Fotona QX MAX User manual

SERVICE MANUAL
Fotona QX MAX
Model: M031-3A/2
83826 SM ENG/05
MANUFACTURER:
Fotona d.d.
Stegne 7
SI – 1000 Ljubljana, Slovenia
phone: + 386 1 500 91 00
fax: + 386 1 500 92 00
www.fotona.com

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Please note that while every effort has been made to ensure that the data given in this manual is accurate,
the information, figures, illustrations, tables, specifications, and schematics contained herein are subject to
change without notice.
Copyright © 2008 Fotona d.d. Printed in Slovenia. All rights reserved.
The contents of this publication may not be reproduced in any form without the explicit permission of Fotona
d.d.
83826 SM ENG/5 Page 3/94

Content
1.SPECIFICATIONS............................................................................................................................................9
1.1.Laser..............................................................................................................................................................9
1.2.General........................................................................................................................................................10
2.FUNCTIONAL DIAGRAM DESCRIPTION.....................................................................................................12
2.1.Mains inlet and auxiliary power supplies.....................................................................................................12
2.2.Power distribution circuit – Relay soft start board.......................................................................................13
2.3.Controller.....................................................................................................................................................13
2.4.Control panel with display assembly...........................................................................................................14
2.5.Charger assembly.......................................................................................................................................14
2.6.PFM MODULE assembly............................................................................................................................15
2.7.Cooling System assembly...........................................................................................................................15
2.8.Laser head assembly..................................................................................................................................16
2.8.1.Nd:YAG Laser module..........................................................................................................................16
2.8.1.1.Polarizer.........................................................................................................................................16
2.8.1.2.Electro optical Q-switch..................................................................................................................16
2.8.1.3.Λ/4 plate (analyzer)........................................................................................................................16
2.8.2.KTP Laser Module................................................................................................................................16
2.8.3.Simmer Trigger board...........................................................................................................................17
2.8.4.Laser beam sampling optics.................................................................................................................17
2.8.5.Energy meter assembly........................................................................................................................17
2.8.6.Beam sampling optics...........................................................................................................................18
2.8.7.Head Control and safety shutter assembly...........................................................................................18
2.8.8.Oven control PCB.................................................................................................................................19
2.8.9.Beam coupling optics ...........................................................................................................................19
2.8.10.Aiming (diode) laser assembly............................................................................................................19
2.9.Laser beam delivery ...................................................................................................................................19
2.10.Mains filter A and B...................................................................................................................................20
2.11.Protective housing ....................................................................................................................................20
2.11.1.Housing...............................................................................................................................................20
2.11.2.Fixed power cord................................................................................................................................20
2.11.3.Main circuit breaker ...........................................................................................................................20
2.11.4.Door switch receptacle.......................................................................................................................20
2.11.5.Foot switch receptacle........................................................................................................................20
2.11.6.Potential equalization terminal ...........................................................................................................20
2.11.7.Emergency Stop switch......................................................................................................................20
2.11.8.Key Switch..........................................................................................................................................20
2.11.9.EMC shielding.....................................................................................................................................20
2.12.Laser pulse forming sequence and energy regulation..............................................................................21
2.13.System wiring diagram..............................................................................................................................21
2.14.Optical path diagram.................................................................................................................................22
2.15.Hand pieces...............................................................................................................................................22
3.DIS-ASSEMBLY / REPLACEMENT...............................................................................................................22
3.1.Laser console covers removal.....................................................................................................................22
3.1.1.Removal of the top metal cover............................................................................................................22
3.1.2.Removal of the metal side covers........................................................................................................22
3.2.Laser head cover removal...........................................................................................................................22
3.3.Charger removal/replacement ....................................................................................................................23
3.4.PFM MODULE assembly removal/replacement.........................................................................................23
3.5.Cooling system removal/replacement.........................................................................................................23
3.5.1.Cooling system replacement................................................................................................................23
3.5.1.1.Draining water................................................................................................................................24
3.5.1.2.Complete cooling system drawer removal.....................................................................................24
3.5.2.De-ionizing cartridge replacement........................................................................................................24
3.5.3.Cooling fans replacement.....................................................................................................................24
3.6.Relay board removal/replacement..............................................................................................................24
3.7.Auxiliary power supply assembly removal/replacement..............................................................................25
3.7.1.24VDC Auxiliary power supply removal/replacement...........................................................................25
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3.7.2.5VDC Auxiliary power supply removal replacement.............................................................................25
3.8.Controller removal/replacement..................................................................................................................26
3.8.1.Complete Controller removal replacement...........................................................................................26
3.8.2.Replacement of the IC30 EEPROM.....................................................................................................26
3.8.3.Replacement of the IC24 (serial EEPROM).........................................................................................27
3.8.4.Replacement or upgrade of system firmware ......................................................................................27
3.9.Laser module removal/replacement............................................................................................................28
3.9.1.Simmer Trigger Board removal/replacement.......................................................................................28
3.9.2.Nd:YAG Resonator mirrors removal/replacement................................................................................28
3.9.2.1.Nd:YAG laser output coupler mirror removal replacement............................................................28
3.9.3.Nd:YAG rear mirror removal replacement............................................................................................29
