Gates M5700 series User manual

<

Fig.

1

-

M5700

Transistor

Program

Amplifier

o

TECHNICAL

DATA

0

*

Inp t

Impedance:

Factory

connected

for

150

ohms.

May

also

be

connected

for

600

ohms.

The

Gates

Transistor

Program

Amplifier

is

available

in

two

versions:

Intermod lation

Distortion:

Under

0.3%

at

+14

dbm

eq ivalent

sine

Harmonic

Distortion:

Under

0.75%

at

30

cps

.,

0.5%

from

50

to

15,000

cps.,

at

+24

dbm

o tp t.

Source

Impedance:

150/250

ohms,

Noise

Level:

-122

dbm

eq ivalent

inp t

noise.

i

o

wave

power

o tp t,

sing

40

and

7000

cps.,,

mixed

4:1.

Under

1.5%

at

+24

dbm.

or

500/600

ohms

.

2.

The

M5700B

is

designed

for

rack

mo nt



ing

in

system

installations

with

the

level

control

mo nted

internally.

The

inp t

of

the

amplifier

is

nterminated

to

facilitate

application.

Terminate

the

inp t

connect



ions

on

the

amplifier

mo nting

tray

in

the

proper

resistance

(150

or

600

ohms).

The

gain

of

the

M5700B

will

then

be

approxi



mately

70

db

maxim m.

Gain:

M5700:

80

DB,

M5700B:

76

DB,

may

be

red ced

as

req ired

with

internal

vol me

control.

Freq ency

Response:

+

1

db

from

30

to

15,000

cps.

1.

The

M5700

is

designed

specifically

for

se

in

Gates

Transistor

Consoles.

It

is

s pplied

less

the

interstage

level

control

,

and

with

the

inp t

nterminated.

The

con



trol

is

mo nted

externally

on

the

Console

panel.

1

o

8-1/4

lbs.

packed.

2

-

2N5087

DESCRIPTION

50

20

100

200

500

IKC

2KC

10

5KC

I0KC

Fig.

2

-

Response

and

Distortion.

■

.

p

1

......

...

—

TYPICAL

TOTAL

HARMONIC

4

1

vided

with

the

mo nting

tray

to

prevent

ac**

cidental

interchange

of

non-similar

pl g-in

nits

in

the

system.

Typical

freq ency

response

and

distortion

These

meas



rements

were

taken

with

all

transistors

se



lected

at

random.

20XC

SOKC

813

6380

001

%IO

0.8

0.6

OA

0.2

0

08

0

-I

-2

o

-5

DISTORTION

AT

+

2

DBM

OUTPUT

iinir

_

n

_

nrum'

ti

TYPICAL

FREQUENCY

RESPONSE,

150-n.

IN,

600^.

OUT

The

amplifier

is

sed

with

theM6031

Mo nt



ing

Tray

which

carries

a

mating

receptacle

and

is

s pplied

with

mo nting

hardware.

Up

to

seven

trays

may

be

installed

on

the

M6029

Shelf

Assembly

,

which

mo nts

in

a

*

c rves

are

shown

in

Fig.

2.

standard

-Gates

rack

cabinet,

and

occ pies

3-1/2

”

of

panel

space.

A

keying

is

pro-

The

interstage

level

control

is

located

on

the

ffont

panel

of

the

M5700B

model.

The

o tp t

transformer

and

receptacle

are

at-

‘

tached

to

the

frame,

and

all

other

compo



nents

are

mo nted

on

the

printed

wiring

boards.

The

M5700

Program

Amplifier

is

completely

transistorized,

and

is

designed

for

se

as

a

line

or

isolation

amplifier

in

broadcasting

,

and

recording

applications.

Special

tech



ie

niq es

have

been

employed

to

obtain

low

noise,

low

distortion,

and

good

temperat re

stability.

Load

Impedance:

Finish:

?

Factory

connected

for

600

ohms.

May

Satin-silver

cover,

black

also

be

connected

for

150

ohms.

esc tcheon

plate.

Maxim m

Inp t

Level:

Mo nting:

-35

dbm.

M6031

Mo nting

Tray

req ired

to

mo nt

Maxim m

O tp t

Level:

inM6029

Shelf

Assembly

.

Shelf

assem-

+24

dbm.

bly

accommodates

seven

Program

Ampli-

Maxim m

Operating

Ambient

Temperat re:

fiers

and

req ires

panel

space

of

3-1/2

”

.

