Elan eSK-R30B-X User manual

Elan Smart-KeyboardTM
eSK-R30B-X
Windows
Windows Windows
Windows 8
88
8 TouchPad
TouchPad TouchPad
TouchPad
Support
SupportSupport
Supports
ss
s for
for for
for Multi
MultiMulti
Multi-
--
-Touch
TouchTouch
Touch Gesture
Gesture Gesture
Gesture
Solution
Specification
D OC . V ERSION 1.3
ELAN MICROELECTRONICS CORP.
Jan. 2013

Trademark Acknowledgments:
IBM is a registered trademark and PS/2 is a trademark of IBM.
Windows is a trademark of Microsoft Corporation.
ELAN and ELAN logo are trademarks of ELAN Microelectronics Corporation.
Copyright © 2009 by ELAN Microelectronics Corporation
All Rights Reserved
Printed in Taiwan
The contents of this specification are subject to change without further notice. ELAN Microelectronics assumes
no responsibility concerning the accuracy, adequacy, or completeness of this specification. ELAN
Microelectronics makes no commitment to update, or to keep current the information and material contained in
this specification. Such information and material may change to conform to each confirmed order.
In no event shall ELAN Microelectronics be made responsible for any claims attributed to errors, omissions, or
other inaccuracies in the information or material contained in this specification. ELAN Microelectronics shall
not be liable for direct, indirect, special incidental, or consequential damages arising from the use of such
information or material.
The software (if any) described in this specification is furnished under a license or nondisclosure agreement, and
may be used or copied only in accordance with the terms of such agreement.
ELAN Microelectronics products are not intended for use in life support appliances, devices, or systems. Use of
ELAN Microelectronics product in such applications is not supported and is prohibited.
NO PART OF THIS SPECIFICATION MAY BE REPRODUCED OR TRANSMITTED IN ANY FORM OR BY
ANY MEANS WITHOUT THE EXPRESSED WRITTEN PERMISSION OF ELAN MICROELECTRONICS.
ELAN MIC OELECT ONICS CO PO ATION
Headquarters:
No. 12, Innovation Road 1
Hsinchu Science Park
Hsinchu, Taiwan 30077
Tel: [phone]
Fax: [phone]
http://www.emc.com.tw
Hong Kong:
Elan (HK) Microelectronics
Corporation, Ltd.
Flat A, 19/F, World Tech Centre
95 How Ming Street, Kwun
Tong
Kowloon , HONG KONG
Tel: [phone]
Fax: [phone]
[email protected]
USA:
Elan Information
Technology Group (U.S.A.)
1821 Saratoga Ave., Suite 250
Saratoga, CA 95070
USA
Tel: [phone]
Fax:[phone]
Shenzhen:
Elan Microelectronics
Shenzhen, Ltd.
SSMEC Bldg., 3F, Gaoxin S. Ave.
Shenzhen Hi-Tech Industrial Park
Shenzhen, Guandong, CHINA
Tel: [phone]
Fax:[phone]
Shanghai:
Elan Microelectronics
Shanghai , Ltd.
23/Bldg. #115 Lane 572, Bibo Road
Zhangjiang Hi-Tech Park
Shanghai, CHINA
Tel: [phone]
Fax:[phone]

Contents
Solution Specification (V1.3) 2013.01.25 •
••
•iii
1. General Description _____________________________________________________1
2. Features ______________________________________________________________1
3. System Block Diagram___________________________________________________2
4. Schematic Diagram _____________________________________________________3
5. Main Components List___________________________________________________5
5.1 MCU package type __________________________________________________6
6. Touchpad Specifications ________________________________________________15
6.1 Touchpad Orientation ______________________________________________15
6.2 Pin Assignment ___________________________________________________16
6.3 Mechanical Drawing _______________________________________________17
6.4 Mounting Recommendations_________________________________________20
7. Keyboard Matrix ______________________________________________________21
8. Support Gestures Behavior ______________________________________________22
9. Ten key function_______________________________________________________23
10. Power Management ____________________________________________________24
11. The LED indicator _____________________________________________________25
12. Manual Syncing Steps __________________________________________________25