3.9.4.Nd:YAG laser pumping chamber removal replacement.......................................................................29
3.9.5.Nd:YAG laser flash lamp removal/replacement....................................................................................29
3.9.6.Laser rod replacement..........................................................................................................................30
3.10.Energy meter removal/replacement..........................................................................................................31
3.11.Head Control and safety shutter removal replacement.............................................................................31
3.12.Aiming beam laser removal/replacement..................................................................................................31
3.13.Front panel removal/replacement..............................................................................................................32
3.13.1.Control panel Display assembly removal and replacement................................................................32
3.14.Incoming cooling air filter removal/replacement........................................................................................32
4.USING THE BUILT IN SERVICE FIRMWARE..............................................................................................32
4.1.Service FW access with system's front panel.............................................................................................32
4.1.1.Access to the service firmware:............................................................................................................33
4.1.2.Changing the settings in service mode.................................................................................................33
4.1.3.Exiting the service firmware..................................................................................................................34
4.2.Use of external notebook computer for advanced service..........................................................................34
4.2.1.Setup of external notebook computer...................................................................................................34
4.2.2.Connection of external notebook computer to the Controller...............................................................34
4.2.3.Service mode with external notebook computer...................................................................................35
4.2.4.Fotona QX MAX system firmware parameters ....................................................................................37
4.2.4.1.For Nd:YAG laser:..........................................................................................................................37
4.2.4.2.For KTP operation..........................................................................................................................37
4.3.Using EPEM communication software........................................................................................................38
4.3.1.Connection problems............................................................................................................................38
4.3.2.Laser parameters adjustment...............................................................................................................39
5.SAFETY MEASUREMENTS..........................................................................................................................40
5.1.Medical device type B, class I leakage current measurement....................................................................40
5.1.1.Earth leakage current...........................................................................................................................41
5.1.2.Enclosure leakage current measurement.............................................................................................41
5.1.3.Patient leakage current measurement..................................................................................................42
5.2.Medical device class I Protective earth impedance Measurement.............................................................42
5.2.1.General.................................................................................................................................................43
5.2.2.Protective earth impedance measuring device.....................................................................................43
5.2.3.Measuring procedure and conditions....................................................................................................43
6.ADJUSTMENT/ALIGNMENT/CALIBRATION PROCEDURES.....................................................................44
6.1.Laser alignment...........................................................................................................................................44
6.1.1.Complete laser alignment.....................................................................................................................44
6.1.2.Both laser mirrors alignment.................................................................................................................44
6.1.3.Rear mirror alignment...........................................................................................................................46
6.1.4.Front mirror alignment..........................................................................................................................47
6.1.5.EOQS cell and Λ/4 plate alignment......................................................................................................48
6.1.5.1.Complete EOQS cell and Λ/4 plate alignment...............................................................................48
6.1.5.2.Field service EOQS and Λ/4 plate alignment.................................................................................50
6.1.6.Checking the laser alignment (field service).........................................................................................50
6.2.Aiming diode laser alignment......................................................................................................................52
6.3.Nd:YAG beam alignment ............................................................................................................................58
6.4.KTP assembly alignment ............................................................................................................................63
6.4.1.KTP beam alignment ...........................................................................................................................63
6.4.2.KTP crystal alignment ..........................................................................................................................65
6.5.Energy meters calibration procedure..........................................................................................................65
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6.5.1.Nd:YAG energy meters calibration.......................................................................................................66
6.5.1.1.Checking the Q-SW energy meter calibration...............................................................................66
7.Nd Q-SW Energy meter calibration 1 (field service, preferred)..............................................................66
7.1.Nd Q-SW Energy meter calibration 2...................................................................................................67
7.1.1.ACC energy meter calibration...............................................................................................................67
7.1.1.1.ACC energy meter calibration test.................................................................................................67
7.1.1.2.ACC energy meter calibration........................................................................................................67
7.1.2.KTP energy meters calibration.............................................................................................................68
7.1.2.1.Checking the KTP energy meter calibration..................................................................................68
7.1.2.2.KTP energy meter calibration.........................................................................................................68
7.2.Articulated arm alignment ...........................................................................................................................69
7.2.1.Tools:....................................................................................................................................................69
7.2.2.Aiming beam alignment........................................................................................................................69
7.2.2.1.OPTION 1 (Default): ......................................................................................................................69
7.2.2.2.OPTION 2:.....................................................................................................................................71
7.2.3.Arm alignment.......................................................................................................................................71
7.2.3.1.First mirror alignment.....................................................................................................................71
7.2.3.2.Second mirror alignment................................................................................................................72
7.2.3.3.Third mirror alignment. ..................................................................................................................72
7.2.3.4.Forth mirror alignment....................................................................................................................73
7.2.3.5.Fifth mirror alignment.....................................................................................................................73
7.2.3.6.Sixth mirror alignment....................................................................................................................73
7.2.3.7.Seventh mirror alignment...............................................................................................................74
8.TROUBLESHOOTING...................................................................................................................................75
8.1.Advisory messages.....................................................................................................................................75
8.1.1.Advisory messages during power-up....................................................................................................75
