Dave Embedded Systems ARM Cortex-A9 MPCore User manual

Solo / Dual / Quad
ARM Cortex-A9 MPCore
CPU Module
HARDWARE MANUAL
[email protected]
www.dave.eu
DAVE Embedded Systems
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Table of Contents
1 Preface.....................................................................................................................................6
1.1 About this manual.............................................................................................................6
1.2 Copyrights/Tra emarks.....................................................................................................6
1.3 Stan ar s..........................................................................................................................6
1.4 Disclaimers.......................................................................................................................6
1.5 Warranty............................................................................................................................6
1.6 Technical Support.............................................................................................................7
1.7 Relate ocuments...........................................................................................................8
1.8 Conventions, Abbreviations, Acronyms............................................................................8
2 Intro uction.............................................................................................................................10
2.1 Pro uct Highlights...........................................................................................................12
2.2 Block Diagram.................................................................................................................13
2.3 Feature Summary...........................................................................................................14
3 Design overview.....................................................................................................................17
3.1 Freescale i.MX6 application processor...........................................................................17
3.2 DDR3 memory bank.......................................................................................................19
3.3 NOR flash bank...............................................................................................................19
3.4 NAND flash bank............................................................................................................20
3.5 Memory Map...................................................................................................................20
3.6 Power supply unit...........................................................................................................20
3.7 CPU mo ule connectors.................................................................................................20
4 Mechanical specifications......................................................................................................22
4.1 Boar Layout...................................................................................................................22
4.2 Connectors......................................................................................................................24
5 Power, reset an control........................................................................................................25
5.1 Power Supply Unit (PSU) an recommen e power-up sequence...............................25
5.2 Reset scheme an control signals..................................................................................29
5.2.1 CPU_PORn.............................................................................................................30
5.2.2 Boot_Mo e0/1.........................................................................................................30
5.3 Voltage monitor...............................................................................................................30
5.4 System boot....................................................................................................................30
5.4.1 Boot mo es.............................................................................................................31
5.4.2 Default boot configuration.......................................................................................32
5.4.3 Boot sequence customization.................................................................................33
5.5 Clock scheme.................................................................................................................34
5.6 Recovery.........................................................................................................................34
5.6.1 JTAG Recovery.......................................................................................................34
5.6.2 USB Recovery.........................................................................................................35
5.6.3 SD/MMC Recovery..................................................................................................35
5.7 Multiplexing.....................................................................................................................35
5.8 RTC.................................................................................................................................36
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5.9 Watch og........................................................................................................................36
6 Pinout table............................................................................................................................38
6.1 Carrier boar mating connector J1.................................................................................39
6.2 Carrier boar mating connector J2.................................................................................43
6.3 Carrier boar mating connector J3.................................................................................47
7 Peripheral interfaces..............................................................................................................52
7.1 Notes on pin assignment................................................................................................52
7.2 Gigabit Ethernet..............................................................................................................52
7.3 USB.................................................................................................................................53
7.3.1 USB Host.................................................................................................................53
7.3.2 USB OTG.................................................................................................................54
7.4 Vi eo Output ports..........................................................................................................54
7.4.1 LVDS........................................................................................................................55
7.4.1.1LVDS0...............................................................................................................55
7.4.1.2LVDS1...............................................................................................................56
7.4.2 HDMI........................................................................................................................57
7.4.3 Parallel RGB............................................................................................................58
7.4.4 MIPI DSI..................................................................................................................59
7.5 Vi eo Input ports.............................................................................................................59
7.5.1 Parallel RGB............................................................................................................59
7.5.2 MIPI CSI..................................................................................................................60
