Congatec X945 User manual

XTX™

conga-X945 and conga-XA945

Intel® Atom™ N270, Intel® Core™ 2 Duo, Intel® Core™ Duo

and Celeron M processors with an Intel® 94 chipset

User's Guide

Revision 1.3

Revision History

Revision Date (dd.mm.yy) Author hanges

0.1 02.06.06 GDA Preliminary release

0.2 23.06.06 GDA Updated order table, specification table, and BI S section. Added BI S

Setup Data Backup overview section 5.3.1. Added Performance Control

information to section 6.4. Added ACPI resume events table to section 6.6.

1.0 14.11.06 GDA fficial Release.

Added section 1.4.1 Supply Voltage Ripple and sections 1.5.2, 1.5.4

power consumption tables. Updated section 1.6 Supply Voltage Battery

Power, section 1.7 Environmental Specifications, section 3.1 Heatspreader

Dimensions diagram, section 5.3.1 BI S Setup Data Backup verview

diagram. Added Power Consumption Graph for Intel® Core™ Duo U2500

ULV 1.2GHz variant and description for PP_TPM pin 60 on X2 connector.

Updated complete BI S Setup Description section.

1.1 13.02.07 GDA Added Electrostatic Sensitive Device information. Added Intel® Core™ 2

Duo L7400 1.5GHz variant to document. Removed processor core voltage

values from power consumption tables. Added caution statement to

section 3 Heatspreader.

1.2 23.08.07 GDA Changed all references of 82945GM to 82945GME. Replaced Intel®

Core™ Duo U2500 variant with Intel® Core™ Duo U7500. U2500 is no

longer available as a standard variant. Added information about center

mounting hole to 'Caution' statement in section 3 Heatspreader. Added

information to 'Caution' statement in section 4.1.4 nboard Generated

Supply Voltage. Added information to section 4.2.4 PCI Express about x4

mode. Added note about floppy cable to section 4.3.6 Parallel Port/Floppy

Interface. Added section 5.7 'congatec Battery Management Interface'.

Updated section 8 System Resources and section 9 BI S Setup

Description.

1.3 02.07.09 GDA Added conga-XA945 variant to user's guide. Improved section 1.4.1 and

added section 1.4.2. Corrected name of SMB Alert signal in the 'ACPI

Suspend and Resume Events' table in section 6.5. Was SMBALERT# but

should be SMBALRT#. Added 'Note' to section 7 'Signal Descriptions and

Pinout Tables'. Updated section 9, 'BI S Setup Description'.

Preface

This user's guide provides information about the components, features, connectors and

BI S Setup menus available on the conga-X945/XA945. It is one of four documents

that should be referred to when designing an XTX™ application. The other reference

documents that should be used include the following:

XTX™ Design Guide

XTX™ Specification

ETX® Design Guide

The links to these documents can be found on the congatec AG website at

www.congatec.com

Disclaimer

The information contained within this user's guide, including but not limited to any

product specification, is subject to change without notice.

congatec AG provides no warranty with regard to this user's guide or any other

information contained herein and hereby expressly disclaims any implied warranties of

merchantability or fitness for any particular purpose with regard to any of the foregoing.

congatec AG assumes no liability for any damages incurred directly or indirectly from

any technical or typographical errors or omissions contained herein or for discrepancies

between the product and the user's guide. In no event shall congatec AG be liable for

any incidental, consequential, special, or exemplary damages, whether based on tort,

contract or otherwise, arising out of or in connection with this user's guide or any other

information contained herein or the use thereof.

Intended Audience

This user's guide is intended for technically qualified personnel. It is not intended for

general audiences.

Symbols

The following symbols are used in this user's guide:

Warning

Warnings indicate conditions that, if not observed, can cause personal injury.

aution

Cautions warn the user about how to prevent damage to hardware or loss of data.

Note

Notes call attention to important information that should be observed.

Terminology

Term Description

GB Gigabyte (1,073,741,824 bytes)

GHZ Gigahertz (one billion hertz)

kB Kilobyte (1024 bytes)

MB Megabyte (1,048,576 bytes)

Mbit Megabit (1,048,576 bits)

kHz Kilohertz (one thousand hertz)

MHz Megahertz (one million hertz)

PCI-EX PCI Express

SATA Serial ATA

PATA Parallel ATA

T. .M. Top of memory = max. DRAM installed

HDA High Definition Audio

I/F Interface

N.C. Not connected

N.A. Not available

T.B.D. To be determined

opyright Notice

protected by copyrights. No copying is permitted without written permission from

congatec AG.