55°

C.

(131°

F.)

X

19".

Maxim m

Storage

Ambient

Temperat re:

Size:

85°

C.

(185°

F.)

2-7/32"

wide,

3-1/8"

high,

10-3/4"

Power

Req irements:

long,

overall.

30

volts

D.C.

,

90

ma.

,0.1

mv.

Weight:

maxim m

ripple.

4-1/4

lbs.

net.

Transistors:

C bage:

2N1414

2

-

2N5087

0.8

cu.

ft.

domestic

pack.

2N118

2

INSTALLATION

.MOUNTING

TRAY

AND

SHELF

ASSEMBLY

INPUT

AND

OUTPUT

TRANSFORMERS

GUIDE

BAR

PI

,

S';

813

6350

001

Fig.

3

-

Shelf

Assembly

With

G ide

Bar

Fig.

4

-

Inp t

Transformer

Connections

The

o tp t

transformer

is

factory

connected

.

It

will

not

be

req ired

where

another

M6029

Shelf

Assembly

is

mo nted

directly

above,

The

inp t

transformer

is

factory

connected

for

150

ohms

primary

impedance,

as

shown

on

the

schematic

diagram

and

on

Fig.

4.

If

a

terminated

inp t

is

desired,

a

150

ohm

resistor

sho ld

be

connected

to

terminals

9

and

10

on

the

amplifier

mo nting

tray,

since

the

amplifier

inp t

is

nterminated.

Refer

to

Fig.

4

for

connection

to

600

ohms

impedance.

If

a

terminated

inp t

is

req ir



ed,

connect

a

620

ohm

resistor

across

term



inals

9

and

10-

on

the

amplifier

mo nting

tray.

4.

ware

Mo nting

holes

have

been

spaced

in

the

shelf

assembly

to

allow

it

to

be

completely

filled

with

trays

of

any

one

type

for

the

Gates

transistorized

nits.

It

is

possible,

where

maxim m

se

of

shelf

space

is

not

req ired,

to

mix

trays

of

different

sizes.

Th s

a

pro



gram

amplifier

and

preamplifier

co ld

be

placed

at

the

left

and

a

power

s pply

at

the

extreme

right.

Proceed

as

follows:

.If

6db

more

gain

is

desired

in

some

appli



cations,

the

inp t

terminating

resistor

may

be

deleted.

In

this

case,

however,

the

system

component

proceeding

the

amplifier

will

not

be

properly

terminated.

2.

Sec re

the

tray

to

the

shelf

with

the

two

#4-40

x

1/4

”

flat

head

screws

with

the

two

#6

internal-external

shakeproof

washers

n



der

two

#4

hex

n ts.

Mo nt

the

shelf

in

the

rack

sing

hard-

s pplied

with

the

rack.

The

two

end

strips

mo nt

nder

the

screw

heads,

and

are

to

be

fl sh

with

the

drop

panel.

3.

Determine

whether

or

not

the

g ide

bar,

shown

in

Fig.

3,

will

be

req ired.

The

p r



pose

of

this

bar

is

to

prevent

possible

dam



age

to

the

mating

connectors

when

pward

press re

is

inadvertently

applied

to

the

am



plifier

d ring

withdrawal.

The

bar

will

be

req ired

only

where

no

other

protecting

ob



str ction

is

present

in

the

rack,

or

where

the

shelf

is

sed

at

a

location

s ch

as

a

work

bench.

or

where

overhead

eq ipment

interferes

withf~)

mo nting

of

the

shelf

d e

to

the

presence

of

the

bar.

The

mo nting

screws

are

locat



ed

so

that

they

may

be

removed

from

within

the

shelf.

1.

Locate

the

first

tray

at

the

extreme

left

:

or

right

of

the

shelf

assembly

,

with

the

re



ceptacle

at

the

rear.

The

co nters nk

holes

of

the

tray

will

fit

into

the

matching

holes

in

the

shelf,

when

properly

located.

Leave

a

1/16"

space

between

trays

.

3

EXTERNAL

CONNECT

IO

NS

Terminals

Circ it

EXTERNAL

VOLUME

CONTROL

THE

PREAMPLIFIER

R n

the

D.

C.

s pply

leads,

o tp t

pair,

.

and

chassis

and

circ it

gro nd

leads

along

therear

edge

of

the

shelf.