8.1.2.Advisory messages during self-test......................................................................................................75
8.1.3.Advisory messages in normal operation...............................................................................................75
8.1.4.Advisory message in service mode......................................................................................................76
8.2.Error messages reported by the system.....................................................................................................76
8.2.1.System error 10 - parameters error .....................................................................................................76
8.2.2.System error 11 - Energy meter communication error.........................................................................77
8.2.3.System error 12 – Energy meter data not available timeout................................................................77
8.2.4.System error 13 - Energy meter supply voltage low.............................................................................78
8.2.5.System error 14 - Energy meter data transfer error CRC failure..........................................................78
8.2.6.System error 16 – EM1 data transfer error, wrong wavelength read....................................................78
8.2.7.System error 17 – EM2 data transfer error, wrong wavelength read....................................................78
8.2.8.System error 18 – Energy meter saturation error.................................................................................78
8.2.9.System error 19 (or five longer beeps at power-on) – Console communication (I2C) error.................78
8.2.10.System error 20 - Shutter blocked in open position............................................................................78
8.2.11.System error 21 - Shutter blocked in closed position.........................................................................79
8.2.12.System error 22 – Laser switch blocked.............................................................................................79
8.2.13.System error 23 – Laser switch blocked.............................................................................................79
8.2.14.System error 24 – Head control error.................................................................................................79
8.2.15.System error 30 - Cooling liquid flow error ........................................................................................79
8.2.16.System error 31 - Cooling liquid pump soft start circuit error.............................................................80
8.2.17.System error 32 - Cooling liquid overheated or temperature switch error..........................................80
8.2.18.System error 40 - Simmer error (simmer current not present)...........................................................80
8.2.19.System error 50 - Overshoot in energy (> +20%) of Nd:YAG laser....................................................81
8.2.20.System error 52 – Missing laser pulse................................................................................................81
8.2.21.CANNOT CALIBRATE USE LOWER SETTINGS.............................................................................81
8.2.22.System error 56 – Under energy of Nd:YAG laser.............................................................................82
8.2.23.System error 57 - Under voltage limit in calibration of Nd:YAG laser.................................................82
8.2.24.System error 58 - Energy meters mismatch >30% of Nd:YAG laser.................................................82
8.2.25.System error 59 – High Q-switch leakage..........................................................................................82
8.2.26.System error 60 - HV Power supply error (charging time > 2s)..........................................................83
8.2.27.System error 61 – PFM Module assembly error (high voltage dropped under 120V)........................83
8.2.28.System error 62 – OW1 control signal error.......................................................................................83
8.2.29. System error 67 - HV Power supply relay error ................................................................................83
8.2.30.System error 68 - HV Power supply, capacitor bank without 24VDC.................................................84
8.2.31.System error 69 - HV Power supply error in selftest...........................................................................84
8.2.32.System error 99 – Program execution error.......................................................................................84
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8.3.Malfunctions not reported by the system.....................................................................................................84
8.3.1.The display does not show anything after turning on the system.........................................................84
8.3.2.The system does not respond to the keyboard on the control panel....................................................85
8.3.3.The control panel LCD backlight does not light....................................................................................85
8.3.4.The key switch does not respond ........................................................................................................85
8.3.5.The system does not respond to the footswitch...................................................................................85
8.3.6.Calibration time too long ......................................................................................................................85
8.3.7.The expected treatment effect is weaker then usual............................................................................85
9.SCHEMATICS................................................................................................................................................86
9.1.Fotona QX MAX electrical wiring diagram...................................................................................................86
9.2.Flash lamp replacement..............................................................................................................................86
9.3.Simmer trigger board layout........................................................................................................................86
9.4.Head Control layout.....................................................................................................................................86
9.5.Energy meter layout ....................................................................................................................................86
9.6.Relay Board layout......................................................................................................................................86
9.7.24VDC Auxiliary power supply layout..........................................................................................................86
9.8.5VDC Auxiliary power supply layout............................................................................................................86
9.9.PFM Module layout......................................................................................................................................86
9.10.Controller layout.........................................................................................................................................86
9.11.Fotona QX MAX optical diagram...............................................................................................................87
10.PARTS LIST.................................................................................................................................................89
83826 SM ENG/5 Page 7/94

CAUTION
USE OF CONTROLS OR ADJUSTMENTS OR PERFORMANCE OF PROCEDURES OTHER THAN
THOSE SPECIFIED HEREIN MAY RESULT IN HAZARDOUS RADIATION EXPOSURE AND ELECTRIC
SHOCK!
NOTE
THE ADJUSTMENT, ALIGNMENT AND CALIBRATION SERVICING PROCEDURES CAN BE
PERFORMED BY QUALIFIED SERVICING PERSONS AUTHORIZED BY FOTONA D.D. ONLY. CONTACT
YOUR RETAILER FOR FOTONA AUTHORIZED SERVICE PERSONNEL.
CAUTION
DURING THE ADJUSTMENT, ALIGNMENT AND CALIBRATION PROCEDURES THE SERVICEMAN AND
ALL PERSONNEL PRESENT IN THE LASER ROOM MUST USE APPROPRIATE SAFETY GOGGLES.
FOR WAVELENTH 532nm PROTECTIVE EYEWARE OF LB6 (OD6) OR HIGHER
FOR WAVELENGTH 1064nm PROTECTIVE EYEWARE OF LB6 (OD6) OR HIGHER
FOR WAVELENGTH 585nm PROTECTIVE EYEWARE OF LB5 (OD5) OR HIGHER
FOR WAVELENGTH 650nm PROTECTIVE EYEWARE OF LB6 (OD6) OR HIGHER
WARNING
OBSERVE CAUTION!
WHEN THE LASER SYSTEM COVERS ARE REMOVED AN ACCESS TO
HIGH VOLTAGE AS WELL AS MAINS SUPPLY VOLTAGE IS POSSIBLE DURING THE ADJUSTMENT,
ALIGNMENT AND CALIBRATION PROCEDURES!
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1. Specifications
1.1. Laser
Q-switched
Nd:YAG Long Pulse Accelera Nd:YAG
Laser wavelength: 1064 nm
Output energy per pulse: Up to 1600 mJ Up to 5 J
Max. fluence 12.7 J/cm
2
160 J/cm
2
Pulse repetition rate (frequency): 0.5 to 10 Hz 0.5 to 2.2 Hz
Pulse width: 5 – 20 ns 250 µs
Laser system classification:
(according to IEC 60825-1/2007) Class IV
Classification according to
MDD93/42/EEC, Annex IX: Class IIb, Rule 9
Classification according to CMDR: Class III, Rule 9
Beam Converter
650 Beam Converter
585
Laser wavelength: 650 nm 585 nm
Output energy per pulse: Up to 220 mJ 340 mJ
Max. fluence 7 J/ cm2 10.5 J/ cm
2
Pulse repetition rate (frequency): 1 Hz 2 Hz
Pulse width: 5 - 20 ns 5 - 20 ns
Laser system classification:
(according to IEC 60825-1/2007) Class IV
Classification according to
MDD93/42/EEC, Annex IX: Class IIb, Rule 9
Classification according to CMDR Class IIb, Rule 9
Frequency-doubled Q-switched KTP Nd:YAG laser
Laser wavelength: 532 nm
Output energy per pulse: Up to 600 mJ
Max. fluence 6.3 J/cm
2
Pulse repetition rate (frequency): 0.5 to 10 Hz
Pulse width: 5 - 20 ns
Laser system classification:
(according to IEC 60825-1/2007) Class IV
Classification according to
MDD93/42/EEC, Annex IX: Class IIb, Rule 9
Classification according to CMDR Class III, Rule 9
83826 SM ENG/5 Page 9/94

1.2. General
Power requirements
Rated voltage: 230 V
Long term input power: 2.3 kVA
Long term current rating: 10 A
Momentary input power: 3.9 kVA
Momentary current rating: 17 A
Frequency: 50/60 Hz
Electrical connection: Non-detachable power supply cord
Class of equipment: Class 1 equipment
Type of equipment: Type B equipment
Protective earth impedance: <100 m
Ω
Leakage currents: - earth leakage currents <500 µA
- patient leakage currents <100 µA
- enclosure leakage currents <100 µA
Circuit breaker: 16 A
Aiming beam - semiconductor diode laser at a wavelength of
650 nm
- power 1 mW max.