7.6 UARTs.............................................................................................................................60
7.6.1 UART1.....................................................................................................................60
7.6.2 UART2.....................................................................................................................60
7.6.3 UART3.....................................................................................................................61
7.6.4 UART4.....................................................................................................................61
7.6.5 UART5.....................................................................................................................62
7.7 SPI..................................................................................................................................62
7.7.1 ECSPI1....................................................................................................................63
7.7.2 ECSPI2....................................................................................................................63
7.7.3 ECSPI3....................................................................................................................64
7.7.4 ECSPI4....................................................................................................................64
7.7.5 ECSPI5....................................................................................................................65
7.8 Raw NAND flash controller.............................................................................................65
7.9 I²C...................................................................................................................................66
7.9.1 I²C1..........................................................................................................................67
7.9.2 I²C2..........................................................................................................................67
7.9.3 I²C3..........................................................................................................................67
7.10 CAN..............................................................................................................................67
7.10.1 FLEXCAN1............................................................................................................68
7.10.2 FLEXCAN2............................................................................................................68
7.11 JTAG.............................................................................................................................68
7.12 SD/SDIO/MMC..............................................................................................................69
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7.12.1 MMC/SD/SDIO1....................................................................................................69
7.12.2 MMC/SD/SDIO2....................................................................................................71
7.12.3 MMC/SD/SDIO3....................................................................................................72
7.12.4 MMC/SD/SDIO4....................................................................................................73
7.13 PCI Express..................................................................................................................74
7.14 SATA.............................................................................................................................75
7.15 Au io interface..............................................................................................................75
7.16 Keypa ..........................................................................................................................75
7.17 GPIO.............................................................................................................................75
8 Operational characteristics....................................................................................................76
8.1 Maximum ratings.............................................................................................................76
8.2 Recommen e ratings....................................................................................................76
8.3 Power consumption........................................................................................................76
8.3.1 Set 1........................................................................................................................77
8.3.2 Set 2........................................................................................................................77
8.4 Heat Dissipation..............................................................................................................77
9 Application notes....................................................................................................................78
Index of Tables
Tab. 1: Relate ocuments........................................................................................................8
Tab. 2: Abbreviations an acronyms use in this manual..........................................................8
Tab. 3: CPU, Memories, Buses................................................................................................14
Tab. 4: Peripherals...................................................................................................................15
Tab. 5: Electrical, Mechanical an Environmental Specifications............................................16
Tab. 6: i.MX6 comparison.........................................................................................................19
Tab. 7: DDR3 specifications.....................................................................................................19
Tab. 8: NOR flash specifications..............................................................................................20
Tab. 9: NAND flash specifications............................................................................................20
Illustration Index
Fig. 1: AXEL – Powere by i.MX6 processor............................................................................10
Fig. 2: AXEL – Solo / Dual / Qua core ARM Cortex A9...........................................................10
Fig. 3: AXEL SOM (top view)....................................................................................................12
Fig. 4: Boar layout - Top view..................................................................................................22
Fig. 5: Boar layout - Si e view................................................................................................23
Fig. 6: Connectors layout..........................................................................................................24
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1 Preface
1.1 About this manual
This Hardware Manual describes the AXEL CPU module design
and functions.
Precise speci cations for the Freescale i.MX6 processor can be
found in the CPU datasheets and/or reference manuals.
1.2 Copyrights/Trademarks
Ethernet® is a registered trademark of XEROX Corporation.
All other products and trademarks mentioned in this manual
are property of their respective owners.
All rights reserved. Speci cations may change any time without
noti cation.
1.3 Standards
DAVE Embedded Systems is certi ed to ISO 9001 standards.
1. Disclaimers
DAVE Embedded Systems does not assume any responsibility
about availability, supplying and support regarding all the
products mentioned in this manual that are not strictly part of
the AXEL CPU module.
AXEL CPU Modules are not designed for use in life support
appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal
injury. DAVE Embedded Systems customers who are using or
selling these products for use in such applications do so at their
own risk and agree to fully indemnify DAVE Embedded
Systems for any damage resulting from such improper use or
sale.