Some of the information found in this user's guide has been extracted WITH EXPRESS

PERMISSI N from the following C PYRIGHTED American Megatrends, Inc

documents:

•AMIBI S8_HDD_Security.pdf

•AMIBI S8-Flash-Recovery-Whitepaper.pdf

•AMIBI S8_SerialRedirection.pdf

•AMIBI S8 Setup User's Guide

rights reserved. All text, pictures and graphics are protected by copyrights. No copying

is permitted without written permission from American Megatrends, Inc.

congatec AG has made every attempt to ensure that the information in this document is

accurate yet the information contained within is supplied “as-is”.

Trademarks

Intel and Pentium are registered trademarks of Intel Corporation. Expresscard is a

registered trademark of Personal Computer Memory Card International Association

(PCMCIA). PCI Express is a registered trademark of Peripheral Component

Interconnect Special Interest Group (PCI-SIG). I²C is a registered trademark of Philips

Corporation. CompactFlash is a registered trademark of CompactFlash Association.

Winbond is a registered trademark of Winbond Electronics Corp. AVR is a registered

trademark of Atmel Corporation. ETX is a registered trademark of Kontron AG.

AMIC RE8 is a registered trademark of American Megatrends Inc. Microsoft®,

Windows®, Windows NT®, Windows CE and Windows XP® are registered trademarks of

Microsoft Corporation. VxWorks is a registered trademark of WindRiver. conga,

congatec and XTX are registered trademark of congatec AG. All product names and

logos are property of their owners.

Warranty

congatec AG makes no representation, warranty or guaranty, express or implied

regarding the products except its standard form of limited warranty ("Limited Warranty").

congatec AG may in its sole discretion modify its Limited Warranty at any time and from

time to time.

Beginning on the date of shipment to its direct customer and continuing for the

published warranty period, congatec AG represents that the products are new and

warrants that each product failing to function properly under normal use, due to a defect

in materials or workmanship or due to non conformance to the agreed upon

specifications, will be repaired or exchanged, at congatec AG's option and expense.

Customer will obtain a Return Material Authorization ("RMA") number from congatec AG

prior to returning the non conforming product freight prepaid. congatec AG will pay for

transporting the repaired or exchanged product to the customer.

Repaired, replaced or exchanged product will be warranted for the repair warranty

period in effect as of the date the repaired, exchanged or replaced product is shipped by

congatec AG, or the remainder of the original warranty, whichever is longer. This

Limited Warranty extends to congatec AG's direct customer only and is not assignable

or transferable.

Except as set forth in writing in the Limited Warranty, congatec AG makes no

performance representations, warranties, or guarantees, either express or implied, oral

or written, with respect to the products, including without limitation any implied warranty

(a) of merchantability, (b) of fitness for a particular purpose, or (c) arising from course of

performance, course of dealing, or usage of trade.

congatec AG shall in no event be liable to the end user for collateral or consequential

damages of any kind. congatec AG shall not otherwise be liable for loss, damage or

expense directly or indirectly arising from the use of the product or from any other

cause. The sole and exclusive remedy against congatec AG, whether a claim sound in

contract, warranty, tort or any other legal theory, shall be repair or replacement of the

product only.

ertification

congatec AG is certified to DIN EN IS 9001:2000 standard.

Technical Support

congatec AG technicians and engineers are committed to providing the best possible

technical support for our customers so that our products can be easily used and

implemented. We request that you first visit our website at www.congatec.com for the

latest documentation, utilities and drivers, which have been made available to assist

you. If you still require assistance after visiting our website then contact our technical

support department by email at support@congatec.com

ETX® oncept and XTXTM Extension

The ETX® concept is an off the shelf, multi vendor, Single-Board-Computer that

integrates all the core components of a common PC and is mounted onto an application

specific baseboard. ETX® modules have a standardized form factor of 95mm x 114mm

and have specified pinouts on the four system connectors that remain the same

regardless of the vendor. The ETX® module provides most of the functional

requirements for any application. These functions include, but are not limited to,

graphics, sound, keyboard/mouse, IDE, Ethernet, parallel, serial and USB ports. Four

ruggedized connectors provide the baseboard interface and carry all the I/ signals to

and from the ETX® module.