- adjustable in 7 steps from 0 to max.
- Laser Classification: Class II ( according to IEC
60825-1/2007)
Safety interlocks: - remote door switch interlock connector
Emergency laser stop: - emergency stop according to
IEC 947-3
Foot switch: - to operate the treatment laser
Controls: - main switch
- keylock switch (key removable in vertical OFF
position only)
Indicators:
LCD screen with following display
options: - Energy per pulse in mJ or fluence per pulse in J/cm2
- Spot size
- Frequency - Pulse repetition rate
- Laser type
- System state (STANDBY or READY)
- Laser status: EMISSION when in READY
state
- Laser pulse count
- Menu – with Pilot, Melody and Error history
Control panel keys:
KTP
Nd
MENU
FLUENCE
FREQUENCY
SPOT SIZE
SET
- to select frequency-doubled KTP Nd:YAG
laser source
- to select Q-switched Nd:YAG laser source
- to access the menu for aiming beam intensity
adjustment, pulse counter, error history etc..
- to change fluence value
- to vary pulse repetition rate
- to change the spot size
- to save the setting
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Status keys:
STANDBY
READY - to enter the standby state - to enter the ready state
Safety goggles: To operate the device in accordance with IEC
60825-1/2007 safety goggles with the following
safety levels are prescribed (in accordance
with EN 207:1998/A1:2003):
- for 1064 I,R 1064 LB6 (OD 6) and/or 532
I,R 532 LB6 or OD 6 (elsewhere)
- for 585nm: I R 585 LB5 (for Europe) or
OD5 (elsewhere)
- for 650nm: I R 650 LB6 (for Europe) or
OD6 (elsewhere)
Mechanical
Construction: Mobile equipment
Degree of protection: IPX0 (IEC 529)
Cooling: Internal water to air
Dimensions: 55 x 33 x 82 cm (Length x Width x Height)
Weight: Console 88 kg without arm
Shipping weight: 145 kg
Environmental conditions:
Operation: - ambient temperature range +10
o
C to +25
o
C;
must be above dew point
- relative humidity range of 30% to 75% - non
condensing
- atmospheric pressure range of 700 hPa to
1060 hPa
Storage and transport: - ambient temperature range -40
o
C to +70
o
C
(without cooling water)
- relative humidity range of 10% to 100% (incl.
condensation)
- atmospheric pressure range of 500 hPa to
1060 hPa
External connections: - Potential equalization terminal
- Door switch connector (NC contact)
- Foot switch connector (NC &ON contact)
Foot switch cable length: 3 m
Power cord length: 2 m
Beam delivery system: 7-mirror articulated arm permanently attached
to the system with exchangeable hand piece
83826 SM ENG/5 Page 11/94

2. Functional diagram description
Please refer to attached drawing Fotona QX MAX Model M031-3A or M001-13A functional diagram. The
wiring diagram is also applicable.
The M031-3A, M001-13A console consist from the following sub-units:
• Mains inlet and auxiliary power supplies comprising of:
• Circuit breaker
• Mains Filter A
• Mains filter B
• 24VDC - auxiliary power supply
• 5VDC - auxiliary power supply
• Power distribution circuit (Relay – soft start assembly)
• Controller assy.
• Control panel with display assy.
• Charger assy.
• PFM MODULE assembly. (PFM 31 2S2 0SCR assy. or PFM 31 1S1 0SCR assy.)
• Cooling System assy.
• Laser head with:
• Laser module Q-switched Nd:YAG
• Electrooptical (EO) Q-switch cell with polarizer and analyzer
• Q-switch driver PCB
• Simmer Trigger board
• Wavelength conversion KTP module
• Beam distribution elements
• Lasers beam sampling and combining optics
• Energy meters
• Head Control and safety shutters assembly
• Beam coupling assembly
• Aiming (diode) laser assembly
• Nd:YAG 1064 laser nm and KTP 532nm 7-mirror articulated arm beam delivery assembly
• Mains filter A and B
• Protective housing consisting of:
• Housing
• Fixed power cord
• Main circuit breaker
• Door switch
• Foot switch
• Potential equalization screw
• Emergency stop switch
• Key switch
• EMC shielding
2.1. Mains inlet and auxiliary power supplies
The mains power is entering the system through a fixed power cord followed by a double pole circuit breaker
and mains filter A. After turning on the main circuit breaker the 24VDC and 5VDC auxiliary power supplies
turn on.
The 5VDC auxiliary supply is powering only the laser system CONTROLLER.
The 24VDC auxiliary supply when turned on is powering the following circuits:
• The 24VDC part of the CONTROLLER (responsible for communication with the Foot Switch, Door
Switch, Emergency STOP Switch, Temperature switch, FLOW SENSOR and power distribution circuit
- relay board.
• RELAY SOFT START
• ENERGY METERS
• HEAD CONTROL board with safety shutters, aiming diode laser, KTP beam diverting control, KTP
oven and EOQS driver PCB.
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When both auxiliary supplies are turned on the Controller starts to check its integrity and also performs the
CRC check. After the completing of this check it performs the checking of the Emergency Stop switch status
and the Key Switch status. If both are not activated it shows on the control panel display of Fotona QX MAX
the Fotona logo and waits for the Key Switch to be activated.
When the Key Switch is turned on the system is ready to start up and first performs the self-test of the
complete laser system.
Both auxiliary power supplies are medical grade global switchers.
2.2. Power distribution circuit – Relay soft start board
It consists of a K1 relay for turning on the Charger and soft start circuits for turning on the cooling system
pump motor and fans. Note that Relay PCB is designed for variety of systems and some functions and
elements might not be in use.
The 230VAC from the mains filter A is attached to this board via connector X1D (INT Power) and it is directly
delivered to X3D to immediately activate the AUX power supplies.
