Dave Embedded Systems AXEL LITE User manual

Solo / Dual / Quad
ARM Cortex-A9 MPCore
CPU Module
HARDWARE
MANUAL
[email protected]
www.dave.eu
DAVE Embedded Systems
LITE LINE
AXEL LITE

AXEL LITE Hardware Manual v. 0.9.5
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Table of Contents
1 Preface.....................................................................................................................................6
1.1 About this manual.............................................................................................................6
1. Copyrights/Trademarks....................................................................................................6
1.3 Standards..........................................................................................................................6
1.4 Disclaimers.......................................................................................................................6
1.5 Warranty...........................................................................................................................6
1.6 Technical Support.............................................................................................................7
1.7 Related documents...........................................................................................................8
1.8 Conventions, Abbreviations, Acronyms............................................................................8
Introduction............................................................................................................................10
.1 Product Highlights...........................................................................................................1
. Block Diagram................................................................................................................13
.3 Feature Summary...........................................................................................................14
3 Design overview.....................................................................................................................16
3.1 Freescale i.MX6 application processor..........................................................................16
3. DDR3 memory bank.......................................................................................................18
3.3 NOR flash bank..............................................................................................................18
3.4 NAND flash bank............................................................................................................19
3.5 Memory Map...................................................................................................................19
3.6 Power supply unit........................................................................................................... 0
3.7 CPU module connectors................................................................................................. 0
4 Mechanical specifications...................................................................................................... 1
4.1 Board Layout.................................................................................................................. 1
4. Connectors.....................................................................................................................
5 Power, reset and control........................................................................................................ 3
5.1 Power Supply Unit (PSU) and recommended power-up sequence............................... 3
5.1.1 Power-up sequence................................................................................................ 4
5.1. Power rails and related signals............................................................................... 5
5. Reset scheme and control signals................................................................................. 6
5. .1 CPU_PORn............................................................................................................. 6
5.3 System boot.................................................................................................................... 7
5.3.1 Boot options............................................................................................................ 7
5.3.1.1SPI NOR / SD option........................................................................................ 7
5.3.1. NAND / SD option............................................................................................. 8
5.4 Clock scheme................................................................................................................. 8
5.5 Recovery......................................................................................................................... 8
5.5.1 JTAG Recovery....................................................................................................... 8
5.5. USB Recovery......................................................................................................... 9
5.5.3 SD/MMC Recovery.................................................................................................. 9
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5.6 Multiplexing..................................................................................................................... 9
6 Pinout table............................................................................................................................30
6.1 Carrier board mating connector J .................................................................................31
7 Peripheral interfaces..............................................................................................................39
7.1 Notes on pin assignment................................................................................................39
7. Gigabit Ethernet..............................................................................................................39
7.3 USB.................................................................................................................................40
7.3.1 USB Host.................................................................................................................40
7.3. USB OTG................................................................................................................40
7.4 Video Output ports..........................................................................................................41
7.4.1 LVDS........................................................................................................................41
7.4.1.1LVDS0...............................................................................................................4
7.4.1. LVDS1...............................................................................................................4
7.4. HDMI........................................................................................................................43
7.4.3 Parallel RGB............................................................................................................44
7.5 Video Input ports.............................................................................................................45
7.5.1 Parallel RGB............................................................................................................45
7.5. MIPI CSI..................................................................................................................45
7.6 UARTs.............................................................................................................................45
7.6.1 UART1.....................................................................................................................46
7.6. UART .....................................................................................................................46
7.6.3 UART3.....................................................................................................................47
7.6.4 UART4.....................................................................................................................47
7.6.5 UART5.....................................................................................................................47