Baseboard designers can utilize as little or as many of the I/ interfaces as deemed

necessary. The baseboard can therefore provide all the interface connectors required to

attach the system to the application specific peripherals. This versatility allows the

designer to create a dense and optimized package, which results in a more reliable

product while simplifying system integration. Most importantly ETX® applications are

scalable, which means once a product has been created there is the ability to diversify

the product range through the use of different performance class ETX® modules. Simply

unplug one module and replace it with another, no redesign is necessary.

XTX™ is an expansion and continuation of the well-established and highly successful

ETX® standard. XTX™ offers the newest I/ technologies on this proven form factor.

Now that the ISA bus is being used less and less in modern embedded applications

congatec AG offers an array of different features on the X2 connector than those

currently found on the ETX® platform. These features include new serial high speed

buses such as PCI Express™ and Serial ATA®. All other signals found on connectors

X1, X3, and X4 remain the same in accordance to the ETX® standard (Rev. 2.7) and

therefore will be completely compatible. If the embedded PC application still requires the

ISA bus then an ISA bridge can be implemented on the application specific baseboard

or the readily available LPC bus located on the XTX™ module may be used. Contact

congatec technical support for details.

Lead-Free Designs (RoHS)

All congatec AG designs are created from lead-free components and are completely

RoHS compliant.

Electrostatic Sensitive Device

All congatec AG products are electrostatic sensitive devices and are packaged

accordingly. Do not open or handle a congatec AG product except at an

electrostatic-free workstation. Additionally, do not ship or store congatec AG products

near strong electrostatic, electromagnetic, magnetic, or radioactive fields unless the

device is contained within its original manufacturer's packaging. Be aware that failure to

comply with these guidelines will void the congatec AG Limited Warranty.

conga-X945/XA945 Options Information

The conga-X945 is available in five different optional variants. The conga-XA945 is

available in one variant. This user's guide describes all of these options. Below you will

find an order table showing the different configurations that are currently offered by

congatec AG. Check the table for the Part no./ rder no. that applies to your product.

This will tell you what options described in this user's guide are available on your

particular module.

Part-No. 055874 085691 014781 034571 078965

PU Intel® Core™ 2

Duo L7400 LV

1.5GHz (Low

Voltage)

Intel® Core™

Duo L2400 LV

1.66GHz (Low

Voltage)

Intel® Core™ 2

Duo U7500 ULV

1.06GHz (Ultra

Low Voltage)

Intel® Celeron M

423 ULV

1.06GHz (Ultra

Low Voltage)

Intel® Celeron M

440 1.86GHz

ache 4 MByte 2 MByte 2 MByte 1 MByte 1 MByte

SATA 2x 2x 2x 2x 2x

SDVO Yes Yes Yes Yes Yes

USB 2.0 6x 6x 6x 6x 6x

P I Express 4x 4x 4x 4x 4x

Suspend to RAM (S3) Yes Yes Yes Yes Yes

conga-XA945 Variants

Part-No. 055874

PU Intel® Atom™ N270 1.6GHz

ache 512kB

SATA 2x

SDVO Yes

USB 2.0 6x

P I Express 4x

Suspend to RAM (S3) Yes

ontents

1 Specifications.............................................................................................................................11

1.1 Feature List.............................................................................................................................11

1.2 Supported perating Systems................................................................................................12

1.3 Mechanical Dimensions...........................................................................................................12

1.4 Electrical Characteristics.........................................................................................................12

1.4.1 Supply Voltage Ripple..........................................................................................................13

1.4.2 Rise Time.............................................................................................................................13

1.5 Power Consumption................................................................................................................13

1.5.1 conga-XA945 Intel® Atom™ N270 1.6GHz 512kB cache....................................................15

1.5.2 conga-X945 Intel® Core™ 2 Duo L7400 1.5GHz 4MB cache..............................................15

1.5.3 conga-X945 Intel® Core™ Duo L2400 1.66GHz 2MB cache...............................................15

1.5.4 conga-X945 Intel® Core™ 2 Duo U7500 1.06GHz 2MB cache...........................................16

1.5.5 conga-X945 Intel® Celeron M 423 1.06GHz 1MB cache.....................................................16

1.5.6 conga-X945 Intel® Celeron M 440 1.86GHz 1MB cache.....................................................16

1.6 Supply Voltage Battery Power.................................................................................................17