The Charger is connected to this board via connector X1D (HV power, pins 6,7-L, 2-N).
The Soft start assy. is connected to the auxiliary 24VDC power supply with connector X2D (pin 4 24VDC, pin
2 GND) and it is distributed to X4D for power up the fans and X2D (pin 3) for power up the pump. The soft
start circuit activates the fans and the pump by connecting them GND.
The control signals from the Controller are fed to this board with connector X5D (Control input).
During the start up of the system, due to high starting current of the cooling system pump motor, the soft start
circuit on this board limits the inrush current and therefore prevents from high voltage drop in the 24VDC
auxiliary supply voltage, which can cause the situation equal to pressing the emergency switch.
2.3. Controller
The system Controller is located on a single board. It is powered by 5VDC auxiliary power supply. A part of
the Controller circuitry, which is connected by wires to the power distribution circuit (K1 relay and soft start
circuit), Spray controller board, Cooling system (temperature switch, flow sensor), Door switch, Foot switch,
Emergency Stop switch, Control Panel and Key switch is powered by 24VDC.
When the main circuit breaker is turned on the Controller is also turned on. It makes the power on self- test
and waits for the key switch to be turned on for starting up the laser system.
If during the operation the Emergency stop switch is activated the system will immediately shut down the
laser, Charger, PFM MODULE assembly, and the Cooling system. An advisory message will appear on the
control panel display showing that the Emergency stop switch has been activated. To resume operation the
Key switch has to be turned to off position, the emergency Stop switch deactivated and the main circuit
breaker has to be turned off and on again.
The Controller communicates through optical links (OW1, OW2, OW5, OW16) with the PFM MODULE
assembly, OW13, OW14, OW15 and OW17 with the Energy meter and OW3 and OW4 with the Head
Control assembly. Most of the optical links are multiplexed and are introduced into the system for eliminating
EMI on the Controller.
The Controller communicates through flat cable with the Spray Controller board.
The Controller has a serial port for attaching an external Notebook computer in a terminal mode for
accessing system parameters and for certain servicing purposes. This port is accessible only when the Upper
cover of the laser console is removed.
The main program (firmware) of the laser system is located in the IC30 flash EPROM. Inside IC24 EPROM
the system parameters are written and kept. When the controller is replaced these two ICs must be placed
on the new controller, which normally comes without these ICs.
The functions of the controller are the following:
• To monitor the integrity of the Controller itself
• To keep all the system parameters in its EEPROM
• To control the Cooling system (pump motor, fans, temp switch status, flow rate)
• To control the safety shutters and aiming beam power level
• To control the PFM MODULE assembly, Charger, and Crowbar protection circuit on PFM MODULE
assembly
• To turn on and off the simmer power supply located in the Charger assembly via Optical link OW 21
83826 SM ENG/5 Page 13/94

NOTE:
This feature of turning on and off the simmer power supply via optical link OW21 is in some laser
system having the Charger with code: 58216 not used.
• To perform the selection of laser by switching the simmer power supply through a relay K1 on the PFM
MODULE assembly from one flash lamp to the other
• To monitor each flash lamp simmer current
• To monitor the status of Door switch, Foot switch, Emergency Stop switch and Key switch
• To control the flash lamp every current pulse duration, and amplitude (through the PFM MODULE
assembly and Charger)
• To control the proper operation of energy meters
• To read the measured energies of each laser pulse of the selected laser from both energy meters
• To perform the software compensation of the raw energy measured by energy meters in order to
calculate the true energy of each laser pulse
• To run the on-line digital feedback for the selected laser output energy regulation
• To compensate for losses of different hand pieces and beam deliveries
• To communicate with the control panel keyboard and display through a User Interface
• To communicate with the Spray Controller board
• To provide appropriate advisory and system error messages
• To provide and access to system parameters through an RS232 serial port
• To facilitate through a special service software easy servicing and calibration of the system
• To reset a safety watchdog timer in the controller for checking the proper operation of the Controller.
2.4. Control panel with display assembly
The control panel with display is located on the system console front panel. It comprises a flat keyboard, and
a 2x20 character backlight LCD display with its driving circuit and display electronics assembly (TV KONZ
I
2
C). The keyboard comprises keys with LED diodes indicating the status of certain statuses of operation or
functions.
The keyboard cable is attached to the display assembly.
The Key Switch, and the Nd:YAG hand piece micro-switch are also connected to the Display assembly (TV
KONZ I
2
C). The Display assembly is connected to the Controller with a detachable cable.
The LCD display together with its driving circuit (Display assembly) is encapsulated in a metal sheet housing.
The LCD display clearly shows all the relevant information to the user.
2.5. Charger assembly
The Charger is turned on through Relay K1 on the relay soft-start PCB, which is controlled by the Controller.
The Charger assembly is responsible to charge the capacitor bank located in the PFM MODULE assembly to
the desired voltage. The voltage value from the Controller to the PFM MODULE assembly is fed via optical
link UREFERENCE (OW16) and it is further fed to Charger via optical link CHARGE (OW20). The Charger
also creates a 24VDC supplying voltage for proper operation of the PFM MODULE circuit.
The Charger comprises the Simmer power supply, which is used to keep the flash lamp ionized (simmer
current). It is controlled (turned on and off) by optical link OW21 from the PFM MODULE.
NOTE:
This feature of turning on and off the simmer power supply via optical link OW21 is not used in all chargers.
Please check for charger version that is installed in the particular laser system. The charger with only one
optical link OW20 does not have this feature.
The integral part of the charger is also the Mains filter B located on the top of the charger.
The charger can be separated from the rest of the system by a single connector, and by two optical links
OW20 and OW21 running from PFM MODULE assembly.
NOTE:
The Fotona QX MAX charger is dual simmer current capable of charging the capacitor bank to 800VDC. At
the time of the Fotona QX MAX system design it was not used in any other Fotona laser system.
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2.6. PFM MODULE assembly
The PFM 31 assembly circuit is operating only when the Charger is turned on and a 24VDC created in
Charger is present. All the other necessary voltages (15VDC and 5VDC) for proper operation of the PFM
MODULE assembly are created internally on-board. It communicates with the Controller and Charger only
through optical links.