The

D.C.

s pply

leads

sho ld

be

at

least

18

ga ge,

and

m st

be

r n

SEPARATELY

from

each

program

amp



lifier

to

its

respective

power

s pply,

to

pre



vent

the

possibility

of

common

co pling

in

the

power

wiring.

See

the

power

s pply

In



str ction

Book

for

f rther

information.

signed

for

se

in

critical

low

noise

appli



cations.

R n

inp t

pairs

and

external

control

leads

along

the

shelf

brace,

above

the

receptacles

.

J mper

together

all

#13

terminals

on

the

shelf,

whether

program

amplifiers

or

other

types,

and

connect

to

the

rack

gro nd

b s.

Connection

from

rack

gro nd

to

the

circ it

gro nd

in

the

program

amplifier

(B+)

sho ld

be

made

at

the

amplifier

(not

at

the

power

.

s pply).

Make

a

connection

from

the

rack

gro nd

b s

to

each

amplifier

terminal

#14,

SEPARATELY

,

with

at

least

18

g age

wire.

1

These

circ it

gro nds

m st

be

carried

sepa



rately

to

prevent

the

possibility

of

interac



tion

(d e

to

mixing

of

ret rn

c rrents

in

a

common

wire).

Where

other

types

of

amp



lifiers

are

mo nted

on

the

same

shelf,

con



s lt

their

respective

Instr ction

Book

for

gro nding

information.

.Where

many

ampli



fiers

and

power

s pplies

are

mo nted

in

a

rack,

it

is

preferable

to

r n

a

vertical

rack

gro nd

b s-bar,

to

pick

p

gro nds

at

each

shelf.

External

connections

are

made

to

the

mo nt



ing

tray

receptacle

as

follows:

1,2,3

4

5,6

7

9,10

11

12

13

8,14,15,16

Biasing

is

accomplished

by

a

combination

of

voltage

divider

and

emitter

resistance,

as

with

R2

,

R3,

and

R5

.

This

method

of

bias



ing

also

ins res

a

high

degree

of

tempera



t re

stability.

Signal

degeneration

is

pro



vided

for

QI

by

R6,

and

for

Q3

by

R17.

A

loop

feedback

network

connects

from

Q3,

thr

R7

and

C5

,

to

QI

.

The

large

amo nt

of

feedback

and

degeneration

obtained

by

these

Reference

to

the

schematic

diagram

will

in



dicate

that

the

program

amplifier

is

wired

to

accommodate

an

external

vol me

control.

This

feat re

makes

it

possible

to

locate

the

vol me

control

on

an

adjacent

rack

panel,

or

on

a

console

control

panel

,

when

the

amp



lifier

is

mo nted

internally.

The

internal

control,

R30,

m st

be

disconnected

when

the

amplifier

is

to

be

sed

.in

this

way.

The

(R30)

control

may

be

ordered

as

part

n mber

550

0218

000.

for

600

ohms

secondary

impedance.

To

re-

*

connect

for

150

ohms

refer

to

the

schematic

diagram

.

Remove

the

green/white

and

black

^^wires

from

terminal

#7.

Connect

the

black

wire

to

terminal

#5

and

the

green/white

wire

to

terminal

#6.

THEORY

OF

O

PERATION

For

the

p rpose

of

explanation,

the

program

amplifier

can

be

considered

to

be

made

p

of

two

parts:

the

preamplifier,

and

the

high

level

amplifier.

External

Control

(Optional)

!

+30V.

Circ it

Gro nd

.

O tp t

Connections

O tp t

Center-Tap

(600

ohms)

•

Inp t

Connections

•

Inp t

Center-Rap

.

-30

V.

Chas

is

Gro nd

No

Connection

o

~

The

fo r

stage

preamplifier

has

a

transform



beer

co pled

inp t

and

emitter

follower

o t

-

^^p t,

with

direct

co pling

tilized

between

QI

and

Q2,

and

between

Q3

and

04.

QI

and

Q2

transistors

are

low

noise

types

de-

o

s

4

o

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distortion

to

a

low

val e.

o

THE

HIGH

LEVEL

AMPLIFIER

R18

IN.

E2

B-(PI-12J

R5

R24

CONTROL

ARM

Cl

4

L

C1

Fig.

6

-

Printed

Board

Component

Location,

Viewed

from

Wiring

Side.

