Ebyte E78-400M22S1C User manual

Chengdu Ebyte Electronic Technology Co.,Ltd. E78-400M22S1C User Manual
E78-400M22S1C
ASR6601SE 400/470MHz LPWAN Low Power LoRa Wireless SoC

Chengdu Ebyte Electronic Technology Co.,Ltd. E78-400M22S1C User Manual
Copyright ©2012–2021，Chengdu Ebyte Electronic Technology Co.,Ltd.
1
Contents
DISCLAIMER............................................................................................................................................................................................. 2
1 INTRODUCTION.....................................................................................................................................................................................3
1.1 BRIEF INTRODUCTION....................................................................................................................................................3
1.2 FEATURES...................................................................................................................................................................... 3
1.3 APPLICATION................................................................................................................................................................. 3
2 SPECIFICATION AND PARAMETER...................................................................................................................................................4
2.1 SPECIFICATION...............................................................................................................................................................4
2.2 LIMIT PARAMETER......................................................................................................................................................... 4
2.3 OPERATING PARAMETER................................................................................................................................................5
2.4 PARAMETER DESCRIPTION............................................................................................................................................. 5
3 SIZE AND PIN DEFINITION..................................................................................................................................................................6
4 E78-400M22S1C DEVELOPMENT.........................................................................................................................................................8
5 FAQ........................................................................................................................................................................................................... 9
5.1 COMMUNICATION RANGE IS TOO SHORT........................................................................................................................9
5.2 MODULE IS EASY TO DAMAGE....................................................................................................................................... 9
6 PRODUCTION GUIDANCE................................................................................................................................................................... 9
6.1 REFLOW SOLDERING TEMPERATURE.............................................................................................................................. 9
6.2 REFLOW SOLDERING CURVE........................................................................................................................................ 10
7 BULK PACKAGING............................................................................................................................................................................. 11
REVISION HISTORY............................................................................................................................................................................... 11
ABOUT US................................................................................................................................................................................................11

Chengdu Ebyte Electronic Technology Co.,Ltd. E78-400M22S1C User Manual
Copyright ©2012–2021，Chengdu Ebyte Electronic Technology Co.,Ltd.
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Disclaimer
EBYTE reserves all rights to this document and the information contained herein.
Products, names, logos and designs described herein may in whole or in part be
subject to intellectual property rights. Reproduction, use, modification or disclosure to
third parties of this document or any part thereof without the express permission of
EBYTE is strictly prohibited.
The information contained herein is provided “as is” and EBYTE assumes no
liability for the use of the information. No warranty, either express or implied, is given,
including but not limited, with respect to the accuracy, correctness, reliability and
fitness for a particular purpose of the information. This document may be revised by
EBYTE at any time. For most recent documents, visit www.ebyte.com.