1.6.1 CM S Battery Power Consumption.....................................................................................17

1.7 Environmental Specifications..................................................................................................17

2 Block Diagram............................................................................................................................18

3 Heatspreader.............................................................................................................................19

3.1 Heatspreader Dimensions.......................................................................................................20

3.2 Exploded view of Threaded XTX Heatspreader, Module and Carrier Board Assembly...........21

4 Connector Subsystems..............................................................................................................22

4.1 Connector X1..........................................................................................................................22

4.1.1 PCI Bus................................................................................................................................22

4.1.2 USB......................................................................................................................................22

4.1.3 Audio....................................................................................................................................23

4.1.4 nboard Generated Supply Voltage....................................................................................23

4.2 Connector X2 (XTX™ Extension)............................................................................................24

4.2.1 LPC......................................................................................................................................24

4.2.2 USB 2.0................................................................................................................................24

4.2.3 Serial ATA™ .......................................................................................................................24

4.2.4 PCI Express™ .....................................................................................................................24

4.2.5 ExpressCard™ ....................................................................................................................24

4.2.6 AC'97 / HDA (High Definition Audio) Digital Audio...............................................................25

4.2.7 Extended System Management...........................................................................................25

4.3 Connector X3..........................................................................................................................26

4.3.1 Graphics...............................................................................................................................26

4.3.2 LCD......................................................................................................................................26

4.3.3 TV- ut..................................................................................................................................26

4.3.4 Serial Ports (1 and 2)...........................................................................................................26

4.3.5 Serial Infrared Interface........................................................................................................26

4.3.6 Parallel Port/Floppy Interface...............................................................................................26

4.3.7 Keyboard/Mouse..................................................................................................................27

4.4 Connector X4..........................................................................................................................28

4.4.1 IDE.......................................................................................................................................28

4.4.2 Ethernet................................................................................................................................28

4.4.3 I²C Bus 400kHz....................................................................................................................28

4.4.4 Power Control.......................................................................................................................28

4.4.5 Power Management.............................................................................................................30

5 Additional Features....................................................................................................................31

5.1 Watchdog................................................................................................................................31

5.2 nboard Microcontroller..........................................................................................................31

5.3 Embedded BI S.....................................................................................................................31

5.3.1 Simplified verview of BI S Setup Data Backup.................................................................32

5.4 SDV ......................................................................................................................................33

5.5 Security Features....................................................................................................................33

5.6 Suspend to RAM (S3).............................................................................................................33

5.7 congatec Battery Management Interface.................................................................................33

6 conga Tech Notes......................................................................................................................34

6.1 Comparison of I/ APIC to 8259 PIC Interrupt mode..............................................................34

6.2 Native vs. Compatible IDE mode.............................................................................................34

6.2.1 Compatible Mode.................................................................................................................34

6.2.2 Native Mode ........................................................................................................................34

6.3 Thermal Monitor and Catastrophic Thermal Protection...........................................................35

6.4 Processor Performance Control..............................................................................................36

6.5 Thermal Management.............................................................................................................39

6.6 ACPI Suspend Modes and Resume Events............................................................................40

6.7 USB 2.0 EHCI Host Controller Support...................................................................................42

7 Signal Descriptions and Pinout Tables.......................................................................................43

7.1 X1 Connector Signal Descriptions...........................................................................................44

7.2 Connector X1 Pinout...............................................................................................................46

7.3 X2 Connector Signal Descriptions (XTX™ extension).............................................................47

7.4 X2 Connector Pinout...............................................................................................................51

7.5 X3 Connector Signal Descriptions...........................................................................................53

7.6 X4 Connector Signal Descriptions...........................................................................................58

7.7 X4 Connector Pinout...............................................................................................................61

7.8 SDV Connector X6...............................................................................................................62

7.9 Boot Strap Signals...................................................................................................................64

8 System Resources.....................................................................................................................65

8.1 System Memory Map...............................................................................................................65

8.2 I/ Address Assignment..........................................................................................................66

8.2.1 LPC Bus...............................................................................................................................67

8.3 Interrupt Request (IRQ) Lines.................................................................................................67

8.4 Direct Memory Access (DMA) Channels.................................................................................69

8.5 PCI Configuration Space Map.................................................................................................70

8.6 PCI Interrupt Routing Map.......................................................................................................71

