 -
Contact Us ........................................................................................................................... - 16 -

- 3 -
1. Overview
ML3362T-P is a cost-effective embedded Wi-Fi module designed by BroadLink, which supports
802.11 b/g/n standards and UART communication with other devices. The module integrates
radio transceiver, MAC, baseband, all Wi-Fi protocols, configurations and network stack. It can be
widely used in applications like smart home devices, remote monitoring devices and medical care
instruments.
The module integrates an ARM Cortex-M4 processor speed up to 160MHz with 352KB SRAM
and 1MB flash.
2. Basic Specifications
2.1. Power Consumption
Please refer to Table 1 for power consumption data.
Table 1 ML3362T-P Power Consumption Data
Specifications
Min.
Typ.
Max.
Units
VDD1
3.3
4
V
VIL(input low voltage)
0
0.3VDD
V
VIH(input high voltage)
0.7VDD
VDD
V
VOL(output low voltage)
0
V
VOH(output high voltage)
VDD
V
Io
10
mA
Standby (SP mini)
80
85
mA
pulse current @TX
11b @17dBm 11Mbps
305
mA
pulse current @TX
11g @15dBm 54Mbps
250
mA
pulse current @TX
11n @14dBm 65Mbps
225
mA
Networking
305
mA
Note: Make sure VDD is not lower than 3.3V

- 4 -
2.2. Working Environment
Please refer to Table 2 for working environment data.
Table 2 BL3363T-P Working Environment Data
Symbol
Description
Min.
Max.
Units
Ts
Storage temperature
-40
125
℃
TA
Ambient operating temperature
-10
105
℃
Vdd
Supply voltage
3.3
4
V
Vio
Voltage on IO pin
0
VDD
V
ESD
HBM
1000
2000
V
3. Radio Specifications
3.1. Basic Radio Specification
Please refer to Table 3 for radio specification.
Table 3 ML3362T-P Radio Specification
Radio range
2.412 GHz - 2.462 GHz
Wireless standards
IEEE 802.11 b/g/n
Radio output
802.11b :17dBm ± 1dBm
802.11g :14dBm ± 1dBm
802.11n :14dBm ± 1dBm
Antenna type
Internal: PCB antenna
External: Not supported
Receiving sensitivity
802.11b<-83dBm@11Mbps
802.11g<-72dBm@54Mbps
802.11n<-71dBm@MCS7
Stack
IPv4, TCP/UDP/FTP/HTTP/HTTPS/TLS/mDNS
Data rate (max)
Security
Encryption standard:
Open/WEP-Open/WPA/WPA2
Encryption algorithm:
WEP64/WEP128/TKIP/AES
Network types
STA/AP/STA+AP/WIFI Direct

- 5 -
3.2. Radio Performance
3.2.1. IEEE 802.11b
Table 4 Basic specifications under IEEE802.11b
ITEM
Specification
Modulation Type
DSSS / CCK
Frequency range
2412MHz~2462MHz
Channel
CH1 to CH11
Data rate
1, 2, 5.5, 11Mbps
Table 5 Transmitting performance under IEEE802.11b
TX Characteristics
Min.
Typical
Max.
Unit
Power@11Mbps
17
dBm
Frequency Error
-10
+10
ppm
EVM@11Mbps
-20
dB
Transmit spectrum mask
Pass
Table 6 Receiving performance under IEEE802.11b
RX Characteristics
Min
.
Typical
Max.
Unit
Minimum Input Level Sensitivity
11Mbps (FER≦8%)
-83
dBm
Maximum Input Level (FER≦8%)
-3
dBm
3.2.2. IEEE 802.11g
Table 7 Basic specifications under IEEE802.11g
ITEM
Specification
Modulation Type
OFDM
Frequency range
2412MHz~2462MHz