Chengdu Ebyte Electronic Technology Co.,Ltd. E78-400M22S1C User Manual
Copyright ©2012–2021，Chengdu Ebyte Electronic Technology Co.,Ltd.
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1 Introduction
1.1 Brief Introduction
E78 series are RF transceiver module of various frequency bands designed
and manufactured by Chengdu Ebyte, with long communication distance and
extremely low power mode current consumption. It is a small-sized SMD type
(pin pitch 1. lmm).
E78-400M22S1C is developed by ASR6601SE, the first domestically made
LPWAN wireless communication SoC chip that supports LoRa. ASR6601SE
integrates a general-purpose micro Limit parametercontroller and radio
frequency unit on a single chip, including radio frequency transceivers, modems,
and a 48 MHz clocked 32-bit MCU with Arm Cortex M4 architecture. The Flash capacity is 256kB, and the SRAM
capacity is 64kB. Low power consumption, support up to 62.5Kbps airspeed under LoRa modulation, support up to
300Kbps airspeed under (G)FSK modulation, support LoRaWAN, LinkWAN multiple protocol standards, applicable for
a variety of IoT application scenarios, is currently the best choice for LPWAN applications..
E78-400M22S1C is a hardware platform, cannot be used independently. Users need to conduct secondary
development. (We can customize standard LoRaWan, Ali linkWan nodes).
1.2 Features
The first domestic universal LPWAN wireless SoC module based on ASR6601SE;
Support LoRaWAN, LinkWAN multiple protocol standards;
Ultra-high sensitivity of -148 dBm and a maximum transmit power of 22 dBm;
Support 42 configurable GPIOs：3xI2C，1xICS，4xUART，1xLPUART，1xSWD，3xSPI，1xQSPI 和2xWDG;
62.5Kbps air data rate under LoRa modulation, and 300Kbps under (G)FSK modulation;
Support the global license-free ISM 433MHz band, support 470MHz meter reading frequency band;
Support deep sleep, the power consumption of the whole machine is about 2uA in this mode;
The measured communication distance can reach 5.5km;
Built-in embedded LCD driver;
Support AES, DES, RSA, ECC, SHA, SM2/3/4 hardware encryption;
Industrial grade standard design, support -40 ~ 85 °C for working over a long time;
IPEX and stamp hole optional, good for secondary development and integration.
1.3 Application
Street lamp control, environmental monitoring, etc;
Smart parking lot sensor;
Smart home and industrial sensors, etc.
Smart Agriculture Sensor;
Wireless alarm security system;

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Building automation solutions;
Wireless industrial-grade remote control;
Health care products;
Advanced Meter Reading Architecture(AMI).
2 Specification and parameter
2.1 Specification
Model No.
Frequency
Transmit
power
Reference distance(stamp
hole/IPEX)
Package
Antenna
E78-400M22S1C
410-490MHz
21dBm
5.5Km(Lora 1kbps)
SMD
Stamp/IPEX
Model No.
IC
Size
Net Weight
Operation
Temperature
Operation
Humidity
Storage
Temperature
E78-400M22S1C
ASR6601S
E
26* 16*2.8 mm
1.9g
-40 ~ 85℃
10% ~ 90%
-40 ~ 125°C
2.2 Limit parameter
Main parameter
Performance
Remark
Min
Max
Power supply（V）
-0.3
3.9
≥3.9 V ensures output power
Digital input level voltage
（V）
-0.3
3.9
≥3.9 V ensures output power
Rf input power（dBm）
-
+10
Chances of burn is slim when modules are used in
short distance
Temperature（℃）
Storage：
-55~+125
Operating：
-40~+85
Industrial grade
Humidity（%）
Storage：
5~95
Operating：
10~95
Without condensation

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2.3 Operating parameter
Main parameter
Performance
Remark
Min
Type
Max
Power supply（V）
1.7
3.3
3.7
Communication level（V）
1.7
3.3
3.7
TX Current (mA)
105
108
110
LoRa Pout=+22dBm
RC current (mA)
8.5
8.7
11
LoRa 125KHz DCDC Mode, MCU
Operation, Build-in TCXO
Sleep current(uA)
0.8
1
1
MCU reserved
Sleep current(uA)
1.6
1.8
1.8
RF/MCU/RTC reserved
TX power (dBm)
20.6
20.8
21
Set up Pout=+22dBm
Recommended frequency (MHz)
410
433/470/490
490
Module working frequency
410~490MHz
Receiving sensitivity (dBm)
-
-148
-
TCXO crystal (MHz)
-
32
-
Built-in crystal oscillator and uses
PWR_TCXO for power supply
TCXO crystal voltage（V）
1.8
1.8
3.3
Recommended output voltage of
PWR_TCXO pin
Antenna
IPEX/Stamp hole
50 ohm impedance
2.4 Parameter description
When designing the power supply circuit for the module, it is recommended to reserve more than 30% of the
remaining amount, and the whole machine is conducive to long-term stable operation;
The current required for the inst ant of launch is large but often because the launch time is extremely short, the total
energy consumed may be smaller;
When customers uses an external antenna, the impedance matching degree between the antenna and the module at
different frequency points will affect the magnitude of the transmission current to varying degrees;
The current consumed by the RF chip in the pure receiving state is called the receiving current. Some RF chips with
communication protocols or developers have loaded some self-developed protocols on the whole machine, which
may cause the receiving current of the test to be too large;
The current in the purely receiving state is often mA level, and the "receiving current" of the μA level needs to be
processed by the developer through software;
The shutdown current is often much smaller than the current consumed by the power supply part of the whole
machine at no load, without being overly demanding;
Since the material itself has a certain error, a single LRC component has an error of +0.1%. However, since a
plurality of LRC components are used in the entire RF loop, there is a case where error accumulation occurs,