7.7 SPI..................................................................................................................................48
7.7.1 ECSPI1....................................................................................................................48
7.7. ECSPI ....................................................................................................................49
7.7.3 ECSPI3....................................................................................................................49
7.7.4 ECSPI4....................................................................................................................50
7.7.5 ECSPI5....................................................................................................................50
7.8 I²C...................................................................................................................................51
7.8.1 I²C1..........................................................................................................................51
7.8. I²C ..........................................................................................................................51
7.8.3 I²C3..........................................................................................................................51
7.9 CAN................................................................................................................................5
7.9.1 FLEXCAN1..............................................................................................................5
7.9. FLEXCAN ..............................................................................................................53
7.10 JTAG.............................................................................................................................53
7.11 SD/SDIO/MMC..............................................................................................................54
7.11.1 MMC/SD/SDIO1....................................................................................................54
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7.11. MMC/SD/SDIO ....................................................................................................55
7.11.3 MMC/SD/SDIO3....................................................................................................56
7.1 PCI Express..................................................................................................................57
7.13 Audio interface..............................................................................................................57
7.14 Keypad..........................................................................................................................57
7.15 GPIO.............................................................................................................................58
8 Operational characteristics....................................................................................................59
8.1 Maximum ratings............................................................................................................59
8. Recommended ratings...................................................................................................59
8.3 Power consumption........................................................................................................59
8.3.1 Set 1........................................................................................................................59
8.3. Set ........................................................................................................................60
8.4 Heat Dissipation..............................................................................................................60
9 Application notes....................................................................................................................63
Index of Tables
Tab. 1: Related documents........................................................................................................8
Tab. : Abbreviations and acronyms used in this manual.........................................................8
Tab. 3: CPU, Memories, Busses..............................................................................................14
Tab. 4: Peripherals...................................................................................................................15
Tab. 5: Electrical, Mechanical and Environmental Specifications...........................................15
Tab. 6: i.MX6 comparison........................................................................................................18
Tab. 7: DDR3 specifications.....................................................................................................18
Tab. 8: NOR flash specifications..............................................................................................19
Tab. 9: eCSPI1 pin mapping....................................................................................................19
Tab. 10: NAND flash specifications..........................................................................................19
Tab. 11: Power dissipation Vs.Thermal Resistance.................................................................61
Tab. 1 : Ambient Temperature Vs.Thermal Resistance...........................................................61
Illustration Index
Fig. 1: AXEL-LITE- Powered by I.MX6 processor....................................................................10
Fig. : AXEL-LITE – Solo / Dual / Quad core ARM Cortex A9.................................................10
Fig. 3: AXEL LITE SOM (top view)............................................................................................1
Fig. 4: Board layout - Top view.................................................................................................. 1
Fig. 5: Board layout - Bottom view............................................................................................
Fig. 6: On board JTAG connector J7........................................................................................53
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AXEL LITE Hardware Manual v. 0.9.5
Preface
. About this manual
This Hardware Manual describes the AXEL LITE CPU module design
and functions.
Precise specifications for the Freescale i.MX6 processor can be found in
the CPU datasheets and/or reference manuals.
.2 Copyrights/Trademarks
Ethernet® is a registered trademark of XEROX Corporation.
All other products and trademarks mentioned in this manual are property
of their respective owners.
All rights reserved. Specifications may change any time without
notification.
.3 Standards
DAVE Embedded Systems is certified to ISO 9001 standards.
.4 Disclaimers
DAVE Embedded Systems does not assume any responsibility about
availability, supplying and support regarding all the products mentioned in
this manual that are not strictly part of the AXEL LITE CPU module.
AXEL LITE CPU Modules are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. DAVE Embedded
Systems customers who are using or selling these products for use in
such applications do so at their own risk and agree to fully indemnify
DAVE Embedded Systems for any damage resulting from such
improper use or sale.
.5 Warranty
AXEL LITE is warranted against defects in material and workmanship for
the warranty period from the date of shipment. During the warranty
period, DAVE Embedded Systems will at its discretion decide to repair
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AXEL LITE Hardware Manual v. 0.9.5
or replace defective products. Within the warranty period, the repair of
products is free of charge as long as warranty conditions are observed.
The warranty does not apply to defects resulting from improper or
inadequate maintenance or handling by the buyer, unauthorized
modification or misuse, operation outside of the product’s environmental
specifications or improper installation or maintenance.
DAVE Embedded Systems will not be responsible for any defects or
damages to other products not supplied by DAVE Embedded Systems
that are caused by a faulty AXEL LITE module.
.6 Technical Support
We are committed to making our product easy to use and will help
customers use our CPU modules in their systems. Technical support is
delivered through email to our valued customers. Support requests can
be sent to support- a [email protected].