- 6 -
Channel
CH1 to CH11
Data rate
6, 9, 12, 18, 24, 36, 48, 54Mbps
Table 8 Transmitting performance under IEEE802.11g
TX Characteristics
Min.
Typical
Max.
Unit
Power@54Mbps
14
dBm
Frequency Error
-10
+10
ppm
EVM@54Mbps
-30
-29
dB
Transmit spectrum mask
Pass
Table 9 Receiving performance under IEEE802.11g
RX Characteristics
Min.
Typical
Max.
Unit
Minimum Input Level Sensitivity
54Mbps
-71
dBm
Maximum Input Level
(FER≦10%)
-8
dBm
3.2.3 IEEE802.11n
IEEE802.11n 20MHz bandwidth mode
Table 10 Basic specifications under IEEE802.11n with 20MHz
ITEM
Specification
Modulation Type
OFDM
Frequency range
2412MHz~2462MHz
Channel
CH1 to CH11
Data rate
MCS0/1/2/3/4/5/6/7

- 7 -
Table 11 Transmitting performance under IEEE802.11n with 20MHz
TX Characteristics
Min.
Typical
Max.
Unit
Power@HT20, MCS7
14
dBm
Frequency Error
-10
+10
ppm
EVM@HT20, MCS7
-29
dB
Transmit spectrum mask
Pass
Table 12 Receiving performance under IEEE802.11n with 20MHz
RX Characteristics
Min.
Typical
Max.
Unit
Minimum Input Level Sensitivity
MCS7
-69
dBm
Maximum Input Level
(FER≦10%)
-8
dBm
IEEE802.11n 40MHz bandwidth mode
Table 13 Basic specifications under IEEE802.11n with 40MHz
ITEM
Specification
Modulation Type
OFDM
Frequency range
2422MHz~2452MHz
Channel
CH3 to CH9
Data rate
MCS0/1/2/3/4/5/6/7
Table 14 Transmitting performance under IEEE802.11n with 40MHz
TX Characteristics
Min.
Typical
Max.
Unit
Power@HT40, MCS7
14
dBm
Frequency Error
-10
+10
ppm
EVM@HT40, MCS7
-33
dB
Transmit spectrum mask
Pass

- 8 -
Table 15 Receiving performance under IEEE802.11n with 40MHz
RX Characteristics
Min.
Typical
Max.
Unit
Minimum Input Level Sensitivity
MCS7
-68
dBm
Maximum Input Level
(FER≦10%)
-8
dBm
4. ML3362T-P Hardware Information
4.1. Footprint Sequence
Please refer to Fig 1 for the footprint sequence of ML3362T-P.
Fig 1 ML3362T-P Footprint sequence

- 9 -
4.2. Footprint Definitions
Please refer to Table 16 for the footprint definitions of ML3362T-P.
Table 16 ML3362T-P footprint definitions
pin
Function
1
Function
2
Function
3
Function
4
Function
5
Default
state
1
GPIO2
TX2
UP
2
GPIO1
RX2
I2C_SDA
UP
3
GPIO3
I2C_SCK
UP
4
GPIO12
SPI_MOSI
DOWN
5
GPIO13
SPI_MISO
PWM1
DOWN
6
GPIO25
PWM3
DOWN
7
GPIO0
PWM2
DOWN
8
VDD
9
GND
10
PDN
11
GPADC
GPIO6
DOWN
12
GPIO7
DOWN
13
GPIO8
PWM0
DOWN
14
GPIO5
SPI_CS
DOWN
15
GPIO4
SPI_CLK
DOWN
16
RX0
GPIO_26
DOWN