Chengdu Ebyte Electronic Technology Co.,Ltd. E78-400M22S1C User Manual
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resulting in a difference in emission current and reception current of different modules;
Reducing the transmit power can reduce power consumption to some extent, but reducing the transmit power
emissions for a number of reasons reduces the efficiency of the internal PA.
3 Size and pin definition
Pin No.
Item
Direction
Description
1
GND
-
Ground wire, connected to the power reference ground
2
GND
-
Ground wire, connected to the power reference ground
3
GND
-
Ground wire, connected to the power reference ground
4
NC
-
Reserved
5
GPIO01
Input/Output
MCU GPIO
6
GPIO00
Input/Output
MCU GPIO
7
GPIO03
Input/Output
MCU GPIO
8
GPIO02
Input/Output
MCU GPIO
9
GPIO06
Input/Output
MCU GPIO
10
GPIO07
Input/Output
MCU GPIO

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11
NRST
Input
External reset pin
12
GPIO14
Input/Output
MCU GPIO
13
GPIO15
Input/Output
MCU GPIO
14
GPIO23
Input/Output
MCU GPIO
15
GPIO25
Input/Output
MCU GPIO
16
GPIO24
Input/Output
MCU GPIO
17
GPIO27
Input/Output
MCU GPIO
18
GPIO26
Input/Output
MCU GPIO
19
GPIO29
Input/Output
MCU GPIO
20
GND
-
Ground wire, connected to the power reference ground
21
GPIO28
Input/Output
MCU GPIO
22
GPIO30
Input/Output
MCU GPIO
23
GPIO31
Input/Output
MCU GPIO
24
GPIO62
Input/Output
MCU GPIO
25
UART0_RX
Input
MCU GPIO
26
UART0_TX
Output
MCU GPIO
27
GPIO60
Input/Output
MCU GPIO
28
GPIO58
Input/Output
MCU GPIO
29
GPIO13
Input/Output
MCU GPIO
30
GPIO12
Input/Output
MCU GPIO
31
VCC
-
Power supply, range 2.5V ~ 3.7V (recommended to add external ceramic
filter capacitor)
32
GND
-
Ground wire, connected to the power reference ground
33
GND
-
Ground wire, connected to the power reference ground
34
GPIO11
Input/Output
MCU GPIO
35
GPIO08
Input/Output
MCU GPIO
36
GPIO05
Input/Output
MCU GPIO
37
GPIO04
Input/Output
MCU GPIO
38
GPIO09
Input/Output
MCU GPIO
39
GPIO45
Input/Output
MCU GPIO
40
GPIO44
Input/Output
MCU GPIO
41
GPIO42
Input/Output
MCU GPIO
42
GPIO41
Input/Output
MCU GPIO
43
GPIO40
Input/Output
MCU GPIO
44
GPIO37
Input/Output
MCU GPIO
45
GPIO33
Input/Output
MCU GPIO
46
GPIO32
Input/Output
MCU GPIO
47
GPIO36
Input/Output
MCU GPIO
48
GPIO35
Input/Output
MCU GPIO
49
GPIO34
Input/Output
MCU GPIO
50
GND
-
Ground wire, connected to the power reference ground