3

methods

red ces

distortion

in

the

preamp



lifier

to

an

extremely

low

val e,

and

makes

the

operation

almost

completely

independent

^^pf

variations

in

transistor

parameters.

PREAMP-

BUT

1

PRI

T1

SEC-

GRN

■ft

R

1

5

'

C4

;

CONTROL

PI-1

AMP

IN

<

E10

R19

E1

1

R8

I

+

The

o tp t

stage,

Q7,

is

connected

in

the

common

emitter

config ration,

with

a

ser



ies

fed

o tp t

transformer,

T2,

in

the

col



lector

circ it.

Emitter

resistor

R29

provid



es

a

large

amo nt

of

degeneration,

to

red ce

,

R28<

The

low

driving

impedance

req ired

by

a

stage

of

this

type

is

obtained

from

the

e-

mitter

follower,

Q6.

The

stages

are

direct

co pled,

with

R25

and

R26

establishing

the

bias

on

both

Q6

and

Q7

.

Q5

provides

addi



tional

gain

for

the

high

level

amplifier.

CONTROL

COM

Pi-3

B+(Pl- )

B-(P1-12)

T2

PRI

RED

;

t.-'

—

J

-----

T2

PRI

BLUE

©

1

V

ei

2

--

<>R20

—

E3

E4

e

/

Mi

e

8

''T

•

V

The

feedback

network,

R28

and

Cl

6,

is

sed

primarily

for

low

freq ency

response

compensation.

.4-1

4

c>n;

R18

;■

....

-J

■

T

).

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C

-

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K

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(

kW

c?

'll

JcsH

>■

J]

^R23/

R21

R22

lz.

'

E1

C'

—

|

if

c

—

T1

PRI

CT-

T1

PRI

IN-

B+(

P

1

-4)

T1

OR.WH

-

,R16?

®

^T1

^11

7

MAINTENANCE

PREVENTIVE

MAINTENANCE

SERVICING

o

The

condition

of

the

o tp t

stages

,

Q7

1.

PRINTED

CHASSIS

COMPONENT

REPLACEMENT

CHECKING

COMPONENTS

RESOLDERING

THE

COMPONENT

/

Remove

as

m ch

solder

from

the

lead

as

.

Fig.

7

-

Cleaning

Holes

i

I

It

is

recommended

that

when

the

amplifier

is

first

placed

in

operation,

D.C.

voltage

be

meas red

with

the

same

voltmeter

that

will

be

sed

for

maintenance

and

tro ble

shooting,

and

that

these

readings

be

record



ed

on

the

amplifier

schematic

above

the

typical

voltage

shown.

The

M5700

Program

Amplifier

for

long,

tro ble-free

service.

When

servicing

the

amplifier,

the

following

points

sho ld

be

observed:

D st

and

dirt

sho ld

be

periodically

remov



ed

with

a

soft

br sh.

and

Q6,

can

be

most

readily

checked

by

meas ring

the

D.

C.

voltages

associated

with

these

stages

.

possible.

Remove

all

the

kinks

in

the

wire.

With

heat

applied,

gently

p ll

the

wire

thro gh

the

hole.

A

bottom

view

of

chassis

5.

Circ it

voltages

are

reversed

from

stand



ard

vac m

t be

practice,

as

is

the

polarity

of

all

the

electrolytic

capacitors.

6.

The

location

of

the

positive

end

of

each

electrolytic

capacitor

is

indicated

by

the

white

dot

marked

on

the

top

of

the

circ it

board.

I

is

designed

However,

as

with

all

high

q ality

electronic

eq ip



ment,

a

reg lar

program

of

inspection

sho ld

be

followed.

2.-

If

the

component

is

good,

replace

as

•follows:

Use

a

metal

twist

drill

(1/8

”

dia.

or

less)

to

clear

the

hole

only

in

the

fillet

of

solder.

T rn

with

the

fingers

only

re



move

solder

slowly

to

prevent

the

drill

from

tearing

the

fillet.

2.

Circ it

resistances

sho ld

be

meas red

only

after

removing

the

associated

transis



tor

or

transistors,

to

prevent

damage

d e

to

ohm-meter

battery

voltage.

1.

The

components

sho ld

be

caref lly

checked

by

meas ring

circ it

voltages

and

resistances

before

attempting

to

remove

one

of

the

leads

from

the

printed

chassis.