Software upgrades are available for download in the restricted access
download area of DAVE Embedded Systems web site:
http://www.dave.eu/reserved-area. An account is required to access this
area and is provided to customers who purchase the development kit
(please contact support- a [email protected] for account requests)..
Please refer to our Web site to http://www.dave.eu/products/axel-lite for
the latest product documentation, utilities, drivers, Product Change
Notifications, Board Support Packages, Application Notes, mechanical
drawings and additional tools and software.
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AXEL LITE Hardware Manual v. 0.9.5
.7 Related documents
Document Location
DAVE Embedded Systems
Developers Wiki
http://wiki.dave.eu/index.php/Main_
Page
NXP i.MX 6Dual/6Quad
Applications
Processor Reference Manual
http://cache.freescale.com/files/3
bit/doc/ref_manual/IMX6DQRM.pdf
?fpsp=1&WT_TYPE=Reference
% 0Manuals&WT_VENDOR=FRE
ESCALE&WT_FILE_FORMAT=pdf
&WT_ASSET=Documentation
Tab. : Related documents
.8 Conventions, Abbreviations, Acronyms
Abbreviation Definition
i.MX 6 APRM i.MX 6 Application Processor Reference
Manual
IPU Image Processing Unit
GPI General purpose input
GPIO General purpose input and output
GPO General purpose output
PCB Printed circuit board
RTC Real time clock
SOM System on module
TRM Technical Reference Manual
XELK Axel Embedded Linux Kit
Tab. 2: Abbreviations and acronyms used in this manual
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AXEL LITE Hardware Manual v. 0.9.5
Revision History
Version Date Notes
0.8.0 February 014 First Draft
0.8.5 February 014 First Revision
0.9.0 February 014 First Release
0.9.1 May 014 Minor fixes
Added J7 pinout
Completed Section 5
Added UART4 interface
0.9. August 014 Fixed PGOOD signal description
0.9.3 November 014 Minor fixes
0.9.4 October 016 Minor fixes
0.9.5 October 016 Minor fixes
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AXEL LITE Hardware Manual v. 0.9.5
2 Introduction
AXEL LITE is the new top-class Single - Dual - Quad Core ARM Cortex-
A9 CPU module by DAVE Embedded
Systems, based on the recent NXP i.MX6
application processor. Thanks to AXEL
LITE, customers have the chance to save
time and resources by using a compact
solution that permits to reach scalable
performances that perfectly fits the
application requirements avoiding
complexities on the carrier board. The use
of this processor enables extensive
system-level differentiation of new
applications in many industry fields, where
high-performance and extremely compact
form factor (67,5 mm x 43 mm) are key
factors. Smarter system designs are made possible, following the trends
in functionalities and
interfaces of the new, state-
of-the-art embedded
products.
AXEL LITE enables
designers to create smart
products suitable for harsh
mechanical and thermal
environments, allowing the
development of high
computing and reliable
solutions. Thanks to the
tight integration between the
ARM Core-based
processing system, designers are able to share the application through
the multi-core platform and/or to divide the task on different cores in
order to match with specific application requirements (thanks to AMP is
possible to create application where RTOS and Linux works together on
different cores). AXEL LITE is designed in order to keep full compatibility
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Fi . 2: AXEL-LITE – Solo / Dual / Quad
core ARM Cortex A9
Fi . 1: AXEL-LITE- Powered
b I.MX6 processor

AXEL LITE Hardware Manual v. 0.9.5
with the LITE Line CPU modules where quality and reliability are
important factors.
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2. Product Highlights
●Unmatched performances thanks to Solo / Dual / Quad Core @ 1.