The PFM MODULE circuitry performs the following functions:
• Senses if the simmer current is established through the flash lamps and sends this information to the
Controller through the optical link OW2 in a multiplexed form.
• Detects the status of the Capacitor bank and sends this information multiplexed through optical link
OW2.
• Receives from the Controller via optical link OW16 the reference value of the voltage to which the
capacitor bank is to be charged.
• Compares the reference voltage with the capacitor bank voltage and creates the optical link OW20
signal to activate the Charger’s current if the capacitor bank voltage is lower then the reference
voltage.
• Sends to the controller a signal if the charger is charging the capacitor bank (OW7).
• Switches On and Off the main discharge through the flash lamp on commands from the Controller
(optical link OW 5) via a powerful IGBT module in the PFM MODULE assembly.
• Performs the checking of proper operation of the Crowbar circuitry after each start-up of the system
and sends this information though optical link OW2 to the Controller.
• Performs the checking if voltage on capacitor bank is greater then min. specified via a multiplexed
optical link OW2.
NOTE:
The standard PFM assembly features the “crowbar” function. Because of operational principles of the
Fotona QX MAX laser this function must be disabled. Placing the jumper JP1 on the PFM control
PCB to pins 2,3 disables “crowbar” function.
• Performs the discharging of the capacitor bank through a chain of wire resistors each time the charger
is turned off (when the 24VDC voltage disappears on the PFM MODULE assembly) through the
DISCHARGE CIRCUIT located on the top of the IGBT Switch. In this way the huge capacitor bank is
being discharged and after turning off the instrument placed in a safe discharged state.
2.7. Cooling System assembly
The cooling system is placed in a drawer on the bottom back side of the system. It consists of:
• Cooling liquid tank
• Pump driven by a 24VDC motor
• De-ionizing cartridge
• Upper water-to-air heat exchanger with two 24VDC fans
• Lower water-to-air heat exchanger with two 24VDC fans
• Temperature switch – located in the cooling liquid tank
• Flow sensor
When the Controller sends a signal for starting the cooling system via the Soft Start board (TV RELE
SOFSTART) the pump and heat exchangers fans start. The de-ionized water is running from the water tank
through the upper heat exchanger, lower heat exchanger, laser module and through a flow sensor back to the
tank. The de-ionizing cartridge is connected in parallel to the flow sensor. The flow through the de-ionizer is
restricted with a restrictor placed in the flow. Therefore a small amount of water flows through the de-ionizing
cartridge, which keeps the water always de-ionized and clean.
The flow sensor is generating a frequency proportional to the flow rate. This signal is sent to the Controller,
which performs the function of determining the flow. The checking of the flow rate starts with a 5 second
delay after turning on the pump to allow for the flow to establish. Later on the flow is continuously monitored
and if it drops bellow a prescribed value the Controller immediately stops the laser, turns off the Charger,
cooling system pump and fans, blocks the system and issues an appropriate message.
The Controller through a thermal switch mounted on the cooling liquid tank monitors the temperature of the
cooling liquid. Should the water temperature exceed the allowed limit the Controller will stop the laser
emission disable the triggering of the laser and issue an advisory message (Over temperature). The cooling
system pump and fans remain to operate. The system will remain in this state until the cooling liquid
temperature does not fall under the trip point of the temperature switch. The system will then revert to a
STBY state.
83826 SM ENG/5 Page 15/94

In case of leakage of cooling liquid it will be conveyed through plastic tubing out of the instrument.
NOTE:
The Fotona QX MAX laser system was designed to operate properly with ambient temperature NOT HIGHER
then 25°C. Since water to air heat exchanger is used, by increasing the ambient temperature the cooling
liquid of the laser will also increase which may lead to overheating of certain components and cause damage
to the system.
2.8. Laser head assembly
2.8.1. Nd:YAG Laser module
It consists of a highly efficient laser pumping chamber with Nd:YAG laser rod and two flash lamps, optical
resonator with high reflectivity (HR) and out-coupling (OC) mirror both mounted in their adjusting
mechanisms. The Nd:YAG laser pumping chamber is cooled by de-ionized water. The pumping chamber is
insulated from the resonator base plate with appropriate insulators with suitable creepage distances and air
clearances. The flash lamps are operating in a simmer current mode and kept ionized for the main discharge
current pulse initiated through a powerful IGBT module (located on the PFM MODULE assembly). The main
discharge excites the laser rod and as a consequence a laser pulse is created within the optical resonator.
From the OC mirror the laser beam emerges if both OC and HR mirrors are properly aligned.
In case of KTP system operation the Nd:YAG laser beam is diverted into the KTP cell with the KTP crystal
where it is converted to 532 nm wave length.
The laser characteristics (laser output energy vs capacitor bank voltage) are described by two parameters A
and B. The Aparameter is the laser offset parameter, while the Bparameter is the slope efficiency in terms
of output energy vs. capacitor bank voltage or in other words:
Elaser = A + B* Ubank
NOTE:
The Aand Bparameters can be accessed and edited in the service mode of operation of the Fotona QX
MAX Laser system. Because of the KTP conversion the output laser characteristics are also changed and
independent set of Aand Bparameter is also used for KTP case.
When the laser system is to be operated at a selected energy with a selected hand piece the computer first
calculates the value of the energy of the laser (taking in account the transmission of the selected hand piece)
and then calculates the voltage to which the capacitor bank is to be charged. With this starting voltage the
energy regulation loop is starting the calibration sequence of the laser. After the calibration is completed (the
laser energy is close to the desired energy) the shutter opens and the system is placed in a ready state. After
pressing the footswitch the laser will all the time run in the energy regulation loop, which adjusts the capacitor
bank voltage to a value, which will always deliver the selected energy to the treatment site.
2.8.1.1. Polarizer
Polarizer function is to assure the laser beam EM field polarization that is necessary to operate the Electro
Optically Q-switch laser.