Contents
iv •
••
•Solution Specification (V1.3) 2013.01.25
Specification Revision History
Doc. Version Revision Description Date
1.0 Preliminary Specification 2012/07/19
1.1 Updata dongle circuit 2012/08/20
1.2 Additional the LED indicator and Manual
syncing step described 2012/11/26
1.3 Modify RF ciruit 2013/01/25

Smart-Keyboard eSK-R30B-X
Solution Specification (V1.3) 01.25.2013 •
••
•1
(This specification is subject to change without further notice)
1. General Description
The Smart-Keyboard is a keyboard-touchpad hybrid meant to improve the experience of
using a keyboard attached to a computer as an input device. The Smart-Keyboard allows the
user to control a mouse cursor, enter numeric text, and perform Windows 8 multi-touch
without the need for a touch screen panel.
The touchpad has two distinct features: the first is that the touchpad is behaved as a multi-
touch input device which performs Windows 8 multi-touch as well; the second feature is that
the touchpad can sends graphical keypad characters out which are printed on the touchpad.
2. Features
 Wireless Keyboard with built-in touchpad
 Integrated Touchpad plus 2 mouse buttons
 Touchpad Support:
- Windows 8 Multi-Touch
- Mouse cursor
- Ten-Key function
 Capacitive sensing technique (Elan registered patent *)
 Contact count: Up to 2 fingers
 USB Specification Compliance
-USB Specification Version 2.0 for low-speed requirements
-USB Device Class Definition for Human Interface Device (HID) Version 1.11
 2.4GHz wireless transmission
 Report rate: 90/sec

Smart-Keyboard eSK-R30B-X
2 •
••
•Solution Specification (V1.3) 01.25.2013
(This specification is subject to change without further notice)
3. System Block Diagram
~ Figure 3-1: Smart-Keyboard System Block Diagram ~

Smart-Keyboard eSK-R30B-X
Solution Specification (V1.3) 01.25.2013 •
••
•3
(This specification is subject to change without further notice)
4. Schematic Diagram
 Remote terminal with RF circuit:
~ Figure 4-1a: Smart-Keyboard system schematic diagram ~
U1
EM198860AW
1 2 3 4 5
6
7
8
9
10
11 12 13 14 15
16
17
18
19
20
21
CE
CSN
SCK
MOSI MISO
IRQ
VDD
VSS
XC2
XC1
VDD_PA ANT1 ANT2 VSS VDD
IREF
VSS
VDD
CDVDD
VSS
GND
GND
C3
1.2PF/0402
GND
GND
C24 104
R4 4.7R
S1
KBT1 1.5Vx2 BATTERY
Y1
16Mhz/20ppm
SPI_CLK
TP3 /PGMB
TP5 DINCK
C2
3.9pF/0402
R2 1M/0402
S2
L3 27uH
C19 0.8pF/0402
S10
C7
105/0402
L4 0R/0402
C21 104
S12
U5 ACE701133AM
1
3 2
GND
LX VOUT
TP4 DATA_IN
C5
105/0402
R4 S17
KSW5 Mode
SPI_MISO
C17 104
C10 22P/0402
SPI_CLK
GND
C8 33n/0402
U4
ACE301N22BM
1
2
3Vout
GND
VDD
R9 3K
R7
DR
C11
4.7uF/0603
SW1
POW ER SWITCH
S6
CE
R7 470R
S0
SPI_MOSI
R5 47K
C13
104/0402
3.3VDC
TP1 VPP
R1
C12
*/0402
SPI_MOSI
S8
L2
12nH/0402
DR
C18
*/0402 R1
22K/0402
U3
CAT24C02TD/TSOT23-5
1 2
43 5
SCL GND
VCCSDA
WP
R8 0R
L1
4.7nH/0402
SPI_SDO
GND
S5
RF_CE
SPI_SCK
U2
EM78P451SAQ 44pin QFP
2 3 5 7 8 9
10 11
12
14
16
17
18
19
20
21
22
23 24 25 26 27 28 29 30 31 32 33
34
35
36
37
38
39
40
41
42
43
1 4 6
13
15
44
P91 P92/SDI P94/SCK P50 P51 P52 P53 P54
P55
P57
P81
NC
P82
P83
P84
P85
P86
P87 P60 P61 P62 P63 P64 P65 P66 P67 P72 P71
P70//RESET
NC
NC
NC
VDD
R-OSI
OSCO
VSS
/INT
DATA
P90 P93/SDO P95/SS
P56
P80
CLK
DATA-IO
S15
+
C23
47uF/16V(Tantalum)
RF_CSN
S4
TP8 VDD
R0
KSW3
R
DATA-IO
/INT
L5 2nH/0402
SPI_/SS
SPI_MISO
LED1
BAT LED
BTN1
SPI_CLK
KSW2
L
S7
R3 R6
PCB_ANT S11
KY2
6MHz Cry stal
GND
GND
S9
SPI_SDI
KSW1 ID
GND
SPI_/SS 3.3VDC
TP2 /OEB
R2
C9
22P/0402
R5
D1 1N5819
J1
HEADER 10
1 2 3 4 5 6 7 8 9 10
C14 18PF
S13
TP6 ACLK
S16
ESK-R30B-X-V1.1 1.1 RF 2.4G Smart Key board
A4
1 1Friday , December 21, 2012
Title Size Document Number Rev Date: Sheet of
C15
18PF
S3
C16 104
S14
SPI_CSN
C1 */0402
VDD
BTN2
C4
*/0402
+
C22
100uF/16V(Tantalum)
TP7 VSS
R3 270K