Ex



treme

care

m st

be

exercised

in

removing

the

lead

to

prevent

damage

to

the

board

or

cond ctors.

This

operation

sho ld

not

be

considered

nless

it

is

the

only

way

the

component

can

be

checked.

If

one

lead

m st

be

removed

witho t

damage

to

the

compo



nent,

apply

a

well

cleaned

and

tinned

25

to

60

watt

iron

to

the

fillet

adjacent

to

the

lead.

With

small

long

nose

pliers

or

thin

screwdriver,

pry

the

folded

portion

of

the

lead

in

line

with

the

holes.

Applying

the

iron

for

more

than

fo r

seconds

at

a

time

may

damage

the

chassis

base

material.

3.

Do

not

remove

or

insert

transistors

with

the

power

on.

4.

Do

not

probe

the

printed

board

with

a

metal

probe

with

the

power

on.

8

o

REPLACING

COMPONENTS

Fig.

10

-

Installing

New

Component

pliers

B

J

o

pliers

Fig

8

PARTS

LIST

Symbol

No.

Gates

Stock

No.

Description

0

To

replace

the

component,

fold

the

leads

bn

the

new

part

to

the

same

spacing

as

the

mo nting

holes.

Insert

the

part

and

fold

the

After

removing

the

leads,

prepare

the

chas



sis

for

the

new

component

as

explained

in

Fig.

7,

paragraph

2.,

With

the

iron

applied

to

the

fillet,

p ll

the

wire

gently

o t

of

the

component

side

of

the

chassis*

E2

508

522

0215

0178

0160

If

a

fillet

is

p lled

loose,

break

it

off

to

get

rid

of

the

loose

end.

Fold

the

new

compo



nent

leadto

lay

on

thecond ctor

and

solder.

If

the

component

lead

is

too

short,

solder

in

another

piece

of

wire

to

bridge

the

gap.

Printed

chassis

constr ction

places

no

strain

on

repairs

of

this

nat re,

th s,

soldering

alone

will

provide

s fficient

mechanical

strength

even

with

heavy

shock

and

vibra



tion

in

almost

every

case,.

clip

here

Cap

.

,

Cap.

,

Cap.,

fold

&

clip

here

.005

Uf.

,

100

V.

.01

f.

,

100

V.

25

f.

,

6

V.

D.C.

100

f.

,

3

V.

D.C.

*^^ron

tip

Fig.

9

-

Removing

Components

.

Iron

tip

Fig.

8

-

Removing

Lead

A

£

Be

s re

the

component

lead

is

straight

and

free

of

solder.

P sh

it

gently

back

thro gh

the

hole

ntil

some

of

it

shows

on

the

other

side.

Solder

caref lly

b t

rapidly

to

pre



vent

chassis

damage.

0076

000

leads

nder

the

chassis

to

hold

the

compo



nent

firmly

against

it.

3.

Components

can

be

replaced

with

less

chance

of

damage

to

the

chassis

than

the

removal

and

rewiring

of

one

of

the

leads.

Remove

as

follows:

Clip

the

leads

close

to

the

body

of

the

component.

Heat

the

fillet

and

gently

p sh

the

wire

thro gh

ntil

the

hook

may

be

clipped

off.

Clip

the

hook

off

(on

the

soldered

side)

with

sharp

c tters.

The

base

material

sed

on

the

printed

chas

sis

is

the

best

available

for

this

service

The

two

oz.

copper

is

twice

as

heavy

as

s

ed

in

average

applications

of

this

type

o

eq ipment.

This

ass res

reliable

service

and

repair,

if

and

when

req ired.

If

re



placement

parts

are

ordered

from

the

Gates

Radio

Company,

please

list

the

Gates

stock

n mber

given

in

the

parts

list,

as-well

as

the

description

of

the

part.

This

will

as



s re

receipt

of

the

right

part

immediately.

'J

Clip

off

the

excess

wire.

Place

the

iron

on

both

the

component

lead

and

fillet.

Solder

caref lly

and

rapidly

to

prevent

damage

to

the

chassis

base.

If

one

of

the

cond ctors

is

damaged,

it

is

seldom

necessary

to

scrap

the

printed

chassis.

Lay

a

small

piece

of

wire

(#18

to

24

ga.)

across

the

break

and

solder

each

end

to

the

cond ctor.