8.7 PCI Bus Masters.....................................................................................................................72

8.8 I²C Bus....................................................................................................................................72

8.9 SM Bus....................................................................................................................................72

9 BI S Setup Description.............................................................................................................73

9.1 Entering the BI S Setup Program..........................................................................................73

9.1.1 Boot Selection Popup...........................................................................................................73

9.1.2 Manufacturer Default Settings..............................................................................................73

9.2 Setup Menu and Navigation....................................................................................................73

9.3 Main Setup Screen..................................................................................................................74

9.4 Advanced Setup......................................................................................................................75

9.4.1 ACPI Configuration Submenu..............................................................................................76

9.4.2 PCI Configuration Submenu.................................................................................................78

9.4.2.1 PCI IRQ Resource Exclusion Submenu............................................................................78

9.4.2.2 PCI Interrupt Routing Submenu........................................................................................78

9.4.3 Graphics Configuration Submenu........................................................................................79

9.4.4 CPU Configuration Submenu for conga-X945 variants only.................................................81

9.4.5 CPU Configuration Submenu for conga-XA945 variants only..............................................82

9.4.6 Chipset Configuration Submenu...........................................................................................83

9.4.7 I/ Interface Configuration Submenu...................................................................................85

9.4.8 Clock Configuration..............................................................................................................86

9.4.9 IDE Configuration Submenu.................................................................................................86

9.4.9.1 Primary/Secondary IDE Master/Slave Submenu...............................................................87

9.4.10 USB Configuration Submenu.............................................................................................88

9.4.10.1 USB Mass Storage Device Configuration Submenu........................................................89

9.4.11 Keyboard/Mouse Configuration Submenu..........................................................................89

9.4.12 Remote Access Configuration Submenu............................................................................90

9.4.13 Hardware Monitoring Submenu..........................................................................................91

9.4.14 Watchdog Configuration Submenu....................................................................................92

9.5 Boot Setup..............................................................................................................................93

9.5.1 Boot Device Priority..............................................................................................................93

9.5.2 Boot Settings Configuration..................................................................................................94

9.6 Security Setup.........................................................................................................................95

9.6.1 Security Settings..................................................................................................................95

9.6.2 Hard Disk Security................................................................................................................96

9.6.2.1 Hard Disk Security User Password....................................................................................96

9.6.2.2 Hard Disk Security Master Password................................................................................96

9.7 Power Setup............................................................................................................................97

9.7.1 Exit Menu.............................................................................................................................98

10 Additional BI S Features.........................................................................................................99

10.1 Updating the BI S................................................................................................................99

10.2 BI S Recovery......................................................................................................................99

10.2.1 BI S Recovery via Storage Devices..................................................................................99

10.2.2 BI S Recovery via Serial Port..........................................................................................100

10.3 Serial Port and Console Redirection....................................................................................100

10.4 BI S Security Features.......................................................................................................100

10.5 Hard Disk Security Features................................................................................................101

11 Industry Specifications...........................................................................................................102

1 Specifications

1.1 Feature List

Table 1 Feature Summary

Form Factor ETX® standard (Rev. 2.7) with XTXTM extension

Processor Intel® Atom™ N270 1.6GHz with 512-kB L2 cache

Intel® Core™ 2 Duo L7400 LV 1.5GHz with 4-MByte L2 cache (Low Voltage)

Intel® Core™ Duo L2400 1.66GHz with 2-MByte L2 cache LV (Low Voltage)

Intel® Core™ Duo U7500 ULV 1.06GHz with 2-MByte L2 cache (Ultra Low Voltage)

Intel® Celeron M 423 ULV 1.06GHz, with 1-MByte L2 cache (Ultra Low Voltage)

Intel® Celeron M 440 1.86GHz, with 1-MByte L2 cache

Memory S -DIMM DDR2 667 up to 2-GByte

hipset Graphics and Memory Controller Hub (GMCH) Intel® 82945GME

Intel® I/ Controller Hub 82801GBM (ICH7M)

Audio Realtek ALC 203 AC'97 Rev. 2.3 compatible.

Ethernet ICH7M with PHY Intel® 82562

Graphics Options Intel® Graphics Media Accelerator 950 with max.224MByte Dynamic Video Memory

Technology (DVMT 3.0) as well as Dual independent display support.