Smart-Keyboard eSK-R30B-X
4 •
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•Solution Specification (V1.3) 01.25.2013
(This specification is subject to change without further notice)
 Dongle terminal:
~ Figure 4-1b: USB dongle schematic diagram ~
RF_CE
TP6 P54
C9
22P/0402
GND
C13 150pF/0402
C1 */0402
RF_DR
C12 1.2pF/0402
DATA_IO
C10
22P/0402
TP1 VDD
C6
105/0402
R1
22K/0402
U1
EM198860W
1 2 3 4 5
6
7
8
9
10
11 12 13 14 15
16
17
18
19
20
21
CE
CSN
SCK
MOSI MISO
IRQ
VDD
VSS
XC2
XC1
VDD_PA ANT1 ANT2 VSS VDD
IREF
VSS
VDD
DVDD
VSS
GND
U3 CAT24C02TD/TSOT23-5
1 2
43 5
SCL GND
VCCSDA
WP
R7 0R
C3
1.2pF/0402
TP9 P57
C20 0.1uF/0402
SPI_MISO C7 0.1uF/0402
R6
330R
TP7 P55
R2 1M/0402
U2
EM78P611G
1 2 3 4 5 6
7
8
9
10
11
12
13 14 15 16 17 18
19
20
21
22
23
24
P77 VUSB OSCI OSCO VSS V3.3
D+
D-
P92
P93
P94/VPP
P53
P54/OE
P55/PGM
P56/DATAIN
P57/DINCLK
P81 P82
P60
P61
P62
P63
P64
P65
R8 NC
GND
C14 4.7uF/0603
L1
4.7nH/0402
C2
3.9pF/0402
SPI_MISO
L2
12nH/0402
PCB_ANT
SPI_MOSI
TP2 OSCI
R3
4.7R/0402
D2 LED
C17 */0402
C4
NC
Y1
16Mhz/20ppm
C16 0.1uF/0402
L4 0/0402
C15
4.7uF/0603
TP8 P56
SPI_CLK RF_CSN
eKM6312_RF2.4G_USB_DONGLE_V1.13 V1.13 eKM6312_RF2.4G USB DONGLE_V1.13
A
1 1Tuesday , December 18, 2012
Title Size Document Number Rev Date: Sheet of
RF_DR
RF_CE
TP4 VPP
R5 4.7R/0402
C8 33n/0402
GND
SPI_CSn
C5 150pF/0402
L5 1nH/0402
DATA_IO
GND
SPI_CLK
C11
*/0402
TP3 VSS
USB PORT
VDD
VSS
D+ / CLK
D- / DATA
SHLD
SPI_CLK SPI_MOSI