Chengdu Ebyte Electronic Technology Co.,Ltd. E78-400M22S1C User Manual
Copyright ©2012–2021，Chengdu Ebyte Electronic Technology Co.,Ltd.
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51
ANT
Output
Antenna interface, stamp hole (50 ohm characteristic impedance)
52
GND
-
Ground wire, connected to the power reference ground
★For the pin definition,software driver and communication protocol of the module, please refer to ASR official
《ASR6601SE Datasheet》 ★
4 E78-400M22S1C development
In the process of software development, please be sure to follow ASR6601SE official user manual and related
software development materials in detail, details see ASR official;
The E78-400M22S1C module has a built-in 32MHz TCXO. The crystal power supply uses the PWR_TCXO pin of
the ASR6601SE chip. The recommended voltage is 1.8V;
The module has a built-in external 32.768KHz crystal oscillator, and the load capacitance of the crystal oscillator is
programmable inside the ASR6601SE chip;
Module firmware download can use SWD and UART two ways, the pins are respectively:
The module integrates a radio frequency switch, which supports two modes of single control and dual control, see
the table below for details：
Operating mode
GPIO10
GPIO59
Remark
Transmit mode
1
1
Single control mode
Receive mode
1
0
Single control mode
Others: GPIO59 (LORA_RF_SWITCH) is the DIO2 pin with built-in RF. After the official SDK is modified to
TCXO mode, it can be directly downloaded to the module for running test.
Download port
Pin description
SWD
GPIO06 (SWDATA), GPIO07 (SWCLK), NRST respectively are the 9th, 10th, and
11th pins
Serial
UART0_RX and UART0_TX respectively are the 25th and 26th pins
Note: Use the official SDK, before starting to download, please connect GPIO02 to high level, then restart the module
to enter the serial download mode.

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Copyright ©2012–2021，Chengdu Ebyte Electronic Technology Co.,Ltd.
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5 FAQ
5.1 Communication range is too short
The communication distance will be affected when obstacle exists;
Data lose rate will be affected by temperature, humidity and co-channel interference;
The ground will absorb and reflect wireless radio wave, so the performance will be poor when testing near ground;
Sea water has great ability in absorbing wireless radio wave, so performance will be poor when testing near the sea;
The signal will be affected when the antenna is near metal object or put in a metal case;
Power register was set incorrectly, air data rate is set as too high (the higher the air data rate, the shorter the
distance);
The power supply low voltage under room temperature is lower than 2.5V, the lower the voltage, the lower the
transmitting power;
Due to antenna quality or poor matching between antenna and module.
5.2 Module is easy to damage
Please check the power supply, ensure it is between the recommended values, voltage exceed the maximum than
will cause permanent damage to the module.
Please check the stability of power supply, the voltage cannot fluctuate too much.
Please make sure antistatic measure are taken when installing and using, high frequency devices have electrostatic
susceptibility.
Please ensure the humidity is within limited range, some parts are sensitive to humidity.
Please avoid using modules under too high or too low temperature.
6 Production guidance
6.1 Reflow soldering temperature
Profile Feature
Curve characteristics
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Solder paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min （Tsmin）
Min preheating temp.
100℃
150℃
Preheat temperature max (Tsmax)
Mx preheating temp.
150℃
200℃
Preheat Time (Tsmin to Tsmax)(ts)
Preheating time
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
Average ramp-up rate
3℃/second max
3℃/second max
Liquidous Temperature (TL)
Liquid phase temp.
183℃
217℃

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Time（TL）Maintained Above（TL）
Time below liquid phase line
60-90 sec
30-90 sec
Peak temperature（Tp）
Peak temp.
220-235℃
230-250℃
Aveage ramp-down rate（Tp to Tsmax）
Aveage ramp-down rate
6℃/second max
6℃/second max
Time 25℃ to peak temperature
Time to peak temperature
for 25℃
6 minutes max
8 minutes max
6.2 Reflow soldering curve

Chengdu Ebyte Electronic Technology Co.,Ltd. E78-400M22S1C User Manual
Copyright ©2012–2021，Chengdu Ebyte Electronic Technology Co.,Ltd.
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7 Bulk packaging
Revision history
Version
Date
Description
Issued by
1.0
2020/12/01
Initial version
Linsoin
About us
Technical support: supp[email protected]om
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