2.8.1.2. Electro optical Q-switch
Q-switch function is to change the optical energy losses inside the laser between the laser mirrors. In case of
Fotona QX MAX the Q-switch reduces the losses – enable the laser action. It is done by rotating the EM field
beam polarization to the angle that is necessary to pass through the analyzer.
2.8.1.3. Λ/4 plate (analyzer)
Analyzer function in Fotona QX MAX laser is to close/disable the laser action when the Q-switch is not
activated.
2.8.2. KTP Laser Module
The KTP module consists of movable Nd:YAG beam diverting mirror, adjusting beam steering mirror, KTP
chamber, beam bending mirror that reflects 532 nm and transmit 1064 nm, heat sink for 1064 nm and filter
for 1064 nm. The 532/1064 nm beam combiner is considered a standard element but it can be missing in the
M001-13F system.
Page 16/94 83826 SM ENG/5

The laser characteristics (laser output energy vs. capacitor bank voltage) is for this mode of operation
described in a similar manner as for Nd:YAG laser – by parameters Aand B, where The Aparameter is the
laser offset parameter, while the Bparameter is the slope efficiency in terms of output energy vs. capacitor
bank voltage or in other words:
Elaser = A + B * Ubank
NOTE: The Aand Bparameters can be accessed and edited in the service mode of operation of the Fotona
QX MAX Laser system. Corresponding external computer directory (set ktp) separates the Nd:YAG and KTP
parameters Aand B.
When the laser system is to be operated at a selected average power and frequency with a selected beam
delivery the computer first calculates the value of the energy per pulse of the laser (taking in account the
transmission of the selected beam delivery and repetition rate - frequency) and then calculates the voltage to
which the capacitor bank is to be charged. With this starting voltage the energy regulation loop is starting the
calibration sequence of the laser. After the calibration is completed (the laser energy is close to the desired
energy) the shutter opens and the system is placed in a ready state. After pressing the footswitch the laser is
all the time running in the energy regulation loop, which adjusts the capacitor bank voltage to a value, which
will always deliver the selected average power to treatment site.
2.8.3. Simmer Trigger board
The Simmer trigger board is located on the top of the N:YAG laser module. Its function is to create high
voltage (12kV) short pulses via a Trigger transformer to ionize the Xenon gas within both flash lamps. The
flash lamp ionized gas impedance drops allowing the external Simmer power supply to draw a small current
(called simmer current) through the flash lamp. The simmer operation of the flash lamp allows accurate flash
lamp firing with high rep rates.
The negative terminal of a trigger transformer secondary winding is connected to both flash lamps cathode.
The positive terminal of the trigger transformer is connected to the laser pumping chamber metal part. This
allows for efficient external triggering of both flash lamps.
When the Controller turns on the Charger the simmer power supply starts to develop approx. 1.2kV voltage
on the selected flash lamp terminals. This high voltage is also applied to the simmer trigger board and if it is
sufficiently high the simmer trigger board starts to trigger the flash lamp through the trigger transformer.
When the flash lamp ionizes the simmer current establishes and the simmer power supply accommodates
the voltage on the flash lamp to keep the simmer current through the flash lamp to a preset constant value
(the simmer power supply acts as a constant current source). Normal flash lamp voltages in simmer
operation are between 90 and 150V. The exact voltage depends on the flash lamp itself. The simmer trigger
board disables the triggering of the trigger transformer when the simmer current is established.
The whole simmer trigger board is electrically on a floating potential together with the Charger and PFM
MODULE assemblies.
2.8.4. Laser beam sampling optics
There are two beam sampling optics – one for each energy meter. The function of the beam sampling optics
is to supply a sample of the treatment laser beam to the energy meters. They are accurately fixed to the laser
head base plate.
Both optical elements are reflecting a portion of the Nd:YAG or KTP laser pulse energy against the energy
meter sensors.
2.8.5. Energy meter assembly
Two energy meter modules are used to measure the energy inside the Fotona QX MAX laser system. Each
module measures both treatment beam wavelengths. For this reason 2 photo-diode sensors are placed in
side each module. The Energy meters are placed sideways before the shutter head control. They are picking
a small portion of the treatment laser beam reflected from the sampling optics.
The energy meter is a complex analog and digital assembly, which communicates with the Controller only
through two optical links.
The Energy meter circuitry is powered by 24VDC from the auxiliary power supply when the main circuit
breaker is turned on.
The energy meter cycle:
83826 SM ENG/5 Page 17/94

The functions of the energy meters are:
• Receives from the system controller the starting (initiating) sequence.
• Sends (returns) the acknowledge status and measures the energy.
• To amplify the signals from each photo-diode detector, time integrate it and hold it for processing.
During factory calibration of the energy meters or during service calibration the gain of this amplifiers
can be trimmed to calibrate the energy meter sensitivity.
• To convert this signals via a A/D converter in a digital form
• Receives the stop measuring sequence command.
• Converts the analog signal to digital format and adapt the format for communication with the controller.
• Transfer the measured data to the controller.
• Sends the EM status data.
• The EM checks the optical communication status.
• The EM checks the local power status.
• The EM checks the energy measurement availability status.
• The EM verifies data (CRC) and indirectly checks the A/D converter status.
NOTE:
The controller adjusts the energy of the laser pulse during calibration procedure after the READY button has
been pressed.
The Controller reads the energy of laser pulse from both energy meters (Feedback and Monitor energy
meter).
The response of the energy meter is linear but different for Nd:YAG and KTP operating mode as well as for
different sensors. For this reasons the original raw energies measured by the energy meter need to be
software compensated in order to get the true measured energy of laser pulses. Four compensation
parameters are therefore implemented in the system firmware for the ND:YAG laser and KTP operation.
Each laser operation has two parameters, which are distinct characteristics of the particular energy meter and
are determined during energy meter calibration.
Please refer to energy meter calibration procedure section of this manual for further information.
2.8.6. Beam sampling optics
Two beam splitting optical elements are placed in front of the energy meters reflecting a very small portion of
the beam against the energy meter sensors.
2.8.7. Head Control and safety shutter assembly
The Head Control and safety shutter assembly is located before the articulated arm support after the energy
meters. The circuit is powered by 24VDC from auxiliary power supply.
