Dave Embedded Systems diDo User manual

HARDWARE MANUAL
ARM Cortex-A8 CPU Module Family
DAVE Embedded Systems www.dave.eu [email protected]
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Table of Contents
1 Preface.....................................................................................................................................6
1.1 About this manual.............................................................................................................6
1.2 Copyrights/Tra emarks.....................................................................................................6
1.3 Stan ar s..........................................................................................................................6
1.4 Disclaimers.......................................................................................................................6
1.5 Warranty............................................................................................................................6
1.6 Technical Support.............................................................................................................7
1.7 Relate ocuments...........................................................................................................8
1.8 Conventions, Abbreviations, Acronyms............................................................................8
2 Intro uction.............................................................................................................................11
2.1 Pro uct Highlights...........................................................................................................12
2.2 Block DiagramBlock Diagram.........................................................................................13
2.3 Feature Summary...........................................................................................................14
3 Design overview.....................................................................................................................16
3.1 “DaVinci” DM814x / “Sitara” AM387x CPU.....................................................................16
3.2 DDR3 memory bank.......................................................................................................18
3.3 NOR flash bank...............................................................................................................18
3.4 NAND flash bank............................................................................................................18
3.5 Memory Map...................................................................................................................19
3.6 Power supply unit...........................................................................................................19
3.7 CPU mo ule connectors.................................................................................................19
4 Mechanical specifications......................................................................................................21
4.1 Boar Layout...................................................................................................................21
4.2 Connectors......................................................................................................................23
5 System Logic..........................................................................................................................24
5.1 Power..............................................................................................................................24
5.2 PMIC...............................................................................................................................24
5.3 Reset...............................................................................................................................24
5.3.1 MRST (J2.102)........................................................................................................24
5.3.2 PORSTn (J2.109)....................................................................................................24
5.3.3 RSTOUTn (J2.91)....................................................................................................25
5.3.4 CPU_RESETn (J2.15).............................................................................................25
5.3.5 JTAG_TRSTn (J2.100)............................................................................................25
5.4 Voltage monitor...............................................................................................................25
5.5 Boot options....................................................................................................................25
5.5.1 Default boot configuration.......................................................................................26
5.5.2 Boot sequence customization.................................................................................27
5.6 Clock scheme.................................................................................................................27
5.7 Recovery.........................................................................................................................27
5.7.1 JTAG Recovery.......................................................................................................27
5.7.2 UART Recovery.......................................................................................................28
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5.7.3 SD/MMC Recovery..................................................................................................28
5.8 Multiplexing.....................................................................................................................28
5.9 RTC.................................................................................................................................29
6 Pinout table............................................................................................................................30
6.1 Carrier boar mating connector J1.................................................................................32
6.2 Carrier boar mating connector J2.................................................................................38
6.3 CPU mo ule mount options............................................................................................45
6.4 A itional notes...............................................................................................................46
6.4.1 EN_BCK_LS............................................................................................................46
7 Peripheral interfaces..............................................................................................................47
7.1 Digital Vi eo Output (DVO).............................................................................................47
7.1.1 VOUT0.....................................................................................................................47
7.1.2 VOUT1.....................................................................................................................48
7.2 HDMI...............................................................................................................................49
7.3 Analog SDTV out............................................................................................................50
7.4 Digital Vi eo Input ports..................................................................................................51
7.4.1 VIN0.........................................................................................................................52
7.4.2 VIN1.........................................................................................................................54
7.5 Ethernet ports.................................................................................................................55
7.5.1 EMAC_RMREFCLK................................................................................................56
7.5.2 Ethernet 10/100.......................................................................................................56
7.5.3 Gigabit EMAC..........................................................................................................57
7.6 CAN ports.......................................................................................................................58
7.6.1 DCAN0.....................................................................................................................58
7.6.2 DCAN1.....................................................................................................................58
7.7 UARTs.............................................................................................................................59
7.7.1 UART0.....................................................................................................................59
7.7.2 UART3.....................................................................................................................60
7.7.3 UART5.....................................................................................................................60
7.8 MMC/SD channels..........................................................................................................61
7.8.1 MMC/SD/SDIO0......................................................................................................61
7.8.2 MMC/SD/SDIO1......................................................................................................62
7.8.3 MMC/SD/SDIO2......................................................................................................63
7.9 USB ports........................................................................................................................63
7.9.1 USB0.......................................................................................................................63
7.9.2 USB1.......................................................................................................................64
7.9.3 USB2.......................................................................................................................64
7.9.4 Other USB signals...................................................................................................64
7.10 Touchscreen..................................................................................................................65
7.11 EEPROM.......................................................................................................................65
7.12 Keypa controller..........................................................................................................65
7.13 PCI Express..................................................................................................................66
7.14 SPI buses......................................................................................................................67
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7.14.1 SPI1.......................................................................................................................67
7.14.2 SPI2.......................................................................................................................68
7.14.3 SPI3.......................................................................................................................68
7.15 I2C buses......................................................................................................................69
7.15.1 I2C2.......................................................................................................................69
7.15.2 I2C3.......................................................................................................................69
7.16 SATA.............................................................................................................................70
7.17 Au io interfaces............................................................................................................70
7.17.1 McASP2.................................................................................................................71
7.18 GPIOs...........................................................................................................................71
7.19 Local Bus......................................................................................................................71
8 Operational characteristics....................................................................................................75
8.1 Maximum ratings.............................................................................................................75
8.2 Recommen e ratings....................................................................................................75
8.3 Power consumption........................................................................................................75
8.3.1 Set 1........................................................................................................................76
8.3.2 Use cases................................................................................................................76
8.4 Heat Dissipation..............................................................................................................77
9 Application notes....................................................................................................................78
Index of Tables
Tab. 1: Relate ocuments........................................................................................................8
Tab. 2: Abbreviations an acronyms use in this manual..........................................................9
Tab. 3: CPU, Memories, Busses..............................................................................................14
Tab. 4: Peripherals...................................................................................................................15
Tab. 5: Electrical, Mechanical an Environmental Specifications............................................15
Tab. 6: DM814x/AM387x comparison......................................................................................18
Tab. 7: DDR2 specifications.....................................................................................................18
Tab. 8: NOR flash specifications..............................................................................................18
Tab. 9: NAND flash specifications............................................................................................19
Tab. 10: ZFF form factor – example of pinout ifferences.......................................................20
Illustration Index
Fig. 1: DIDO CPU mo ule.........................................................................................................11
Fig. 2: DIDO (top-right), NAON (top-left) an MAYA (bottom)...................................................11
Fig. 3: DIDO SOM (top view)....................................................................................................12
Fig. 4: Boar layout - top view..................................................................................................21
Fig. 5: Boar layout - size view.................................................................................................22
Fig. 6: Connectors layout..........................................................................................................23
Fig. 7: Simplifie schematics of EN_BCK2_LS internal pin configuration................................46
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1 Preface
1.1 About this manual
This Hardware Manual describes the DIDO CPU modules
family design and functions.