GHz
●All memories you need on-board
●Boot from NOR for safe applications
●Enabling massive computing applications thanks to wide range DDR3
RAM memory up to GB
●Single 3V3 Power Supply
●Reduced carrier complexity: SDIO, dual CAN, USB, Ethernet with on-
board PHY, GPIOs
●Multiple video outputs available
●H 64 Video encoding and decoding
●Multiple video inputs available
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Fi . 3: AXEL LITE SOM (top view)

AXEL LITE Hardware Manual v. 0.9.5
2.2 Block Diagram
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2.3 Feature Summary
Feature Specifications Options
CPU NXP i.MX6 S/D/Q ARM Cortex A9 MPCore @
1. GHz
Cache L1: 3 Kbyte instruction, 3 Kbyte data
L : Unified data/instruction, 1 MByte
RAM Default: up to GB DDR3 (for 4GB support
please contact our sales department)
x64 data bus width @ 533 MHz
Storage Bootable SPI NOR 16, 3 , 64 MB
Flash NAND: all sizes, on request
Expansion bus One PCI Express .0 lane with integrated PHY
(5.0 GT/s Endpoint/Root Complex operations)
Tab. 3: CPU, Memories, Busses
Feature Specifications Options
Graphics
Controller
16-/ 4-bit HD Display Port
1x HDMI 1.4 channel + DDC
1x TFT/RGB output port
x LVDS output ports
D/3D Engines GPU D cores for raster (R D, Vivante GC3 0)
and vector (V D, Vivante GC355) graphics
acceleration
GPU3D core (Vivante GC 000) for
OpenGL/OpenGL ES/OpenVG/OpenCL API
acceleration
Video capture 1x RGB Parallel port 1 bit 1x MIPI CSI port
Video
processing
High performance, multi-standard VPU
Up to 1080p60 H 64 decode
Up to 1080p30 H 64 encode
Coprocessors Media Processing Engine with NEON™ &
VFPv3-D3 Floating-Point Unit
USB 1x .0 OTG port (PHY on board)
1x .0 Host port (PHY on board)
UARTs 5x UART ports (up to 1x full, up to 4x four-
wires)
GPIO Available lines, shared with other functions
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Feature Specifications Options
(interrupts available)
Networks Default: Fast Ethernet 10/100 Mbps with
integrated PHY (for Gigabit support please
contact our sales department)
CAN x CAN .0B ports (1x with integrated PHY)
SD/MMC up to 3x SD 3.0 /SDIO 3.0/MMC 4.x compliant
controllers
Serial buses 5x full-duplex SPI ports with four peripheral
chip selects
3x master and slave I²C interfaces
Audio up to 3x I²S / SSI / AC97
Timers Enhanced Periodic Interrupt Timer
General Purpose Timer
Debug JTAG IEEE 1149.1 Test Access Port
CoreSight™ and Program Trace Macrocell
(PTM)
Tab. 4: Peripherals
Feature Specifications Options
Supply Voltage Single 3.3V input, voltage regulation on board
Active power
consumption
See section 8.3 - Power consumption
Dimensions 67.5mm x 43mm
Operating
temperature
range
Commercial: 0°C / +70°C
Industrial: -40°C / +85°C
Connectors SODIMM 04 pins
Tab. 5: Electrical, Mechanical and Environmental Specifications
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AXEL LITE Hardware Manual v. 0.9.5
3 Design overview
The heart of AXEL LITE module is composed by the following
components:
●NXP i.MX6 Solo / Dual / Quad core SoC application
processor
●Power supply unit
●DDR memory banks
●NOR and NAND flash banks
●1x 04 pin SODIMM connector with interfaces signals
This chapter shortly describes the main AXEL LITE components.
3. Freescale i.MX6 application processor
The i.MX6 Solo/Dual/Quad processors feature NXP's advanced
implementation of the ARM® Cortex®-A9 MPCore, which operates at
speeds up to 1. GHz. They include D and 3D graphics processors,
1080p video processing, and integrated power management. As a result,
the i.MX6 devices are able to serve a wide range of applications
including:
●Automotive driver assistance, driver information, and
infotainment
●Multimedia-centric smart mobile devices
●Instrument clusters, and portable medical devices.
●E-Readers, smartbooks, tablets
●Intelligent industrial motor control, industrial networking, and
machine vision
●IP and Smart camera
●Human-machine interfaces
●Medical diagnostics and imaging
●Digital signage
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●Video and night vision equipment
●Multimedia-focused products
●Entertainment and gaming appliances
The i.MX6 application processor is composed of the following major
functional blocks:
●ARM Cortex-A9 MPCore x/4x CPU Processor, featuring:
1 Megabyte unified L cache shared by all CPU cores
NEON MPE co-processor
General Interrupt Controller (GIC) with 1 8 interrupt
support
Snoop Control Unit (SCU)
External memories interconnect
●Hardware accelerators, including:
VPU -Video Processing Unit
Two IPUv3H -Image Processing Unit (version 3H)
D/3D/Vector graphics accelerators
●Connectivity peripherals, including
PCIe
SATA
SD/SDIO/MMC
Serial buses: USB, UART, I²C, SPI, ...