Smart-Keyboard eSK-R30B-X
Solution Specification (V1.3) 01.25.2013 •
••
•5
(This specification is subject to change without further notice)
5. Main Components List
Component Part No. Note
Keyboard
Control MCU EM78P451SAQ
Touchpad 83A871-XX11
RF Transceiver EM198860AW
Dongle
USB MCU EM78P611GAW
RF Transceiver EM198860AW
~ Table 5-1: Smart-Keyboard main component list ~

Smart-Keyboard eSK-R30B-X
6 •
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•Solution Specification (V1.3) 01.25.2013
(This specification is subject to change without further notice)
5.1 MCU package type
•44-pin QFP : EM78P451SAQ
CLK DATA /INT VSS OSCO R-OSC I VDD NC NC NC P70/RESET
•
• •
•
44 43 42 41 40 39 38 37 36 35 34
P90 1
33
P71
P91 2
32
P72
P92 /SDI 3
31
P67
P93/SDO 4
30
P66
P94/SCK 5
29
P65
P95/SS 6
EM78P451SAQ 28
P64
P50 7
27
P63
P51 8
26
P62
P52 9
25
P61
P53 10
24
P60
P54 11
23
P87
12 13 14 15 16 17 18 19 20 21 22
P55 P56 P57 P80 P81
NC
P82 P83 P84 P85 P86
~ Figure 5-1a: 44-pin QFP EM78P451SAQ ~
~ Figure 5-1b: 44-pin QFP package information ~

Smart-Keyboard eSK-R30B-X
Solution Specification (V1.3) 01.25.2013 •
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•7
(This specification is subject to change without further notice)
~ Figure 5-1c: EM78P451SAQ 44-pin QFP Bonding Pad Diagram ~

Smart-Keyboard eSK-R30B-X
8 •
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•Solution Specification (V1.3) 01.25.2013
(This specification is subject to change without further notice)
EM78P451S 44-pin QFP PAD List
Chip Size :1650 µ m* 2250
Pad No. Sym. X Y Pad No. Sym. X Y
1 P90 -691.0 1015.0 23 P87 715.0 -960.5
2 P91 -715.0 89.5 24 P60 715.0 -855.5
3 P92/SDI -715.0 -15.5 25 P61 715.0 -750.5
4 P93/SDO -715.0 -120.5 26 P62 715.0 -645.5
5 P94/SCK -715.0 -225.5 27 P63 715.0 -540.5
6 P95//SS -715.0 -330.5 28 P64 715.0 -435.5
7 P50 -715.0 -435.5 29 P65 715.0 -330.5
8 P51 -715.0 -540.5 30 P66 715.0 -225.5
9 P52 -715.0 -645.5 31 P67 715.0 -120.5
10 P53 -715.0 -750.5 32 P72 715.0 -15.5
11 P54 -715.0 -855.5 33 P71 715.0 89.5
12 P55 -715.0 -960.5 34 P70 407.6 1015.0
13 P56 -421.8 -1015.0 35 - - -
14 P57 -316.8 -1015.0 36 - - -
15 P80 -211.8 -1015.0 37 - - -
16 P81 -106.8 -1015.0 38 VDD 302.5 1015.0
17 - - - 39 R-OSCI 197.6 1015.0
18 P82 -1.9 -1015.0 40 OSCO -152.8 1015.0
19 P83 103.2 -1015.0 41 VSS -257.8 1015.0
20 P84 208.2 -1015.0 42 /INT -362.8 1015.0
21 P85 313.2 -1015.0 43 DATA -471.1 1015.0
22 P86 418.1 -1015.0 44 CLK -582.7 1015.0

Smart-Keyboard eSK-R30B-X
Solution Specification (V1.3) 01.25.2013 •
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•9
(This specification is subject to change without further notice)
•24-pin QFN : EM78P611G
P65 P64 P63 P62 P61 P60
•
• •
•
24 23 22 21 20 19
P77 1 18 P82
VDD 2 17 P81
OSCI 3 EM78P611G 16 P57
OSCO 4 15 P56
VSS 5 14 P55
V3.3 6 13 P54
7 8 9
10 11 12
D+
D-
P92 P93 P94 P53
~ Figure 5-1d: 24-pin QFN EM78P611GAW ~
~ Figure 5-1e: 24-pin QFN package information ~