•CRT Interface

400 MHz RAMDAC

Resolutions up to 2048x1536 @ 70Hz (QXGA)

including 1920x1080 @ 85Hz (HDTV)

•Flatpanel Interface (integrated)

2x112MHz LVDS Transmitter

Supports all 1x18, 2x18, 1x24, 2x24 Bit TFT

configurations (current chipset revisions

support 24Bit modes although not officially

stated by Intel®)

Supports both conventional (FPDI) and non-

conventional (LDI) color mappings

Automatic Panel Detection via EPI (Embedded

Panel Interface based on VESA EDID™ 1.3)

Resolutions 640x480 up to 1600x1200 (UXGA)

•Motion Video Support

Up- and Downscaling

High definition content decode

H/W motion compensation

Subpicture support

Dynamic bob and weave

•AUX utput

2 x Intel compliant SDV ports

(serial DV ) 200MPixel/sec each

Supports external DVI, TV and LVDS

transmitter

•TV ut: Integrated TV encoder

Supports component + s-video

Super I/O Winbond 83627HG

Peripheral

Interfaces

•2x Serial ATA®

•4x x1 PCI Express® Links

•PCI Bus Rev. 2.3

•6x USB 2.0 (EHCI)

•LPC Bus (no ISA Bus)

•1x EIDE (UDMA-66/100)

•PS/2 Keyboard, Mouse

•I2C Bus, Fast Mode (400 kHz) multimaster

•Floppy (shared with LPT)

•LPT (EEP/ECP, shared with floppy)

•2 x C M Ports, TTL Level

•1 x IrDA Port

•AC'97/HDA (High Definition Audio codecs) Digital Audio

interface

BIOS Based on AMIBI S8® -1MByte Flash BI S with congatec Embedded BI S features

Power Management ACPI 3.0 compliant with battery support. Also supports Suspend to RAM (S3).

Note

Some of the features mentioned in the Feature Summary are optional. Check the article

number of your module and compare it to the option information list on page of this

user's guide to determine what options are available on your particular module.

1.2 Supported Operating Systems

The conga-X945/XA945 supports the following operating systems.

•Microsoft® Windows® Vista

•Microsoft® Windows® XP/2000

•Microsoft® Windows ®XP Embedded

•Microsoft® Windows® CE 5.0 / 6.0

•Linux

•QNX

1.3 Mechanical Dimensions

•95.0 mm x 114.0 mm (3.75” x 4.5”)

•Height approx. 12mm (0.4”)

1.4 Electrical haracteristics

haracteristics Min Typ Max Units omment

5V Voltage +/-5% 4.75 5.00 5.25 Vdc

Ripple - - 100 mVpp 0-20MHz

urrent See section 1.5 'Power Consumption' for supply current information.

5V_SB Voltage +/-5% 4.75 5.00 5.25 Vdc

urrent 250 mA

1.4.1 Supply Voltage Ripple

•Maximum 100mV peak to peak over a frequency band of 10Hz to 20MHz.

The dynamic range shall not exceed the static range.

1.4.2 Rise Time

The input voltages shall rise from 10% of nominal to 90% of nominal at a minimum rise

time of 250V/s. The smooth turn-on requires that, during the 10% to 90% portion of the

rise time, the slope of the turn-on waveform must be positive.

1.5 Power onsumption

The power consumption values listed in this document were measured under a

controlled environment. The XTX module was mounted into a special baseboard. This

special baseboard does not have any power consuming components mounted on it. It

provides one connector for a CRT monitor connection, a PS/2 keyboard and mouse

connection, and an IDE device connection. The baseboard is powered by a Direct

Current (DC) power supply that is set to output 5 Volts and is connected directly to the

special baseboard. Additionally, positive and negative sense lines are connected to the

baseboard in order to measure the current consumption of the module. This current

consumption value is displayed by the DC power supply's readout and this is the value

that is recorded as the power consumption measurement. All recorded values are

approximate.

All external peripheral devices, such as the hard drive, are externally powered so that

they do not influence the power consumption value that is measured for the module.

This ensures the value measured reflects the true power consumption of the module

and only the module. A keyboard is used to configure the module and then it is

disconnected before the measurement is recorded. If the keyboard remained

connected, an additional current consumption of approximately 10 mA is noticed.