Cl

(M5700)

Cl

(M5700B)

C2,

Cll

C3

9

o

I

o

0

T1

T2

80

0014

000

80

0012

000

540

0044

000

540

00 4

000

548

0050

000

540

0062

000

540

0066

000

548

0049

000

540

0046

000

540

0077

000

■

540

0068

000

540

0064

000

540

0095

000

540

0086

000

540

0048

000

540

006

000

540

00 2

000

540

0058

000

540

00 5

000

540

0089

000

540

007

000

540

0025

000

540

0049

000

548

01 5

000

548

0095

000

540

005

000

540

0064

000

540

0059

000

548

009

000

550

0218

000

522

0242

000

516

0054

000

522

0187

000

516

004

000

522

0189

000

516

0075

000

522

0 5

000

522

0251

000

516

00 5

000

516

0426

000

516

04 5

000

500

0759

000

610

0244

000

80

0112

000

478

018

000

478

0125

000

404

0066

000

404

0149

000

Transformer,

Input

Transformer,

Output

Socket

.005

f.

,

500V

.05

f.

,

100V

lOOpf.

,

500

V.

■

i

■

i

Description

Cap.

,

50

f.

,

15

V.

D.C.

Gates

Stock

No.

522

0227

000

XQ3,XQ4,XQ5,XQ6

XQ7

Res

.,

270

ohm.

Res.,

47Kohm,

Res.

,

10K

ohm.

Res

.,

100

ohm,

Res.,

1000

ohm,

1/2

W.

,

5%

Res.,

25K

ohm,

1/2

W.

,

1%

Res.,

4640

ohm,

1/2

W.

,

1%

Res.,

1500

ohm,

1/2W,

,

5%

Res.,

4.3Kohm,

1/2

W.

,

5%

Res.,

2.7Kohm,

1/2

W,

,

5%

Res.

,

61.9

ohm,

1

W.

,

1%

Potentiometer,

2500

ohm

Transistor,

2N1414

Transistor,

2N1183

Res.

,

620

ohm,

1/2

W.

,

5%

Res.,

240

ohm,

1/2

W.

,

5%

Res.,

20K

ohm,

1/2

W.

,

1%

Res.,

600

ohm,

1/2

W.

,

5%

Res.,

5100

ohm,

1/2

W.

,

5%

Res.,

100

ohm,

1/2

W.

,

1%

Res.,

750

ohm,

1/2

W.

,

5%

Res.,

15K

ohm,

1/2

W.

,

5%

Res.,

6200

ohm,

1/2

W.

,

5%

Res.

,

4 00

ohm,

1/2

W.

,

5%

Res.,

82K

ohm,

1/2

W.

,

5%

Res.,

6K

ohm,

1/2

W.

,

5%

Res.

,

910

ohm,

1/2

W.

,

5%

Res.,

900

ohm,

1/2

W.

,

5%

Res.

,

200

ohm,

1/2

W.

,

5%

Res.,

2400

ohm,

1/2

W.

,

5%

1/2

W.

,

5%

1/2

W.

,

5%

1/2

W.

,

5%

1/2

W.

,

5%

Symbol

No.

C8

C4,

C7,

CIO,

C13

C5

C6

C9,

C12

C14

C15

C16

(M5700)

C16

(M5700B)

C17

C18,C19,C20,C21,

C23,C24,C25

C22,C26

C

27

Pl

QI,

Q2

Q3,

Q4,

Q5,

Q6,

Q7

R1

(M5700A)

R1

(M5700,B)

R2,

R4

R12,

R22

R5

R6

R7

R8

R9

R3,

R10

Rll

R14

R15

R16

R17

R18

R19

R20

R21

R23

R24

R25

R26

R27,

R31

R28

(M5700)

R28

(M5700B)

R29

R30

(M5700A/B)

Cap.

,

Cap.

,

Cap.

,

Pl g

Transistor,

2N5087

Cap.,

25

f.,

25

V.

D.C.

Cap.,

.001

f.

,

1KV

Cap.,

200

f.,

6V

D.C.

Cap.

,

470

pf.

.

1KV

Cap.,

300

f

.,

6V.

D.C.

Cap.

,

.005

f.,

1

KV

Cap.

,

1.5

f.

,

50

V.

D.C.

Cap.

,

5

f.

,

50

V.

D.C.

Cap.

,

250

f.

,

1

KV

Gates M5700 Series User manual

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