The Head Control is mounted together with the safety shutter to the laser head base plate. It comprises only
one safety shutter because the Nd:YAG and KTP beam have the same optical path. The shutter is actuated
by a rotary actuator and has a static magnet rod on its flag. Hall sensors on the Head Control board detect
the shutter’s position. The circuit is communicating with the Controller via two optical links OW3 and OW4.
The Head Control and safety shutter functions are:
Page 18/94 83826 SM ENG/5

• To receive commands from the Controller for opening or closing the shutter via optical link OW3
• To sense the position of the shutter and to send this information via optical link OW4 to the controller.
• To receive commands for diode laser aiming beam power level via optical link OW3
• To supply power and drive the diode laser with PWM (pulse width modulated) signal with eight
hardwired average power levels.
• It controls via OVEN CTRL PCB the beam diverting mirror movement and position.
• Supplies 24VDC to KTP chamber via Oven CTRL PCB for KTP heating. Regulate the KTP
temperature by switching ON and OFF the KTP heating and detects if the KTP temperature is inside
preset value.
• It delivers 24VDC to the Q-switch driver.
• It delivers 5VDC to the energy meters.
2.8.8. Oven control PCB
This PCB is an interface between dislocated KTP assembly, beam diverting mirror assembly and the laser
head control. It function is:
• To distribute the beam diverting motor control signals.
• To control the KTP crystal temperature based on the signals coming from the head control PCB.
2.8.9. Beam coupling optics
Basically the beam coupling consists of two Nd:YAG adjustable steering mirrors. One (near field) is located
immediately after the first laser beam bending mirror on the laser exit and just before the movable beam
diverting mirror. The second (far field) is located inside the articulated arm support before the arm input. Both
these mirrors are used to align the Nd:YAG laser beam into the articulated arm.
When KTP module is in operation the movable beam diverting mirror is placed into the Nd:YAG laser beam.
The diverting mirror reflects the Nd beam against the first adjustable KTP steering (near field) mirror. After
passing the KTP chamber and converting to 532 nm wavelength the beam is reflected by the second (far
field) steering mirror against the filter. The second KTP steering mirror reflects well only the 532 nm
wavelength and the residual 1064 nm is transmitted through the mirror into the sink. Small portion of the 1064
nm light is always reflected from the second KTP beam steering mirror and this residual 1064 nm wavelength
beam is filtered out by the 1064 nm filter. After the filter the KTP beam couples into the Nd beam optical path
with the beam coupler. Both KTP steering mirrors are used to align the KTP beam path to be collinear with
the Nd:YAG laser beam.
2.8.10. Aiming (diode) laser assembly
The aiming beam laser assembly is located close to the shutter head control PCB and articulated arm
support. It is mounted in its adjusting mechanism used for aligning the aiming beam to coincide with the
Nd:YAG treatment beam.
The aiming beam is combined with the Nd:YAG and KTP treatment beam via fixed 100% reflecting mirror
inside at the bottom of the articulated arm support and the beam combiner BCNd. In this way the optical axis
of the treatment and aiming beam can be brought to be the same. The aiming beam is also coupled into the
articulated arm and through it to different handpieces. At the hand piece exit the aiming beam position marks
the point to which the Nd:YAG and KTP treatment beam will hit the target when the foot switch will be
depressed.
The Diode laser assembly is powered and controlled from the Head Control board with 24VDC via a cable
attached to the Head Control board with a connector.
The aiming beam laser is a diode laser source operating in a PWM (Pulse Width Modulated) mode. Eight
hardwired power levels can be selected via the Head Control board received from the Controller through
optical link OW3.
2.9. Laser beam delivery
The Nd:YAG laser and KTP beam delivery is a 7-mirror balanced articulated arm. After installation at the user
it is permanently attached to the system. To the articulated arm distal end different hand pieces can be
attached depending on the application.
83826 SM ENG/5 Page 19/94

2.10. Mains filter A and B
There are two mains filters in the system. The mains Filter A is located immediately after the main Circuit
breaker behind the laser head.
The second mains Filter B is located above the Charger and is an integral part of it.
2.11. Protective housing
2.11.1. Housing
The complete console is made from spot welded metal sheet console, spot welded metal sheet upper side
covers and a plastic front panel painted in the inner side with a conductive paint. Therefore the construction
gives good mechanical integrity and excellent grounding as well as EMC compatibility.
2.11.2. Fixed power cord
A fixed power cord is used in Fotona QX MAX Model M031-3A, M002-3A.
2.11.3. Main circuit breaker
It is located on the rear side of the instrument and it is also the main switch in the same time.
2.11.4. Door switch receptacle
The door switch receptacle is located on the rear side of the instrument. In some countries it is mandatory
(e.g. EU).
An external switch has to be installed on the laser room doors and connected via the door switch connector
to the system. This will automatically disable laser operation when the laser room door opens. Until the door
is not closed the laser system cannot be operational.
2.11.5. Foot switch receptacle
It is located on the rear side of the housing next to the door switch receptacle. The foot switch is connected to
this receptacle. If not attached the system cannot start up.
2.11.6. Potential equalization terminal
It is located next to the fixed power inlet cord. The use of this terminal is defined by regulatory issues
(potential equalization).
2.11.7. Emergency Stop switch
It is located on the front panel. When activated the system blocks immediately, closes the shutter, disables
laser emission, turns of the Charger, IGBT Switch, Cooling system and issues an advisory message
"Emergency Stop" indicating the user that the switch has been actuated. The system cannot be restarted
before Emergency stop switch is deactivated (turned leftward), the Key switch is turned off, and the main
circuit breaker turned off and then again on.
2.11.8. Key Switch
It is located on the front panel. The function of the key switch is to protect the system from unauthorized use
of the system. When the main circuit breaker is turned on, the system starts up after turning on the key
switch. The key cannot be removed in the On position.
2.11.9. EMC shielding
The inner metal sheet protective housing is properly EMC shielded by the use of appropriate EMC gaskets.
The plastic front plate inner side is painted with a conductive paint.
Page 20/94 83826 SM ENG/5