Each module was measured while running Windows XP Professional with SP2 (service

pack 2) and the “Power Scheme” was set to “Portable/Laptop”. This setting ensures that

Pentium M processors reduce their output during desktop idle. Celeron M processors do

not support this feature and therefore run at full speed even during desktop idle. The

screen resolution was set to 800x600 32bit High Color. Each module was tested while

using a swissbit® DDR2 PC2-4200-444 512MB memory module. Using different sizes of

RAM will cause slight variances in the measured results. Power consumption values

were recorded during the following stages:

Windows XP Professional SP2

•Desktop Idle (1000MHz for Intel® Core™ Duo L2400 1.66GHz)

•100% CPU workload (see note below)

•Windows XP Professional Standby Mode (requires setup node “Suspend Mode” in

the BI S to be configured to S1 P S (Power n Suspend))

•Suspend to RAM (requires setup node “Suspend Mode” in BI S to be configured to

S3 STR (Suspend to RAM))

Note

A software tool was used to stress the CPU to 100% workload.

Processor Information

In the following power tables there is some additional information about the processors.

Intel® offers processors that are considered to be low power consuming. These

processors can be identified by their voltage status. Intel uses the following terms to

describe these processors. If none of these terms are used then the processor is not

considered to be low power consuming.

LV=Low voltage

ULV=Ultra low voltage

When applicable, the above mentioned terms will be added to the power tables to

describe the processor. For example:

Intel® Core™ Duo L2400 1.66GHz 2MB L2 cache

LV 90nm

Intel® also describes the type of manufacturing process used for each processor. The

following term is used:

nm=nanometer

The manufacturing process description is included in the power tables as well. See

example below. For information about the manufacturing process visit Intel®'s website.

Intel® Core™ Duo L2400 1.66GHz 2MB L2 cache

LV 65nm

1.5.1 conga-XA945 Intel® Atom™ N270 1.6GHz 512kB cache

With 512MB memory installed

conga-XA945 Art. No. 055600 conga-XA945 Intel® Atom™ N270 1.6GHz 512kB cache

LV 65nm

Layout Rev. X270X0 /BIOS Rev. X270R110

Memory Size 512MB

Operating System Windows XP Professional SP2

Power State Desktop Idle 100% workload Standby Suspend to Ram (S3)

Power consumption (measured

in Amperes/Watts)

1.2 A/6 W 2.0 A/10 W 1.3 A/6.5 W 0.1 A/0.5 W

1.5.2 conga-X945 Intel® ore™ 2 Duo L7400 1.5GHz 4MB cache

With 512MB memory installed

conga-X945 Art. No. 055874 Intel® ore™ 2 Duo L7400 1.5GHz 4MB L2 cache

LV 65nm

Layout Rev. X945B0 /BIOS Rev. X945R111

Memory Size 512MB

Operating System Windows XP Professional SP2

Power State Desktop Idle 100% workload Standby Suspend to Ram (S3)

Power consumption (measured

in Amperes/Watts)

1.2 A/6 W 5.5 A/27.5 W 1.7 A/8.5 W 0.1 A/0.5 W

1.5.3 conga-X945 Intel® ore™ Duo L2400 1.66GHz 2MB cache

With 512MB memory installed

conga-X945 Art. No. 085691 Intel® ore™ Duo L2400 1.66GHz 2MB L2 cache

LV 65nm

Layout Rev. X945X0 /BIOS Rev. X945R006

Memory Size 512MB

Operating System Windows XP Professional SP2

Power State Desktop Idle 100% workload Standby Suspend to Ram (S3)

Power consumption (measured

in Amperes/Watts)

1.2 A/6 W 4.8 A/24 W 1.4 A/7 W 0.1 A/0.5 W

1.5.4 conga-X945 Intel® ore™ 2 Duo U7500 1.06GHz 2MB cache

With 512MB memory installed

conga-X945 Art. No. 014781 Intel® ore™ 2 Duo U7500 1.06GHz 2MB L2 cache

ULV 65nm

Layout Rev. X945 1 /BIOS Rev. X945R111

Memory Size 512MB

Operating System Windows XP Professional SP2

Power State Desktop Idle 100% workload Standby Suspend to Ram (S3)

Power consumption (measured

in Amperes/Watts)

1.2 A/6 W 3.3 A/16.5 W 1.4 A/7 W 0.1 A/0.5 W

1.5.5 conga-X945 Intel® eleron M 423 1.06GHz 1MB cache

With 512MB memory installed

conga-X945 Art. No. 034571 Intel® eleron M 423 1.06GHz 1MB L2 cache

ULV 65nm

Layout Rev. X945A0 /BIOS Rev. X945R007

Memory Size 512MB

Operating System Windows XP Professional SP2

Power State Desktop Idle 100% workload Standby Suspend to Ram (S3)