- 10 -
17
TX0
GPIO_27
DOWN
18
GND
Note:
1. In default, UART2 (pin1 and pin2) are used for bypass communication and UART0
(pin16 and pin17) are used for output of debugging information and burning firmware. Please
refer to the description in DC Characteristics for UART output current level.
2. PDN is hardware reset for the module and will be effective with VIL. Configuration
information will be remained after module reset. The module has pull-up process for PDN
designed internally.
3. In default, PIN13 (GPIO8) is the PIN for external LED indicator to show the module
configuration status and output VIH after configuration is successful.
4. In default, PIN14 (GPIO5) is the module software reset PIN and will be effective with
VIH. The previous configuration information will be cleared after the module is reset (reset to
factory settings).
5. The module supports max 4 channels of external interruption simultaneously except
GPIO25 and UART0.
6. The ADC is 10bit with input voltage 0-2V
7. The power supply VDD should not be lower than 3.3V.
4.3. PCB Antenna
Please refer to Fig 2 for PCB antenna. Please avoid to place any electrical components,
wiring or grounding under PCB antenna area on main board and it’s better to leave this area
blank on PCB.

- 11 -
Fig 2 BL3335-PAntenna
The gain of PCB antenna on this module is about 0dB, as shown in Fig Fig 3.
Fig 3 Simulated radiation pattern of antenna gain
The following precautions should be considered during designing with PCB antenna:
1. Do not place any electrical components or grounding in antenna area on main board and
it’s better to leave this area blank on PCB.
2. It is recommended to not place any electrical components within 30mm range of module

- 12 -
antenna and not design any circuit or bond copper on main board under this area.
3. Do not use the module inside any metal case or containers with metal painting.
4. Keep the antenna of wifi module next to the edge of main board during design of PCB to
ensure better performance of antenna, as illustrated below.
Fig 4 BL3335-P Recommended PCB layout
4.4. Mechanical Dimensions
Please refer to Fig Fig 5 for the dimensions of BL3335-P module.
Module
Device PCB

- 13 -
Fig 5 BL3335-P Dimensions
a.Note: Dimensions (13.3±0.2) mm * (21±0.2) mm * (2.6±0.2)mm (with shielding case)
4.5. Recommended Pad Size
Please refer to Fig Fig 6 for the recommended pad size of BL3335-P module.
Fig 6 BL3335-P Recommended pad size
Unit: mm

- 14 -
5. Reference Design
5.1. UART Interface Design
For devices with 3.3V power supply, you can directly connect the device UART port with
module UART port according to the illustration in Fig Fig 7.
Fig 7 Circuit diagram (3.3V)
If your device is powered by 5V, you can refer to the circuit shown in Fig Fig 8 or design your
own circuit for power conversion. The value of resistor can be adjusted according to actual circuit
design.
Wi-Fi
module
External
MCU
Capacitor
Grounding

- 15 -
Fig 8 Circuit diagram (5V)
5.2. Power Supply Requirement
If an LDO is used to supply the module with 3.3V power, C1 capacitor can be considered to
be used with 10u-22u; If a DCDC is used to supply 3.3V power, C1 capacitor can be considered to
be used with 22uF.
It is recommended to supply the module with power higher than 400mA to ensure enough
power supply to the module and avoid power down during data transmission.

- 16 -
Revision History
Date
Version
Updated Content
2018-05-24
1.0
Preliminary version
2020-02-19
1.1
Copyrights
It is prohibited to use or copy all or any part of contents in this manual without
prior permission, especially applicable for trademarks, models, part numbers and
figures.
Contact Us
Ms Wu
SHENZHEN YUECHUANGKONGJIAN TECHNOLOGY CO.,LTD
Add: Room 1401, Sangtai building, Lishan Road, Taoyuan Street, Nanshan District,
Shenzhen
Postcode: 310052
Tel: +86 18938933720
Email:amy.wu@lemaker.com
----------------------------------------------------------------------------------------
For more information of YUECHUANGKONGJIAN Wi-Fi modules, please visit our