Precise speci cations for the Texas Instruments DM814x and
AM387x processors can be found in the CPU datasheets and/or
reference manuals.
1.2 Copyrights/Trademarks
Ethernet® is a registered trademark of XEROX Corporation.
All other products and trademarks mentioned in this manual
are property of their respective owners.
All rights reserved. Speci cations may change any time without
noti cation.
1.3 Standards
DAVE Embedded Systems Srl is certi ed to ISO 9001
standards.
1. Disclaimers
DAVE Embedded Systems does not assume any responsibility
about availability, supplying and support regarding all the
products mentioned in this manual that are not strictly part of
the DIDO CPU module.
DIDO CPU Modules are not designed for use in life support
appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal
injury. DAVE Embedded Systems customers who are using or
selling these products for use in such applications do so at their
own risk and agree to fully indemnify DAVE Embedded
Systems for any damage resulting from such improper use or
sale.
1.5 Warranty
DIDO is warranted against defects in material and
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workmanship for the warranty period from the date of
shipment. During the warranty period, DAVE Embedded
Systems will at its discretion decide to repair or replace
defective products. Within the warranty period, the repair of
products is free of charge as long as warranty conditions are
observed.
The warranty does not apply to defects resulting from improper
or inadequate maintenance or handling by the buyer,
unauthorized modi cation or misuse, operation outside of the
product’s environmental speci cations or improper installation
or maintenance.
DAVE Embedded Systems will not be responsible for any
defects or damages to other products not supplied by DAVE
Embedded Systems that are caused by a faulty DIDO module.
1.6 Technical Support
We are committed to making our product easy to use and will
help customers use our CPU modules in their systems.
Technical support is delivered through email to our valued
customers. Support requests can be sent to
[email protected].
Software upgrades are available for download in the restricted
access download area of DAVE Embedded Systems web site:
http://www.dave.eu/reserved-area. An account is required to
access this area and is provided to customers who purchase the
development kit (please contact [email protected] for
account requests)..
Please refer to our Web site at
http://www.dave.eu/dave-cpu-module-dm814x-dido.html for the
latest product documentation, utilities, drivers, Product
Change Noti cations, Board Support Packages, Application
Notes, mechanical drawings and additional tools and software.
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1.7 Related documents
Document Location
DAVE Embedded
Systems
Developers Wiki
http://wiki.dave.eu/index.php/Main_Pa
ge
TMS32 DM814x
DaVinci
Technical
Reference Manual
http://www.ti.com/litv/pdf/sprugz8d
DM814x Overview
(on TI Embedded
Processors Wiki )
http://processors.wiki.ti.com/index.ph
p/DM814x_Overview
Integration guide
(on DAVE
Embedded
Systems
Developers Wiki)
http://wiki.dave.eu/index.php/Integrati
on_guide_%28Dido%29
Tab. 1: Related documents
1.8 Conventions, Abbreviations, Acronyms
Abbreviation Definition
BTN Button
DSP Digital Signal Processor
DVO Digital Video Output
GPI General purpose input
GPIO General purpose input and output
GPO General purpose output
HDVPSS HD Video Processing Subsystems
HDVCIP HD Video Image Coprocessing
NELK NAON Embedded Linux Kit
PCB Printed circuit board
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Abbreviation Definition
RTC Real time clock
SOM System on module
VIP Video Input Port
PMIC Power Management Integrated Circuit
ZFF Z Form Factor
Tab. 2: Abbreviations and acronyms used in this manual
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Revision History
Version Date Notes
.9. March 2 13 First Draft
.9.1 March 2 13 First Release
.9.2 March 2 13 First Release with DIDO
development kit
Minor fixes
1. . April 2 13 Released with NELK 4. .
Minor fixes
1. .1 May 2 13 Added information on
EMAC_RMREFCLK signal
Minor fixes
1. .2 December 2 13 Fixed JTAG_TDO and JTAG_TCK
pinout table entries
1. .3 January 2 14 Updated pin J2.97 information
Minor fixes
1. .4 April 2 14 SPI2: removed J2.36 from the
muxable signals
Added HDMI CEC and HPDET
information
1. .5 August 2 14 Added EMAC_RMREFCLK
termination resistors information
Updated block diagram
Minor fixes
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