1.5 Warranty
AXEL is warranted against defects in material and
workmanship for the warranty period from the date of
shipment. During the warranty period, DAVE Embedded
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Systems will at its discretion decide to repair or replace
defective products. Within the warranty period, the repair of
products is free of charge as long as warranty conditions are
observed.
The warranty does not apply to defects resulting from improper
or inadequate maintenance or handling by the buyer,
unauthorized modi cation or misuse, operation outside of the
product’s environmental speci cations or improper installation
or maintenance.
DAVE Embedded Systems will not be responsible for any
defects or damages to other products not supplied by DAVE
Embedded Systems that are caused by a faulty AXEL module.
1.6 Technical Support
We are committed to making our product easy to use and will
help customers use our CPU modules in their systems.
Technical support is delivered through email to our valued
customers. Support requests can be sent to
support- a [email protected].
Software upgrades are available for download in the restricted
access download area of DAVE Embedded Systems web site:
http://www.dave.eu/reserved-area. An account is required to
access this area and is provided to customers who purchase the
development kit (please contact support- a [email protected] for
account requests)..
Please refer to our Web site at
http://www.dave.eu/dave-cpu-module-imx6-axel.html for the
latest product documentation, utilities, drivers, Product
Change Noti cations, Board Support Packages, Application
Notes, mechanical drawings and additional tools and software.
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1.7 Related documents
Document Location
DAVE Embedded
Systems Developers
Wiki
http://wiki.dave.eu/index.php/
Main_Page
Freescale i.MX
6Dual/6 uad Applications
Processor Reference
Manual
http://cache.freescale.com/file
s/32bit/doc/ref_manual/IMX6D
RM.pdf?
fpsp=1&WT_TYPE=Reference
%20Manuals&WT_VENDOR=F
REESCALE&WT_FILE_FORMAT=
pdf&WT_ASSET=Documentatio
n
Tab. 1: Related documents
1.8 Conventions, Abbreviations, Acronyms
Abbreviation Definition
i.MX 6 APRM i.MX 6 Application Processor Reference
Manual
IPU Image Processing Unit
GPI General purpose input
GPIO General purpose input and output
GPO General purpose output
PCB Printed circuit board
RTC Real time clock
SOM System on module
TRM Technical Reference Manual
XELK AXEL Embedded Linux Kit
Tab. 2: Abbreviations and acronyms used in this manual
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Revision History
Version Date Notes
0.9.0 October 2013 First Draft
1.0.0 November 2013 First official release with XELK
1.0.0
1.0.1 January 2014 Minor fixes
1.0.2 August 2014 Minor fixes
Fixed power-up sequence diagram
1.0.3 November 2014 Minor fixes
Released with XELK 2.0.0
1.0.4 April 2015 Minor fixes
Added BOARD_PGOOD info
Notes on NVCC_EIM_EXT
Released with XELK 2.1.0
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2 Introduction
AXEL is the new top-class
Solo/Dual/Quad core ARM
Cortex-A9 CPU module by
DAVE Embedded Systems,
based on the recent
Freescale i.MX6 application
processor.
Thanks to AXEL, customers
have the chance to save time
and resources by using a
compact solution that
permits to reach scalable
performances that perfectly
ts the application
requirements avoiding complexities on the carrier board.
The use of this processor enables extensive system-level
differentiation of new applications in many industry elds,
where high-performance
and extremely compact
form factor (85mm x
50mm) are key factors.
Smarter system designs
are made possible,
following the trends in
functionalities and
interfaces of the new,
state-of-the-art
embedded products.
AXEL offers great
computational power,
thanks to the rich set of
peripherals, the
Scalable ARM Cortex-A9 together with a large set of
high-speed I/Os (up to 5GHz).
AXEL enables designers to create smart products suitable for
harsh mechanical and thermal environments, allowing the
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Fig. 1: AXEL – Powered by i.MX6
processor
Fig. 2: AXEL – Solo / Dual / uad
core ARM Cortex A9