- 17 -
website: http://www.lemaker.org/
2.2 List of applicable FCC rules
FCC Part 15.247
2.6 RF exposure considerations
This equipment complies with the FCC RF radiation exposure limits set forth for an
uncontrolled environment. This equipment should be installed and operated with a
minimum distance of 20cm between the radiator and any part of your body.
2.8 Label and compliance information
Remind end customers to FCC ID label on the final system must be labeled with
“Contains FCC ID: 2AXPC-ML3362T-P” or “Contains transmitter module FCC ID:
2AXPC-ML3362T-P”.
2.9 Information on test modes and additional testing requirements
Contact SHENZHEN YUECHUANGKONGJIAN TECHNOLOGY CO.,LTD will provide
stand-alone modular transmitter test mode. Additional testing and certification may
be necessary when multiple modules are used in a host.
2.10 Additional testing, Part 15 Subpart B disclaimer
To ensure compliance with all non-transmitter functions the host manufacturer is
responsible for ensuring compliance with the module(s) installed and fully
operational. For example, if a host was previously authorized as an unintentional
radiator under the Supplier’s Declaration of Conformity procedure without a
transmitter certified module and a module is added, the host manufacturer is
responsible for ensuring that the after the module is installed and operational the
host continues to be compliant with the Part 15B unintentional radiator
requirements. Since this may depend on the details of how the module is integrated
with the host, SHENZHEN YUECHUANGKONGJIAN TECHNOLOGY CO.,LTD shall
provide guidance to the host manufacturer for compliance with the Part 15B
requirements.
FCC Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an
uncontrolled environment. End users must follow the specific operating instructions
for satisfying RF exposure compliance.
This module certified that complies with RF exposure requirement under mobile or
fixed condition, this module is to be installed only in mobile or fixed applications. A
separate approval is required for all other operating configurations, including

- 18 -
portable configurations with respect to Part 2.1093 and difference antenna
configurations.
This transmitter must not be co-located or operating in conjunction with any other
antenna or transmitter.
FCC Warning
This device complies with Part 15 of the FCC Rules. Operation is subject to the
following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept
any interference received, including interference that may cause undesired
operation.
NOTE 1: This product has been tested and found to comply with the limits for a Class
B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to
provide reasonable protection against harmful interference in a residential
installation. This product generates, uses, and can radiate radio frequency energy
and, if not installed and used in accordance with the instructions, may cause
harmful interference to radio communications. However, there is no guarantee that
interference will not occur in a particular installation. If this product does cause
harmful interference to radio or television reception, which can be determined by
turning the equipment off and on, the user is encouraged to try to correct the
interference by one or more of the following measures:
—Reorient or relocate the receiving antenna.
—Increase the separation between the equipment and receiver.
—Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected.
—Consult the dealer or an experienced radio/TV technician for help.
NOTE 2: Any changes or modifications to this unit not expressly approved by the
party responsible for compliance could void the user's authority to operate the
equipment.
NOTE 3: Any modifications made to the module will void the Grant of Certification,
this module is limited to OEM installation only and must not be sold to end-users,
end-user has no manual instructions to remove or install the device, only software
or operating procedure shall be placed in the end-user operating manual of final
products.
NOTE 4: The module may be operated only with the antenna with which it is

- 19 -
authorized. Any antenna that is of the same type and of equal or less directional
gain as an antenna that is authorized with the intentional radiator may be marketed
with, and used with, that intentional radiator.
NOTE 5: For all products market in US, OEM has to limit the operation channels to
CH1 to CH11 for 802.11b/g/n-HT20 and CH3 to CH9 for 802.11n-HT40 by supplied
firmware programming tool. OEM shall not supply any tool or info to the end-user
regarding to Regulatory Domain change.
Table of contents
Other BroadLink Wireless Router manuals
Popular Wireless Router manuals by other brands

TP-Link
TP-Link TL-WR810N user guide

NETGEAR
NETGEAR DGND3700v2 Podręcznik Instalacji

Ecox
Ecox WF01 user manual

CONN-X
CONN-X SAGEMCOM FAST 1704W installation guide

Linksys
Linksys WRVS4400N - Small Business Wireless-N Gigabit Security... user guide

ZyXEL Communications
ZyXEL Communications P-2612HNU-Fx Series Support notes