Smart-Keyboard eSK-R30B-X
10 •
••
•Solution Specification (V1.3) 01.25.2013
(This specification is subject to change without further notice)
~ Figure 5-1f: EM78P611G 24-pin QFN Bonding Pad Diagram ~

Smart-Keyboard eSK-R30B-X
Solution Specification (V1.3) 01.25.2013 •
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•11
(This specification is subject to change without further notice)

Smart-Keyboard eSK-R30B-X
12 •
••
•Solution Specification (V1.3) 01.25.2013
(This specification is subject to change without further notice)
•EM198860 uses the QFN20 4x4 package
EM198860
1
2
3
4
5
6 7 8 9 10
20 1819 17 16
15
14
13
12
11
CE
CSN
MISO
IRQ
VDD3RX
VSSPA
RFN
REP
VDDPA
VDD3B
VSS3A
XTALP
XTALN
DVSS
CDVDD
VDD3IF
VSSIF
IREF
SCK
MOSI
~ Figure 5-1g: EM198860 QFN20 4x4 pin assignment
~ Figure 5-1h: 20-pin QFN package information ~

Smart-Keyboard eSK-R30B-X
Solution Specification (V1.3) 01.25.2013 •
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•13
(This specification is subject to change without further notice)
~ Figure 5-1i: EM198860 20-pin QFN Bonding Pad Diagram ~

Smart-Keyboard eSK-R30B-X
14 •
••
•Solution Specification (V1.3) 01.25.2013
(This specification is subject to change without further notice)
Chip Size : 80*67 µ m
Pad No. Sym. X Y Pad No. Sym. X Y
1 VDDPA 13.6 1527.875 11 DVSS 1433.955 25.925
2 RFP 13.6 1156.425 12 CE 1447.975 127.925
3 RFN 13.6 1054.425 13 CSN 1447.975 229.925
4 VSSPA 13.6 886.125 14 SCK 1447.975 1319.625
5 VSSPA 13.6 792.625 15 MOSI 1447.975 1421.625
6 VDD3RX 121.975 13.6 16 MISO 1447.975 1523.625
7 IREF 491.725 13.6 17 IRQ 1136.875 1592.9
8 VSSIF 593.725 13.6 18 VDD3B 1034.875 1592.9
9 VDD3IF 699.975 13.6 19 VSS3A 864.875 1592.9
10 CDVDD 1201.475 13.6 20 XTALP 762.875 1592.9
21 XTALN 660.875 1592.9

Smart-Keyboard eSK-R30B-X
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(This specification is subject to change without further notice)
6. Touchpad Specifications
6.1 Touchpad Orientation
The orientation of the TouchPad is shown as follows. The connector part number is P-
TWO 196087-10021-1 or equivalent device (10PIN /1.0mm). For more information
about the connector, see the manufacturer’s specification.
Figure 6-1 TouchPad Orientation

Smart-Keyboard eSK-R30B-X
16 •
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•Solution Specification (V1.3) 01.25.2013
(This specification is subject to change without further notice)
6.2 Pin Assignment
Pin # 1 2 3 4 5 6 7 8 9 10
Signal VCC GND BTN1 BTN2 BTN3 /INT
SDI
(MOSI)
SDO
(MISO)
SCK /SS
Connector type: P-TWO 196087-10021-1 10 pins connector or equivalent, pitch is 1.0
±0.10 mm.
Pin Assignment Description
Pin Signal I/O Description
1 VCC Power VCC
2 GND Ground Ground
3 BTN1 I
Physical Button Input # 1, active low.
The BTN1 is connected to Vcc through a 66 KΩresistor
inside the TouchPad controller.
4 BTN2 I
Physical Button Input # 2, active low.
The BTN2 is connected to Vcc through a 66 KΩresistor
inside the TouchPad controller.
5 BTN3 I
Physical Button Input #3, active low.
The BTN3 is connected to Vcc through a 66 KΩresistor
inside the
6 /INT O I Interrupt, active low, indicates that the Smart-Pad
TM
is
ready to send data
7 SDI
(MOSI) I Master out, Slave in. Data from host to Smart-Pad
TM
.
8 SDO
(MISO) O Master in, Slave out Data from Smart-Pad
TM
to host.
9 SCK I SPI clock in
10 /SS I Slave select in