Power consumption (measured

in Amperes/Watts)

1.4 A/7 W 2.5 A/12.5 W 1.4 A/7 W 0.1 A/0.5 W

1.5.6 conga-X945 Intel® eleron M 440 1.86GHz 1MB cache

With 512MB memory installed

conga-X945 Art. No. 078965 Intel® eleron M 440 1.86GHz 1MB L2 cache

65nm

Layout Rev. X945A0 /BIOS Rev. X945R111

Memory Size 512MB

Operating System Windows XP Professional SP2

Power State Desktop Idle 100% workload Standby Suspend to Ram (S3)

Power consumption (measured

in Amperes/Watts)

1.9 A/9.5 W 4.6 A/23 W 2.1 A/10.5 W 0.1 A/0.5 W

Note

All recorded power consumption values are approximate and only valid for the

controlled environment described earlier. 100% workload refers to the CPU workload

and not the maximum workload of the complete module. Power consumption results will

vary depending on the workload of other components such as graphics engine,

memory, etc.

1.6 Supply Voltage Battery Power

•2.0V-3.6V DC

•Typical 3V DC

1.6.1 MOS Battery Power onsumption

RT @ 20º Voltage urrent

Integrated in the Intel®

I/ Controller Hub

82801GBM (ICH7M)

3V DC 2.4 µA

The CM S battery power consumption value listed above should not be used to

calculate CM S battery lifetime. You should measure the CM S battery power

consumption in your customer specific application in worst case conditions, for example

during high temperature and high battery voltage. The self-discharge of the battery must

also be considered when determining CM S battery lifetime. For more information

about calculating CM S battery lifetime refer to application note

AN9_RTC_Battery_Lifetime.pdf, which can be found on the congatec AG website at

www.congatec.com.

1.7 Environmental Specifications

Temperature peration: 0° to 60°C Storage: -20° to +80°C

Humidity peration: 10% to 90% Storage: 5% to 95%

aution

The above operating temperatures must be strictly adhered to at all times. When using

a heatspreader the maximum operating temperature refers to any measurable spot on

the heatspreader's surface.

congatec AG strongly recommends that you use the appropriate congatec module

heatspreader as a thermal interface between the module and your application specific

cooling solution.

If for some reason it is not possible to use the appropriate congatec module

heatspreader, then it is the responsibility of the operator to ensure that all components

found on the module operate within the component manufacturer's specified

temperature range.

For more information about operating a congatec module without heatspreader contact

congatec technical support.

Humidity specifications are for non-condensing conditions.

2 Block Diagram

3 Heatspreader

An important factor for each system integration is the thermal design. The heatspreader

acts as a thermal coupling device to the module. It is a 2mm thick aluminum plate.

The heatspreader is thermally coupled to the CPU via a thermal gap filler and on some

modules it may also be thermally coupled to other heat generating components with the

use of additional thermal gap fillers.

Although the heatspreader is the thermal interface where most of the heat generated by

the module is dissipated, it is not to be considered as a heatsink. It has been designed

to be used as a thermal interface between the module and the application specific

thermal solution. The application specific thermal solution may use heatsinks with fans,

and/or heat pipes, which can be attached to the heatspreader. Some thermal solutions

may also require that the heatspreader is attached directly to the systems chassis

therefore using the whole chassis as a heat dissipater.

aution

The center mounting hole on the heatspreader must be used to ensure that all

components that are required to make contact with heatspreader do so. Failure to utilize

the center mounting hole will result in improper contact between these components and

heatspreader thereby reducing heat dissipation efficiency.

Attention must be given to the mounting solution used to mount the heatspreader and

module into the system chassis. Do not use a threaded heatspreader together with

threaded carrier board standoffs. The combination of the two threads may be

staggered, which could lead to stripping or cross-threading of the threads in either the

standoffs of the heatspreader or carrier board.

For more information about this subject refer to Application Note

AN14_ETX_XTX_Mounting_Solutions.pdf that can be found on the congatec website.

3.1 Heatspreader Dimensions

Note

All measurements are in millimeters. Torque specification for heatspreader screws is

0.5 Nm.

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