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AXEL LITE can mount three versions of the i.MX6 processor. The
following table shows a comparison between the processor models,
highlighting the differences:
Processor #
core
s
Clock L2
cach
e
DDR3 Graphics
acceleration
IPU VP
U
SATA
-II
i.MX6 Solo 1 800 MHz
1 GHz
51 KB 3 bit @
400 MHz
3D: Vivante GC880
2D: Vivante GC3 0
Vector: N.A.
1x 1x N.A.
i.MX6 Dual 850 MHz
1 GHz
1. GHz
1 MB 64 bit @
533 MHz
3D: Vivante GC 000
2D: Vivante GC3 0
Vector: Vivante GC335
x x Yes
i.MX6 Quad 4 850 MHz
1 GHz
1. GHz
1MB 64 bit @
533 MHz
3D: Vivante GC 000
2D: Vivante GC3 0
Vector: Vivante GC335
x x Yes
Tab. 6: i.MX6 comparison
3.2 DDR3 memory bank
DDR3 SDRAM memory bank is composed by 4x 16-bit width chips
resulting in a 64-bit combined width bank.
The following table reports the SDRAM specifications:
CPU connection Multi-mode DDR controller (MMDC)
Size min 51 MB
Size max GB (for 4GB support please contact
our sales department)
Width 64 bit
Speed 533 MHz
Tab. 7: DDR3 specifications
3.3 NOR flash bank
NOR flash is a Serial Peripheral Interface (SPI) device. This device is
connected to the eCSPI channel 1. Specific models of the AXEL LITE
SOM provide the SPI NOR as boot memory.
The following table reports the NOR flash specifications:
CPU connection eCSPI channel 1
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Size min 16 MByte
Size max 64 MByte
Chip select ECSPI1_SS0
Bootable Yes
Tab. 8: NOR flash specifications
For AXEL LITE models that have the NOR flash bank populated, the
eCSPI channel 1 is mapped by design on the following multiplexed pins:
NOR signal Function I.MX6 signal I.MX6 ball #
NOR_CS0n Chip select EIM_EB E
NOR_DQ0/MOSI Serial Input EIM_D18 D 4
NOR_DQ1/MISO Serial Output EIM_D17 F 1
NOR_SCLQ Serial clock EIM_D16 C 5
Tab. 9: eCSPI1 pin mapping
3.4 NAND flash bank
On board main storage memory is a 8-bit wide NAND flash connected to
the CPU's Raw NAND flash controller. Optionally, it can act as boot
peripheral.
The following table reports the NAND flash specifications:
CPU connection Raw NAND flash controller
Page size 51 byte, kbyte or 4 kbyte
Size min 1 8 MByte
Size max GByte
Width 8 bit
Chip select NANDF_CS0
Bootable Yes
Tab. 0: NAND flash specifications
3.5 Memory Map
For detailed information, please refer to chapter “Memory Maps” of the
i.MX Applications Processor Reference Manual.
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3.6 Power supply unit
AXEL LITE, as the other LITE Line CPU modules, embeds all the
elements required for powering the unit, therefore power sequencing is
self-contained and simplified. Nevertheless, power must be provided
from carrier board, and therefore users should be aware of the ranges
power supply can assume as well as all other parameters. For detailed
information, please refer to Section 5.1 Power Supply Unit (PSU) and
recommended power-up sequence.
3.7 CPU module connectors
All interface signals AXEL LITE provides are routed through SODIMM
DDR3 04 pin (named J ). The dedicated carrier board must mount the
mating connector and connect the desired peripheral interfaces
according to AXEL LITE pinout specifications.
For mechanical information, please refer to Section 4 (Mechanical
specifications). For pinout and peripherals information, please refer to
Sections 6 (Pinout table) and 7 (Peripheral interfaces).
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